Air conditioner and direct current frequency conversion electric control integrated board

Abstract

The utility model relates to an air conditioner and a direct current frequency conversion electric control integrated board, the direct current frequency conversion electric control integrated board comprises a substrate, the substrate comprises a first side edge and a second side edge which are arranged along the width direction, and a first installation area, a second installation area and a third installation area are arranged between the first side edge and the second side edge; the second mounting area is located between the first mounting area and the third mounting area; the first function module is mounted in the first mounting area; the second function module is mounted in the second mounting area; the third function module is mounted in the third mounting area; wherein the heating value of the first functional module is greater than that of the second functional module and / or the third functional module, and the weight of the second functional module is greater than that of the first functional module and the third functional module. The direct current frequency conversion electric control integrated board optimizes the layout, is beneficial to improving the heat dissipation performance, reduces the interference between devices, and guarantees the assembly balance.

Description

Technical Field

[0001] The utility model relates to the technical field of air conditioning, in particular to an air conditioner and a DC frequency conversion electric control integrated board. Background Art

[0002] Air conditioners in related technologies, especially all-DC variable-frequency air conditioners (all-DC variable-frequency air conditioners mean that both the compressor and the outdoor fan are DC brushless motors), are limited by cost and installation difficulty. The variable-frequency integrated board in the air conditioner is becoming more and more popular. However, the switching devices and various high-power devices of the variable-frequency integrated board are arranged in a disorderly manner on the circuit board, which easily leads to problems such as high failure rate and difficult-to-control heating, causing troubles in production, procurement and after-sales maintenance. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an improved DC frequency conversion electric control integrated board.

[0004] The technical solution adopted by the utility model to solve the technical problem is to construct a DC frequency conversion electric control integrated board, including:

[0005] The substrate includes a first side and a second side arranged along a width direction, a first mounting area, a second mounting area, and a third mounting area are arranged between the first side and the second side; the second mounting area is located between the first mounting area and the third mounting area;

[0006] A first functional module is installed in the first installation area;

[0007] a second functional module, installed in the second installation area;

[0008] A third functional module is installed in the third installation area;

[0009] The heat generated by the first functional module is greater than that of the second functional module and / or the third functional module, and the weight of the second functional module is greater than that of the first functional module and the third functional module.

[0010] In some embodiments, the substrate includes a third side and a fourth side arranged along the length direction;

[0011] The first mounting area is disposed between the first side and the fourth side;

[0012] The first functional module includes a power input module.

[0013] In some embodiments, the third mounting area extends from the third side to the fourth side and is located on the second side;

[0014] The third functional module includes a main control module.

[0015] In some embodiments, a fourth mounting area is provided on the substrate, and the fourth mounting area is provided between the first mounting area and the third side;

[0016] The DC frequency conversion electric control integrated board further includes a PFC inductor, and the PFC inductor is arranged in the fourth installation area.

[0017] In some embodiments, the substrate further includes a fifth mounting area, which is disposed between the third side and the first side and located on a side of the fourth mounting area away from the first mounting area.

[0018] The DC frequency conversion electric control integrated board further includes a high-power module, and the high-power module is arranged in the fifth installation area.

[0019] In some embodiments, the high-power module includes at least one of a rectifier circuit, a PFC boost circuit, and an inverter circuit.

[0020] In some embodiments, the substrate further includes a sixth mounting area, the sixth mounting area being disposed on a side of the second mounting area away from the fourth mounting area and located between the second mounting area and the third mounting area;

[0021] The DC frequency conversion electric control integrated board further includes a heat dissipation drive module, and the heat dissipation drive module is arranged in the sixth installation area.

[0022] In some embodiments, the substrate further includes a seventh mounting area, the seventh area being disposed on a side of the second mounting area away from the fourth mounting area and between the second mounting area and the third mounting area;

[0023] The DC frequency conversion electric control integrated board further includes a switching power supply module, and the switching power supply module is installed in the seventh installation area.

[0024] In some embodiments, the second functional module includes a capacitor.

[0025] The utility model relates to an air conditioner, comprising a casing and a DC frequency conversion electric control integrated board arranged in the casing.

[0026] The implementation of the air conditioner and DC variable frequency electric control integrated board of the present invention has the following beneficial effects: the DC variable frequency electric control integrated board is provided with a first installation area, a second installation area and a third installation area between the first side and the second side on the substrate; and the second installation area is placed in the middle of the substrate, by installing the first functional module in the first installation area, wherein the heat generated by the first functional module is greater than the heat generated by the second functional module and / or the third functional module; installing the second functional module in the second installation area, and making the weight of the second functional module greater than the weight of the first functional module and the weight of the third functional module; and installing the third functional module in the third installation area, thereby optimizing the layout, making the various components staggered, and being beneficial to improving the heat dissipation performance, reducing the interference between components, and ensuring the assembly balance, thereby reducing the failure rate and improving the convenience of production, procurement and after-sales maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The present invention will be further described below with reference to the accompanying drawings and embodiments, in which:

[0028] Figure 1 It is a structural schematic diagram of a DC frequency conversion electric control integrated board in some embodiments of the present utility model. DETAILED DESCRIPTION

[0029] To provide a clearer understanding of the technical features, objectives, and effects of the present invention, a detailed description of the specific embodiments of the present invention is now provided with reference to the accompanying drawings. In the following description, it should be understood that, unless otherwise expressly specified or limited, terms such as "mounted," "connected," and "disposed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; internal connections between two elements, or interactions between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located above the other element, or one or more intervening elements may be present. The terms "first," "second," and "third," etc., are used solely to facilitate the description of the present technical solution and should not be construed to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, features designated as "first," "second," and "third," etc., may explicitly or implicitly include one or more of such features. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0030] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present invention with unnecessary detail.

[0031] Figure 1 Some preferred embodiments of the air conditioner of the present invention are shown. The air conditioner has the advantages of low failure rate, low manufacturing cost, and convenient after-sales maintenance. In some embodiments, the air conditioner can be a full DC variable frequency air conditioner.

[0032] In some embodiments, the air conditioner may include a housing and a DC frequency conversion electric control integrated board, wherein the housing may be configured to accommodate the DC frequency conversion electric control integrated board. The DC frequency conversion electric control integrated board may be fixedly disposed in the housing.

[0033] like Figure 1 As shown, in some embodiments, the DC variable frequency electric control integrated board includes a substrate 10, a first functional module 20, a second functional module 30, and a third functional module 40. In some embodiments, the substrate 10 can be substantially rectangular in shape and is a PCB. In other embodiments, the substrate 10 is not limited to a rectangular shape and can be a square, diamond, or irregular shape. The first functional module 20, the second functional module 30, and the third functional module 40 are arranged in sections on the substrate 10.

[0034] In some embodiments, the substrate 10 may include a first side 11, a second side 12, a third side 13, and a fourth side 14. The first side 11 and the second side 12 may be disposed along the width direction of the substrate 10, may be disposed opposite each other, and may be parallel to each other. The third side 13 and the fourth side 14 may be disposed along the length direction of the substrate 10, may be disposed opposite each other, and may be parallel to each other. The first side 11, the second side 12, the third side 13, and the fourth side 14 collectively define a surface.

[0035] In some embodiments, a first mounting area 10a, a second mounting area 10b, and a third mounting area 10c are provided on the substrate 10. The first mounting area 10a, the second mounting area 10b, and the third mounting area 10c are provided between the first side 11 and the second side 12. The second mounting area 10b may be located between the first mounting area 10a and the second mounting area 10b. The shapes and areas of the first mounting area 10a, the second mounting area 10b, and the third mounting area 10c may be different. In other embodiments, the shapes and areas of the first mounting area 10a, the second mounting area 10b, and the third mounting area 10c may also be the same.

[0036] In some embodiments, the first mounting area 10a can be located in a corner of the substrate 10. Specifically, the first mounting area 10a is disposed between the first side 11 and the fourth side 14. The first safe area 10a can be used to mount components that generate a large amount of heat. In some embodiments, the first mounting area 10a can be irregular in shape. In other embodiments, the first mounting area 10a can also be a regular shape, such as a rectangle or square.

[0037] In some embodiments, the second mounting area 10b may be the middle area of the substrate 10 and may be irregularly shaped for mounting heavy components. In other embodiments, the second mounting area 10b may be regular in shape, such as a rectangle or a square.

[0038] In some embodiments, the third mounting area 10c can extend from the third side 13 to the fourth side 14. The third mounting area 10c can be used to mount components that generate less heat. In some embodiments, the third mounting area 10c can be irregular in shape. In other embodiments, the third mounting area 10c can also be regular in shape, such as a rectangle or square.

[0039] In some embodiments, a fourth mounting area 10d is provided on the substrate 10. This fourth mounting area 10d is located between the first mounting area 10a and the third side 13. The fourth mounting area 10d can be located to one side of the second mounting area 10b. The fourth mounting area 10d can be used to mount components that generate a large amount of heat. In some embodiments, the fourth mounting area 10d can be of a regular shape. Specifically, in some embodiments, the fourth mounting area 10d can be of a rectangular shape. Of course, it is understood that in other embodiments, the fourth mounting area 10d can also be of an irregular shape.

[0040] In some embodiments, a fifth mounting area 10e is provided on the substrate 10. The fifth mounting area 10e can be provided between the third side 13 and the first side 11, and is located on the side of the fourth mounting area 10d away from the first mounting area 10a. This is also known as the fifth mounting area 10e. The fourth mounting area 10d and the first mounting area 10a are sequentially provided along the third side 13 toward the fourth side 14. The fifth mounting area 10e can extend toward the second side 12 and can connect with the third mounting area 10c. The fifth mounting area 10e can be rectangular. Of course, it is understood that in other embodiments, the fifth mounting area 10e is not limited to a rectangle and can be an irregular shape. In some embodiments, the fifth mounting area 10e can be used to mount high-power components.

[0041] In some embodiments, the substrate 10 further includes a sixth mounting area 10f. The sixth mounting area 10f can be located on a side of the second mounting area 10b away from the fourth mounting area 10d and between the second mounting area 10b and the third mounting area 10d. In some embodiments, the sixth mounting area 10f can be rectangular. In other embodiments, the sixth mounting area 10f is not limited to a rectangular shape and can be an irregular shape.

[0042] In some embodiments, the substrate 10 further includes a seventh mounting area 10g. The seventh mounting area 10g is disposed on a side of the second mounting area 10b away from the fourth mounting area 10d and between the second mounting area 10b and the third mounting area 10c. Specifically, the seventh mounting area 10g is disposed between the second mounting area 10b, the sixth mounting area 10f, and the third mounting area 10c. In some embodiments, the seventh mounting area 10g may be a regular shape. Further, the seventh mounting area 10g may be a rectangular shape. In other embodiments, the seventh mounting area 10g is not limited to a rectangular shape and may be an irregular shape.

[0043] In some embodiments, the heat generated by the first functional module 20 may be greater than the heat generated by the second functional module 30 and the third functional module 40. In some embodiments, the heat generated by the first functional module 20 may also be greater than the heat generated by only the second functional module 30 or the third functional module 40. In some embodiments, the first functional module 20 can be installed in the first installation area 10a. In some embodiments, the first functional module 20 can be a power input module, which may include EMC filter components such as power input lines, protection components, common mode inductors, etc., wherein the heat generated by the common mode inductor is greater than the heat generated by some components. The first functional module 20 can be used to absorb the interference generated by the DC frequency conversion electric control integrated board and prevent external interference from entering the DC frequency conversion electric control integrated board.

[0044] In some embodiments, the second functional module 30 can be installed in the second mounting area 10b. The mass of the second functional module 30 can be greater than the weight of the first functional module 20 and the third functional module 40. In some embodiments, installing heavier components in the second mounting area 10b can improve balance after assembly. In some embodiments, the second functional module 30 can be a capacitor, specifically a large high-voltage electrolytic capacitor, which can generate less heat than the first functional module 20. Because the height and width of the second functional module 30 are greater than those of other components, it can block interference from components in some other mounting areas.

[0045] In some embodiments, the third functional module 40 can be installed in the third installation area 10c. In some embodiments, the third functional module 40 is a main control module, which performs functions such as current sampling for the PFC, compressor, and fan, sampling AC voltage and DC bus voltage, sampling temperature sensors on the outside of the air conditioner, controlling various outdoor electronic valves, and communicating between the indoor and outdoor units. Because the third installation area 10c is located away from high-frequency, high-voltage, and high-heat-generating areas, installing the main control module there can achieve strong and weak current separation while effectively collecting voltage and current signals from various areas.

[0046] In some embodiments, the DC frequency conversion electric control integrated board may also include a PFC inductor 50, which is arranged in the fourth mounting area 10d. Since high-frequency PFC will generate high-frequency voltage and current pulsations, it needs to be placed on one side of the substrate 10 and away from other areas. The PFC inductor will also generate large copper loss and iron loss, and generate a lot of heat. Placing it in the fourth mounting area 10d is conducive to heat dissipation.

[0047] In some embodiments, the DC frequency conversion electric control integrated board may further include a high-power module 60, which may be arranged in the fifth installation area 10e. In some embodiments, the high-power module 60 may include at least one of a rectifier circuit, a PFC boost circuit, and an inverter circuit. Specifically, the high-power module 60 may include a rectifier circuit, a PFC boost circuit, and an inverter circuit. In some other embodiments, the high-power module 60 also includes one or two of a rectifier circuit, a PFC boost circuit, and an inverter circuit. In some embodiments, the high-power module 60 may be connected to a heat sink to transfer heat in a timely manner through the heat sink. In some embodiments, by rationally arranging the components in the high-power module 60 (such as a rectifier bridge, a fast recovery diode, an IGBT, and an IPM intelligent power module), it is beneficial to improve the overall heat dissipation capacity.

[0048] In some embodiments, the DC variable frequency electric control integrated board further includes a heat dissipation drive module 70. In some embodiments, the heat dissipation drive module 70 can be disposed in the sixth mounting area 10f. The heat dissipation drive module 70 can be used to drive the DC fan, and the heat generated by the heat dissipation drive module 70 is greater than the heat generated by the third functional module 40. In some embodiments, the heat dissipation drive module 70 can include an IPM intelligent power module for the fan and a fixed heat sink.

[0049] In some embodiments, the DC frequency conversion electric control integrated board further includes a switching power supply module 80. The switching power supply module 80 is mounted in the seventh mounting area 10g. In some embodiments, the switching power supply module 80 may include components such as a high-frequency transformer, a switching power supply chip, a diode, and an electrolytic capacitor. Because the switching power supply module 80 generates less heat than the first functional module 20, mounting it in the seventh mounting area 10g prevents heat from being transferred to the third mounting area 10c.

[0050] In some embodiments, the components in each functional module can be installed on the substrate 10 by using a single-sided patch or a single-sided plug-in, and the substrate 10 has a first side 11, a second side 12, a third side 13, and a fourth side 14 to define the contact surface, thereby simplifying the installation process and reducing production costs.

[0051] In some embodiments, devices that are prone to heat are placed in the first mounting area 10a, the fourth mounting area 10d, and the fifth mounting area 10e. These areas realize AC-DC and DC-AC conversion. Since they are separated from the third mounting area 10c by the second mounting area 10b, high-frequency interference generated by the devices in the first mounting area 10a, the fourth mounting area 10d, and the fifth mounting area 10e can be avoided from interfering with the main control module in the third mounting area 10c. By optimizing the layout of each functional module on the substrate 10 and reasonably controlling the spacing, a reasonable layout is achieved, good circuit performance and heat dissipation performance are achieved, and the failure rate is reduced, so that the overall size of the DC frequency conversion electric control integrated board can be reduced, so that it can adapt to a narrow casing and be easy to install, which can further reduce the cost.

[0052] It can be understood that the above embodiments only express the preferred implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A DC frequency conversion electric control integrated board, characterized in that: include: A substrate (10) comprises a first side (11) and a second side (12) arranged along a width direction; a first mounting area (10a), a second mounting area (10b), and a third mounting area (10c) are arranged between the first side (11) and the second side (12); the second mounting area (10b) is located between the first mounting area (10a) and the third mounting area (10c); A first functional module (20) is installed in the first installation area (10a); A second functional module (30) is installed in the second installation area (10b); a third functional module (40), installed in the third installation area (10c); The heat generation of the first functional module (20) is greater than the heat generation of the second functional module (30) and / or the third functional module (40), and the weight of the second functional module (30) is greater than the weight of the first functional module (20) and the third functional module (40).

2. The DC frequency conversion electric control integrated board according to claim 1, characterized in that: The substrate (10) comprises a third side (13) and a fourth side (14) arranged along the length direction; The first installation area (10a) is arranged between the first side (11) and the fourth side (14); The first functional module (20) includes a power input module.

3. The DC frequency conversion electric control integrated board according to claim 2, characterized in that: The third mounting area (10c) extends from the third side (13) to the fourth side (14) and is located on the second side (12); The third functional module (40) includes a main control module.

4. The DC frequency conversion electric control integrated board according to claim 2, characterized in that: A fourth mounting area (10d) is provided on the substrate (10), and the fourth mounting area (10d) is provided between the first mounting area (10a) and the third side (13); The DC frequency conversion electric control integrated board further includes a PFC inductor (50), and the PFC inductor (50) is arranged in the fourth installation area (10d).

5. The DC frequency conversion electric control integrated board according to claim 4, characterized in that: The substrate (10) is further provided with a fifth mounting area (10e), the fifth mounting area (10e) being arranged between the third side (13) and the first side (11), and being located on a side of the fourth mounting area (10d) away from the first mounting area (10a); The DC frequency conversion electric control integrated board further comprises a high-power module (60), and the high-power module (60) is arranged in the fifth installation area (10e).

6. The DC frequency conversion electric control integrated board according to claim 5, characterized in that: The high-power module (60) includes at least one of a rectifier circuit, a PFC boost circuit and an inverter circuit.

7. The DC frequency conversion electric control integrated board according to claim 5, characterized in that: The substrate (10) is further provided with a sixth mounting area (10f), the sixth mounting area (10f) being arranged on a side of the second mounting area (10b) away from the fourth mounting area (10d), and being located between the second mounting area (10b) and the third mounting area (10c); The DC frequency conversion electric control integrated board further comprises a heat dissipation drive module (70), and the heat dissipation drive module (70) is arranged in the sixth installation area (10f).

8. The DC frequency conversion electric control integrated board according to claim 5, characterized in that: The substrate (10) is further provided with a seventh mounting area (10g), the seventh mounting area being arranged on a side of the second mounting area (10b) away from the fourth mounting area (10d), and being located between the second mounting area (10b) and the third mounting area (10c); The DC frequency conversion electric control integrated board further comprises a switching power supply module (80), and the switching power supply module (80) is installed in the seventh installation area (10g).

9. The DC frequency conversion electric control integrated board according to claim 1, characterized in that: The second functional module (30) includes a capacitor.

10. An air conditioner, characterized in that: The invention comprises a casing and a DC frequency conversion electric control integrated board according to any one of claims 1 to 9 arranged in the casing.

Images