Insulation composite structure and electronic equipment

Abstract

The utility model provides an insulating composite structure and an electronic device, which can reduce wrinkles or bubbles during fitting and can also give consideration to heat dissipation. The insulating composite structure provided by the utility model comprises a rigid insulating layer and a flexible insulating layer, the rigid insulating layer is provided with at least one first heat dissipation reinforcing part, the first heat dissipation reinforcing part is of a first hollow structure or a first sunken part, and the first sunken part is sunken towards one side of the flexible insulating layer; the flexible insulating layer at least covers the first heat dissipation reinforcing part, and the rigidity of the rigid insulating layer is greater than that of the flexible insulating layer.

Description

Technical Field

[0001] The present application relates to the field of electrical technology, and in particular to an insulating composite structure and an electronic device. Background Art

[0002] Electronic components are installed in enclosures. To ensure safety compliance, an insulator is applied to the components. This insulator is typically either flexible or rigid. For example, it's used between the enclosure and high-voltage components like inductors. However, a thin flexible insulation layer can easily wrinkle and form bubbles. A thicker rigid insulation layer creates a high thermal resistance, hindering heat dissipation from the electronic components. Utility Model Content

[0003] The purpose of the present application is to provide an insulating composite structure and an electronic device, which can reduce wrinkles or bubbles during bonding while taking into account heat dissipation.

[0004] In order to solve the above technical problems, the present application provides an insulating composite structure, including a rigid insulating layer and a flexible insulating layer, the rigid insulating layer having at least one first heat dissipation reinforcement portion, the first heat dissipation reinforcement portion being a first hollow structure or a first recessed portion, and the first recessed portion being recessed toward one side of the flexible insulating layer; the flexible insulating layer at least covers the first heat dissipation reinforcement portion, and the rigid insulating layer has a stiffness greater than that of the flexible insulating layer.

[0005] Optionally, the rigid insulation layer is a single-layer structure; or, the rigid insulation layer includes multiple insulation layer units, the insulation layer units are a single-layer structure, at least one layer of the insulation layer units has a hollow portion, and the cavity of the recessed portion includes a through hole of the hollow portion.

[0006] Optionally, the flexible insulating layer covers the entire surface of one side of the rigid insulating layer.

[0007] Optionally, the insulating composite structure further includes at least one second heat dissipation reinforcement portion, which is a second hollow structure or a second recessed portion, and the second recessed portion is recessed toward one side of the flexible insulating layer; the flexible insulating layer at least covers the second heat dissipation reinforcement portion.

[0008] Optionally, the thickness of the rigid insulation layer is more than three times that of the flexible insulation layer, and the thickness of the flexible insulation layer is 0.06-0.075 mm.

[0009] Optionally, the rigid insulating layer is an insulating layer made of polypropylene or polycarbonate; and / or the flexible insulating layer is an insulating layer made of polyimide.

[0010] The present application also provides an electronic device, comprising an electronic device and any one of the above-mentioned insulating composite structures; the flexible insulating layer of the insulating composite structure is adhered to the inner wall of the housing;

[0011] The electronic device includes a shell, the insulating composite structure is attached to the inner wall of the shell, the electronic device is installed in the shell, and at least part of the electronic device is located in the first heat dissipation reinforcement part.

[0012] Optionally, the electronic device has a heat dissipation portion;

[0013] At least one of the first heat dissipation reinforcement parts is a first hollow structure, and the heat dissipation part is in contact with the flexible insulation layer corresponding to the first heat dissipation reinforcement part; or, at least one of the first heat dissipation reinforcement parts is a first recessed part, and the heat dissipation part is in contact with the bottom of the first recessed part.

[0014] Optionally, the shell is provided with a mounting groove, and the insulating composite structure is attached to the wall of the mounting groove. After the electronic device is inserted into the mounting groove, the heat dissipation part of the electronic device is in contact with the flexible insulating layer corresponding to the first hollow structure, or the heat dissipation part is in contact with the bottom of the first recessed portion.

[0015] Optionally, the insulating composite structure includes a plurality of hollow structures, some of the hollow structures are used to cooperate with the electronic components, and some of the hollow structures are used to dissipate heat from the shell.

[0016] Optionally, the electronic device is a control box of a vehicle, and the electronic device includes an inductor coil.

[0017] The insulating composite structure disclosed in this application is provided with a first heat dissipation reinforcement portion. The electronic device can be in direct contact with the flexible insulating layer at the first heat dissipation reinforcement portion, or separated from the flexible insulating layer by a thin rigid insulating layer. The flexible insulating layer not only provides insulation, but also, because it is thin and has a higher heat transfer coefficient than air, can transfer heat more quickly to the housing of the electronic device where the electronic device is located, and then transfer it outward, effectively dissipating heat from the electronic device, thus achieving both insulation and heat dissipation. The rigid insulating layer, because its stiffness is greater than that of the relatively flexible insulating layer, can serve as a supporting frame. It is not easily deformed, wrinkled, or bubbled, thus allowing the insulating composite structure to be simply and reliably attached to the housing of the electronic device, making installation easy, operation convenient, and labor-saving. Furthermore, the rigid insulating layer is hollowed out or recessed and thinned in the position corresponding to the electronic device, which does not increase thermal resistance and reduce the heat dissipation effect of the electronic device. This insulating composite structure has the advantages of easy installation and high insulation and thermal conductivity, meeting the requirements of both heat dissipation and ease of operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the first insulating composite structure in an embodiment of the present application;

[0019] Figure 2 for Figure 1 Side view of;

[0020] Figure 3 for Figure 1 Middle AA section view;

[0021] Figure 4 This is a schematic diagram of a second insulating composite structure according to an embodiment of the present application;

[0022] Figure 5 This is a schematic diagram of a third insulating composite structure in an embodiment of the present application;

[0023] Figure 6 This is a schematic diagram of a fourth insulating composite structure according to an embodiment of the present application;

[0024] Figure 7 This is a schematic diagram of the structure of an electronic device in an embodiment of the present application;

[0025] Figure 8 for Figure 7 A schematic diagram of the structure of the electronic device from another perspective;

[0026] Figure 9 for Figure 7 Schematic diagram of the assembled electronic equipment;

[0027] Figure 10 This is a schematic diagram of the coordination between the electronic device and the insulating composite structure in an embodiment of the present application.

[0028] The reference numerals in the figures are described as follows:

[0029] 100-Insulation composite structure;

[0030] 101-rigid insulating layer; 101-1-insulating layer unit; 101-1a-hollow portion; 101a-first hollow structure; 101b-first recessed portion; 101A-first heat dissipation reinforcement portion;

[0031] 102-flexible insulation layer;

[0032] 200-PCBA;

[0033] 300-Electronic devices;

[0034] 400 - housing; 400a - mounting groove; 401 - bottom wall. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Please refer to Figure 1-3 , Figure 1 Schematic diagram of a first insulating composite structure 100 according to an embodiment of the present application; Figure 2 for Figure 1 Side view of; Figure 3 for Figure 1 Middle AA section view.

[0037] The insulating composite structure 100 in this embodiment includes a rigid insulating layer 101 and a flexible insulating layer 102 covering at least a portion of one side surface of the rigid insulating layer 101. That is, the insulating composite structure 100 includes at least two insulating layers, one being the rigid insulating layer 101 and one being the flexible insulating layer 102. The area defined by the outer contour of the flexible insulating layer 102 can be equal to or smaller than that of the rigid insulating layer 101. The flexible insulating layer 102 is adhered to the rigid insulating layer 101, for example, by bonding the flexible insulating layer 102 to the rigid insulating layer 101 using double-sided tape, which makes the composite structure simple and easy to operate.

[0038] In practical applications, for example, one or more insulating films can be used as the flexible insulating layer 102, that is, the flexible insulating layer 102 can be a single-layer or multi-layer structure. Similarly, one or more insulating paper can be used as the rigid insulating layer 101, that is, the rigid insulating layer 101 can also be a single-layer or multi-layer structure.

[0039] It should be emphasized that the rigid insulating layer 101 in this embodiment has at least one first heat dissipation reinforcement portion 101A. Figure 3 Specifically, the first hollow structure 101a is covered by the flexible insulating layer 102, and the area of the flexible insulating layer 102 is at least enough to cover the first hollow structure 101a. That is, the first hollow structure 101a of the rigid insulating layer 101 penetrates the rigid insulating layer 101 along the thickness direction of the rigid insulating layer 101, and the first hollow structure 101a of the rigid insulating layer 101 has a corresponding flexible insulating layer 102. When the flexible insulating layer 102 is attached to one side surface of the rigid insulating layer 101, it can cover the first hollow structure 101a. Figure 3 As shown, in the first hollow structure 101a of the insulating composite structure 100, a groove structure is actually formed by the flexible insulating layer 102 and the rigid insulating layer 101. The flexible insulating layer 102 serves as the bottom of the groove, and the hole wall corresponding to the first hollow structure 101a is the annular circumferential wall of the groove.

[0040] In this embodiment, the insulating composite structure 100 has only one flexible insulating layer 102 at the location of the first hollow structure 101a. Outside the first hollow structure 101a, the structure comprises two insulating layers: the flexible insulating layer 102 and the rigid insulating layer 101. This applies only to the case where the flexible insulating layer 102 covers the entire surface of one side of the rigid insulating layer 101. When the flexible insulating layer 102 covers a portion of the surface of the rigid insulating layer 101, the structure outside the first hollow structure 101a may comprise two insulating layers: the flexible insulating layer 102 and the rigid insulating layer 101, or may comprise only one insulating layer: the rigid insulating layer 101.

[0041] The flexible insulating layer 102 is provided to cover the entire surface of one side of the rigid insulating layer 101 ( Figure 3 In other words, the flexible insulating layer 102 covers the entire surface of the lower side of the rigid insulating layer 101. For example, the flexible insulating layer 102 can be attached to the hollowed-out rigid insulating layer 101 by a machine. Compared with the manual laying of the flexible insulating layer 102 in the housing 400 by an operator when assembling an electronic device, this is easier to implement from a process point of view and less likely to cause wrinkles. In practical applications, two large pieces of rigid insulating layer and flexible insulating layer can be attached and then cut into multiple insulating composite structures 100, or each insulating composite structure 100 can be formed by attaching two pieces of rigid insulating layer 101 and flexible insulating layer 102 of appropriate size. It can be seen that when the flexible insulating layer 102 covers the entire surface of one side of the rigid insulating layer 101, there is no need to pre-cut the flexible insulating layer, fewer steps are required, and processing is more convenient. However, it can be seen that when the flexible insulating layer 102 does not completely cover the rigid insulating layer 101, the material used for the flexible insulating layer 102 is relatively small, and the material cost is relatively lower.

[0042] In addition, it should be emphasized that the rigid insulating layer 101 can be processed into a first hollow structure 101a before being bonded to the flexible insulating layer 102, that is, the complete rigid insulating layer is pre-cut to form the first hollow structure 101a by a cutting tool, and then bonded to the flexible insulating layer 102. Of course, the flexible insulating layer 102 and the complete rigid insulating layer can also be bonded and then only the first hollow structure 101a can be cut out of the rigid insulating layer. In comparison, cutting first and then bonding has lower requirements on the cutting process.

[0043] Of course, the area defined by the outer contour of the flexible insulating layer 102 may also be smaller than the area of the rigid insulating layer 101. For example, the insulating composite structure 100 may include a number of flexible insulating layers 102 corresponding to the number of first hollow structures 101a. The area of each flexible insulating layer 102 may be slightly larger than the area of the first hollow structure 101a, and then be pasted onto the rigid insulating layer 101. Alternatively, the area of the flexible insulating layer 102 may be smaller than the area of the rigid insulating layer 101, and the flexible insulating layer 102 may only cover the first hollow structure 101a. The insulating composite structure 100 may also be provided with a flexible insulating layer 102 only on the first hollow structure 101a of the rigid insulating layer 101, for example, by attaching the rigid insulating layer 101 to a corresponding structural member (e.g. Figure 4 In contrast, it is obviously easier to implement to cover the entire surface of one side of the rigid insulating layer 101 with the flexible insulating layer 102 .

[0044] In this insulating composite structure 100, the flexible insulating layer 102 has both insulating and heat dissipating effects, and the rigid insulating layer 101 has a greater stiffness than the flexible insulating layer 102, thereby facilitating both installation and insulation. Thus, by combining the flexible insulating layer 102 with the rigid insulating layer 101, the advantages of both the flexible insulating layer 102 and the rigid insulating layer 101 can be achieved. In other words, the insulating composite structure 100 has a simple structure, is easy to operate, has low thermal resistance, and is highly reliable.

[0045] It can be seen that the purpose of the embodiment of the present application is to utilize the rigidity of the rigid insulating layer 101 to facilitate installation and improve the insulation effect, and to thin it in a local position to achieve the purpose of heat dissipation. Therefore, the first heat dissipation reinforcement portion 101A is not limited to the first hollow structure 101a, and can also be the first recessed portion 101b, such as Figure 4 As shown, Figure 4 Schematic diagram of the structure of the second insulating composite structure 100 in the embodiment of the present application.

[0046] First recessed portion 101b is recessed toward one side of flexible insulating layer 102, meaning its bottom contacts flexible insulating layer 102, while its opening faces away from flexible insulating layer 102. The provision of first recessed portion 101b effectively thins rigid insulating layer 101 at the location of first recessed portion 101b, reducing local thermal resistance and ensuring effective heat dissipation while retaining the advantages of rigid insulating layer 101.

[0047] In actual use, when the rigid insulating layer 101 is a single-layer structure, the first hollow structure 101a can be directly processed on the rigid insulating layer 101, or the single-layer rigid insulating layer 101 can be partially thinned to form the first recessed portion 101b. Figure 4 shown.

[0048] The rigid insulating layer 101 may also have a multi-layer structure, such as Figure 5 As shown, Figure 5 Schematic diagram of the structure of the third insulating composite structure 100 in the embodiment of the present application.

[0049] At this time, the rigid insulating layer 101 includes a multi-layer insulating layer unit 101-1. Figure 5 The figure schematically shows the insulating layer units 101-1 on both sides. Each insulating layer unit 101-1 is a single-layer structure. The hollow portion 101-1a can be directly processed on the single-layer insulating layer unit 101-1. After the multiple layers of insulating layer units 101-1 are stacked, the through holes formed by stacking the corresponding multiple layers of hollow portions 101-1a together serve as a first hollow structure 101a.

[0050] Alternatively, when the rigid insulating layer 101 is a multi-layer structure formed by combining a plurality of insulating layer units 101 - 1 , the plurality of insulating layer units 101 - 1 may be directly stacked and then processed together to form the first hollow structure 101 a .

[0051] Or, as Figure 6 As shown, Figure 6 This is a schematic diagram of the fourth insulating composite structure in the embodiment of the present application.

[0052] When the rigid insulation layer 101 is a multi-layer structure formed by combining multiple insulation layer units 101-1, one layer or multiple layers of insulation layer units 101-1 arranged continuously can be selected to process a hollow portion 101-1a, and the through holes of one or more hollow portions 101-1a with corresponding positions are combined together to serve as the cavity of the first recessed portion 101b, and the surface of a layer of insulation layer units 101-1 adjacent to the cavity serves as the bottom of the first recessed portion 101b. Figure 6In the embodiment, the rigid insulating layer 101 has two insulating layer units 101-1. The insulating layer unit 101-1 farther from the flexible insulating layer 102 has a hollow portion 101-1a, which serves as the cavity of the first recessed portion 101b. Other configurations are also possible. For example, the rigid insulating layer 101 may include three insulating layer units 101-1, with the side farther from the flexible insulating layer 102 being the top. From top to bottom, the first and second insulating layer units 101-1 may have hollow portions 101-1a, while the third insulating layer unit 101-1 may not have a hollow portion 101-1a. Alternatively, two hollow portions 101-1a may serve as the cavity of the first recessed portion 101b. These configurations are not described in detail here.

[0053] The following description mainly uses the first heat dissipation reinforcement portion 101A as the first hollow structure 101 a for the application of the insulating composite structure.

[0054] For specific application methods, please continue to refer to Figure 7-10 understand, Figure 7 This is a schematic diagram of the structure of an electronic device in an embodiment of the present application; Figure 8 for Figure 7 A schematic diagram of the structure of the electronic device from another perspective; Figure 9 for Figure 7 Schematic diagram of the assembled electronic equipment; Figure 10 Schematic diagram of the cooperation between the electronic device 300 and the insulating composite structure 100 in an embodiment of the present application.

[0055] The electronic device in this embodiment includes an electronic device 300, Figure 7 The illustrated electronic device 300 includes an inductor coil, and the electronic device also includes a printed circuit board assembly (PCBA) 200. One end of the inductor coil is electrically connected to PCBA 200, which is used to secure the inductor coil and the main circuit control unit. The insulating composite structure 100 includes a first hollow structure 101a corresponding to the electronic device 300. The electronic device 300 contacts the flexible insulating layer 102 corresponding to the first hollow structure 101a. Specifically, the other end of the inductor coil can contact the flexible insulating layer 102 at the first hollow structure 101a.

[0056] The electronic device also includes a housing 400, which is used to accommodate at least part of the electronic device 300. The insulating composite structure 100 can be attached to the inner wall of the housing 400, and at least the flexible insulating layer 102 corresponding to the first hollow structure 101a needs to be attached to the inner wall of the housing 400. After the electronic device 300 is installed in the housing 400, the electronic device 300 can be in contact with the flexible insulating layer 102 of the first hollow structure 101a. The flexible insulating layer 102 can not only achieve insulation, but also because it is thin and has a higher heat transfer coefficient than air, it can transfer heat to the housing 400 and then transfer it outward to better dissipate heat for the electronic device 300. However, the rigid insulating layer 101 is thicker than the flexible insulating layer 102, such as Figure 3 As shown, the thickness T2 of the rigid insulating layer 101 is greater than the thickness T1 of the flexible insulating layer 102, for example, T2>3T1, then the rigid insulating layer 101 can be used as a supporting frame, which is not easy to deform, wrinkle or generate bubbles, so that the insulating composite structure 100 can be simply and reliably attached to the shell 400. At the same time, the rigid insulating layer 101 is hollowed out at the position corresponding to the electronic device 300, which will not increase the thermal resistance and reduce the heat dissipation effect of the electronic device 300. That is, this insulating composite structure 100 can take into account the needs of heat dissipation and convenient operation.

[0057] It can be seen that the structural setting of the shell 400 of the electronic device is different depending on the structure. The shell 400 can be a closed shell or an open shell, but in specific applications, the electronic devices 300 located inside the shell 400 can be insulated from the outside and dissipate heat to the outside through the insulating composite structure 100 attached to the shell 400.

[0058] In this embodiment, when projected along a direction perpendicular to the first hollow structure 101a, or projected along the thickness direction of the insulating composite structure 100, the projection of the heat dissipation portion of the electronic device 300 falls within the projection of the first hollow structure 101a. Figure 10 The heat dissipation part of the electronic device 300 is its end. In this way, the entire end of the electronic device 300 can contact the flexible insulating layer 102 and will not contact the rigid insulating layer 101, so as to minimize thermal resistance and improve heat transfer efficiency. Figure 10 Of course, the end portion of the electronic device 300 may contact the flexible insulating layer 102 and the end portion may contact the rigid insulating layer 101. In this embodiment, the electronic device 300 is an inductor coil, and the first hollow structure 101a corresponding to the inductor coil is set to a circular shape, as shown in FIG. Figure 3 As shown, the diameter of the circular first hollow structure 101a is D1. Figure 10As shown, the diameter of the inductor coil is D2, so D1 can be set to be not less than D2. For example, D1 can be set to be slightly larger than D2. In this way, during the assembly process, even if the electronic device 300 is offset to a certain extent, its entire end can still be in contact with the flexible insulating layer 102.

[0059] The housing 400 in this embodiment is further provided with a mounting groove 400a, and the insulating composite structure 100 is attached to the bottom wall 401 of the mounting groove 400a. After the electronic device 300 and the PCBA board 200 are assembled and inserted together into the mounting groove 400a, the electronic device 300 contacts the flexible insulating layer 102 corresponding to the corresponding first hollow structure 101a. Specifically, the PCBA 200 and the mounting groove 400a cooperate with each other to achieve the positioning of the electronic device 300. That is, the shell 400 can directly or indirectly assemble and position the electronic device 300 by setting the installation groove 400a. After the electronic device 300 is installed, the position relative to the shell 400 is determined, and the position of the insulating composite structure 100 relative to the shell 400 is also determined. Then, the position of the first hollow structure 101a relative to the shell 400 is determined. In this way, after the electronic device 300 is installed in place, the end of the electronic device 300 can serve as a heat dissipation part and can automatically contact the flexible insulating layer 102 at the corresponding first hollow structure 101a. There is no need for manual labor or the use of other equipment to match the electronic device 300 and the first hollow structure 101a of the insulating composite structure 100, and the assembly is simple and reliable. It can be seen that the specific form of the installation groove 400a is not limited. It can be the entire inner cavity of the shell 400, or the wall of the shell 400 is only a part of the wall of the installation groove 400a. For example, a number of partitions are also provided in the shell 400, and the partitions and the wall of the shell 400 cooperate to enclose and form the installation groove 400a, etc. The electronic device 300 can be completely or partially located in the installation groove 400a, and the electronic device 300 and the installation groove 400a can be directly positioned or indirectly positioned through other components.

[0060] I understand. Figure 7-9The inner cavity of the housing 400 of the electronic device shown in the figure is the mounting groove 400a, but it is obviously not limited to this. For example, if multiple electronic devices 300 are installed in the housing 400 of the electronic device, multiple corresponding mounting grooves 400a can be provided in the inner cavity of the housing 400. In fact, depending on the heat dissipation location of the electronic device 300, the location of the insulating composite structure 100 is not limited to the bottom wall 401 of the mounting groove 400a. For example, if the end of the electronic device 300 is inserted into the mounting groove 400a, but the heat dissipation location of the electronic device 300 that contacts the flexible insulating layer 102 is not at the end of the electronic device 300, but is located on the side of the electronic device 300, then the insulating composite structure 100 can be attached to the side wall of the mounting groove 400a. When the electronic device 300 is installed in place, the flexible insulating layer 102 corresponding to the first hollow structure 101a of the insulating composite structure 100 just contacts the heat dissipation location of the electronic device 300. The heat dissipation location can be the location of the electronic device 300 that generates the most heat, or any location of the electronic device 300 can be used. For example, even if a certain location of the electronic device 300 is not the location that generates the most heat, or even if the electronic device 300 does not have a location that generates the most heat, a location of the electronic device 300 that is easily accessible to the external insulating composite structure 100 can be used as the heat dissipation location. When the electronic device 300 is specifically an inductor or capacitor, the heat dissipation location can be an end of the electronic device 300, or a heat conducting or heat dissipating structure provided on the end of the electronic device 300.

[0061] In addition, the insulating composite structure 100 in this embodiment may also include multiple second heat dissipation reinforcement portions (not shown). These second heat dissipation reinforcement portions may be second hollow structures or second recessed portions. The second hollow structures and second recessed portions have substantially the same structure as the first hollow structures 101a and first recessed portions, and can be understood by reference thereto. The second heat dissipation reinforcement portions are used to dissipate heat in conjunction with the housing 400. Specifically, in addition to the first hollow structures 101a or first recessed portions 101b formed at locations where the insulating composite structure 100 mates with the electronic device 300, the rigid insulating layer 101 of the insulating composite structure 100 may also be provided with second heat dissipation reinforcement portions at other locations, thereby directly thinning the flexible insulating layer 102 to enhance heat dissipation. Specifically, in addition to the first heat dissipation reinforcement portion 101A mates with the electronic device 300, the second heat dissipation reinforcement portions may be provided at other locations to thin the flexible insulating layer 102 or directly expose a portion of the flexible insulating layer 102 to enhance heat dissipation.

[0062] The rigid insulating layer 101 of the insulating composite structure 100 in the above-mentioned embodiment of the present application can be an insulating layer made of PP (Polypropylene) or PC (Polycarbonate). Such insulating layers can also be called insulating paper. As mentioned above, the rigid insulating layer 101 is mainly used for insulation and providing frame support. It has a certain pressure resistance. The rigid insulating layer 101 made of PP or PC can improve the rigidity. In addition, the rigid insulating layer 101 made of PP or PC can meet the following insulation performance requirements: voltage 3000V, DC 1min, leakage current less than 20mA. It can be seen that the rigid insulating layer 101 made of these two materials has the advantage of reliable insulation.

[0063] The flexible insulating layer 102 can be an insulating layer made of polyimide, which can also be called an insulating film. It has good thermal conductivity. Generally speaking, the thermal conductivity of a flexible insulating layer is higher than that of a rigid insulating layer, and the flexible insulating layer can meet the insulation requirements. The thickness of the flexible insulating layer 102 can be processed to be thinner. Since it is composited with the rigid insulating layer 101, the flexible insulating layer 102 does not need to consider the overall rigidity requirements. Therefore, the flexible insulating layer 102 can be processed to be thinner, for example, a thickness of 0.06-0.075mm is selected, and the thermal resistance is also lower. The insulating layer used in the background art is generally selected to be 0.25mm or even thicker. Even so, if the insulating layer used in the background art is a flexible insulating layer, the rigidity requirements are still insufficient, wrinkles and bubbles will be generated during the bonding process, and the thermal resistance will be relatively high. However, the insulating composite structure 100 used in the embodiment of the present application can take into account both heat dissipation and rigidity requirements. Of course, the specific thickness, area and other dimensions of the rigid insulation layer 101 and the flexible insulation layer 102 in this embodiment can be adjusted according to safety regulations, actual heat dissipation needs and assembly requirements.

[0064] Furthermore, the housing 400 of the electronic device described in the above embodiment can be filled with a thermally conductive medium to improve heat transfer efficiency and enhance heat dissipation. Examples of the thermally conductive medium include silicone grease, thermally conductive adhesive, or phase change material. Furthermore, the filling of the thermally conductive medium further enhances the reliability of the insulating composite structure 100 adhering to the inner wall of the housing 400.

[0065] In addition, if Figure 10 As shown, the flexible insulating layer 102 of the insulating composite structure 100 can be adhered to the inner wall of the shell 400. The heat dissipation part of the electronic device 300 in this embodiment actually passes through the first hollow structure 101a to contact the flexible insulating layer 102 exposed by the first hollow structure 101a. Figure 10The flexible insulating layer 102 is attached to the entire surface of one side of the rigid insulating layer 101. If the area of the flexible insulating layer 102 is small and only covers part of the rigid insulating layer 101, the uncovered part of the rigid insulating layer 101 can be directly attached to the shell 400.

[0066] It is understood that the reverse arrangement, where the rigid insulating layer 101 of the insulating composite structure 100 is attached to the housing 400, can also be employed. However, due to the thickness of the first hollow structure 101a, the flexible insulating layer 102 corresponding to the first hollow structure 101a cannot be suspended on the inner wall of the housing 400. Therefore, the flexible insulating layer 102 is equivalently configured as a groove-shaped structure here so that the flexible insulating layer 102 can contact the inner wall of the housing 400. Therefore, from the perspective of the installation process, configuring the flexible insulating layer 102 to cover the entire surface of one side of the rigid insulating layer 101 also facilitates reliable attachment to the housing 400, avoids bubbles or wrinkles, and ensures heat dissipation.

[0067] The electronic device in the embodiments of the present application may specifically be a control box in a car. The car may be a new energy vehicle or a fuel-powered vehicle. The control box may be, for example, an MCU (Microcontroller Unit), a motor controller, or an OBC (On-Board Charger). The control box may also be a power conversion device, such as a DCDC (Direct Current-Direct Current Converter), an inverter, or a converter. The housing 400 is the housing of the control box. The insulating composite structure 100 is disposed within the control box to dissipate heat from the electronic device 300 within the control box.

[0068] The above is only a preferred embodiment of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. An insulating composite structure, characterized in that: The invention comprises a rigid insulating layer (101) and a flexible insulating layer (102), wherein the rigid insulating layer (101) has at least one first heat dissipation reinforcement portion (101A), the first heat dissipation reinforcement portion (101A) being a first hollow structure (101a) or a first recessed portion (101b), and the first recessed portion (101b) being recessed toward one side of the flexible insulating layer; the flexible insulating layer (102) at least covers the first heat dissipation reinforcement portion (101A), and the rigid insulating layer (101) has a greater rigidity than the flexible insulating layer (102).

2. The insulating composite structure according to claim 1, characterized in that: The rigid insulating layer (101) is a single-layer structure; or, the rigid insulating layer (101) comprises multiple insulating layer units (101-1), the insulating layer units (101-1) are a single-layer structure, at least one layer of the insulating layer units (101-1) comprises a hollow portion (101-1a), and the cavity of the first recessed portion (101b) comprises a through hole of the hollow portion (101-1a).

3. The insulating composite structure according to claim 1, characterized in that: The flexible insulating layer (102) covers the entire surface of one side of the rigid insulating layer (101).

4. The insulating composite structure according to any one of claims 1 to 3, characterized in that: The insulating composite structure further comprises at least one second heat dissipation reinforcement portion, the second heat dissipation reinforcement portion being a second hollow structure or a second recessed portion, the second recessed portion being recessed toward one side of the flexible insulating layer (102); The flexible insulating layer (102) at least covers the second heat dissipation reinforcement portion.

5. The insulating composite structure according to any one of claims 1 to 3, characterized in that: The thickness of the rigid insulation layer (101) is more than three times that of the flexible insulation layer (102), and the thickness of the flexible insulation layer (102) is 0.06-0.075 mm.

6. The insulating composite structure according to any one of claims 1 to 3, characterized in that: The rigid insulating layer (101) is an insulating layer made of polypropylene or polycarbonate; and / or the flexible insulating layer (102) is an insulating layer made of polyimide.

7. An electronic device, characterized in that: The insulating composite structure (100) comprises an electronic device (300) and any one of claims 1 to 6; the flexible insulating layer (102) of the insulating composite structure (100) is adhered to the inner wall of the housing (400); The electronic device comprises a housing (400), the insulating composite structure (100) is adhered to the inner wall of the housing (400), the electronic device (300) is installed in the housing (400), and at least a portion of the electronic device (300) is located in the first heat dissipation reinforcement portion (101A).

8. The electronic device according to claim 7, wherein: The electronic device (300) has a heat dissipation portion; At least one of the first heat dissipation reinforcement parts (101A) is a first hollow structure (101a), and the heat dissipation part is in contact with the flexible insulating layer (102) corresponding to the first heat dissipation reinforcement part (101A); or at least one of the first heat dissipation reinforcement parts (101A) is a first recessed part (101b), and the heat dissipation part is in contact with the bottom of the first recessed part (101b).

9. The electronic device according to claim 8, wherein: The housing (400) is provided with a mounting groove (400a), the insulating composite structure (100) is attached to the wall of the mounting groove (400a), and after the electronic device is inserted into the mounting groove (400a), the heat dissipation portion of the electronic device (300) contacts the flexible insulating layer (102) corresponding to the first hollow structure (101a), or the heat dissipation portion contacts the bottom of the first recessed portion (101b).

10. The electronic device according to any one of claims 7 to 9, characterized in that: The housing (400) is filled with a heat-conducting medium; and / or the electronic device is a control box of a vehicle, and the electronic device (300) includes an inductor coil.

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