Heat dissipation device and electronic equipment

Abstract

The embodiment of the utility model discloses a heat dissipation device and electronic equipment. The heat dissipation device comprises a base, a fin assembly, a fan and a heat conduction assembly. The base is provided with a first side and a second side which are oppositely arranged; the fin assembly is arranged on the base, the surface, close to the first side, of the fin assembly is concavely provided with first concave grains, and the surface, close to the second side, of the fin assembly is concavely provided with second concave grains; the fan is arranged on the base and used for driving air to flow and penetrate through the fin assembly. The heat conduction assembly is arranged on the side, away from the fin assembly, of the base and used for making contact with electronic parts of the circuit board for heat conduction. By means of the mode, under the condition that the overall size of the heat dissipation device is not changed, the contact surface area of the fin assembly and the air can be increased, the heat dissipation area of the heat dissipation device is increased, and the heat dissipation efficiency of the heat dissipation device is improved. In addition, flowing air penetrates through the fin assembly and can rapidly take away heat accumulated on the fin assembly, and the heat dissipation efficiency of the heat dissipation device is improved.

Description

Technical Field

[0001] The embodiments of the utility model relate to the field of heat dissipation technology, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] Electronic devices (e.g. graphics cards) include circuit boards and electronic components mounted on them. These components generate heat during operation. To dissipate the heat quickly, they are usually equipped with heat sinks. These heat sinks are mounted on the circuit boards and in contact with the electronic components for heat conduction. The heat generated by the electronic components is transferred to the heat sinks and dissipated quickly through the heat sinks.

[0003] Currently, to improve the heat dissipation efficiency of heat sinks, the structure of the heat sink is often modified by increasing its surface area. Specifically, this is done by increasing the length, width, and height of the heat sink's aluminum extrusion (i.e., the fins). However, while this approach increases the heat dissipation area of the heat sink, it also increases the overall size of the heat sink, increasing the space occupied by the heat sink and hindering its use. Utility Model Content

[0004] The main technical problem solved by the embodiments of the present invention is to provide a heat dissipation device and an electronic device, which can increase the heat dissipation surface area of the heat dissipation device while keeping the space occupancy rate of the heat dissipation device unchanged.

[0005] In order to solve the above technical problems, a technical solution adopted in an embodiment of the present utility model is: providing a heat dissipation device, including a base, a fin assembly, a fan and a heat-conducting assembly; the base is provided with a first side and a second side arranged opposite to each other; the fin assembly is arranged on the base, and the surface of the fin assembly close to the first side is concavely formed with a first groove, and the surface of the fin assembly close to the second side is concavely formed with a second groove; the fan is arranged on the base, and the fan is used to drive air to flow and pass through the fin assembly; the heat-conducting assembly is arranged on the side of the base away from the fin assembly, and the heat-conducting assembly is used to contact and conduct heat with the electronic components of the circuit board.

[0006] In some embodiments, the fin assembly includes a first fin, a second fin, a plurality of third fins and a plurality of fourth fins, the first fin and the second fin are relatively arranged on the base along a first direction, the first groove is located on the surface of the first fin facing away from the second fin, the second groove is located on the surface of the second fin facing away from the first fin, the plurality of third fins and the plurality of fourth fins are relatively arranged between the first fin and the second fin along a second direction, the fan is used to drive air to flow and pass through the plurality of third fins and the plurality of fourth fins, the first direction is perpendicular to the second direction, and the first direction is the direction from the first side to the second side.

[0007] In some embodiments, the base, the first fin, the second fin, the plurality of third fins, and the plurality of fourth fins enclose a receiving space, and the fan is disposed in the receiving space.

[0008] In some embodiments, the first fin, the third fin and the fourth fin together form a first gap, and the fan is used to drive air to flow through the first gap; and / or, the second fin, the third fin and the fourth fin together form a second gap, and the fan is used to drive air to flow through the second gap.

[0009] In some embodiments, a surface of the base facing away from the fin assembly is provided with a groove, the heat conducting assembly is at least partially provided in the groove, and the heat conducting assembly is used for contacting and conducting heat with electronic components of a circuit board.

[0010] In some embodiments, the heat-conducting component includes a first heat-conducting member and a second heat-conducting member. The first heat-conducting member is arranged in the groove, and the second heat-conducting member is arranged on the side of the first heat-conducting member away from the groove. The second heat-conducting member is used to contact and conduct heat with electronic components of the circuit board.

[0011] In some embodiments, a third groove is formed on a side of the first heat conducting member contacting the second heat conducting member, and the second heat conducting member at least partially blocks the third groove.

[0012] In some embodiments, the first heat conducting member includes a first portion, a second portion, and a third portion connected end to end in sequence, the second portion extends along the second direction, the first portion extends from one end of the second portion to bend away from the second portion, the third portion extends from the other end of the second portion to bend away from the second portion, and the third groove extends through the first portion, the second portion, and the third portion.

[0013] In some embodiments, the heat dissipation device includes a fastening assembly, which includes a nut, an elastic member, a screw member and a gasket. One end of the nut is fixed to the side of the base facing away from the fin assembly, and the other end of the nut is used to at least partially penetrate the circuit board. One end of the elastic member is connected to one end of the screw member, and the other end of the elastic member is connected to the gasket. The gasket is used to abut the circuit board when the other end of the screw member is screwed to the nut.

[0014] In order to solve the above technical problems, another technical solution adopted in an embodiment of the present utility model is: to provide an electronic device, including a circuit board, an electronic module and the above-mentioned heat dissipation device, the electronic module is arranged on the circuit board, the heat dissipation device is arranged on the circuit board, and the heat conductive component of the heat dissipation device at least partially contacts the electronic module.

[0015] The beneficial effects of the embodiment of the present invention are as follows: Different from the prior art, the embodiment of the present invention provides a heat dissipation device, including a base, a fin assembly, a fan and a heat conduction assembly; the base is provided with a first side and a second side arranged opposite to each other; the fin assembly is provided on the base, and the surface of the fin assembly close to the first side is concavely formed with a first groove, and the surface of the fin assembly close to the second side is concavely formed with a second groove; the fan is provided on the base, and the fan is used to drive air to flow and pass through the fin assembly; the heat conduction assembly is provided on the side of the base away from the fin assembly, and the heat conduction assembly is used to contact and conduct heat with the electronic components of the circuit board. Through the above method, the surface area of the fin assembly in contact with the air can be increased while the overall volume of the heat dissipation device remains unchanged, thereby increasing the heat dissipation area of the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device. In addition, the flowing air passing through the fin assembly can quickly take away the heat accumulated in the fin assembly, thereby improving the heat exchange efficiency between the fin assembly and the air, thereby improving the heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0017] Figure 1 This is a schematic diagram of the structure of the heat dissipation device provided by the embodiment of the utility model Figure 1 ;

[0018] Figure 2 This is a schematic diagram of the structure of the heat dissipation device provided by the embodiment of the utility model Figure 2 ;

[0019] Figure 3 yes Figure 1 A partial enlarged view of point A in the middle;

[0020] Figure 4 yes Figure 2 A partial enlarged view of point B in the middle;

[0021] Figure 5 The structure explosion of the heat dissipation device provided by the embodiment of the utility model Figure 1 ;

[0022] Figure 6 The structure explosion of the heat dissipation device provided by the embodiment of the utility model Figure 2 ;

[0023] Figure 7 This is a structural diagram of a fastening assembly of a heat dissipation device provided by an embodiment of the present utility model;

[0024] Figure 8 This is a diagram showing the use state of the fastening assembly of the heat dissipation device provided by an embodiment of the present utility model;

[0025] Figure 9 It is a structural diagram of an electronic device provided by an embodiment of the present utility model;

[0026] Figure 10 This is a cross-sectional view of the structure of an electronic device provided by an embodiment of the present utility model;

[0027] Figure 11 yes Figure 10 A partial enlarged view of point C in the middle.

[0028] Description of reference numerals:

[0029] 1 base, 11 first side, 12 second side, 13 groove;

[0030] 2 fin assembly, 21 first groove, 211 first indentation, 22 second groove, 221 second indentation, 23 first fin, 24 second fin, 25 third fin, 26 fourth fin, 27 first gap, 28 second gap, 29 third gap, 210 fourth gap;

[0031] 3 fans;

[0032] 4 heat-conducting component, 41 first heat-conducting member, 411 third groove, 412 first portion, 413 second portion, 414 third portion, 42 second heat-conducting member;

[0033] 5. Containment space;

[0034] 6 fastening assembly, 61 nut, 62 elastic member, 63 threaded member, 64 gasket;

[0035] 7 gaps;

[0036] 100 heat dissipation device;

[0037] 200 electronic modules;

[0038] 300 circuit boards;

[0039] X is the first direction; Y is the second direction. DETAILED DESCRIPTION

[0040] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "upper", "lower", "inside", "outside", "vertical", "horizontal", etc. used in this specification indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0041] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this utility model belongs. The terms used in this specification and in the description of this utility model are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used in this specification includes any and all combinations of one or more of the relevant listed items.

[0042] Electronic devices (e.g. graphics cards) include circuit boards and electronic components mounted on them. These components generate heat during operation. To dissipate the heat quickly, they are usually equipped with heat sinks. These heat sinks are mounted on the circuit boards and in contact with the electronic components for heat conduction. The heat generated by the electronic components is transferred to the heat sinks and dissipated quickly through the heat sinks.

[0043] Currently, to improve the heat dissipation efficiency of heat sinks, the structure of the heat sink is often modified by increasing its surface area. Specifically, this is done by increasing the length, width, and height of the heat sink's aluminum extrusion (i.e., the fins). However, while this approach increases the heat dissipation area of the heat sink, it also increases the overall size of the heat sink, increasing the space occupied by the heat sink and hindering its use.

[0044] For this reason, see Figure 1 and Figure 2 The present invention provides an embodiment of a heat dissipation device 100, which can maintain the space occupancy rate unchanged while keeping the overall volume of the heat dissipation device 100 unchanged, increase the surface area of the fin assembly 2 in contact with the air, and thus increase the heat dissipation area of the heat dissipation device 100, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0045] For the heat dissipation device 100, please refer to Figure 1 and Figure 2 The heat dissipation device 100 includes a base 1, a fin assembly 2, a fan 3, and a heat conduction assembly 4. The base 1 has a first side 11 and a second side 12 disposed opposite each other. The fin assembly 2 is disposed on the base 1, and a first groove 21 is formed concavely on the surface of the fin assembly 2 near the first side 11, and a second groove 22 is formed concavely on the surface of the fin assembly 2 near the second side 12. The fan 3 is disposed on the base 1 and is used to drive air through the fin assembly 2. The heat conduction assembly 4 is disposed on the side of the base 1 facing away from the fin assembly 2 and is used to contact and conduct heat with the electronic components of the circuit board. The base 1 and the fin assembly 2 are integrally formed, and the fin assembly 2 is integrally formed with the first groove 21 and the second groove 22.

[0046] For base 1 above, see Figure 1 and Figure 2 The base 1 has a first length along the first direction X and a second length along the second direction Y, so that the base 1 is rectangular. It is understood that the base 1 includes but is not limited to a rectangular shape. For example, the base 1 can be circular, elliptical, trapezoidal, triangular or other irregular shapes.

[0047] For the above fin assembly 2, see Figure 1 and Figure 2 The fin assembly 2 includes a first fin 23, a second fin 24, a plurality of third fins 25 and a plurality of fourth fins 26. The first fin 23 and the second fin 24 are relatively arranged on the base 1 along the first direction X. The first groove 21 is located on the surface of the first fin 23 away from the second fin 24, and the second groove 22 is located on the surface of the second fin 24 away from the first fin 23. The plurality of third fins 25 and the plurality of fourth fins 26 are relatively arranged between the first fin 23 and the second fin 24 along the second direction Y. The fan 3 is used to drive air to flow and pass through the plurality of third fins 25 and the plurality of fourth fins 26. The first direction X is perpendicular to the second direction Y. The first direction X is the direction from the first side 11 to the second side 12, wherein the first fin 23 is close to the first side 11, and the second fin 24 is close to the second side 12.

[0048] In some embodiments, the spacing between the first fin 23 and the second fin 24 along the first direction X is equal to the first length of the base 1. In this way, the number of third fins 25 and fourth fins 26 can be increased, thereby increasing the surface area of the fin assembly 2 in contact with the air, thereby increasing the heat dissipation area of the heat dissipation device 100, and helping to improve the heat dissipation efficiency of the heat dissipation device 100.

[0049] In some embodiments, the length of the first fin 23 along the second direction Y and the length of the second fin 24 along the second direction Y are both equal to the second length of the base 1 , the length of the first groove 21 along the second direction Y is equal to the length of the first fin 23 along the second direction Y, and the length of the second groove 22 along the second direction Y is equal to the length of the second fin 24 along the second direction Y. Through the above-described method, the surface area of the first groove 21 and the second groove 22 can be increased, thereby increasing the surface area of the fin assembly 2 in contact with the air, thereby increasing the heat dissipation area of the heat dissipation device 100 and helping to improve the heat dissipation efficiency of the heat dissipation device 100.

[0050] For the first groove 21, see Figure 2 and Figure 4 The first groove 21 includes a plurality of first indentations 211 connected in sequence, and the plurality of first indentations 211 are arranged in sequence along the height direction on the surface of the first fin 23 away from the second fin 24, and the sum of the heights of the plurality of first indentations 211 along the height direction is less than or equal to the height of the surface of the first fin 23 away from the second fin 24.

[0051] For the second grooves 22, see Figure 1 and Figure 3 The second groove 22 includes a plurality of second indentations 221 connected in sequence, and the plurality of second indentations 221 are arranged in sequence along the height direction on the surface of the second fin 24 away from the first fin 23, and the sum of the heights of the plurality of second indentations 221 along the height direction is less than or equal to the height of the surface of the second fin 24 away from the first fin 23.

[0052] For the above fin assembly 2, see Figure 1 and Figure 5 The base 1, the first fin 23, the second fin 24, the third fins 25, and the fourth fins 26 enclose a receiving space 5, and the fan 3 is disposed in the receiving space 5. That is, the first fin 23, the second fin 24, the third fins 25, and the fourth fins 26 are disposed around the periphery of the fan 3, and the base 1 is disposed at the bottom of the fan 3. Through the above-mentioned manner, the utilization rate of the fan 3 can be improved, that is, the fan 3 drives the air to flow from the center to the periphery, and the flowing air evenly passes through all directions of the fin assembly 2, effectively avoiding local air flow obstruction, so that the flowing air fully contacts each fin, accelerates the heat dissipation of the fin assembly 2, and improves the heat dissipation efficiency of the heat dissipation device 100.

[0053] For the above fin assembly 2, see Figure 1 and Figure 5 The first fin 23, a third fin 25, and a fourth fin 26 together form a first gap 27. The fan 3 is used to drive air to flow through the first gap 27. The second fin 24, a third fin 25, and a fourth fin 26 together form a second gap 28. The fan 3 is used to drive air to flow through the second gap 28. A third gap 29 is formed between any two adjacent third fins 25, and a fourth gap 210 is formed between any adjacent fourth gaps 210. The first gap 27, the second gap 28, the third gap 29, and the fourth gap 210 are all connected to the receiving space 5. In the above manner, when the fan 3 drives the air to flow from the center to the periphery in the receiving space 5, the flowing air simultaneously passes through the first gap 27, the second gap 28, the third gaps 29, and the fourth gaps 210 and is discharged outside the fin assembly 2, effectively avoiding the existence of dead corners or stagnation areas of the flowing air in the fin assembly 2, further improving the heat dissipation efficiency of the heat dissipation device 100.

[0054] For the above mentioned thermal conductive components 4, please refer to Figure 2 and Figure 6 The surface of the base 1 facing away from the fin assembly 2 is provided with a groove 13. The heat conducting assembly 4 is at least partially disposed within the groove 13. The heat conducting assembly 4 is used to contact and conduct heat with the electronic components of the circuit board. In this manner, the surface of the heat conducting assembly 4 contacts the walls of the groove 13, increasing the contact area between the heat conducting assembly 4 and the base 1. This in turn increases the heat conduction efficiency between the heat conducting assembly 4 and the base 1, thereby increasing the heat conduction efficiency between the base 1 and the fin assembly 2, and improving the heat dissipation efficiency of the heat dissipation device 100.

[0055] It should be noted that the shape of the heat conducting component 4 is adapted to the shape of the groove 13. It should also be noted that the heat conducting component 4 is fixed to the groove 13 by one or more connection methods including but not limited to bonding, snapping, screwing, magnetic attraction or clamping.

[0056] For the above mentioned thermal conductive components 4, please refer to Figure 2 and Figure 6 The heat-conducting component 4 includes a first heat-conducting member 41 and a second heat-conducting member 42. The first heat-conducting member 41 is arranged in the groove 13, and the second heat-conducting member 42 is arranged on the side of the first heat-conducting member 41 away from the groove 13. The second heat-conducting member 42 is used to contact and conduct heat with the electronic components of the circuit board.

[0057] Among them, see Figure 8When the second heat-conducting member 42 is in contact with the electronic components of the circuit board, the height difference of the second heat-conducting member 42 creates a gap 7 between the first heat-conducting member 41 and the circuit board. Air passes through the gap 7 and simultaneously contacts the first heat-conducting member 41 and the second heat-conducting member 42. At this point, the heat dissipation device 100 has two heat dissipation paths: first, heat is transferred from the circuit board to the heat-conducting component 4, the base 1, and the fin assembly 2 in sequence, and dissipated through the fin assembly 2 in contact with the air, achieving heat dissipation; second, heat is transferred from the circuit board to the heat-conducting component 4, and dissipated through the heat-conducting component 4 in contact with the air, achieving heat dissipation. This approach can further improve the heat dissipation efficiency of the heat dissipation device 100.

[0058] For the first heat conducting member 41 and the second heat conducting member 42, please refer to Figure 2 and Figure 6 The side of the first heat conducting member 41 that contacts the second heat conducting member 42 is concavely formed with a third groove 411, and the second heat conducting member 42 at least partially obscures the third groove 411. This method increases the surface area of the first heat conducting member 41 in contact with the air, thereby increasing the surface area of the heat conducting assembly 4 in contact with the air. This improves the efficiency of the heat conducting assembly 4 in dissipating heat through the air, thereby contributing to improved heat dissipation efficiency of the heat dissipation device 100.

[0059] For the first heat conducting member 41, please refer to Figure 2 and Figure 6 The first heat conducting member 41 includes a first portion 412, a second portion 413, and a third portion 414 connected end to end. The second portion 413 extends along the second direction Y. The first portion 412 bends and extends from one end of the second portion 413 away from the second portion 413. The third portion 414 bends and extends from the other end of the second portion 413 away from the second portion 413. The third groove 411 extends through the first portion 412, the second portion 413, and the third portion 414. By using the above method, the length of the first heat conducting member 41 and the length of the third groove 411 can be increased, thereby increasing the surface area of the first heat conducting member 41 in contact with air. This further increases the surface area of the heat conducting component 4 in contact with air, thereby further improving the efficiency of the heat conducting component 4 in dissipating heat through the air, and thus helping to further improve the heat dissipation efficiency of the heat dissipation device 100.

[0060] See also Figure 7 and Figure 8The heat sink 100 includes a fastening assembly 616, which includes a nut, an elastic member 62, a screw 63, and a washer 64. One end of the nut is fixed to the side of the base 1 facing away from the fin assembly 2, and the other end of the nut is configured to at least partially penetrate the circuit board. One end of the elastic member 62 is connected to one end of the screw 63, and the other end of the elastic member 62 is connected to the washer 64. The washer 64 is configured to abut the circuit board when the other end of the screw 63 is screwed to the nut. This method not only allows the heat sink 100 to be connected to the circuit board, but also limits the pressure of the fastening assembly 616 on the circuit board, preventing the fastening assembly 616 from excessively squeezing the circuit board, thereby preventing the fastening assembly 616 from squeezing and damaging the circuit board, and preventing the base 1 from squeezing and damaging electronic components mounted on the circuit board. In addition, this method allows the elastic member 62 to absorb vibration or stress generated during the operation of the heat sink 100. That is, during operation, the heat sink 100 and the circuit board may experience slight displacement or vibration caused by the rotation of the fan 3 or thermal expansion, and the elastic member 62 can act as a buffer.

[0061] In some embodiments, the number of fastening assemblies 616 is four, with one fastening assembly 616 disposed at a corner of the base 1. It is understood that the number of fastening assemblies 616 includes but is not limited to four. For example, in other embodiments, the number of fastening assemblies 616 is six or eight.

[0062] The present invention provides a heat sink 100, comprising a base 1, a fin assembly 2, a fan 3, and a heat conducting assembly 4. The base 1 has a first side 11 and a second side 12 disposed opposite each other. The fin assembly 2 is disposed on the base 1, and a first groove 21 is formed concavely on the surface of the fin assembly 2 near the first side 11, and a second groove 22 is formed concavely on the surface of the fin assembly 2 near the second side 12. The fan 3 is disposed on the base 1, and is used to drive air to flow through the fin assembly 2. The heat conducting assembly 4 is disposed on the side of the base 1 facing away from the fin assembly 2, and is used to contact and conduct heat with electronic components on a circuit board. Through the above-described method, the surface area of the fin assembly 2 in contact with the air can be increased while the overall volume of the heat sink 100 remains unchanged, thereby increasing the heat dissipation area of the heat sink 100 and improving the heat dissipation efficiency of the heat sink 100. In addition, the flowing air passing through the fin assembly 2 can quickly remove the heat accumulated in the fin assembly 2, thereby improving the heat exchange efficiency between the fin assembly 2 and the air, thereby improving the heat dissipation efficiency of the heat sink 100.

[0063] See also Figures 9 to 11The present invention further provides an embodiment of an electronic device, comprising a circuit board 300, an electronic module 200, and the heat sink 100. The electronic module 200 is disposed on the circuit board 300, and the heat sink 100 is disposed on the circuit board 300. The heat conducting component 4 of the heat sink 100 at least partially contacts the electronic module 200. The specific structure and function of the heat sink 100 can be referred to the above-mentioned embodiment of the heat sink 100, and will not be described in detail here.

[0064] In some embodiments, the electronic device is a graphics card, and the electronic module 200 is an integration of a processor, a chip, power management components, and other components. The heat conducting component 4 of the heat sink 100 at least partially contacts the chip. It is understood that the electronic device includes, but is not limited to, a graphics card. For example, in some other embodiments, the electronic device is a hard disk, a central processing unit, a memory module, a power supply module, or a wireless communication module.

[0065] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A base having a first side and a second side oppositely disposed; A fin assembly is provided on the base, wherein a surface of the fin assembly close to the first side is concavely formed with a first groove, and a surface of the fin assembly close to the second side is concavely formed with a second groove; a fan, disposed on the base, and configured to drive air to flow through the fin assembly; The heat conducting component is arranged on a side of the base away from the fin component, and is used for contacting and conducting heat with electronic components of the circuit board.

2. The heat dissipation device according to claim 1, characterized in that: The fin assembly includes a first fin, a second fin, a plurality of third fins and a plurality of fourth fins, the first fin and the second fin are arranged relative to the base along a first direction, the first groove is located on the surface of the first fin facing away from the second fin, and the second groove is located on the surface of the second fin facing away from the first fin, the plurality of third fins and the plurality of fourth fins are arranged relative to each other between the first fin and the second fin along a second direction, and the fan is used to drive air to flow and pass through the plurality of third fins and the plurality of fourth fins, the first direction is perpendicular to the second direction, and the first direction is the direction from the first side to the second side.

3. The heat dissipation device according to claim 2, characterized in that: The base, the first fin, the second fin, the plurality of third fins and the plurality of fourth fins enclose a receiving space, and the fan is arranged in the receiving space.

4. The heat dissipation device according to claim 2, characterized in that: The first fin, the third fin, and the fourth fin together enclose a first gap, and the fan is used to drive air to flow through the first gap; and / or, The second fin, the third fin and the fourth fin together form a second gap, and the fan is used to drive air to flow through the second gap.

5. The heat dissipation device according to claim 2, characterized in that: A groove is provided on the surface of the base facing away from the fin assembly. The heat-conducting assembly is at least partially disposed in the groove. The heat-conducting assembly is used for contacting and conducting heat with electronic components of a circuit board.

6. The heat dissipation device according to claim 5, characterized in that: The heat-conducting component includes a first heat-conducting member and a second heat-conducting member. The first heat-conducting member is arranged in the groove, and the second heat-conducting member is arranged on the side of the first heat-conducting member away from the groove. The second heat-conducting member is used to contact and conduct heat with electronic components of the circuit board.

7. The heat dissipation device according to claim 6, characterized in that: A third groove is formed on a side of the first heat conducting member that contacts the second heat conducting member, and the second heat conducting member at least partially blocks the third groove.

8. The heat dissipation device according to claim 7, characterized in that: The first heat conducting member includes a first portion, a second portion, and a third portion connected in sequence, the second portion extends along the second direction, the first portion extends from one end of the second portion and bends away from the second portion, the third portion extends from the other end of the second portion and bends away from the second portion, and the third groove extends from the first portion to the third portion.

9. The heat dissipation device according to claim 1, wherein: The heat dissipation device includes a fastening assembly, which includes a nut, an elastic member, a screw member and a gasket. One end of the nut is fixed to the side of the base facing away from the fin assembly, and the other end of the nut is used to at least partially penetrate the circuit board. One end of the elastic member is connected to one end of the screw member, and the other end of the elastic member is connected to the gasket. The gasket is used to abut the circuit board when the other end of the screw member is screwed to the nut.

10. An electronic device, characterized in that: It comprises a circuit board, an electronic module and the heat dissipation device according to any one of claims 1 to 9, wherein the electronic module is arranged on the circuit board, the heat dissipation device is arranged on the circuit board, and the heat conductive component of the heat dissipation device at least partially contacts the electronic module.

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