Heat dissipation shielding case

Abstract

The utility model discloses a heat radiation shielding case, which relates to the field of radiator design and comprises a cover plate, a plurality of shielding frames are integrally formed on the back surface of the cover plate, and a shielding case structure is formed between the cover plate and the shielding frames; a plurality of positioning cylinders are formed on the cover plate, and at least two positioning pins are integrally formed on the bottom side of the cover plate; the shielding frame comprises a high heating area frame and a low heating area frame, a plurality of cooling fins are integrally formed on the front face of the cover plate, and the cooling fins are located above the high heating area frame; a plurality of wire pressing blocks are formed at the edge of the bottom side of the low heating area frame, are arranged in an equidistant array manner and are arranged at the edge of the same side of the low heating area frame; compared with the prior art, the integrated design of the cover plate and the shielding case is realized, the overall heat balance of the circuit board is ensured, the circuit board is not easy to damage, and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of radiator design, in particular to a heat dissipation shielding cover. Background Art

[0002] Due to the rapid development of semiconductor technology, chips are integrating more and more functions, which has led to an increase in chip operating speed and speed. However, chip size has become smaller and smaller. As a result, the heat generated by the chip has also increased. Moreover, due to the high degree of integration, the chip structure is also relatively dense, making it difficult for the heat generated by the chip to dissipate. In order to ensure the normal operation of the chip, the large amount of heat generated by the chip must be discharged in a timely manner.

[0003] To this end, the prior art (announcement number: CN112804817A, announcement date: 2021.05.14) discloses a chip heat dissipation structure, which sequentially arranges a shielding cover, a graphene film layer, a thermally conductive silicone and a heat sink on the chip. Since there is a multi-layer structure between the chip and the heat sink, the heat transfer effect is not good. In this scheme and other schemes of the prior art, the heat sink and the shielding cover are not integrated into one design, resulting in slow heat transfer, many parts, and inconvenient assembly. Moreover, various chips are currently soldered on the circuit board to realize various functions. Among these chips, their power consumption is different. High-power chips have high heat generation. Therefore, the current circuit board will have heat imbalance, and its heat dissipation effect is poor. Therefore, it is necessary to design an integrated design of a shielding cover structure that can dissipate heat for different chips at the same time. Utility Model Content

[0004] In order to overcome the above-mentioned shortcomings, the utility model provides a technical solution that can solve the above-mentioned problems.

[0005] A heat dissipation shielding cover comprises a cover plate, wherein a plurality of shielding frames are integrally formed on the back of the cover plate, the plurality of shielding frames are separately arranged, and a shielding cover structure is formed between the cover plate and the shielding frames;

[0006] The cover plate is formed with a plurality of positioning cylinders, the two ends of which extend out of the front and back of the cover plate respectively, and the bottom side of the cover plate is integrally formed with at least two positioning pins;

[0007] The shielding frame includes a high-heating area frame and a low-heating area frame, and the front of the cover plate is integrally formed with a plurality of heat sinks, which are located above the high-heating area frame;

[0008] A plurality of press blocks are formed at the bottom edge of the low heating area frame. The plurality of press blocks are arranged in an array at equal distances from each other. The plurality of press blocks are arranged at the same side edge of the bottom heating area frame.

[0009] Furthermore: a plurality of protruding blocks are formed on the bottom edges of the high-heating area frame and the low-heating area frame, and the plurality of protruding blocks are arranged apart from each other.

[0010] Furthermore: a glue edge is provided at the bottom edge of the high-heating area frame and the low-heating area frame.

[0011] Furthermore: a bolt hole is formed in the middle of the bottom end of the positioning cylinder.

[0012] Furthermore: the positioning cylinder is integrally formed on the outer edge of the shielding frame.

[0013] Furthermore: the positioning pin and the positioning cylinder are staggered with each other.

[0014] Furthermore: the back of the cover plate is integrally formed with a plurality of thickened surfaces, and the thickened surfaces are arranged in a one-to-one correspondence within the high-heating area frame and the low-heating area frame.

[0015] Furthermore: a space avoidance is formed on the cover plate, and the space avoidance is arranged on the outside of the low heat area frame, and the space avoidance is located on a side of the low heat area frame close to the multiple wire pressing blocks.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. Apply thermal grease on the high-heat-generating chip and low-heat-generating chip of the circuit board respectively, and then install the cover plate on the corresponding position of the circuit board to complete the installation, so as to realize the integrated design of the cover plate and the shielding cover, which is convenient for assembly;

[0018] 2. After the installation is completed, the thermal grease will be filled and pressed on the back of the chip and the cover. The high-heating area frame can just cover the high-heating chip, and the low-heating area frame will just cover the low-heating chip. The heat of the high-heating chip during operation can be quickly transferred to the cover and dissipated through the heat sink at the corresponding position. The heat of the low-heating chip during operation will also be transferred to the cover, thereby preventing it from overheating and damage, making the overall thermal balance of the circuit board better, less prone to damage, and increasing its service life.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0021] Figure 1 It is a structural diagram of the utility model;

[0022] Figure 2 It is a structural diagram of the front side of the utility model;

[0023] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure at the AA position;

[0024] Figure 4 It is a structural schematic diagram of the back of the utility model.

[0025] As shown in the figure: 1. Cover plate; 2. Shielding frame; 21. High heat area frame; 22. Low heat area frame; 3. Positioning cylinder; 4. Positioning pin; 5. Heat sink; 6. Wire pressing block; 7. Raised block; 8. Glue dot edge; 9. Bolt hole; 10. Thickened surface; 11. Avoidance space. DETAILED DESCRIPTION

[0026] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0027] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention.

[0028] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.

[0029] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] like Figure 1-4 As shown, a heat dissipation shielding cover of the present invention includes a cover plate 1, a plurality of shielding frames 2 are integrally formed on the back of the cover plate 1, and the plurality of shielding frames 2 are separately arranged. The cover plate 1 and the shielding frames 2 form a shielding cover structure;

[0032] The cover plate 1 is formed with a plurality of positioning cylinders 3, with both ends of the positioning cylinders 3 extending out of the front and back of the cover plate 1 respectively. The bottom side of the cover plate 1 is integrally formed with at least two positioning pins 4;

[0033] The shielding frame 2 includes a high-heating region frame 21 and a low-heating region frame 22. The front of the cover plate 1 is integrally formed with a plurality of heat sinks 5, which are located above the high-heating region frame 21.

[0034] A plurality of press blocks 6 are formed at the bottom edge of the low heating area frame 22. The plurality of press blocks 6 are arranged in an array at equal distances from each other, and the plurality of press blocks 6 are arranged at the same side edge of the bottom heating area frame;

[0035] The principle is: during installation, thermal grease is applied to the high-heat-generating chip and the low-heat-generating chip of the circuit board respectively, and then the cover plate 1 is installed on the corresponding position of the circuit board. At this time, the thermal grease will be filled and pressed on the back of the chip and the cover plate 1. The high-heat-generating area frame 21 can just cover the high-heat-generating chip, and the low-heat-generating area frame 22 can just cover the low-heat-generating chip. The heat of the high-heat-generating chip during operation can be quickly transferred to the cover plate 1, and the heat is dissipated through the heat sink 5 at the corresponding position. The heat of the low-heat-generating chip during operation will also be transferred to the cover plate 1, thereby preventing it from overheating and damage, so that the overall thermal balance of the circuit board is better, less prone to damage, and the service life is improved.

[0036] Furthermore: a plurality of raised blocks 7 are formed at the bottom edges of the high-heat area frame 21 and the low-heat area frame 22, and the plurality of raised blocks 7 are arranged separately from each other; grooves can be set at corresponding positions of the circuit board, so that the raised blocks 7 can be inserted into the grooves of the circuit board one by one, thereby preventing the cover plate 1 from shifting, and at the same time being able to quickly determine whether the cover plate 1 is installed in place.

[0037] Furthermore, a glue edge 8 is provided at the bottom edge of the high-heating area frame 21 and the low-heating area frame 22; the glue edge 8 can be adhered to the circuit board by glueing, so as to achieve quick installation.

[0038] Furthermore, a bolt hole 9 is formed in the middle of the bottom end of the positioning cylinder 3; the cover plate 1 can be stably installed on the circuit board by means of bolt locking.

[0039] Furthermore, the positioning cylinder 3 is integrally formed on the outer edge of the shielding frame 2 , which can enhance the strength of the cover plate 1 and prevent the shielding frame 2 from deformation and damage.

[0040] Furthermore, the positioning pins 4 and the positioning cylinders 3 are staggered with each other; the positioning pins 4 can be used in conjunction with the positioning cylinders 3 to achieve precise positioning and installation.

[0041] Furthermore: the back of the cover plate 1 is integrally formed with multiple thickened surfaces 10, and the thickened surfaces 10 are arranged one by one in the high-heating area frame 21 and the low-heating area frame 22; the setting of the thickened surfaces 10 can speed up the speed of heat transfer and achieve the effect of rapid heat dissipation.

[0042] Furthermore: a clearance space 11 is formed on the cover plate 1, and the clearance space 11 is arranged on the outside of the low-heating area frame 22. The clearance space 11 is located on the side of the low-heating area frame 22 close to the multiple wire pressing blocks 6; it can facilitate wiring and use on the low-heating chip, while ensuring its installation stability.

[0043] This embodiment does not impose any formal restrictions on the shape, material, structure, etc. of the utility model. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model are within the scope of protection of the technical solution of the utility model.

Claims

1. A heat dissipation shield, comprising a cover plate, characterized in that: The back of the cover plate is integrally formed with a plurality of shielding frames, which are separately arranged from each other, and a shielding cover structure is formed between the cover plate and the shielding frames; The cover plate is formed with a plurality of positioning cylinders, the two ends of which extend out of the front and back of the cover plate respectively, and the bottom side of the cover plate is integrally formed with at least two positioning pins; The shielding frame includes a high-heating area frame and a low-heating area frame, and the front of the cover plate is integrally formed with a plurality of heat sinks, which are located above the high-heating area frame; A plurality of press blocks are formed at the bottom edge of the low heat generation area frame. The plurality of press blocks are arranged in an array at equal distances from each other. The plurality of press blocks are arranged at the same side edge of the low heat generation area frame.

2. The heat dissipation shield according to claim 1, characterized in that: A plurality of protruding blocks are formed on the bottom edges of the high-heat-generating area frame and the low-heat-generating area frame, and the plurality of protruding blocks are spaced apart from each other.

3. The heat dissipation shield according to claim 2, characterized in that: The bottom edges of the high-heat-generating area frame and the low-heat-generating area frame are both provided with glue edges.

4. The heat dissipation shield according to claim 1, characterized in that: A bolt hole is formed in the middle of the bottom end of the positioning cylinder.

5. The heat dissipation shield according to claim 1, characterized in that: The positioning cylinder is integrally formed on the outer edge of the shielding frame.

6. The heat dissipation shield according to claim 1, characterized in that: The positioning pins and the positioning cylinders are staggered with each other.

7. The heat dissipation shield according to claim 1, characterized in that: The back of the cover plate is integrally formed with a plurality of thickened surfaces, and the thickened surfaces are arranged in the high-heating area frame and the low-heating area frame in a one-to-one correspondence.

8. The heat dissipation shield according to claim 1, characterized in that: A clearance position is formed on the cover plate, and the clearance position is arranged outside the low-heating area frame. The clearance position is located on a side of the low-heating area frame close to the plurality of wire pressing blocks.

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