Charger

Abstract

The utility model provides a charger which comprises a frame body, a heat dissipation frame and a charging module, the charging module is arranged on the frame body, the charging module is connected with the heat dissipation frame, and at least part of the heat dissipation frame is exposed to the outside. According to the charger, a traditional shell is abandoned, the heat dissipation frame is directly communicated with the outside of the charger through the open space, heat absorbed by the heat dissipation frame can be directly dissipated to the outside, the heat dissipation efficiency is greatly improved, and then the charging and using experience feeling of a user is improved.

Description

Technical Field

[0001] The present application relates to the technical field of accessories for electronic devices, and in particular to a charger. Background Art

[0002] A charger is a device that provides power to electronic devices. Taking a wireless charger as an example, wireless charging technology is a special power supply method that does not require a power cord. It relies on electromagnetic wave propagation and then converts electromagnetic wave energy into electrical energy, ultimately achieving wireless charging of mobile terminal devices such as mobile phones. The charged device only needs to be placed on the charger. During the charging process, the charger will continue to generate heat. For example, the 15W charger on the market generates a lot of heat when charging. In particular, game users often play games while charging, which generates even more heat. The heat cannot be dissipated in time, causing the phone temperature to rise, and the phone to freeze, etc., which brings a bad charging and usage experience to users. Existing chargers achieve heat dissipation by providing a heat sink and connecting the heat sink to the charging coil. However, the heat sink is generally set inside the charger's outer shell. Due to the wrapping of the outer shell, the heat absorbed by the heat sink is difficult to dissipate to the outside, resulting in poor heat dissipation effect.

[0003] Based on this, it is necessary to improve the existing charger to solve the above problems. Summary of the Invention

[0004] In view of this, the present application provides a charger that can effectively solve the above problems.

[0005] The present application provides a charger, comprising a frame, a charging module and a heat dissipation frame, wherein the charging module is arranged on the frame, the charging module is connected to the heat dissipation frame, and the heat dissipation frame is at least partially exposed to the outside world.

[0006] In one embodiment, the frame includes an upper frame and a lower frame, the upper frame and the lower frame are spaced apart to form an open space, the heat dissipation frame is arranged in the open space, and the charging module is arranged on the upper frame or the lower frame.

[0007] In one embodiment, the upper frame includes a first substrate, the lower frame includes a second substrate, the open space is formed between the first substrate and the second substrate, the charging module includes a circuit board assembly, the circuit board assembly is arranged on a side of the first substrate close to the open space, and the heat dissipation frame is connected to the circuit board assembly.

[0008] In one embodiment, the heat dissipation frame includes a heat dissipation substrate and a plurality of heat dissipation protrusions, one end of the heat dissipation substrate is connected to the circuit board assembly, and the other end is provided with a plurality of the heat dissipation protrusions, the plurality of heat dissipation protrusions are arranged at intervals, and at least some of the heat dissipation protrusions are connected to the second substrate.

[0009] In one embodiment, the heat dissipation protrusion is cylindrical.

[0010] In one embodiment, the charger further includes a fan module, a plurality of the heat dissipation protrusions are arranged along the periphery of the heat dissipation substrate and enclosed to form an installation cavity, and the fan module is installed in the installation cavity.

[0011] In one embodiment, a heat dissipation gap is formed between the plurality of heat dissipation protrusions, and the heat dissipation gap forms a first vent of the fan module. The second substrate is provided with a second vent corresponding to the fan module, and the first vent and the second vent serve as an air inlet and an air outlet for each other.

[0012] In one embodiment, the first substrate is provided with a first fixed connection portion, the second substrate is provided with a second fixed connection portion, the second fixed connection portion is connected and fixed to the first fixed connection portion, and / or the first fixed connection portion and / or the second fixed connection portion is passed through the interior of the heat dissipation frame.

[0013] In one embodiment, the charging module further includes a charging coil electrically connected to the circuit board assembly, and the charger further includes a semiconductor cooler, which is arranged between the charging coil and the heat dissipation frame.

[0014] In one embodiment, the circuit board assembly includes a circuit board, which is arranged between the charging coil and the heat sink. A avoidance hole is provided in the middle of the circuit board, and the semiconductor cooler is embedded in the avoidance hole. The semiconductor cooler includes a relative hot end and a cold end, the cold end is connected to the charging coil, and the hot end is connected to the heat sink.

[0015] In one embodiment, the plurality of heat dissipation protrusions are arranged at equal intervals, and / or the plurality of heat dissipation protrusions are arranged along the periphery of the heat dissipation substrate and arranged in multiple layers from the periphery toward the center of the heat dissipation substrate.

[0016] In summary, the present application provides a charger comprising a frame, a charging module, and a heat sink. The charging module is mounted on the frame, connected to the heat sink, and at least partially exposed to the outside world. By designing a connection between the charging module and the heat sink, at least partially exposed to the outside world, the present application abandons the traditional outer shell, allowing the heat sink to be directly connected to the outside of the charger through an open space. Heat absorbed by the heat sink can be directly dissipated to the outside, greatly improving heat dissipation efficiency and thereby enhancing the user's charging and usage experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic perspective view of the charger of the present application at an angle.

[0018] Figure 2This is a three-dimensional schematic diagram of the charger of this application at another angle.

[0019] Figure 3 for Figure 1 A three-dimensional cutaway view of the charger.

[0020] Figure 4 for Figure 1 An exploded diagram of the charger at an angle.

[0021] Figure 5 for Figure 1 An exploded diagram of the charger from another angle.

[0022] Figure 6 for Figure 1 Schematic diagram of the upper frame and its mounting components. DETAILED DESCRIPTION

[0023] Before describing the embodiments in detail, it should be understood that the present application is not limited to the detailed structure or component arrangement described below or in the accompanying drawings in this application. The present application may be an embodiment implemented in other ways. Moreover, it should be understood that the words and terms used herein are for descriptive purposes only and should not be interpreted restrictively. The words "including", "comprising", "having" and similar words used herein are intended to include the matters listed thereafter, their equivalents and other additional matters. In particular, when describing "a certain element", the present application does not limit the number of the element to one, but may also include multiple elements.

[0024] Please also refer to Figures 1 to 6 As shown, the present application provides a charger 10 that can be used to charge mobile terminal electronic devices such as mobile phones and tablet computers. The charger 10 can be a mobile power supply, a charging head, a wireless charger, etc. The present application takes a wireless charger as an example for explanation. The charger 10 includes a frame, a heat dissipation frame 16 and a charging module. The charging module is arranged on the frame, and the charging module is connected to the heat dissipation frame 16. The heat dissipation frame 16 is arranged on the charging module or on the frame so that the heat dissipation frame 16 is at least partially exposed to the outside, that is, directly in contact with the external space of the charger 10. The charger 10 of the present application abandons the traditional outer shell, so that the heat dissipation frame 16 is directly connected to the outside of the charger 10 through the open space 20. The heat absorbed by the heat dissipation frame 16 can be directly dissipated to the outside, which greatly improves the heat dissipation efficiency, thereby enhancing the user's charging and usage experience.

[0025] The frame includes an upper frame 12 and a lower frame 14. The upper frame 12 and the lower frame 14 are spaced apart and form an open space 20. The heat sink 16 is arranged in the open space 20. The charging module is arranged on the upper frame 12 or the lower frame and connected to the heat sink 16. It should be noted that the open space 20 refers to the space formed between the upper frame 12 and the lower frame 14, which are spaced apart and are in fluid communication with the outside of the charger 10 without any obstruction, thereby allowing the heat sink 16 installed in the open space 20 to be directly connected to the outside of the charger 10. The charger 10 is used to charge the device to be charged, which is a mobile terminal electronic device such as a mobile phone, a tablet computer, etc. This application takes a mobile phone as an example for detailed description. In this embodiment, the charger 10 as a whole is a circular columnar structure with a vertical hollow middle portion. Specifically, the upper frame 12, the lower frame 14, the heat sink 16 and the charging module are all designed to be circular. In other embodiments, they can also be designed to be other shapes. This application does not limit the specific shape of the charger 10.

[0026] In the illustrated embodiment, the upper frame 12 includes a first base plate 24 and a first peripheral edge 26 connected to the outer periphery of the first base plate 24. The first peripheral edge 26 includes a first lower sidewall 28 extending from the outer periphery of the first base plate 24 toward the side closer to the lower frame 14, and a first upper sidewall 30 extending from the outer periphery of the first base plate 24 toward the side away from the lower frame 14. The first upper sidewall 30, the first lower sidewall 28, and the first base plate 24 are, for example, an integrally formed structure. Similarly, the lower frame 14 includes a second base plate 32 and a second peripheral edge 34 connected to the outer periphery of the second base plate 32. The second peripheral edge 34 includes a second upper sidewall 36 extending from the outer periphery of the second base plate 32 toward the side closer to the upper frame 12, and a second lower sidewall 38 extending from the outer periphery of the second base plate 32 toward the side away from the upper frame 12. The second upper sidewall 36, the second lower sidewall 38, and the second base plate 32 are, for example, an integrally formed structure.

[0027] An open space 20 is formed between the first substrate 24 and the second substrate 32. A partition 22 is formed between the first lower sidewall 28 and the second upper sidewall 36. The partition 22 connects one side to the open space 20 and the other side to the exterior of the charger 10, thereby directly connecting the heat sink 16 to the outside air through the partition 22. In this embodiment, the charging module is disposed on the upper frame 12. Specifically, the charging module is disposed on the side of the first substrate 24 facing away from the open space 20. In the illustrated embodiment, the charger 10 also includes a semiconductor cooler 18, which is disposed on the side of the first substrate 24 near the open space 20. The charging module includes a circuit board assembly and a charging coil 54. The circuit board assembly is disposed on the side of the first substrate 24 near the open space 20, and the heat sink 16 is connected to the circuit board assembly. Furthermore, the circuit board assembly includes a circuit board 52, which is disposed between the charging coil 54 and the heat sink 16 and is electrically connected to the circuit board 52. Preferably, the semiconductor cooler 18 is provided between the charging coil 54 and the heat sink 16 to quickly conduct the heat generated by the charging module to the heat sink 16. Optionally, a relief hole 53 is provided in the middle of the circuit board 52, and the semiconductor cooler 18 is embedded in the relief hole 53.

[0028] Specifically, the first upper side wall 30 and the first substrate 24 are combined to form a first placement position 40, the charging coil 54 is installed in the first placement position 40, and the second lower side wall 38 and the second substrate 32 are combined to form a second placement position 42. The charger 10 also includes a bracket 44, which can be rotatably set in the second placement position 42. For example, the bracket 44 can be rotated relative to the lower frame 14 between a supporting position and a storage position. When in the supporting position, the bracket 44 rotates away from the second placement position 42 and forms a supporting angle with the lower frame 14 to support the charger 10 to stand up. When in the storage position, the bracket 44 is stored in the second placement position 42; further, the bracket 44 can rotate relative to the lower frame 14 to adjust the supporting position of the bracket 44, so that the bracket 44 can rotate 360°. The user can adjust the supporting angle of the mobile phone to use the mobile phone, which brings convenience.

[0029] In this embodiment, the open space 20 is composed of three interconnected sections. Specifically, the open space 20 includes a first section 46 formed by the first lower sidewall 28 and the first substrate 24, a second section 48 formed by the second upper sidewall 36 and the second substrate 32, and a third section 50 connected between the first section 46 and the second section 48. The third section 50 corresponds to the spacer 22. A circuit board 52 is disposed within the first section 46, that is, between the first substrate 24 and the heat sink 16. The circuit board 52 is secured within the first section 46, for example, by snapping or gluing. The charging coil 54 and the semiconductor cooler 18 are electrically connected to the circuit board 52. By disposing the charging coil 54 and the circuit board 52 on opposite sides of the first substrate 24 and separating them using the first substrate 24, the present application reduces the transfer of heat generated by the circuit board 52 to the first mounting position 40 where the charging coil 54 is located. This reduces the heat between the charger 10 and the mobile phone, lowering the temperature of the mobile phone during wireless charging and improving charging efficiency.

[0030] Preferably, the upper frame 12 can be made of a material with poor thermal conductivity such as plastic, so that the first substrate 24 can isolate the heat generated by the circuit board 52 and reduce the heat generated by the circuit board 52 from being transferred to the charging coil 54 through the first substrate 24 .

[0031] In the illustrated embodiment, the charger 10 further includes a magnetic assembly 56, which can be secured within the first placement location 40 by means of snaps, adhesive, or the like. The charging coil 54 is used to wirelessly charge the mobile phone; the magnetic assembly 56 includes multiple magnets arranged in a ring-shaped structure. The magnetic assembly 56 is configured to magnetically cooperate with the mobile phone's built-in magnet array, so that when the mobile phone is placed on the charger 10 for wireless charging, the magnetic assembly 56 can magnetically secure the mobile phone to the charger 10, allowing the user to charge and use the mobile phone simultaneously. The charging coil 54 is positioned at the center of the first placement location 40, and the magnetic assembly 56 is disposed around the periphery of the charging coil 54.

[0032] Specifically, the first mounting location 40 includes a first mounting area 58 and a second mounting area 60. The second mounting area 60 surrounds the circumferential periphery of the first mounting area 58. The charging coil 54 is mounted and fixed to the first mounting area 58, for example, by gluing it to the first substrate 24. The magnetic assembly 56 is mounted and fixed to the second mounting area 60, for example, by gluing it to the first substrate 24. In this embodiment, a partition 62 is provided within the first mounting location 40. The partition 62 extends circumferentially to separate the first mounting location 40 into the first mounting area 58 and the second mounting area 60. The partition 62 can be a single plate-like structure or a plurality of separate plate-like structures spaced apart along the circumference.

[0033] In the illustrated embodiment, the charger 10 further includes a charging panel 64, which covers the port of the first mounting position 40 of the upper frame 12. That is, the charging panel 64 covers the outside of the charging module and completely covers the upper end opening of the upper frame 12 to shield the charging coil 54 and the magnetic assembly 56. The charging panel 64 is connected to the end of the first upper side wall 30, for example, by a snap-fit, and the charging panel 64 contacts the charging coil 54. During wireless charging, the back of the mobile phone is placed on the charging panel 64, so that the receiving coil of the mobile phone aligns with the charging coil 54 and the built-in magnet array of the mobile phone aligns with the magnetic assembly 56 and is magnetically attracted. Preferably, the charging panel 64 is made of superthermal conductive material to quickly transfer the cold energy generated by the semiconductor refrigerator 18 to the mobile phone to dissipate heat, quickly conduct heat from the contact area between the mobile phone and the charging panel 64, and reduce the temperature of the mobile phone and the charger 10; the superthermal conductive material is, for example, a high thermal conductivity insulating material, which can be a composition of polycarbonate, graphite and phosphorus-containing flame retardant, wherein the concentration (i.e., mass fraction) of polycarbonate is 70%-80%, the concentration of graphite is less than or equal to 25%, and the concentration of phosphorus-containing flame retardant is less than or equal to 5%, and the phosphorus-containing flame retardant is, for example, a phosphate flame retardant.

[0034] The first substrate 24 is provided with a housing 66, in which the semiconductor cooler 18 is mounted. In this embodiment, a wall 68 extends from the center of the first substrate 24 toward the open space 20. The wall 68 is open at both ends. The housing 66 is formed within the wall 68 and communicates with the first mounting position 40 and the open space 20. Specifically, the housing 66 is a through-hole structure, and the circuit board 52 is positioned outside the wall 68 via its escape hole 53. Providing the housing 66 for the semiconductor cooler 18 on the first substrate 24 prevents component stacking and reduces the thickness of the entire charger 10.

[0035] Specifically, the semiconductor cooler 18 includes a cold end 70 near the first placement position 40 and a hot end 72 near the open space 20. The cold end 70 is connected to the charging coil 54, and the hot end 72 is connected to the heat sink 16. The heat sink 16 is used to dissipate heat from the hot end 72 of the semiconductor cooler 18. When the semiconductor cooler 18 is in operation, the heat generated by the mobile phone, the heat between the mobile phone and the charging panel 64, and the heat generated by the charging coil 54 can all be transferred from the cold end 70 to the hot end 72 via the charging coil 54, and ultimately dissipated through the heat sink 16, achieving an optimal heat dissipation effect. Because the heat sink 16 and the circuit board 52 are located on the same side of the first substrate 24, the heat generated by the circuit board 52 can be dissipated directly through the heat sink 16, further preventing the heat generated by the circuit board 52 from entering the first placement position 40 through the first substrate 24.

[0036] Preferably, a first heat conductor 74 is provided between the cold end 70 and the charging coil 54, and a second heat conductor 76 is provided between the hot end 72 and the heat sink 16. The first heat conductor 74 and the second heat conductor 76 facilitate heat conduction between the charging coil 54, the semiconductor refrigerator 18, and the heat sink 16, thereby improving heat conduction efficiency and enhancing heat dissipation. The first heat conductor 74 and the second heat conductor 76 are, for example, heat-conducting silicone.

[0037] Furthermore, the heat sink 16 includes a heat sink base 78 and a plurality of heat dissipation protrusions 80 connected to the heat sink base 78 on a side facing away from the semiconductor cooler 18. The hot end 72 is connected to the heat sink base 78 via a second heat conductor 76, for example, connected to the center of the heat sink base 78. The heat sink base 78 covers the port of the first lower side wall 28 and is fixedly connected to the upper frame 12, which can serve to shield internal components. The heat sink base 78 is fixedly connected to the first substrate 24 or the first lower side wall 28, for example, by means of a snap. The end of the heat dissipation protrusion 80 away from the heat dissipation base 78 protrudes into the second portion 48, and at least some of the heat dissipation protrusions 80 are connected to the second substrate 32, for example, by means of a snap or adhesive. The plurality of heat dissipation protrusions 80 are spaced apart to form heat dissipation gaps 82. The heat dissipation protrusions 80 are, for example, cylindrical structures, and the heat dissipation protrusions 80 and the heat sink base 78 are, for example, integrally formed structures. By designing the heat sink 16 as a heat sink substrate 78 and a plurality of heat sink protrusions 80, the heat sink area of the heat sink 16 can be increased and the heat dissipation efficiency can be enhanced. The heat sink protrusions 80 are designed as small cylinders, and the air flow channels between the multiple cylinders intersect with each other, so that the external airflow stays on the heat sink 16 longer when it flows through the multiple cylinders; at the same time, the airflow can fully contact the surface area of the cylinder, increase the heat dissipation area, and improve the heat conduction efficiency; and the airflow hits the cylinder smoothly, and the noise is reduced. In one embodiment, the multiple heat sink protrusions 80 are arranged at equal intervals to make the airflow smoother and less likely to generate turbulence. The multiple heat sink protrusions 80 are arranged along the periphery of the heat sink substrate 78, and are arranged in multiple layers from the periphery of the heat sink substrate 78 to the center. The more layers of heat sink protrusions 80 are arranged from the periphery of the heat sink substrate 78 to the center, the more heat sink protrusions 80 there are, the more heat conduction area there is, and the better the heat dissipation effect.

[0038] In the illustrated embodiment, the charger 10 further includes a fan module 84, which is disposed on the side of the heat sink 78 facing away from the semiconductor cooler 18. The fan module 84 is configured to rapidly dissipate heat from the heat sink 16 by enhancing airflow, further enhancing heat dissipation efficiency, improving the heat dissipation effect of the charger 10, reducing the internal temperature of the charger 10, and preventing a decrease in charging efficiency and heat generation. Specifically, a plurality of heat dissipation protrusions 80 are arranged in a circular pattern along the periphery of the heat sink 78 and enclose a mounting cavity 86. The heat sink 78 has a plurality of spaced heat dissipation protrusions 80 disposed along its periphery, but no heat dissipation protrusions 80 are disposed in the central region of the heat sink 78. The outer heat dissipation protrusions 80 then enclose the mounting cavity 86. The fan module 84 is disposed within the mounting cavity 86 and is connected and fixed to the heat sink 78, for example, by screws. In other embodiments, the fan module 84 may also be connected and fixed to the lower frame 14. The heat dissipation gap 82 forms the first vent for the fan module 84, allowing the heat dissipation frame 16 to directly contact the outside air, thereby improving air intake and heat dissipation. The second substrate 32 is provided with a second vent 88 corresponding to the fan module. The first vent and the second vent 88 can serve as the air inlet and outlet of the fan module 84, respectively. Placing the fan module 84 within the heat dissipation frame 16 can reduce the overall volume of the charger 10. Preferably, when the fan module 84 is in operation, external air enters the heat dissipation gap 82 through the partition 22. As the air passes through the heat dissipation protrusion 80 and the heat dissipation substrate 78, it begins to absorb heat and forms hot air. A portion of the hot air flows out through the heat dissipation gap 82 and the partition 22, while the remaining air is drawn into the fan module 84 and blown out through the air outlet 88, thereby achieving a more effective heat dissipation effect.

[0039] Specifically, a portion of the second base plate 32 corresponding to the fan module 84 is formed toward the side facing away from the upper frame 12 to form a protrusion 90. The protrusion 90 protrudes beyond the side of the lower frame 14 away from the upper frame 12. The second vent 88 is provided on the protrusion 90. The protrusion 90 and the second base plate 32 are, for example, integrally formed. Optionally, the central portion of the second base plate 32 is a through-hole structure. The protrusion 90 includes an intermediate support portion 92 and a plurality of connecting ribs 94 connecting the intermediate support portion 92 and the inner wall of the through-hole structure. The plurality of connecting ribs 94 are spaced apart such that the second vent 88 is formed between the plurality of connecting ribs 94.

[0040] Preferably, an air outlet gap 96 communicating with the outside is formed between the intermediate support portion 92 and the lower frame 14, so that the second vent 88 can communicate with the outside through the air outlet gap 96. For example, the intermediate support portion 92 protrudes beyond the bottom surface of the lower frame 14, that is, the height of the lower frame 14 is higher than the height of the intermediate support portion 92, so that when the charger 10 is placed on a surface, a height difference is formed between the intermediate support portion 92 and the lower frame 14, thereby forming the air outlet gap 96; alternatively, a bottom cover 98 is provided at the bottom of the intermediate support portion 92, and the bottom cover 98 is connected to the intermediate support portion 92 by, for example, a snap-fit connection. The bottom cover 98 can raise the intermediate support portion 92, so that the air outlet gap 96 is formed between the intermediate support portion 92 and the lower frame 14, and at the same time, it can prevent foreign objects such as hair from entering the second vent 88.

[0041] The lower frame 14 and the upper frame 12 can be fixedly connected by screws. Specifically, a first fixing connection portion 100 is provided on the first substrate 24, and a second fixing connection portion 102 is provided on the second substrate 32. The second fixing connection portion 102 is fixedly connected to the first fixing connection portion 100. Furthermore, the first fixing connection portion 100 and the second fixing connection portion 102 are inserted into the interior of the heat sink 16 to unblock the outermost circle of the heat sink 16, thereby ensuring smoother air circulation and better heat dissipation. Preferably, the first fixing connection portion 100 is a fixing hole, and the second fixing connection hole 102 is a fixing post. The fixing post is located on the side of the second substrate 32 facing the first substrate 24 and is inserted between the heat sink substrate 78, the circuit board 52, and the plurality of heat dissipation protrusions 80 and connected to the fixing hole. The fixing post can play a role in positioning the heat sink 16 and the circuit board 52. The screw is threaded through the fixing hole and connected to the fixing post to achieve the connection and fixation of the upper frame 12 and the lower frame 14. Preferably, a support block is further provided between the circuit board 52 and the heat dissipation substrate 78 . The support block is sleeved on the fixing column and supports and limits the circuit board 52 , so that the circuit board 52 is clamped and fixed between the first substrate 24 and the heat dissipation substrate 78 .

[0042] In the illustrated embodiment, a button and a data interface are provided on the outer wall of the upper frame 12. The button and the data interface are electrically connected to the circuit board 52 respectively. The data interface can be connected to an external power supply to power the charger 10, and the button can be used to control the start or shut down of the charger 10.

[0043] In summary, the present application provides a charger comprising a frame, a charging module, and a heat sink. The charging module is mounted on the frame, connected to the heat sink, and at least partially exposed to the outside world. By designing a connection between the charging module and the heat sink, at least partially exposed to the outside world, the present application abandons the traditional outer shell, allowing the heat sink to be directly connected to the outside of the charger through an open space. Heat absorbed by the heat sink can be directly dissipated to the outside, greatly improving heat dissipation efficiency and thereby enhancing the user's charging and usage experience.

[0044] The concepts described herein may be embodied in other forms without departing from their spirit and characteristics. The specific embodiments disclosed are to be considered illustrative rather than restrictive. Therefore, the scope of this application is to be determined by the appended claims, not by the preceding description. Any changes within the literal meaning and range of equivalents of the claims are intended to be within the scope of these claims.

Claims

1. A charger, characterized in that: It includes a frame, a charging module, a heat sink and a semiconductor refrigerator, the charging module is arranged on the frame, the charging module is connected to the heat sink, the frame includes an upper frame and a lower frame, the upper frame and the lower frame are spaced apart and form an open space, the heat sink is arranged in the open space, and the heat sink is at least partially exposed to the outside world; the upper frame includes a first substrate, the semiconductor refrigerator is arranged on a side of the first substrate close to the open space, the heat sink includes a heat sink and a plurality of heat sink protrusions, and the plurality of heat sink protrusions are connected to the side of the heat sink facing away from the semiconductor refrigerator.

2. The charger according to claim 1, wherein: The charging module is arranged on the upper frame or the lower frame.

3. The charger according to claim 2, wherein: The lower frame includes a second substrate, the open space is formed between the first substrate and the second substrate, the charging module includes a circuit board assembly, the circuit board assembly is arranged on a side of the first substrate close to the open space, and the heat dissipation frame is connected to the circuit board assembly.

4. The charger according to claim 3, wherein: One end of the heat dissipation substrate is connected to the circuit board assembly, and the other end is provided with a plurality of heat dissipation protrusions. The plurality of heat dissipation protrusions are arranged at intervals, and at least part of the heat dissipation protrusions are connected to the second substrate.

5. The charger according to claim 4, wherein: The heat dissipation protrusion is cylindrical.

6. The charger according to claim 4, wherein: The charger further includes a fan module. A plurality of heat dissipation protrusions are arranged along the periphery of the heat dissipation substrate and enclosed to form an installation cavity. The fan module is installed in the installation cavity.

7. The charger according to claim 6, wherein: A heat dissipation gap is formed between the multiple heat dissipation protrusions, and the heat dissipation gap forms a first ventilation port of the fan module. The second substrate is provided with a second ventilation port corresponding to the fan module, and the first ventilation port and the second ventilation port serve as an air inlet and an air outlet for each other.

8. The charger according to claim 3, wherein: The first substrate is provided with a first fixed connection part, and the second substrate is provided with a second fixed connection part; the second fixed connection part is connected and fixed to the first fixed connection part, and / or the first fixed connection part and the second fixed connection part are passed through the interior of the heat dissipation frame.

9. The charger according to any one of claims 3 to 8, wherein: The charging module also includes a charging coil electrically connected to the circuit board assembly, and the semiconductor cooler is arranged between the charging coil and the heat dissipation frame.

10. The charger according to claim 9, wherein: The circuit board assembly includes a circuit board, which is arranged between the charging coil and the heat dissipation frame. A avoidance hole is provided in the middle of the circuit board, and the semiconductor cooler is embedded in the avoidance hole. The semiconductor cooler includes a relative hot end and a cold end, the cold end is connected to the charging coil, and the hot end is connected to the heat dissipation frame.

11. The charger according to claim 4, wherein: The plurality of heat dissipation protrusions are arranged at equal intervals, and / or the plurality of heat dissipation protrusions are arranged along the periphery of the heat dissipation substrate and arranged in multiple layers from the periphery to the center of the heat dissipation substrate.

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