Tool for bonding and positioning switch

Abstract

The utility model discloses a tool for bonding and positioning a switch, which comprises a base, a plurality of concave holes for mounting the switch are arranged on the base according to the size of the switch, a heat conduction gap pad is laid at the bottom of each concave hole, the switch is matched with a switch panel to be reversely buckled and mounted in the concave holes, and the switch touches the heat conduction gap pads; the two ends of the base are respectively provided with a rotatable pressing block which is used for pressing or loosening the switch panel. According to the tool provided by the utility model, the switch can be conveniently and rapidly fixed, switch deviation caused by abnormal external force in the glue solution curing process is prevented, the situation of wrong and inclined assembly can be effectively avoided through the holes and the grooves with different depths, and high quality and high reliability of products are realized while the production efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of actual production, processing and assembly, in particular to a tool for bonding and positioning switches. Background Art

[0002] During the production process, when bonding switches for certain products, a significant amount of time is often required to pre-fix the switches. This involves confirming the switch's mounting position and then securing it with tape. Once the switch is bonded, the pre-fixing measures are removed and the bonding is complete. This installation method is detrimental to product consistency and can even lead to insecure bonding and possible detachment due to individual operator skill differences. Utility Model Content

[0003] The purpose of the present invention is to provide a tool for switch bonding and positioning to address the problems existing in the above-mentioned prior art, so as to ensure that the switch can be accurately positioned and firmly fixed during bonding.

[0004] The technical solution for achieving the objectives of the present utility model is: a tool for bonding and positioning a switch, the tool comprising a base, the base having a plurality of recessed holes for mounting the switches according to the size of the switches, a thermally conductive gap pad being laid at the bottom of the recessed holes, the switches being mounted in the recessed holes in coordination with the switch panel in an upside-down manner, and the switches contacting the thermally conductive gap pad; a rotatable pressure block is provided at each end of the base for tightening or loosening the switch panel.

[0005] Furthermore, the pressing block is mounted on the base via a rotating device.

[0006] Furthermore, the rotating device includes a screw and a spring sleeved on the screw, and the screw passes through the pressing block and is installed on the opening on the base.

[0007] Furthermore, the bottom of the pressing block is designed as an arc-shaped structure.

[0008] Furthermore, protrusions are provided on both sides of the pressing block.

[0009] Furthermore, the surface of the thermally conductive gap pad is coated with a rubber coating carrier.

[0010] Furthermore, the base is made of POM material.

[0011] Furthermore, the pressing block is made of plastic.

[0012] Furthermore, the thickness of the thermally conductive gap pad is 2 mm.

[0013] Furthermore, the base is a rectangular parallelepiped structure.

[0014] Compared with the prior art, the present invention has the following significant advantages:

[0015] (1) The tooling is simple and practical, which can help assemblers quickly complete the precise positioning and fixation of multiple switches, prevent the switch from being offset due to abnormal external forces during the curing process of the glue, and effectively avoid incorrect or crooked installation by opening holes and slots of different depths, thereby improving production efficiency and achieving high product quality and reliability.

[0016] (2) The overall size of the utility model is moderate, which can be operated with both hands, thereby enhancing the convenience of operation of the device.

[0017] (3) The material selected has good environmental adaptability and can be used for a long time in the temperature range of -40 to 100 ° C. This allows more adhesives with different curing conditions to be selected during the process planning period.

[0018] The present invention is described in further detail below with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 1 is a schematic structural diagram of a tool for bonding and positioning a switch in one embodiment.

[0020] Figure 2 3-D view of a tool for bonding and positioning a switch in one embodiment, wherein Figure 2 (a) is the main view, Figure 2 (b) is the left view. Figure 2 (c) is a top view.

[0021] Figure 3 This is the relationship between the pressure and deformation of the thermal conductive gap pad. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0023] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if there are descriptions involving "springs", "screws", etc. in the embodiments of the present invention, the descriptions of "springs", "screws", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "springs" and "screws" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0025] In one embodiment, combined Figure 1 and Figure 2 , provides a tool for bonding and positioning switches, the tool comprising a base 1, the base 1 having a plurality of recessed holes 4 for installing switches according to the size of the switches, a thermally conductive gap pad being laid at the bottom of the recessed holes, the switch and the switch panel being installed upside down in the recessed holes 4, and the switch touching the thermally conductive gap pad, the thermally conductive gap pad undergoes elastic deformation to achieve soft contact surface compression; a rotatable pressure block 2 is provided at each end of the base 1 for compressing or loosening the switch panel.

[0026] Here, the recessed hole 4 is provided to facilitate the deep insertion of the switch.

[0027] For example, Figure 1 As shown, for a certain type of switch, four concave holes with a diameter of 20 and a depth of 11.5 and one concave hole with a diameter of 24 and a depth of 10 are opened.

[0028] Furthermore, in one embodiment, the pressing block is mounted on the base via a rotating device.

[0029] Here, in some embodiments, the rotating device includes a screw and a spring 3 sleeved on the screw, and the screw passes through the pressing block and is installed on a screw hole on the base.

[0030] Here, a spring screw is used to fix the pressure block at the upper end, and soft thermal pads in the openings on the base are used to support the bottom end. The combined effect of these elements ensures a stable fixation of the switch.

[0031] Here, the spring structure provides more possibilities for tooling. When the number of spring turns is changed, the pressure will also change in a certain proportion. According to Hooke's law of elasticity, the spring force F is proportional to the compression (or extension) X of the spring, that is, F = KX, where K is the spring constant. Here, it can be assumed that the deformation of the spring is proportional to the amount of screw tightening. Therefore, the spring force value at different installation torques can be calculated by testing the spring deformation (Table 1). At the same time, when the installation torque reaches 0.7N·m, it is basically installed to the bottom, that is, the maximum elastic force is reached.

[0032] Table 1 Spring force values under different installation torques

[0033] 1 2 3 4 5 6 7 Installation torque (N·m) / 0.2 0.3 0.4 0.5 0.6 0.7 Spring length (m) 0.15 0.134 0.126 0.12 0.114 0.11 0.108 Spring deformation (m) / 0.016 0.024 0.03 0.036 0.04 0.042 Elastic force (N) / 3.2 4.8 6 7.2 8 8.4

[0034] Preferably, the parameters of the spring 3 are ψ0.6×6.7×15×6N, and the screw is an M5*15 semi-thread screw with a thread depth of 6mm and a screw hole depth of 7mm.

[0035] Here, in some embodiments, the bottom of the pressing block is designed as an arc-shaped structure 6 and is protruding, which reduces the direct contact area while lifting the pressing block, and can ensure that the pressure is sufficient while rotating the pressing block more smoothly without scratching the product surface.

[0036] Here, in some embodiments, protrusions 5 are provided on both sides of the pressing block 2 to facilitate grasping and realize convenient rotation of the pressing block.

[0037] Preferably, in some embodiments, the pressing block is made of plastic.

[0038] Preferably, in some embodiments, the base is made of POM (polyoxymethylene): a high-density, highly crystalline linear polymer that can be used for long periods of time within a temperature range of -40°C to 100°C. It is an engineering plastic with excellent overall performance, possessing high mechanical properties such as strength, modulus, wear resistance, toughness, fatigue resistance, and creep resistance, as well as excellent electrical insulation, solvent resistance, and machinability. It is one of the five major general-purpose engineering plastics. Its properties make it well-suited for switch bonding applications: On the one hand, it is relatively stable at high temperatures, preventing any adverse effects on the product at high temperatures. On the other hand, the material has good wear resistance, preventing wear or debris from forming during repeated assembly and disassembly, thereby generating unwanted material. Furthermore, the material's stability makes it suitable for bonding with a variety of adhesives without chemical reactions that could deteriorate the adhesive.

[0039] Preferably, in some embodiments, the surface of the thermally conductive gap pad is coated with a rubber coating carrier, which can be used for a long time at -60 to 200°C. On the one hand, it can transfer heat normally to ensure normal curing of the glue, and on the other hand, it can prevent the top of the switch from directly contacting the hard surface and causing appearance wear.

[0040] Preferably, in some embodiments, the thickness of the thermally conductive gap pad is 2 mm.

[0041] Here, when selecting the specifications of the thermal gap pad and designing the switch slot depth, considering the selected spring and the direct contact area, the estimated pressure value is about 0.33~0.67kgf / cm2 (the pressure of the switch on the thermal gap pad is about 1-2N, and the direct contact area is about 3cm2), which is converted to a Psi value of about 4.7~9.6. Figure 3 The calculated deformation is about 50% to 95%. So we choose 2mm thick thermal conductive gap pad and set the minimum deformation to 50% (see Figure 3 ), the depth design is thus reduced by 1mm.

[0042] Preferably, in some embodiments, the base is, but not limited to, a rectangular parallelepiped structure.

[0043] The following describes the use of the tooling for switch bonding and positioning of the utility model:

[0044] Confirm that the tooling is in good condition and the thermal gap pads are attached and flat;

[0045] Move the pressing block to a vertical position;

[0046] Place the switches into the recessed holes of the tooling in sequence according to the model and the direction on the drawing;

[0047] Insert the switch panel;

[0048] Rotate the pressing block until it can completely press the switch panel;

[0049] Pull the switch to ensure that it is not displaced.

[0050] Start applying glue.

[0051] The tooling proposed in this utility model can not only conveniently and quickly realize the switch fixing work, and prevent the switch from being offset due to abnormal external forces during the curing process of the glue, but also effectively avoid the situation of incorrect or crooked installation through openings and grooves of different depths, thereby improving production efficiency and achieving high quality and high reliability of the product.

[0052] From a practical point of view, the present invention can be easily modified according to actual needs. For example, the pressure of the pressing block can be increased by increasing the number of spring coils; the pressing block can be enlarged to adapt to the fixation of a smaller switch panel, etc.

[0053] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for illustrative purposes. Without departing from the spirit and scope of the present invention, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A tool for bonding and positioning a switch, characterized in that: The tooling includes a base, on which are opened several recessed holes for installing switches according to the size of the switches, and a thermal conductive gap pad is laid at the bottom of the recessed holes. The switches and the switch panel are installed upside down in the recessed holes, and the switches touch the thermal conductive gap pad; a rotatable pressure block is provided at each end of the base for tightening or loosening the switch panel.

2. The tooling for switch bonding and positioning according to claim 1, characterized in that: The pressing block is mounted on the base via a rotating device.

3. The tooling for switch bonding and positioning according to claim 2, characterized in that: The rotating device includes a screw and a spring sleeved on the screw. The screw passes through the pressing block and is installed on an opening on the base.

4. The tooling for switch bonding and positioning according to claim 1, characterized in that: The bottom of the pressing block is designed as an arc-shaped structure.

5. The tool for bonding and positioning a switch according to claim 1, characterized in that: The pressing block is provided with protrusions on both sides.

6. The tool for bonding and positioning a switch according to claim 1, characterized in that: The surface of the thermally conductive gap pad is coated with a rubber coating carrier.

7. The tool for bonding and positioning a switch according to claim 1, characterized in that: The base is made of POM material.

8. The tool for bonding and positioning a switch according to claim 1, characterized in that: The pressing block is made of plastic.

9. The tool for bonding and positioning a switch according to claim 1, characterized in that: The thickness of the thermal conductive gap pad is 2 mm.

10. The tool for bonding and positioning a switch according to claim 1, characterized in that: The base is a rectangular parallelepiped structure.

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