Crystalline silicon plate thickness detection equipment
Through the combination of non-contact laser displacement sensor and mobile device, the accuracy and damage problems of crystalline silicon sheet thickness detection are solved, and efficient and lossless thickness measurement is achieved.
Patent Information
- Application Number
- CN202422355606.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The prior art is difficult to efficiently and accurately detect the thickness of crystalline silicon sheets without damaging the material, and the detection accuracy of conventional methods is insufficient.
The non-contact laser displacement sensor is used in combination with the mobile device, and the comprehensive measurement of the crystalline silicon plate is achieved through the C-type scanning frame and the guide rail structure, avoiding direct contact, and using the mobile device to move in the X and Y directions for accurate measurement.
It realizes high-precision and non-destructive testing of crystalline silicon sheet thickness, reduces equipment costs, improves measurement efficiency and accuracy, and reduces damage to the sheet.
Smart Images
Figure CN223192329U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of non-contact laser thickness detection, in particular to a crystalline silicon plate thickness detection device. Background Art
[0002] Crystalline silicon thickness measurement is a crucial step in semiconductor manufacturing and the photovoltaic industry, directly impacting product quality and performance. A variety of methods are available for measuring crystalline silicon thickness, and the appropriate method can be selected based on the application scenario and accuracy requirements. Common methods include grinding and weighing.
[0003] Crystalline silicon sheets are inherently hard, brittle, and have low toughness, requiring high-precision thickness measurement. Conventional thickness measurement methods are not only prone to damage to the material itself, but also difficult to achieve accurate measurement. Laser displacement sensors, through non-contact measurement, effectively improve measurement accuracy and address these detection issues. Utility Model Content
[0004] In order to solve the technical problem of inconvenient thickness detection of crystalline silicon plate in the background technology, the purpose of this utility model is to provide a crystalline silicon plate thickness detection device that can solve the above problem.
[0005] The technical solution for achieving the purpose of the utility model is: a crystalline silicon plate thickness detection device, including a frame and a measuring platform installed on the frame, a C-shaped scanning frame is installed on one side of the measuring platform, the C-shaped scanning frame has a measuring slot with one end opening toward the measuring platform, and measuring sensors are fixed on the upper and lower sides of the open end of the measuring slot respectively, for detecting the thickness of the crystalline silicon plate on the measuring platform; a moving device is also provided on the frame, the C-shaped scanning frame is installed on the moving device, and the moving device drives the C-shaped scanning frame to move its position on the frame.
[0006] This solution provides a testing device that facilitates measuring the thickness of crystalline silicon sheets. Specifically, a measuring table is provided on a frame, and the crystalline silicon sheet is placed on the measuring table. A C-shaped scanning frame, installed on one side of the measuring table, has a measuring slot. The height of the measuring slot is greater than the sum of the thicknesses of the measuring table and the crystalline silicon sheet. The C-shaped scanning frame can move toward the measuring table, which is equivalent to the measuring table being able to extend into the measuring slot. Measuring sensors on the upper and lower sides of the opening of the measuring slot can then perform thickness detection. The measuring sensors can be of various types, such as laser displacement sensors, which can perform non-contact measurement. Because they are non-contact, they do not damage the crystalline silicon sheet or the sensors. To further facilitate the C-shaped scanning frame's measurement of the crystalline silicon sheet on the measuring table, a moving device is added to the machine table. The C-shaped scanning frame is mounted on the moving device and can move not only along the length of the crystalline silicon sheet, but also along the width of the crystalline silicon sheet, thereby increasing the measurement area and efficiency. This device has a simple structure and is easy to operate and control. It can significantly reduce the manufacturing cost of enterprise measurement equipment, improve measurement accuracy and efficiency, and reduce the problem of damage to the crystalline silicon sheet caused by the measuring equipment.
[0007] Furthermore, the moving device includes a first substrate and a second substrate. The first substrate is fixed to the frame, the second substrate is mounted on the first substrate for movement in the Y direction, and the C-type scanning frame is mounted on the second substrate for movement in the X direction. In other words, the second substrate can move in the Y direction on the first substrate, and the C-type scanning frame can move in the X direction on the second substrate. In this way, the C-type scanning frame can move in the length and width directions of the crystalline silicon plate on the measuring table, achieving omnidirectional measurement.
[0008] Furthermore, the first substrate is mounted with a Y-guide rail, and the second substrate is mounted on the Y-guide rail; the second substrate is mounted with an X-guide rail, and the C-type scanning frame is mounted on the X-guide rail. The specific movement structure of the second substrate on the first substrate and the C-type scanning frame on the first substrate can be various forms. In this solution, a guide rail is used. The second substrate and the C-type scanning frame are equipped with rollers that cooperate with the guide rails, which has a simple structure and is easy to operate.
[0009] Furthermore, a Y-direction motor is installed at the end of the Y-direction guide rail, and an X-direction motor is installed at the end of the X-direction guide rail to facilitate driving relative movement.
[0010] Furthermore, the first substrate and the second substrate are both made of marble, and the marble substrate can ensure the levelness of the entire device.
[0011] Furthermore, the frame is also equipped with an adsorption platform, on which the measuring platform is mounted. The adsorption platform is larger than the measuring platform. In other words, the adsorption platform secures the measuring platform by adsorption, and since its area is larger than the measuring platform, it can also adsorb the crystalline silicon plate, thereby securing the crystalline silicon plate, facilitating measurement and ensuring that the crystalline silicon plate does not move, thereby improving measurement accuracy.
[0012] Furthermore, a safety grating is installed on the frame to protect the operator.
[0013] Furthermore, a PC operating table is mounted on the frame, which is electrically connected to other functional components to facilitate operator control and use. The PC operating table can also be provided with components such as a power switch, an emergency stop button, a reset button, a loading button, a start button, and a signal light.
[0014] By adopting the above technical solution, the utility model has the following beneficial effects:
[0015] (1) The measuring slot on the movable C-type scanning frame is moved closer to the measuring table to measure the thickness of the crystalline silicon plate on the measuring table. The structure is simple and easy to operate;
[0016] (2) The C-type scanning frame is equipped with a measuring sensor, such as a laser displacement sensor, which can achieve accurate measurement without contact, thus preventing damage to the crystalline silicon plate;
[0017] (3) The moving device includes a first substrate, a second substrate, and guide rails installed on each substrate to realize the movement of the C-type scanning frame in the length and width directions of the crystalline silicon plate. The structure of the moving device is simple and flexible;
[0018] (4) The first substrate and the second substrate are both made of marble to ensure the levelness of the platform and reduce the impact of other factors on the measurement results. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to make the content of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings, wherein
[0020] Figure 1 This is a schematic diagram of the front structure of the detection equipment in this utility model;
[0021] Figure 2 This is a top view of the detection equipment in this utility model;
[0022] Figure 3 This is a schematic diagram of the back structure of the detection device in this utility model.
[0023] The numbers in the accompanying drawings are: 1 frame; 2 measuring table; 3 C-type scanning frame; 4 measuring slot; 5 measuring sensor; 6 first substrate; 7 second substrate; 8Y guide rail; 9X guide rail; 10Y motor; 11X motor; 12 adsorption platform; 13 safety grating; 14 PC operating table; 15 power switch; 16 emergency stop button; 17 reset button; 18 loading button; 19 start button; 20 signal light. DETAILED DESCRIPTION
[0024] Example:
[0025] like Figure 1-Figure 2 As shown, this embodiment provides a crystalline silicon plate thickness detection device, including a frame 1 and a measuring table 2 installed on the frame 1, a C-type scanning frame 3 is installed on one side of the measuring table 2, and the C-type scanning frame 3 has a measuring slot 4 with one end opening toward the measuring table 2, and measuring sensors 5 are fixed on the upper and lower sides of the open end of the measuring slot 4 respectively, for detecting the thickness of the crystalline silicon plate on the measuring table 2; a moving device is also provided on the frame 1, and the C-type scanning frame 3 is installed on the moving device, and the moving device drives the C-type scanning frame 3 to move its position on the frame 1. This solution provides a detection device that is convenient for detecting the thickness of a plate made of crystalline silicon. Specifically, a measuring table 2 is set on a frame 1, and the crystalline silicon plate is placed on the measuring table 2; a C-type scanning frame 3 is set on one side of the measuring table 2 and has a measuring slot 4. The height of the measuring slot 4 is greater than the sum of the thicknesses of the measuring table 2 and the crystalline silicon plate. The C-type scanning frame 3 can move toward the measuring table 2, which is equivalent to the measuring table 2 being able to extend into the measuring slot 4. The measuring sensors 5 on the upper and lower sides of the open end of the measuring slot 4 can then perform thickness detection. The measuring sensor 5 can be of various styles, such as a laser displacement sensor, which can perform non-contact measurement. Since it is non-contact, it will not cause damage to the crystalline silicon plate and the sensor. In order to further facilitate the measurement of the crystalline silicon plate on the measuring table 2 by the C-type scanning frame 3, a moving device is added to the machine. The C-type scanning frame 3 is installed on the moving device. It can move not only along the length direction of the crystalline silicon plate, but also along the width direction of the crystalline silicon plate, thereby improving the measurement area and efficiency. This equipment has a simple structure and is easy to operate and control. It can greatly reduce the manufacturing cost of enterprise measurement equipment, improve measurement accuracy and efficiency, and reduce the damage caused by measurement equipment to crystalline silicon plates.
[0026] Preferably, the moving device includes a first base plate 6 and a second base plate 7. The first base plate 6 is fixed to the frame 1, the second base plate 7 is mounted on the first base plate 6 for movement in the Y direction, and the C-type scanning frame 3 is mounted on the second base plate 7 for movement in the X direction. That is, the second base plate 7 can move in the Y direction on the first base plate 6, and the C-type scanning frame 3 can move in the X direction on the second base plate 7. This allows the C-type scanning frame 3 to move in both the length and width directions of the crystalline silicon plate on the measuring table 2, achieving omnidirectional measurement. A Y-direction guide rail 8 is mounted on the first base plate 6, on which the second base plate 7 is mounted; an X-direction guide rail 9 is mounted on the second base plate 7, on which the C-type scanning frame 3 is mounted. The specific moving structure of the second base plate 7 on the first base plate 6 and the C-type scanning frame 3 on the first base plate 6 can take various forms. In this embodiment, a guide rail is used. Rollers that cooperate with the guide rails are provided on the second base plate 7 and the C-type scanning frame 3, resulting in a simple structure and easy operation. A Y-direction motor 10 is installed at the end of the Y-direction guide rail 8 , and an X-direction motor 11 is installed at the end of the X-direction guide rail 9 , so as to drive relative movement.
[0027] Preferably, the first substrate 6 and the second substrate 7 are both made of marble, and the marble substrate can ensure the levelness of the entire device.
[0028] Preferably, the frame 1 is further mounted with an adsorption platform 12, on which the measuring platform 2 is mounted, and the adsorption platform 12 is larger than the measuring platform 2. In other words, the adsorption platform 12 secures the measuring platform 2 by adsorption, and since its area is larger than the measuring platform 2, it can also adsorb the crystalline silicon plate, thereby securing the crystalline silicon plate, facilitating measurement and ensuring that the crystalline silicon plate does not move, thereby improving measurement accuracy.
[0029] like Figure 3 As shown, the frame 1 is also equipped with a safety light curtain 13 to protect the operator. A PC console 14 is also mounted on the frame 1. This PC console 14 is electrically connected to other functional components, facilitating operator control. Furthermore, the PC console 14 may be equipped with a power switch 15, an emergency stop button 16, a reset button 17, a loading button 18, a start button 19, and a signal light 20.
[0030] Working Principle: First, place the crystalline silicon sheet onto the measuring table 2. The adsorption platform 12 adsorbs and secures the sheet. Then, based on the measurement position requirements, the X-axis motor 11 and the Y-axis motor 10 respectively drive the C-type scanning frame 3 to adjust its X-axis position on the second substrate 7 and its Y-axis position on the first substrate 6. After adjustment, the crystalline silicon substrate is snapped into the measuring slot 4. The measuring sensors 5 on the upper and lower sides of the measuring slot 4 accurately measure the thickness of the crystalline silicon sheet. Because the height of the measuring slot 4 is greater than the thickness of the measuring table 2 and the crystalline silicon sheet, the measuring sensors 5 do not touch the crystalline silicon sheet, preventing damage to the sheet.
[0031] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A crystalline silicon plate thickness detection device, characterized in that: The invention comprises a frame (1) and a measuring platform (2) mounted on the frame (1); a C-type scanning frame (3) is mounted on one side of the measuring platform (2); the C-type scanning frame (3) has a measuring slot (4) with one end opening toward the measuring platform (2); measuring sensors (5) are fixed on the upper and lower sides of the opening end of the measuring slot (4) for detecting the thickness of the crystalline silicon plate on the measuring platform (2); a moving device is also provided on the frame (1); the C-type scanning frame (3) is mounted on the moving device; and the moving device drives the C-type scanning frame (3) to move its position on the frame (1).
2. The crystalline silicon plate thickness detection device according to claim 1, characterized in that: The moving device comprises a first substrate (6) and a second substrate (7), wherein the first substrate (6) is fixed on the frame (1), the second substrate (7) is mounted on the first substrate (6) so as to be movable along the Y direction, and the C-type scanning frame (3) is mounted on the second substrate (7) so as to be movable along the X direction.
3. The crystalline silicon plate thickness detection device according to claim 2, characterized in that: A Y-direction guide rail (8) is mounted on the first substrate (6), and the second substrate (7) is mounted on the Y-direction guide rail (8); an X-direction guide rail (9) is mounted on the second substrate (7), and the C-type scanning frame (3) is mounted on the X-direction guide rail (9).
4. The crystalline silicon plate thickness detection device according to claim 3, characterized in that: A Y-direction motor (10) is installed at the end of the Y-direction guide rail (8), and an X-direction motor (11) is installed at the end of the X-direction guide rail (9).
5. The crystalline silicon plate thickness detection device according to claim 3, characterized in that: The first substrate (6) and the second substrate (7) are both made of marble.
6. The crystalline silicon plate thickness detection device according to claim 1, characterized in that: An adsorption platform (12) is also installed on the frame (1), and the measuring platform (2) is installed on the adsorption platform (12), and the adsorption platform (12) is larger than the measuring platform (2).
7. The device for detecting the thickness of a crystalline silicon plate according to claim 1, characterized in that: A safety grating (13) is also installed on the frame (1).
8. The device for detecting the thickness of a crystalline silicon plate according to claim 1, characterized in that: A PC operating table (14) is also installed on the frame (1), and the PC operating table (14) is electrically connected to other functional components.