Low-cost silver-plated LED support structure

Abstract

The utility model discloses a low-cost silver-plated LED support structure, which comprises a plurality of pins, each pin comprises a circuit board contact part, a conductive part and a chip binding part, the chip binding part is stretched upwards to enable the circuit board contact part to contract inwards, the conductive part is bent relative to the chip binding part and the circuit board contact part, and the chip binding part is connected with the conductive part. The circuit board contact part and the chip binding part are provided with silver coatings; the pins are plated with the second silver coating at the circuit board contact part, and the chip binding part is provided with the first silver coating, so that the contact resistance of the circuit board contact part and the chip binding part is remarkably reduced, the efficient transmission of current is ensured, and the electrical connection performance of the pins is improved; meanwhile, the thickness of the first silver plating layer is larger than that of the second silver plating layer, the chip binding part is stretched upwards to enable the circuit board contact part to contract inwards, and then the conductive part is driven to be bent relative to the chip binding part and the circuit board contact part, that is, the conductive part of the pin is not in contact with the LED chip or the circuit board during actual use, so that the conductive part of the pin is not plated with the silver plating layer; compared with a mode of electroplating a silver layer on the surface of the whole pin, the electroplating area is reduced under the condition that the overall performance of the pin is not influenced, so that the cost is reduced; and the chip binding part is plated with silver at the position corresponding to the windowing of the cup body, so that the electroplating area is further reduced, and the manufacturing cost is further reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of silver-plated LED brackets, in particular to a low-cost silver-plated LED bracket structure. Background Art

[0002] An LED holder is a structural component specifically used to support and secure light-emitting diodes. It's typically made of metal and plastic, and contains electrical connection pins and a cup that supports the LED. The pins are used to provide power and signal transmission.

[0003] The pins of the LED bracket are usually plated with a silver layer on the surface to improve the conductivity of the LED bracket and enhance the reflectivity of the LED bracket to the light emitted by the LED chip. The existing technology usually plates the silver layer on the surface of the entire pin. However, in actual use, the conductive part of the pin is mainly used to transmit current, and the resistance of the conductive part of the pin is mainly related to the cross-sectional area and conductivity. Therefore, plating the silver layer on the surface of the entire pin is a waste of resources and increases costs. Utility Model Content

[0004] The purpose of the present invention is to provide a low-cost silver-plated LED bracket structure to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solutions:

[0006] A low-cost silver-plated LED bracket structure includes several pins, each of which includes a circuit board contact portion, a conductive portion, and a chip binding portion. The chip binding portion is stretched upward to cause the circuit board contact portion to shrink inward, and the conductive portion is bent relative to the chip binding portion and the circuit board contact portion. The circuit board contact portion and the chip binding portion are provided with a silver-plated layer.

[0007] According to a further technical solution, a second silver-plated layer is formed on the circuit board contact portion, and a first silver-plated layer is formed on the chip binding portion, wherein the thickness of the first silver-plated layer is greater than the thickness of the second silver-plated layer.

[0008] According to a further technical solution, the silver-plated layer is located at a position of the chip binding portion corresponding to the window of the cup body.

[0009] According to a further technical solution, a cup body is provided on one side of the plurality of pins, and a metal reflective layer is provided on the inner cavity side wall of the cup body.

[0010] According to a further technical solution, an isolation zone is formed between the plurality of pins, positioning plastic is injection-molded in the isolation zone, and the positioning plastic is integrally formed with the cup body.

[0011] According to a further technical solution, the positioning plastic is a step-shaped plastic.

[0012] According to a further technical solution, the positioning plastic is a cross-shaped plastic.

[0013] Beneficial effects of the utility model:

[0014] The pin of the utility model is plated with a second silver-plated layer on the circuit board contact portion, and a first silver-plated layer on the chip binding portion, which significantly reduces the contact resistance of the circuit board contact portion and the chip binding portion, ensures efficient current transmission, and improves the electrical connection performance of the pin; at the same time, the thickness of the first silver-plated layer is greater than the second silver-plated layer, and the chip binding portion is stretched upward to cause the circuit board contact portion to shrink inward, thereby driving the conductive portion to bend relative to the chip binding portion and the circuit board contact portion, that is, the conductive portion of the pin does not contact the LED chip or the circuit board during actual use, so the conductive portion of the pin remains un-silvered. Compared with electroplating the silver layer on the entire surface of the pin, the electroplating area is reduced without affecting the overall performance of the pin, thereby reducing the cost; the chip binding portion is silver-plated at the position corresponding to the cup window, further reducing the electroplating area, thereby reducing the manufacturing cost.

[0015] Other features and advantages of the present invention will be described in detail in the subsequent detailed description of the embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 : The overall structural plan of the utility model.

[0017] Figure 2 : The overall structure front view of the utility model.

[0018] Figure 3 : Plan view of the overall structure of the utility model after stretching.

[0019] Figure 4 : A front view of the overall structure of the utility model after stretching.

[0020] Figure 5 : The structure of the utility model and the cross-sectional view of the cup body.

[0021] Figure 6 ; A cross-sectional view of Example 2 of the present invention.

[0022] Reference numerals: 1, pin; 11, circuit board contact portion; 12, conductive portion; 13, chip binding portion; 2, cup body; 3, metal reflective layer; 4, stepped plastic; 5, cross-shaped plastic DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention.

[0024] Please refer to Figure 1-6 ;

[0025] A low-cost silver-plated LED bracket structure includes several pins 1. The pins 1 include a circuit board contact portion 11, a conductive portion 12, and a chip binding portion 13. The circuit board contact portion 11 is mainly used to contact the circuit board to provide current. The conductive portion 12 is located between the circuit board contact portion 11 and the chip binding portion 13 to pass current. The chip binding portion 13 is mainly used to bind to the chip to transmit current to the chip. In actual use, the pins 1 are usually punched into a flat shape first, and then electroplated. The chip binding portion 13 can be stretched upward to make the circuit board contact portion 11 shrink inward, and the conductive portion 12 will bend relative to the chip binding portion 13 and the circuit board contact portion 11. Specifically, the operator binds the chip The fixed portion 13 is stretched upward so that the circuit board contact portions 11 of the two relatively arranged pins 1 move toward each other. At this time, the two ends of the conductive portion 12 are bent in two opposite directions, that is, the conductive portion 12 is mainly used to transmit current between the circuit board contact portion 11 and the chip binding portion 13; it is worth noting that the resistance of the conductive portion 12 of the pin 1 is also related to its cross-sectional area, and the conductive portion 12 of the pin 1 is mainly used for current transmission, so in this embodiment, the conductive portion 12 of the pin 1 is not silver-plated to further reduce the silver-plated area and reduce costs. Although the volume of the bracket is small and the silver saved is very little, considering the expensive cost of silver itself and the extremely large number of brackets, more costs can be saved.

[0026] Compared with the traditional method of silver-plating the entire surface of the pin 1 and then silver-plating the functional area of the pin 1 a second time, the bracket structure reduces the silver plating cost without affecting the overall conductive performance of the bracket.

[0027] In this embodiment, the circuit board contact portion 11 is provided with a second silver-plated layer, and the chip binding portions 13 of the plurality of pins 1 are close to each other to form a functional area. One side of the functional area is injection-molded to form a cup body 2. Since the connection between the LED chip and the pin 1 is the most critical part of the entire circuit, it requires extremely low contact resistance and efficient current transmission. Therefore, the thickness of the first silver-plated layer is greater than that of the second silver-plated layer. Specifically, during injection molding, the operator first punches out four pins 1 from the metal plate, then covers the conductive portion 12 of the pin 1, and then seals the pin 1 between the circuit board contact portion 11 and the chip binding portion. 13 performs the first silver plating, and the thickness of the silver layer of the first silver plating can be 5u-10u, and preferably 10u in this embodiment; then the operator covers the conductive part 12 of the pin 1 and the circuit board contact part 11, and performs the second silver plating on the chip binding part 13, and the thickness of the silver layer of the second silver plating is 10u-20u. In this embodiment, the thickness of the second silver plating is preferably 15u, so that the thickness of the silver plating layer 1 is greater than the thickness of the silver plating layer 2. The operator first connects the pin 1 to the substrate, and then places the pin 1 and the substrate into the injection mold, and injection molds the cup body 2.

[0028] It is worth noting that, in this embodiment, the silver plating layer is located at the position of the window of the cup body 2 on the chip binding part 13, which can further reduce the silver plating area; the specific process is that when the second silver plating is performed on the chip binding part 13, a shielding member is first used to cover the other areas outside the window position of the cup body 2 on the functional area before electroplating.

[0029] In this embodiment, a cup body 2 is provided on one side of several pins 1. The inner cavity of the cup body 2 is in the shape of a trumpet extending outward. A metal reflective layer 3 is provided on the side wall of the inner cavity of the cup body 2, so that the metal layer can converge the light emitted by the LED to the outlet of the window of the cup body 2, thereby increasing the brightness of the packaging bracket.

[0030] In this embodiment, an isolation zone is formed between several pins 1. During the injection molding process of the cup body 2, positioning plastic is also injected into the isolation zone. The positioning plastic is used to form the cup body 2 and the pin 1 into a whole to prevent the pin 1 from falling off relative to the cup body 2. Therefore, the positioning plastic and the cup body 2 are molded as one piece. The positioning plastic is a step-shaped plastic 4, that is, a groove is opened on the lower surface of the corresponding pin 1, so that the plastic is filled with the groove-shaped step-shaped positioning plastic during injection molding.

[0031] Example 2

[0032] The structure of this embodiment is the same as that of embodiment 1;

[0033] The difference between this embodiment and embodiment 1 is that the pin 1 includes a control pin and a common pin, and the control pin and the common pin are provided with a first positioning groove and a second positioning groove relative to each other. The first positioning groove and the second positioning groove are arranged relative to each other, and the first positioning groove and the second positioning groove have the same height in the horizontal direction. When the cup body 2 is formed by injection molding, a cross-shaped positioning plastic is formed in the first positioning groove and the second positioning groove, so that the cross-shaped plastic 5 can help fix the position of the pin 1 and prevent the pin 1 from moving or bending during welding and operation.

[0034] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0035] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A low-cost silver-plated LED bracket structure, comprising a plurality of pins (1), characterized in that: The pin (1) comprises a circuit board contact portion (11), a conductive portion (12) and a chip binding portion (13); the chip binding portion (13) is stretched upward to cause the circuit board contact portion (11) to contract inward; the conductive portion (12) is bent relative to the chip binding portion (13) and the circuit board contact portion (11); and the circuit board contact portion (11) and the chip binding portion (13) are provided with a silver-plated layer.

2. A low-cost silver-plated LED bracket structure according to claim 1, characterized in that: The circuit board contact portion (11) forms a second silver-plated layer, and the chip binding portion (13) forms a first silver-plated layer, and the thickness of the first silver-plated layer is greater than the thickness of the second silver-plated layer.

3. A low-cost silver-plated LED bracket structure according to claim 2, characterized in that: The silver-plated layer 1 is located at a position of the chip binding portion (13) corresponding to the window opening of the cup body (2).

4. The low-cost silver-plated LED bracket structure according to claim 1, characterized in that: A cup body (2) is provided on one side of the plurality of pins (1), and a metal reflective layer (3) is provided on the inner cavity side wall of the cup body (2).

5. The low-cost silver-plated LED bracket structure according to claim 4, characterized in that: An isolation zone is formed between the plurality of pins (1), positioning plastic is injection-molded in the isolation zone, and the positioning plastic is integrally formed with the cup body (2).

6. The low-cost silver-plated LED bracket structure according to claim 5, characterized in that: The positioning plastic is a step-shaped plastic (4).

7. The low-cost silver-plated LED bracket structure according to claim 5, characterized in that: The positioning plastic is a cross-shaped plastic (5).

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