Silicon wafer cleaning machine

Abstract

The utility model relates to the field of silicon wafer processing equipment, in particular to a silicon wafer cleaning machine. The cleaning machine comprises an ultrasonic cleaning machine, a rack, a rotating motor, a linear driving device, a silicon wafer loading frame and an air blower, the rack is fixedly connected to the ultrasonic cleaning machine, the rotating motor and the air blower are fixedly connected to a cross beam of the rack, and the linear driving device is fixedly connected to a rotating shaft of the rotating motor. A piston rod of the linear driving device is fixedly provided with a silicon wafer loading frame. An air opening of the air blower faces the silicon wafer loading frame. According to the utility model, a silicon wafer can be lifted through the linear driving device, the silicon wafer is driven by the rotating motor to swing left and right for draining, and finally, liquid and dirt on the silicon wafer are blown off through airflow generated by the air blower.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer processing equipment, in particular to a silicon wafer cleaning machine. Background Art

[0002] After silicon wafers are processed, they need to be cleaned. However, the cleaning of silicon wafers can only be done by a cleaning machine, which has low cleaning efficiency and effect. Utility Model Content

[0003] In order to overcome the disadvantage of poor cleaning effect of existing silicon wafers, the utility model provides a silicon wafer cleaning machine.

[0004] The technical solution adopted by the utility model to solve its technical problems is: a silicon wafer cleaning machine, including an ultrasonic cleaning machine, a frame, a rotating motor, a linear drive device, a silicon wafer loading frame and a blower, the ultrasonic cleaning machine is fixedly connected to the frame, the rotating motor and the blower are fixedly connected to the crossbeam of the frame, the linear drive device is fixedly connected to the rotating shaft of the rotating motor, the piston rod of the linear drive device is fixed to the silicon wafer loading frame, and the air outlet of the blower faces the silicon wafer loading frame.

[0005] According to another embodiment of the present invention, the linear drive device is further comprised of a cylinder.

[0006] According to another embodiment of the present invention, the silicon wafer loading frame is further comprised of a frame consisting of a bottom plate and rack rods.

[0007] According to another embodiment of the present invention, the piston rod end of the linear drive device is further bolted to the bottom plate of the silicon wafer loading frame.

[0008] The beneficial effect of the present invention is that the utility model can lift the silicon wafer through the linear drive device, and use the rotary motor to drive the silicon wafer to swing left and right to drain water, and finally use the airflow generated by the blower to blow away the liquid and dirt on the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0010] Figure 1 It is a structural diagram of the utility model;

[0011] In the figure, 1. Ultrasonic cleaning machine, 2. Frame, 3. Rotating motor, 4. Linear drive device, 5. Wafer loading frame, 6. Blower. DETAILED DESCRIPTION

[0012] like Figure 1This is a schematic diagram of the structure of the present invention, a silicon wafer cleaning machine, comprising an ultrasonic cleaning machine 1, a frame 2, a rotary motor 3, a linear drive device 4, a silicon wafer loading frame 5, and a blower 6. The ultrasonic cleaning machine 1 is fixedly connected to the frame 2, the rotary motor 3 and the blower 6 are fixedly connected to the crossbeam of the frame 2, the linear drive device 4 is fixedly connected to the rotating shaft of the rotary motor 3, the piston rod of the linear drive device 4 is fixed to the silicon wafer loading frame 5, and the air outlet of the blower 6 faces the silicon wafer loading frame 5. The linear drive device 4 is a cylinder. The silicon wafer loading frame 5 is a frame consisting of a base plate and frame rods. The end of the piston rod of the linear drive device 4 is bolted to the base plate of the silicon wafer loading frame 5.

[0013] As attached Figure 1 As shown, the silicon wafer is first placed into the wafer loading frame 5. The wafer loading frame 5 is composed of fixed rods on a base plate, which supports the wafer. Then, the linear drive device 4 is activated. The piston rod of the linear drive device 4 drives the wafer loading frame 5 into the ultrasonic cleaning machine 1 until it is immersed in the cleaning solution and cleaned by ultrasound.

[0014] After the silicon wafers are cleaned, the piston rod of the linear drive 4 retracts until the wafer loading frame 5 is lifted from the cleaning liquid. The rotary motor 3 then rotates the linear drive 4 and wafer loading frame 5 at a small angle, using the left and right rotation to shake off the liquid on the wafers. The blower 6 is then activated, using airflow to blow away any remaining liquid and dirt on the wafers. This utility model uses the linear drive to raise and lower the wafers, the rotary motor to drive the wafers to swing left and right to drain, and finally the airflow generated by the blower to remove the liquid and dirt from the wafers.

Claims

1. A silicon wafer cleaning machine, characterized in that: The invention comprises an ultrasonic cleaning machine (1), a frame (2), a rotary motor (3), a linear drive device (4), a silicon wafer loading frame (5) and a blower (6), wherein the ultrasonic cleaning machine (1) is fixedly connected to the frame (2), the rotary motor (3) and the blower (6) are fixedly connected to the crossbeam of the frame (2), the linear drive device (4) is fixedly connected to the rotating shaft of the rotary motor (3), the silicon wafer loading frame (5) is fixedly connected to the piston rod of the linear drive device (4), and the air outlet of the blower (6) faces the silicon wafer loading frame (5).

2. The silicon wafer cleaning machine according to claim 1, wherein: The linear drive device (4) is a cylinder.

3. The silicon wafer cleaning machine according to claim 1, wherein: The silicon wafer loading frame (5) is a frame composed of a base plate and rack rods.

4. The silicon wafer cleaning machine according to claim 1, wherein: The piston rod end of the linear drive device (4) is bolted to the bottom plate of the silicon wafer loading frame (5).

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