Pressure-sensitive module and electronic product

Abstract

The utility model relates to a pressure-sensitive module and an electronic product, which are characterized in that a first pressure-sensitive component and a second pressure-sensitive component are respectively arranged on a first mounting framework and a second mounting framework which are separated from each other, so that the first pressure-sensitive component and the second pressure-sensitive component can be in signal connection with a feedback component arranged on the first mounting framework; in the using process of the pressure sensing module, the first pressure sensing assembly and the second pressure sensing assembly which are arranged at different positions can cause feedback of the feedback assembly, and therefore the problem that multiple modules are needed for achieving pressure recognition and vibration feedback at different positions can be solved only through one feedback assembly. The pressure-sensitive module is additionally arranged on the electronic product, so that the number of feedback components is reduced. Compared with the prior art, the pressure sensing module disclosed by the utility model can realize the purpose of realizing pressure identification feedback at different positions only through one module. According to the electronic product disclosed by the invention, the purpose of reducing the manufacturing cost of the electronic product can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of pressure sensors, in particular to a pressure sensing module and an electronic product. Background Art

[0002] There are numerous solutions available on the market for force touch and feedback technology. For example, force touch solutions primarily utilize displacement sensors and resistive pressure sensors, while vibration feedback solutions primarily utilize linear resonator (LRA) motors, piezoelectric ceramic motors, and electromagnet vibration units. Different products and manufacturers can pair these solutions together to create a customized force touch feedback solution based on their specific positioning and needs.

[0003] With the continuous development of current technology and the continuous iteration of products, a type of force touch feedback technology has been applied to electronic products, and is constantly pursuing thinness and lightness, such as the touchpad components of laptops / Pads. Of course, there are many other application scenarios that also require the above-mentioned thin and light force touch feedback technology.

[0004] In current technology, the sensing function and feedback function are often realized through the same module. When an electronic product needs to realize multiple pressure recognition at different positions, it needs to use multiple modules. For electronic products with low requirements for feedback function, such a setting will increase the manufacturing cost of the electronic product. Utility Model Content

[0005] In order to solve the defect that multiple modules with sensing and feedback functions need to be used when realizing pressure recognition at different positions, the present utility model proposes a pressure sensing module.

[0006] The technical solution adopted by the present invention is a pressure sensing module, including a first mounting frame and at least one second mounting frame arranged separately, the first mounting frame is connected to a feedback component and a first pressure sensing component, the second mounting frame is connected to a second pressure sensing component, and the first pressure sensing component and the second pressure sensing component are both connected to the feedback component signal.

[0007] Preferably, the second pressure sensing component includes a pressure sensing unit, and the pressure sensing unit is connected to the feedback component via a control unit signal.

[0008] Preferably, the second pressure sensing component includes a flexible circuit board and a pressure sensing unit, the second mounting frame is connected to the flexible circuit board, and the pressure sensing unit is arranged on the flexible circuit board.

[0009] Preferably, the flexible circuit board has a protruding end, and a driving communication interface connected to the feedback component signal is provided at the protruding end.

[0010] Preferably, the second mounting frame is a bar-shaped structure.

[0011] Preferably, the two second pressure-sensing components are respectively arranged at two ends of the strip structure.

[0012] Preferably, the strip structure has a protrusion, and the second pressure sensing component is arranged at the protrusion.

[0013] Preferably, the second mounting frame has an elastic support member, and the elastic support member is located on one side of the second pressure sensing component and is arranged close to the second pressure sensing component.

[0014] Preferably, the first mounting frame and the second mounting frame are arranged side by side.

[0015] In order to solve the defect of increased manufacturing cost of electronic products when multiple modules are provided, the present invention provides an electronic product.

[0016] An electronic product includes the above-mentioned pressure sensing module.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The present application discloses a pressure-sensing module, in which a first pressure-sensing component and a second pressure-sensing component are respectively provided on a first mounting frame and a second mounting frame separated from each other, so that the first pressure-sensing component and the second pressure-sensing component can both be signal-connected to a feedback component provided on the first mounting frame, so that during use of the pressure-sensing module, the first pressure-sensing component and the second pressure-sensing component provided at different positions can both induce feedback from the feedback component, thereby only requiring one feedback component to solve the problem of requiring multiple modules to realize pressure recognition and vibration feedback at different positions.

[0019] Compared with the prior art, the pressure sensing module disclosed in the present application can achieve the purpose of realizing pressure recognition feedback at different positions by only using one module.

[0020] The present application also discloses an electronic product including the above-mentioned pressure sensing module. By adding the pressure sensing module to the electronic product, the number of feedback components is reduced.

[0021] Compared with the prior art, the electronic product disclosed in this application can achieve the purpose of reducing the manufacturing cost of electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present invention will be described in detail below with reference to the embodiments and accompanying drawings, wherein:

[0023] Figure 1 A schematic structural diagram of a pressure sensing module provided according to an embodiment of the present utility model is shown;

[0024] Figure 2 Shown according to Figure 1 Another embodiment of a second mounting frame in a pressure sensing module is provided;

[0025] Figure 3 Shown according to Figure 1 Another embodiment of a second mounting frame in a pressure sensing module is provided.

[0026] Description of labels:

[0027] 10. First mounting frame; 11. Feedback assembly; 12. First pressure sensing assembly; 13. Coil; 14. Soft magnetic mover;

[0028] 20. Second mounting frame; 21. Second pressure sensing component; 22. Protrusion;

[0029] 30. Flexible circuit board; 31. Extended end; 32. Drive communication interface;

[0030] 40. Pressure sensing unit;

[0031] 50. Elastic support member;

[0032] 60. Fixed structure. DETAILED DESCRIPTION

[0033] To make the objectives, technical solutions, and advantages of the present invention more apparent, embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components having the same or similar functions. The embodiments described below with reference to the accompanying drawings are illustrative and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0034] The utility model discloses a pressure sensing module, including a first mounting frame 10 and at least one second mounting frame 20 that are separately arranged. The first mounting frame 10 is connected to a feedback component 11 and a first pressure sensing component 12, and the second mounting frame 20 is connected to a second pressure sensing component 21. The first pressure sensing component 12 and the second pressure sensing component 21 are both signal-connected to the feedback component 11.

[0035] By respectively providing a first pressure sensing component 12 and a second pressure sensing component 21 on a first mounting frame 10 and a second mounting frame 20 that are separated from each other, the first pressure sensing component 12 and the second pressure sensing component 21 can both be signal-connected to the feedback component 11 provided on the first mounting frame 10. This allows the first pressure sensing component 12 and the second pressure sensing component 21 provided at different positions of the pressure sensing module to both induce feedback from the feedback component 11 during use. This allows only one feedback component 11 to resolve the problem of requiring multiple modules for pressure recognition and vibration feedback at different positions. Compared to the prior art, the pressure sensing module disclosed in this application can achieve the purpose of pressure recognition and feedback at different positions using only one module.

[0036] Specifically, the first pressure sensing component 12 and the second pressure sensing component 21 are used to obtain the user's pressure signal, and the feedback component 11 is used to provide feedback based on the identified pressure signal, thereby achieving interaction with the user.

[0037] The number of the second mounting frames 20 can be determined according to the size of the usage scenario. When the screen is larger, the number of the second mounting frames 20 can be increased, and the power of the feedback component 11 can be increased.

[0038] In addition, the signal connection can be a wired connection or a wireless connection. The wired connection can make the signal transmission more stable, while the wireless connection can place the first mounting frame 10 and the second mounting frame 20 at a greater distance.

[0039] In some embodiments, the second pressure sensing component 21 includes a pressure sensing unit 40 , which is connected to the feedback component 11 via a control unit.

[0040] It should be noted that the pressure sensing unit 40 is connected to the feedback component 11 through the control unit, rather than directly to the feedback component 11. This allows for a more diverse arrangement of the second mounting frame 20, enabling differentiated processing based on the layout of the product's internal electronic component circuits, resulting in a higher degree of adaptability. This also avoids redundant wiring and increases the size of electronic components.

[0041] In some embodiments, the second pressure sensing assembly 21 includes a flexible circuit board 30 and a pressure sensing unit 40 . The second mounting frame 20 is connected to the flexible circuit board 30 , and the pressure sensing unit 40 is disposed on the flexible circuit board 30 .

[0042] Specifically, the second pressure sensing component 21 includes a flexible circuit board 30 and a pressure sensing unit 40. By selecting the flexible circuit board 30, the pressure sensing module can be made thinner and lighter.

[0043] In some specific embodiments, the flexible circuit board 30 has a protruding end 31 , and a driving communication interface 32 connected to the feedback component 11 by signal is provided at the protruding end 31 .

[0044] It should be noted that the flexible circuit board 30 has an extension 31. The configuration of the extension 31 of the flexible circuit board 30 allows designers to adjust the position of the drive communication interface 32 by adjusting the extension 31, thereby improving the adaptability of the pressure sensing module. The drive communication structure is used for signal connection with the feedback component 11.

[0045] In some embodiments, the second mounting frame 20 is a bar-shaped structure.

[0046] The second mounting frame 20 is a bar-shaped structure, which occupies a smaller space, thereby facilitating miniaturization and lightweighting of the pressure sensing module.

[0047] In some specific embodiments, the two second pressure sensing components 21 are respectively disposed at two ends of the strip structure.

[0048] Specifically, two second pressure sensing components 21 are provided, which are respectively arranged at both ends of the strip structure, so that a larger pressure sensing range can be obtained at the position of the second mounting frame 20, and the sensitivity of the pressure sensing module can also be improved.

[0049] In some more specific embodiments, the strip structure has a protruding portion 22 , and the second pressure sensing component 21 is disposed at the protruding portion 22 .

[0050] It should be noted that the protrusions 22 are provided on the bar structure. The arrangement of the protrusions 22 can be adjusted to match the number of second pressure-sensing components 21 to be placed. The arrangement of the protrusions 22 can allow the bar structure to have a variety of shapes. At the same time, when the second pressure-sensing components 21 are placed on the protrusions 22, the user's pressure will not cause significant deformation to the overall structure of the bar structure.

[0051] In some embodiments, the second mounting frame 20 has an elastic support member 50 . The elastic support member 50 is located on one side of the second pressure sensing component 21 and is disposed close to the second pressure sensing component 21 .

[0052] Specifically, the second mounting frame 20 includes an elastic support member 50, which is located on one side of the second pressure sensing assembly 21. The elastic support member 50 has a certain thickness, thereby ensuring a certain gap between the second mounting frame 20 and the surface on which it is to be installed, thereby protecting the elastic support member 50 from damage. Furthermore, the elastic support member 50 is positioned close to the second pressure sensing assembly 21, so that deformation of the second mounting frame 20 around the elastic support member 50 is minimized, further protecting the elastic support member 50 from damage.

[0053] In some embodiments, the first mounting frame 10 and the second mounting frame 20 are arranged side by side.

[0054] It should be noted that, in order to obtain a uniform pressure-sensing signal, the first mounting frame 10 and the second mounting frame 20 are arranged side by side.

[0055] In a particularly specific embodiment, the pressure sensing module includes a pressure-sensing vibration feedback module and a simple pressure sensing module. The pressure-sensing vibration feedback module, as an integrated unit, includes an elastic support pad, a first mounting frame 10, a pressure sensing unit 40, a coil 13, a soft magnetic mover 14, a drive communication interface 32, an integrated hardware FPC, and a mechanical connection fixing structure 60 (which can be, but is not limited to, a screw hole or a nut).

[0056] The elastic support pad on the pressure-sensing vibration feedback module is connected to the touch panel by gluing, and the soft magnetic mover 14 is fixed to the touch panel by gluing. The coil 13 is wound around the teeth of the first mounting frame 10. The number of teeth can be one or more, and the number of coils 13 can also be one or more.

[0057] The interface of coil 13 is electrically connected to the integrated FPC. The pressure sensing unit 40 is attached to the cantilever beam of the first mounting frame 10 and electrically connected to the integrated FPC. The integrated FPC is bonded to the first mounting frame 10. The entire pressure-sensing vibration feedback module communicates with the control unit via the drive communication interface 32. The first mounting frame 10 is a magnetic frame.

[0058] The simple pressure sensing module includes an elastic support pad, a second mounting frame 20 , a pressure sensing unit 40 , a driving and communication interface, an FPC, and a mechanical connection and fixing structure 60 .

[0059] The elastic support pad on the simple pressure sensing module is connected to the touch panel by gluing, and the pressure sensing unit 40 is attached to the second mounting frame 20, which may or may not be magnetically conductive. The simple pressure sensing module communicates with the control unit via the drive communication interface 32.

[0060] The present application also discloses an electronic product, comprising the above-mentioned pressure sensing module.

[0061] By adding a pressure sensing module to the electronic product, the number of feedback components 11 is reduced. Compared with the prior art, the electronic product disclosed in this application can achieve the purpose of reducing the manufacturing cost of the electronic product.

[0062] In this specification, the use of terms such as "Embodiment 1," "this embodiment," or "in one embodiment" indicates that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example; furthermore, the specific features, structures, materials, or characteristics described may be appropriately combined in any one or more embodiments or examples.

[0063] In the description of this specification, the terms "connect," "install," "fix," "dispose," and "have" are to be understood in a broad sense. For example, "connect" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0064] In the description of this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article or apparatus comprising the element.

[0065] The above description of the embodiments is to facilitate ordinary technicians in this technical field to understand and apply the technology of this case. People familiar with the technology in this field can obviously make various modifications to these examples easily and apply the general principles described here to other embodiments without having to go through creative work. Therefore, this case is not limited to the above embodiments. Modifications to the following situations should all be within the scope of protection of this case: ① A new technical solution implemented based on the technical solution of this utility model and combined with existing common knowledge, the technical effect produced by the new technical solution does not exceed the technical effect of this utility model; ② The equivalent replacement of some features of the technical solution of this utility model with common technology, the technical effect produced is the same as the technical effect of this utility model; ③ The technical solution of this utility model can be expanded, and the substantive content of the expanded technical solution does not exceed the technical solution of this utility model; ④ The equivalent transformation made by using the contents of the description and drawings of this utility model is directly or indirectly applied to other related technical fields.

Claims

1. A pressure sensing module, characterized in that: It includes a first mounting frame and at least one second mounting frame that are separately arranged, the first mounting frame is connected to a feedback component and a first pressure sensing component, the second mounting frame is connected to a second pressure sensing component, and the first pressure sensing component and the second pressure sensing component are both connected to the feedback component signal.

2. A pressure sensing module according to claim 1, characterized in that: The second pressure sensing component includes a pressure sensing unit, and the pressure sensing unit is connected to the feedback component through a control unit.

3. The pressure sensing module according to claim 1, characterized in that: The second pressure sensing component includes a flexible circuit board and a pressure sensing unit. The second mounting frame is connected to the flexible circuit board, and the pressure sensing unit is arranged on the flexible circuit board.

4. The pressure sensing module according to claim 3, characterized in that: The flexible circuit board has a protruding end, and a driving communication interface connected to the feedback component signal is provided at the protruding end.

5. The pressure sensing module according to claim 1, characterized in that: The second installation frame is a bar structure.

6. The pressure sensing module according to claim 5, characterized in that: The two second pressure sensing components are respectively arranged at two ends of the strip structure.

7. The pressure sensing module according to claim 6, characterized in that: The strip structure has a protruding portion, and the second pressure sensing component is arranged at the protruding portion.

8. The pressure sensing module according to claim 1, characterized in that: The second installation frame has an elastic support member, and the elastic support member is located at one side of the second pressure sensing component and is arranged close to the second pressure sensing component.

9. The pressure sensing module according to claim 1, characterized in that: The first mounting frame and the second mounting frame are arranged side by side.

10. An electronic product, characterized in that: A pressure-sensing module comprising any one of claims 1 to 9.

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