Multifunctional testing device for electronic products

Abstract

A multifunctional testing device for electronic products comprises a module placement frame, a core CPU processing board card, a system daughter card PCB and at least two function daughter card PCBs, the module placement frame comprises a backboard PCB and a guide structure column, the backboard PCB and the guide structure column define at least three placement cavities, and PCIE slots are formed in the positions, on the inner sides of the placement cavities, of the backboard PCB; the system daughter card PCB is arranged in the placement cavity in a pluggable mode and comprises a system daughter card panel and a system daughter card body, and a PCIE plug is arranged on the system daughter card body; the functional daughter card PCBs are arranged in the placement cavities in a pluggable mode, and each functional daughter card PCB comprises an independent functional daughter card panel and a functional daughter card body; the functional daughter card body is provided with a PCIE plug. According to the utility model, the function daughter card PCB and the system daughter card PCB which can be freely inserted and pulled out in the placement cavity are arranged, and various test functions can be realized through the insertion and pulling switching of the function daughter card PCB and the system daughter card PCB; and the functional daughter card PCB and the system daughter card PCB are placed in the placement cavity, so that the occupied volume of the equipment is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of data acquisition and performance detection, in particular to a multifunctional testing device for electronic products. Background Art

[0002] Electronic product testing is a critical step in ensuring product quality and performance. It encompasses multiple aspects, including electromagnetic compatibility (EMC) testing, voltage safety testing, current safety testing, reliability testing, hardware testing, and fault prediction. With the continuous development of the electronics industry, the number of test items required for electronic products is increasing. However, the testing equipment currently available on the market generally has limited functionality. To meet testing requirements, multiple devices are often required. This results in high testing costs and requires significant floor space, failing to meet market and consumer demands for versatility and convenience.

[0003] Therefore, in view of the shortcomings of the existing technology, it is necessary to design a multifunctional testing device for electronic products to solve the above problems.

[0004] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solution of the present invention and facilitating the understanding of those skilled in the art. It cannot be assumed that the above contents are well known to those skilled in the art simply because they are explained in the background technology of the present invention. Utility Model Content

[0005] In order to overcome the above-mentioned deficiencies in the prior art, the present invention aims to provide a multifunctional testing device for electronic products.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a technical solution: a multifunctional testing device for electronic products, which is used to perform functional testing on electronic products, including a module mounting frame, a core CPU processing board, a system daughter card PCB, and at least two functional daughter card PCBs, wherein:

[0007] The module placement frame includes a backplane PCB and guide structure columns. The backplane PCB and the guide structure columns enclose at least three placement cavities. The backplane PCB inside the placement cavity is provided with a PCIE slot;

[0008] The core CPU processing board is plugged and fixed on the backplane PCB for information transmission and processing;

[0009] The system daughter card PCB is pluggable and arranged in the placement cavity, and is used to plan and layout the test device architecture. Its structure includes a system daughter card panel and a system daughter card body. The system daughter card body is provided with a PCIE plug that can be plugged into the PCIE slot.

[0010] The function daughter card PCB is pluggable and arranged in the placement cavity. Each function daughter card PCB includes an independent function daughter card panel and a function daughter card body. Different test functions can be achieved by plugging and unplugging multiple function daughter card PCBs of different models. The function daughter card body is provided with a PCIE plug that can be plugged into the PCIE slot.

[0011] The preferred technical solution is: at least one set of mutually symmetrical guide grooves are provided on both sides of the guide structure column, and the guide grooves are arranged parallel to the axial direction of the placement cavity; both sides of the system daughter card body and the functional daughter card PCB are slidably connected to the guide grooves.

[0012] The preferred technical solution is: there are two groups of guide grooves, so that one group of guide structure columns can guide the insertion and removal of two functional daughter card PCBs or system daughter card PCBs, so that the functional daughter card PCBs or system daughter card PCBs can be arranged in two layers, reducing space occupancy.

[0013] The preferred technical solution is: a fixing plate is further provided on the outside of the module placement frame, and both sides of the fixing plate are connected to the guide structure columns on both sides of the module placement frame for fixing with external equipment.

[0014] The preferred technical solution is: guide bars are provided on both sides of the fixed plate, and the guide bars are slidably connected to the guide grooves.

[0015] The preferred technical solution is: a positioning screw hole is provided on the guide structure column, a positioning through hole is provided on the fixing plate, and the positioning screw hole and the positioning through hole are fixed by screws.

[0016] The preferred technical solution is: the number of placement cavities is eight, the number of functional daughter card PCBs is seven, and the functional daughter card PCBs and the system daughter card PCBs can realize multiple test functions by plugging and unplugging and switching in the placement cavity.

[0017] The preferred technical solution is: a threaded hole is provided at the rear end of the guide structure column, and the system daughter card panel and the function daughter card panel are both rotatably connected with an auxiliary extraction screw, which can be connected to the threaded hole to fix the system daughter card panel and the function daughter card panel to the guide structure column; an auxiliary extraction rod is provided at the rear end of the auxiliary extraction screw to facilitate the plugging and unplugging operations of the system daughter card panel and the function daughter card panel.

[0018] The preferred technical solution is: ribs are provided between the guide structure columns to enhance the installation stability of the guide structure columns.

[0019] Due to the application of the above technical solution, the multifunctional testing device for electronic products provided by the present invention has the following advantages over the prior art:

[0020] (1) A functional daughter card PCB and a system daughter card PCB are provided which can be freely plugged in and out of the cavity. By plugging and unplugging the functional daughter card PCB, a variety of test functions can be realized;

[0021] (2) The backplane PCB and the guide structure column are used to enclose a placement cavity for placing the functional daughter card PCB and the system daughter card PCB, thereby reducing the volume occupied by the equipment;

[0022] (3) Guide grooves are provided on both sides of the guide structure column. The guide grooves are arranged parallel to the axial direction of the placement cavity, which facilitates the rapid plugging and unplugging of the functional daughter card PCB and the system daughter card PCB, reduces the difficulty of switching the test function, and improves the convenience of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of a multifunctional testing device for electronic products according to the present utility model;

[0024] Figure 2 This is an exploded diagram of a multifunctional testing device for electronic products according to the present utility model;

[0025] Figure 3 for Figure 2 A partial enlarged diagram of the area marked Ⅰ

[0026] Figure 4 for Figure 2 A partial enlarged diagram of the area marked Ⅱ

[0027] Figure 5 for Figure 2 A local enlarged schematic diagram of the area marked III.

[0028] In the above drawings, 1. Module placement frame; 11. Backplane PCB; 12. Guide structure column; 12a. Guide groove; 12b. Threaded hole; 12c. Rib plate; 13. PCIE slot; 14. Pull-out screw; 14a. Pull-out rod; 2. Core CPU processing board; 3. System daughter card PCB; 31. System daughter card panel; 32. System daughter card body; 4. Function daughter card PCB; 41. Function daughter card panel; 42. Function daughter card body; 5. Fixing plate; 51. Guide bar; 52. Positioning through hole. DETAILED DESCRIPTION

[0029] The following describes the implementation of the present invention through specific embodiments. People familiar with this technology can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0030] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or the orientations or positional relationships in which the utility model product is usually placed when in use. These are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present utility model. In addition, terms such as "horizontal", "vertical", and "overhanging" do not mean that the components are required to be absolutely horizontal or overhanging, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0031] It should also be noted that, in the description of the present invention, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0032] Example:

[0033] like Figure 1 As shown, the present invention discloses a multifunctional testing device for electronic products, including a module mounting frame 1, a core CPU processing board 2, a system daughter card PCB 3, seven functional daughter card PCBs 4, and a fixing plate 5. The main components of the present invention are described in detail below:

[0034] like Figure 1 、 Figure 2 、 Figure 3 and Figure 4 As shown, the module mounting frame 1 includes a backplane PCB 11 and guide columns 12. The backplane PCB 11 and the guide columns 12 enclose eight mounting cavities. A PCIE slot 13 is provided on the backplane PCB 11 inside the mounting cavity. Two sets of mutually symmetrical guide grooves 12a are provided on either side of the guide columns 12. The two sets of guide grooves 12a are arranged parallel to the longitudinal direction of the guide columns 12. Threaded holes 12b are provided at the rear ends of the guide columns 12. Auxiliary extraction screws 14 are rotatably connected to the system daughter card panel 31 and the functional daughter card panel 41. The auxiliary extraction screws 14 can be connected to the threaded holes 12b. The rear ends of the auxiliary extraction screws 14 are provided with auxiliary extraction rods 14a. Ribs 12c are provided between the guide columns 12, and positioning screw holes are provided on the guide columns 12.

[0035] like Figure 1、 Figure 2 、 Figure 3 and Figure 5 As shown, the fixing plate 5 is arranged on the outside of the module placement frame 1, and the two sides of the fixing plate 5 are connected to the guide structure columns 12 on both sides of the module placement frame 1; guide bars 51 are provided on both sides of the fixing plate 5, and the guide bars 51 are slidably connected to the guide grooves 12a; a positioning through hole 52 is provided on the fixing plate 5, and the positioning through hole 52 is fixed to the positioning screw hole by screws.

[0036] like Figure 1 and Figure 2 As shown, the core CPU processing board 2 is plugged and fixed on the backplane PCB 11 for transmitting and processing information.

[0037] like Figure 1 、 Figure 2 and Figure 4 As shown, the system daughter card PCB3 is pluggable and arranged in the placement cavity at the lower left of the module placement frame 1, and is used to plan and layout the detection device architecture. Its structure includes a system daughter card panel 31 and a system daughter card body 32. The two sides of the system daughter card body 32 can be slidably connected to the guide groove 12a, and the system daughter card body 32 is provided with a PCIE plug that can be plugged into the PCIE slot 13; the system daughter card panel 31 is rotatably connected to the auxiliary extraction screw 14, the auxiliary extraction screw 14 is connected to the threaded hole 12b, and the rear end of the auxiliary extraction screw 14 is provided with an auxiliary extraction rod 14a.

[0038] like Figure 1 and Figure 3 As shown, the functional daughter card PCB4 is pluggable and arranged in the placement cavity. Each functional daughter card PCB4 includes an independent functional daughter card panel 41 and a functional daughter card body 42, which are used to realize different test functions; the two sides of the functional daughter card body 42 can be slidably connected to the guide groove 12a, and the functional daughter card body 42 is provided with a PCIE plug that can be plugged into the PCIE slot 13; the functional daughter card panel 41 is also rotatably connected to an auxiliary extraction screw 14, and the auxiliary extraction screw 14 is connected to the threaded hole 12b.

[0039] refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 5 As shown, the principle of the present invention is as follows: information transmission and processing are realized through a core CPU processing board 2, the test architecture is planned and laid out through the system daughter card PCB3 in the lower left corner, and various test functions are realized through the plug-in switching combination of multiple different models of functional daughter cards PCB4, so as to meet the test requirements of multiple functions of electronic products through a single test device.

[0040] In summary, the utility model discloses a multifunctional testing device for electronic products, which can realize multiple testing functions by switching the functional daughter card PCB. The function switching is simple, the device is small in size, and the space occupied is low.

[0041] The above embodiments of the present invention are provided for illustrative purposes only to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by persons skilled in the art without departing from the spirit and technical concepts disclosed herein shall be covered by the claims of the present invention.

Claims

1. A multifunctional testing device for electronic products, characterized by: It comprises a module placement frame (1), a core CPU processing board (2), a system daughter card PCB (3) and at least two functional daughter card PCBs (4), wherein: The module placement frame (1) comprises a backplane PCB (11) and a guide structure column (12), wherein the backplane PCB (11) and the guide structure column (12) enclose at least three placement cavities, and a PCIE slot (13) is provided on the backplane PCB (11) inside the placement cavity; The core CPU processing board (2) is plugged and fixed on the backplane PCB (11) for transmitting and processing information; The system daughter card PCB (3) is pluggably arranged in the placement cavity and is used for planning and laying out the module test architecture. Its structure includes a system daughter card panel (31) and a system daughter card body (32). The system daughter card body (32) is provided with a PCIE plug that can be plugged into the PCIE slot (13); The functional daughter card PCB (4) is pluggably arranged in the placement cavity, and each functional daughter card PCB (4) comprises an independent functional daughter card panel (41) and a functional daughter card body (42); the functional daughter card body (42) is provided with a PCIE plug that can be plugged into the PCIE slot (13).

2. The multifunctional testing device for electronic products according to claim 1, characterized in that: At least one set of mutually symmetrical guide grooves (12a) are provided on both sides of the guide structure column (12), and the guide grooves (12a) are arranged parallel to the axial direction of the placement cavity; both sides of the system daughter card body (32) and the functional daughter card PCB (4) are slidably connected to the guide grooves (12a).

3. The multifunctional testing device for electronic products according to claim 2, characterized in that: There are two groups of guide grooves (12a).

4. The multifunctional testing device for electronic products according to claim 3, characterized in that: A fixing plate (5) is further provided on the outside of the module placement frame (1), and both sides of the fixing plate (5) are connected to the guide structure columns (12) on both sides of the module placement frame (1).

5. The multifunctional testing device for electronic products according to claim 4, characterized in that: Guide bars (51) are provided on both sides of the fixed plate (5), and the guide bars (51) are slidably connected to the guide grooves (12a).

6. The multifunctional testing device for electronic products according to claim 4, characterized in that: A positioning screw hole is provided on the guide structure column (12), and a positioning through hole (52) is provided on the fixing plate (5), and the positioning screw hole and the positioning through hole (52) are fixed by screws.

7. The multifunctional testing device for electronic products according to claim 1, characterized in that: The number of the placement cavities is eight, and the number of the functional daughter card PCBs (4) is seven.

8. The multifunctional testing device for electronic products according to claim 1, characterized in that: The rear end of the guide structure column (12) is provided with a threaded hole (12b); the system sub-card panel (31) and the functional sub-card panel (41) are both rotatably connected with an auxiliary extraction screw (14); the auxiliary extraction screw (14a) can be connected to the threaded hole (12b); and the rear end of the auxiliary extraction screw (14) is provided with an auxiliary extraction rod (14).

9. The multifunctional testing device for electronic products according to claim 1, characterized in that: Rib plates (12c) are provided between the guide structure columns (12).

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