Vehicle-mounted sensor chip reliability test equipment

Abstract

The utility model discloses a vehicle-mounted sensor chip reliability test device, which comprises a chip thermal cycle test machine body, a display screen, a plurality of control buttons and a test bin, a storage box is arranged on the left side of the chip thermal cycle test machine body, and box covers are arranged on the two sides in the storage box. A storage mechanism is arranged in the storage box; the storage mechanism comprises a top plate, a storage box and a partition plate, the surface of the partition plate is fixedly connected with the inner wall of the storage box, and the bottom of the storage box is in contact with the top of the top plate. The problems that when a large number of vehicle-mounted sensor chips are subjected to thermal cycle testing, the vehicle-mounted sensor chips need to be continuously taken and placed, the physical power of workers is consumed, and the thermal cycle reliability testing efficiency of the vehicle-mounted sensor chips is affected are solved.

Description

Technical Field

[0001] The utility model relates to the field of chip reliability testing, in particular to a vehicle-mounted sensor chip reliability testing device. Background Art

[0002] A chip, also known as an integrated circuit, is a miniature electronic device or component. It is made on a small piece of semiconductor material through a series of complex processes to produce a large number of electronic components such as transistors, resistors, capacitors, etc., and connect them according to specific circuit functions. The chip has the advantages of small size, light weight, high performance, and strong reliability. It is widely used in many fields such as computers, communications, consumer electronics, automobiles, industrial control, etc.

[0003] After the chips in the vehicle-mounted sensors are produced, they need to undergo reliability testing. The reliability testing of the vehicle-mounted sensor chips includes thermal cycle testing, vibration testing, and salt spray testing. Most of the existing equipment for thermal cycle testing of vehicle-mounted sensor chips does not have a structure for temporary storage and protection of vehicle-mounted sensor chips. When performing thermal cycle testing on a large number of vehicle-mounted sensor chips, it is necessary to constantly move the vehicle-mounted sensor chips around, which consumes the physical strength of the staff and affects the efficiency of the thermal cycle reliability testing of the vehicle-mounted sensor chips. Utility Model Content

[0004] The main purpose of the utility model is to provide a vehicle-mounted sensor chip reliability testing device, which aims to solve the problem that most of the existing equipment for thermal cycle testing of vehicle-mounted sensor chips do not have a structure for temporary storage and protection of vehicle-mounted sensor chips. When performing thermal cycle testing on a large number of vehicle-mounted sensor chips, it is necessary to constantly move the vehicle-mounted sensor chips to be taken and placed, which consumes the physical strength of the staff and affects the efficiency of the thermal cycle reliability testing of the vehicle-mounted sensor chips.

[0005] To achieve the above objectives, the utility model proposes an on-vehicle sensor chip reliability testing device, which includes a chip thermal cycle tester body, a display screen, a plurality of control buttons, and a test chamber. A storage box is provided on the left side of the chip thermal cycle tester body, and a box cover is provided on both sides of the storage box. A storage mechanism is provided inside the storage box.

[0006] The storage mechanism includes a top plate, a storage box and a partition, the surface of the partition is fixedly connected to the inner wall of the storage box, the bottom of the storage box contacts the top of the top plate, and the bottom of the top plate contacts the bottom of the inner wall of the storage box.

[0007] Preferably, the front side and the rear side of the top of the top plate are fixedly connected to limit blocks, and the surface of the storage box is in close contact with the surface of the limit blocks.

[0008] Preferably, the four corners of the top of the top plate are fixedly connected to a rotating rack, and the interior of the rotating rack is rotatably connected to a roller.

[0009] Preferably, the front side and the rear side of the top of the storage box are both fixedly connected with pull rings.

[0010] Preferably, a sliding rod is fixedly connected to the bottom of the top plate, a through hole is opened inside the storage box, the bottom of the sliding rod passes through the storage box and extends to the bottom of the storage box, and the surface of the sliding rod is movably connected to the inside of the through hole.

[0011] Preferably, an electric telescopic rod is provided at the bottom of the sliding rod, the top of the telescopic end of the electric telescopic rod is fixedly connected to the bottom of the sliding rod, the bottom of the electric telescopic rod is fixedly connected to a fixing plate, and the right side of the fixing plate is fixedly connected to the left side of the chip thermal cycle tester body.

[0012] Preferably, the front and rear sides of the tops of the two opposite sides of the box covers are provided with spring hinges, the connection between the spring hinges and the storage box is rotatably connected by the spring hinges, and the bottoms of the opposite sides of the two box covers are both chamfered.

[0013] Preferably, an extension plate is fixedly connected to the right side of the storage box, and the right side of the extension plate is fixedly connected to the left side of the chip thermal cycle tester body.

[0014] The storage box can be moved to the outside of the storage box, and the pull ring can be held to pull the storage box upward until it is disengaged from the limit block, and the storage box can be moved to the centralized storage place of the vehicle-mounted sensor chips, and the vehicle-mounted sensor chips can be loaded into the storage box for storage, and then the storage box can be reset, and then the telescopic end of the electric telescopic rod can be controlled to move downward, and the storage box can be moved to the inside of the storage box for storage, and the torsional rebound of the spring hinge can protect the storage box and the vehicle-mounted sensor chips inside the storage box inside the storage box. When the sensor chip undergoes thermal cycle reliability test, the staff does not need to move around. They only need to control the telescopic end of the electric telescopic rod to extend upward to take out the vehicle-mounted sensor chip inside the storage box and put it into the test chamber for thermal cycle reliability test. By controlling the telescopic end of the electric telescopic rod to move downward, the storage box and the vehicle-mounted sensor to be tested inside the storage box can be moved to the storage box for storage. This avoids the problem that most existing equipment for thermal cycle testing of vehicle-mounted sensor chips does not have a structure for temporary storage and protection of vehicle-mounted sensor chips. When performing thermal cycle testing on a large number of vehicle-mounted sensor chips, it is necessary to constantly move around to take and place the vehicle-mounted sensor chips, which consumes the physical strength of the staff and affects the efficiency of thermal cycle reliability testing of vehicle-mounted sensor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0017] Figure 2 This is a schematic diagram of the three-dimensional connection between the storage box and the box cover in an embodiment of the present utility model;

[0018] Figure 3 This is a schematic diagram of the three-dimensional connection between the storage box and the extension plate in an embodiment of the present utility model;

[0019] Figure 4 This is a three-dimensional exploded schematic diagram of the storage box and the top plate in an embodiment of the present utility model;

[0020] Figure 5 This is a schematic diagram of the three-dimensional connection between the box cover and the spring hinge in the embodiment of the utility model;

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure inside the storage box in an embodiment of the present utility model.

[0022] Explanation of the accompanying figures: 1. Chip thermal cycle tester body; 2. Display screen; 3. Control button; 4. Test chamber; 5. Electric telescopic rod; 6. Box cover; 7. Storage box; 8. Fixed plate; 9. Storage mechanism; 901. Top plate; 902. Storage box; 903. Partition; 10. Sliding rod; 11. Extension plate; 12. Limit block; 13. Roller; 14. Turntable; 15. Pull ring; 16. Spring hinge; 17. Through hole.

[0023] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0026] In addition, the terms "first," "second," and so on, used in this utility model are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0027] Moreover, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0028] The utility model provides a vehicle-mounted sensor chip reliability testing device, which aims to solve the problem that most existing devices for performing thermal cycle tests on vehicle-mounted sensor chips do not have a structure for temporarily storing and protecting the vehicle-mounted sensor chips. When performing thermal cycle tests on a large number of vehicle-mounted sensor chips, the vehicle-mounted sensor chips need to be constantly moved around to be taken and placed, which consumes the physical strength of the staff and affects the efficiency of the thermal cycle reliability test of the vehicle-mounted sensor chips.

[0029] like Figure 1-6 As shown, an embodiment of the present invention provides an on-vehicle sensor chip reliability testing device, comprising a chip thermal cycle tester body 1, a display screen 2, a plurality of control buttons 3, and a test chamber 4. A storage box 7 is provided on the left side of the chip thermal cycle tester body 1, and a box cover 6 is provided on both sides of the storage box 7. A storage mechanism 9 is provided inside the storage box 7;

[0030] The storage mechanism 9 includes a top plate 901, a storage box 902 and a partition 903. The surface of the partition 903 is fixedly connected to the inner wall of the storage box 902. The bottom of the storage box 902 contacts the top of the top plate 901. The bottom of the top plate 901 contacts the bottom of the inner wall of the storage box 7.

[0031] When the storage box 902 is moved to the outside of the storage box 7, the pull ring 15 can be held and the storage box 902 can be pulled upward to disengage from the limit block 12, and the storage box 902 can be moved to the centralized storage place of the vehicle-mounted sensor chips, and the vehicle-mounted sensor chips can be loaded into the storage box 902 for storage, and then the storage box 902 can be reset, and then the telescopic end of the electric telescopic rod 5 can be controlled to move downward, and then the storage box 902 can be moved to the inside of the storage box 7 for storage, and the torsional rebound of the spring hinge 16 can move the storage box 902 and the vehicle-mounted sensor chips inside the storage box 902. The chip is protected inside the storage box 7. When the vehicle-mounted sensor chip needs to be tested for thermal cycle reliability, the staff does not need to move around. They only need to control the telescopic end of the electric telescopic rod 5 to extend upward to take out the vehicle-mounted sensor chip inside the storage box 902 and put it into the test chamber 4 for thermal cycle reliability test. By controlling the telescopic end of the electric telescopic rod 5 to move downward, the storage box 902 and the vehicle-mounted sensor to be tested inside the storage box 902 can be moved to the storage box 7 for storage. This avoids the problem that most existing equipment for thermal cycle testing of vehicle-mounted sensor chips does not have a structure for temporary storage and protection of vehicle-mounted sensor chips. When performing thermal cycle testing on a large number of vehicle-mounted sensor chips, it is necessary to constantly move around to take and place the vehicle-mounted sensor chips, which consumes the physical strength of the staff and affects the efficiency of thermal cycle reliability testing of the vehicle-mounted sensor chips.

[0032] Please refer to Figure 3 and Figure 4 The front and rear sides of the top of the top plate 901 are fixedly connected to the limiting blocks 12, and the surface of the storage box 902 is in close contact with the surface of the limiting blocks 12. In this embodiment, by moving the storage box 902 until the surface of the storage box 902 is in close contact with the surface of the limiting blocks 12, the limiting blocks 12 can limit the storage box 902, thereby achieving the effect of limiting the storage box 902.

[0033] For further information, please refer to Figure 4 The four corners of the top plate 901 are fixedly connected to a rotating frame 14, and the interior of the rotating frame 14 is rotatably connected to the roller 13. In this embodiment, the roller 13 is rotatably connected to the interior of the rotating frame 14, so that the roller 13 can rotate, making it convenient to push the box cover 6 upward to open it, thereby achieving the effect of facilitating the lifting of the box cover 6.

[0034] Please continue to refer to Figure 4The front and rear sides of the storage box 902 tops are all fixedly connected with a pull ring 15. In the present embodiment, the storage box 902 can be conveniently pulled by holding the pull ring 15, thereby achieving the effect of conveniently pulling the storage box 902.

[0035] Please refer to Figure 4 and Figure 6 The bottom of the top plate 901 is fixedly connected to a slide rod 10. A through hole 17 is formed inside the storage box 7. The bottom of the slide rod 10 passes through the storage box 7 and extends to the bottom of the storage box 7. The surface of the slide rod 10 is movably connected to the inside of the through hole 17. In this embodiment, the slide rod 10 slides inside the through hole 17 to facilitate the lifting and movement of the top plate 901, thereby achieving the effect of facilitating the movement of the top plate 901.

[0036] Also, please refer to Figure 2 、 Figure 4 and Figure 6 An electric telescopic rod 5 is disposed at the bottom of the slide bar 10. The top of the telescopic end of the electric telescopic rod 5 is fixedly connected to the bottom of the slide bar 10. The bottom of the electric telescopic rod 5 is fixedly connected to a fixing plate 8. The right side of the fixing plate 8 is fixedly connected to the left side of the chip thermal cycle tester body 1. In this embodiment, by controlling the upward and downward movement of the telescopic end of the electric telescopic rod 5, the slide bar 10, the top plate 901, and the storage box 902 on top of the top plate 901 can be moved, achieving the effect of conveniently moving the storage box 902.

[0037] Please refer to Figure 2 and Figure 5 Spring hinges 16 are provided on the front and rear sides of the tops of the two opposite sides of the two lids 6. The connection between the spring hinges 16 and the storage box 7 is rotatably connected by the spring hinges 16. The bottoms of the two opposite sides of the lids 6 are both chamfered. In this embodiment, the lids 6 are connected to the storage box 7 by the spring hinges 16. This facilitates the roller 13 to push the lid 6 upward, and the spring hinges 16 drive the lid 6 to return to its original position through torque to seal the storage box 7. By providing chamfers on the bottoms of the two opposite sides of the lids 6, the lids 6 can be easily rotated and opened, avoiding the two lids 6 from squeezing each other, thereby achieving the effect of driving the lid 6 to return to its original position.

[0038] Also, please refer to Figure 3 An extension plate 11 is fixedly connected to the right side of the storage box 7, and the right side of the extension plate 11 is fixedly connected to the left side of the chip thermal cycle tester body 1. In this embodiment, the extension plate 11 creates a distance between the chip thermal cycle tester body 1 and the storage box 7, which allows for sufficient opening space for the box cover 6, achieving the effect of facilitating the opening of the box cover 6.

[0039] It should be noted that the chip thermal cycle tester is an existing published mature technology and will not be described in detail here.

[0040] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the contents of the present invention specification and drawings, or direct / indirect application in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A vehicle-mounted sensor chip reliability testing device, characterized in that: The vehicle-mounted sensor chip reliability testing equipment comprises a chip thermal cycle tester body (1), a display screen (2), a plurality of control buttons (3) and a test chamber (4); a storage box (7) is provided on the left side of the chip thermal cycle tester body (1); box covers (6) are provided on both sides of the storage box (7); and a storage mechanism (9) is provided inside the storage box (7); The storage mechanism (9) comprises a top plate (901), a storage box (902) and a partition (903), wherein the surface of the partition (903) is fixedly connected to the inner wall of the storage box (902), the bottom of the storage box (902) contacts the top of the top plate (901), and the bottom of the top plate (901) contacts the bottom of the inner wall of the storage box (7).

2. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: The front side and the rear side of the top of the top plate (901) are both fixedly connected to the limiting block (12), and the surface of the storage box (902) is in close contact with the surface of the limiting block (12).

3. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: The four corners of the top of the top plate (901) are fixedly connected to a rotating rack (14), and the interior of the rotating rack (14) is rotatably connected to a roller (13).

4. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: Pull rings (15) are fixedly connected to the front and rear sides of the top of the storage box (902).

5. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: The bottom of the top plate (901) is fixedly connected to a slide rod (10), a through hole (17) is provided inside the storage box (7), the bottom of the slide rod (10) passes through the storage box (7) and extends to the bottom of the storage box (7), and the surface of the slide rod (10) is movably connected to the inside of the through hole (17).

6. The vehicle-mounted sensor chip reliability testing equipment according to claim 5, characterized in that: An electric telescopic rod (5) is provided at the bottom of the slide rod (10), the top of the telescopic end of the electric telescopic rod (5) is fixedly connected to the bottom of the slide rod (10), the bottom of the electric telescopic rod (5) is fixedly connected to a fixing plate (8), and the right side of the fixing plate (8) is fixedly connected to the left side of the chip thermal cycle tester body (1).

7. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: The front and rear sides of the tops of the two box covers (6) on opposite sides are both provided with spring hinges (16), and the connection between the spring hinges (16) and the storage box (7) is rotatably connected through the spring hinges (16). The bottoms of the two box covers (6) on opposite sides are both provided with chamfers.

8. The vehicle-mounted sensor chip reliability testing equipment according to claim 1, characterized in that: An extension plate (11) is fixedly connected to the right side of the storage box (7), and the right side of the extension plate (11) is fixedly connected to the left side of the chip thermal cycle tester body (1).

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