Surface polishing equipment for low-tin tinplate substrate

Abstract

The surface polishing equipment for the low-tin tinplate base plate comprises a working platform, the working platform comprises a front platform and a rear platform, and the front platform and the rear platform are arranged in a spaced mode to form a polishing area so that the base plate can enter the rear platform after passing through the polishing area from the front platform; the polishing mechanism comprises a first polishing roll shaft and a second polishing roll shaft which are respectively arranged above and below the polishing area, and a driving motor for driving the first polishing roll shaft and the second polishing roll shaft; the adjusting mechanism is used for adjusting the distance between the first polishing roller shaft and the second polishing roller shaft; and an infusion mechanism. According to the surface polishing equipment for the low-tin tinplate base plate, the upper face and the lower face of the base plate are polished at the same time through the first polishing roll shaft and the second polishing roll shaft, the pressure of the first polishing roll shaft and the second polishing roll shaft on the base plate is adjusted through the adjusting mechanism, and therefore the polishing thickness is adjusted.

Description

Technical Field

[0001] The utility model relates to the technical field of tinplate production, in particular to a surface polishing device for a low-tin tinplate substrate. Background Art

[0002] Low tin tinplate is mainly used in chemical industry, aerosol can lid and some miscellaneous can fields. It is deep drawn by plain iron or deep drawn after coating. Since low tin-plated tinplate is easy to alloy after coating, the black alloy layer under the tin layer is easy to show during deep drawing due to the thin tin layer of low tin-plated products. Utility Model Content

[0003] In order to solve the above problems, the present technical solution provides a low-tin tinplate substrate surface polishing device.

[0004] To achieve the above purpose, the technical solution is as follows:

[0005] A low-tin tinplate substrate surface polishing device, comprising

[0006] A working platform, comprising a front platform and a rear platform, wherein the front platform and the rear platform are spaced apart to form a polishing area for a substrate to pass from the front platform through the polishing area and then enter the rear platform;

[0007] a polishing mechanism comprising a first polishing roller and a second polishing roller respectively disposed above and below the polishing area, and a drive motor for driving the first polishing roller and the second polishing roller;

[0008] an adjusting mechanism for adjusting the distance between the first polishing roller and the second polishing roller;

[0009] The infusion mechanism is used to convey the polishing liquid to the polishing mechanism so that the polishing liquid seeps out from the first polishing roller and the second polishing roller.

[0010] In the surface polishing device for a low-tin tinplate substrate as described above, the adjustment mechanism includes a first support bearing provided at both ends of the first polishing roller shaft, a second support bearing provided at both ends of the second polishing roller shaft, a connecting column connecting the first support bearing and the second support bearing, and a spring sleeved on the connecting column.

[0011] The low-tin tinplate substrate surface polishing device as described above further includes a base, the second support bearing is connected to the base, and the connecting column is threadedly connected to the base to adjust the distance between the first polishing roller and the base.

[0012] In the low-tin tinplate substrate surface polishing device described above, the first polishing roller includes a main shaft, the first support bearing includes an upper bearing and a lower bearing enclosed on the upper and lower sides of the main shaft, and the connecting column passes through the upper bearing and the lower bearing.

[0013] In the low-tin tinplate substrate surface polishing device as described above, a collecting cylinder is provided on the base, and the collecting cylinder is arranged below the second polishing roller shaft.

[0014] In the low-tin tinplate substrate surface polishing device described above, the drive motor is provided with an installation position adjustment hole, so that when the first polishing roller is raised or lowered, the drive motor is moved to maintain a distance from the first polishing roller.

[0015] The low-tin tinplate substrate surface polishing device as described above, wherein the two driving motors drive the first polishing roller and the second polishing roller respectively; or

[0016] The first polishing roller shaft is provided with a first driven disk, the second polishing roller shaft is provided with a second driven disk, the output shaft of the driving motor is provided with a first active disk and a second active disk coaxially spaced apart, the first active disk is linked to the first driven disk, and the second active disk is linked to the second driven disk.

[0017] In the low-tin tinplate substrate surface polishing device as described above, the infusion mechanism includes a discharge valve sleeved on the first polishing roller and the second polishing roller, and the first polishing roller and the second polishing roller are provided with a polishing kit sleeved thereon, and the polishing kit covers the discharge valve.

[0018] In the low-tin tinplate substrate surface polishing device described above, the base is provided with a limiting groove for the end of the first polishing roller to be embedded in, and the limiting groove is used to limit the first polishing roller to keep it rising and falling along the axial direction of the connecting column.

[0019] In the low-tin tinplate substrate surface polishing device as described above, the working platform is lower than the highest point of the second polishing roller, so that the substrate is pressed against the second polishing roller.

[0020] The beneficial effects of this application are:

[0021] The utility model provides a low-tin tinplate substrate surface polishing device, which uses a first polishing roller and a second polishing roller to polish the upper and lower surfaces of the substrate simultaneously, and adjusts the pressure of the first polishing roller and the second polishing roller on the substrate through an adjustment mechanism, thereby adjusting the coarseness of the polishing. Since the flatness of the substrate surface affects the uniformity of the electroplated tin layer, the uneven tin layer is prone to showing the color of the black alloy layer under the tin layer after deep drawing or deep drawing after coating. The utility model provides a low-tin tinplate substrate surface polishing device, which makes the substrate surface flat after polishing, and the thickness of the tin layer is uniform during tin plating. Even after deep drawing, the uniform thickness of the tin layer can still be maintained, which can effectively avoid the situation where the tin layer of the low-tin-plated product is thin and the color of the black alloy layer under the tin layer is easily revealed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments.

[0023] Figure 1 This is a schematic diagram of the structure of the utility model Figure 1 ;

[0024] Figure 2 This is a schematic diagram of the structure of the utility model Figure 2 . DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0026] A low-tin tinplate substrate surface polishing device, comprising

[0027] A work platform 1 includes a front platform 11 and a rear platform 12. The front platform 11 and the rear platform 12 are spaced apart to form a polishing area 13, so that a substrate can pass from the front platform 11 through the polishing area 13 and then enter the rear platform 12.

[0028] a polishing mechanism 2 comprising a first polishing roller 21 and a second polishing roller 22 respectively disposed above and below the polishing area 13, and a drive motor 23 for driving the first polishing roller 21 and the second polishing roller 22;

[0029] An adjusting mechanism 3, which is used to adjust the distance between the first polishing roller 21 and the second polishing roller 22;

[0030] The infusion mechanism 4 is used to convey the polishing liquid to the polishing mechanism 2 so that the polishing liquid seeps out from the first polishing roller 21 and the second polishing roller 22 .

[0031] The utility model provides a low-tin tinplate substrate surface polishing device, which uses a first polishing roller and a second polishing roller to polish the upper and lower surfaces of the substrate simultaneously, and adjusts the pressure of the first polishing roller and the second polishing roller on the substrate through an adjustment mechanism, thereby adjusting the coarseness of the polishing. Since the flatness of the substrate surface affects the uniformity of the electroplated tin layer, the uneven tin layer is prone to showing the color of the black alloy layer under the tin layer after deep drawing or deep drawing after coating. The utility model provides a low-tin tinplate substrate surface polishing device, which makes the substrate surface flat after polishing, and the thickness of the tin layer is uniform during tin plating. Even after deep drawing, the uniform thickness of the tin layer can still be maintained, which can effectively avoid the situation where the tin layer of the low-tin-plated product is thin and the color of the black alloy layer under the tin layer is easily revealed.

[0032] Furthermore, as a preferred embodiment of this solution but not limiting, the adjustment mechanism 3 includes first support bearings 31 provided at both ends of the first polishing roller 21, second support bearings 32 provided at both ends of the second polishing roller 22, a connecting post 33 connecting the first support bearing 31 and the second support bearing 32, and a spring 34 sleeved on the connecting post 33. The spring supports the first polishing roller, allowing the first polishing roller to maintain pressure on the substrate after being raised or lowered.

[0033] Furthermore, as a preferred embodiment of this solution but not limiting, it further includes a base 5, the second support bearing 32 is connected to the base 5, and the connecting column 33 is threadedly connected to the base 5 to adjust the distance between the first polishing roller 21 and the base 5. The height of the first polishing roller can be steplessly adjusted by pressing down the spring through the threaded connection.

[0034] Furthermore, as a preferred embodiment of the present invention but not a limitation, the first polishing roller shaft 21 includes a main shaft 211, the first support bearing 31 includes an upper bearing 311 and a lower bearing 312 enclosed on the upper and lower sides of the main shaft 211, and the connecting column 33 passes through the upper bearing 311 and the lower bearing 312.

[0035] Furthermore, as a preferred embodiment of the present invention but not limiting, a collecting cylinder 6 is provided on the base 5, and the collecting cylinder 6 is provided below the second polishing roller shaft 22. The collecting cylinder is used to collect the polishing liquid.

[0036] Furthermore, as a preferred embodiment of this solution but not a limitation, the drive motor 23 is provided with an installation position adjustment hole 231 for moving the drive motor 23 to maintain a distance from the first polishing roller 21 when the first polishing roller 21 is raised or lowered.

[0037] Furthermore, as a preferred embodiment of the present invention but not limiting, the two driving motors 23 drive the first polishing roller 21 and the second polishing roller 22 respectively; or

[0038] The first polishing roller 21 is provided with a first driven disc 212, and the second polishing roller 22 is provided with a second driven disc 221. The output shaft of the drive motor 23 is provided with a first active disc 232 and a second active disc 233 coaxially spaced apart. The first active disc 232 is linked to the first driven disc 212, and the second active disc 233 is linked to the second driven disc 221. A single drive motor can drive both the first and second polishing rollers.

[0039] Furthermore, as a preferred embodiment of this solution but not limiting, the infusion mechanism 4 includes a discharge valve 41 sleeved on the first polishing roller 21 and the second polishing roller 22. The first polishing roller 21 and the second polishing roller 22 are provided with a polishing sleeve 42 sleeved thereon, and the polishing sleeve 42 covers the discharge valve 41. The discharge valve can control the amount of polishing liquid that seeps out. The polishing sleeve can be polishing cotton, polishing cloth, quartz sand sleeve, etc.

[0040] Furthermore, as a preferred embodiment of the present invention but not a limitation, the base 5 is provided with a limiting groove 51 for the end of the first polishing roller 21 to be embedded in, and the limiting groove 51 is used to limit the first polishing roller 21 to keep it rising and falling along the axial direction of the connecting column 33.

[0041] Furthermore, as a preferred embodiment of this solution but not limiting, the working platform 1 is lower than the highest point of the second polishing roller 22, so that the substrate is pressed on the second polishing roller 22. The second polishing roller applies pressure using the weight of the substrate itself.

[0042] The above description is only a preferred embodiment of the present application and is not intended to limit the scope of implementation of the present application. Other embodiments whose principles and basic structures are the same or similar to those of the present application are within the scope of protection of the present application.

Claims

1. A low-tin tinplate substrate surface polishing device, characterized by: include A working platform (1) comprises a front platform (11) and a rear platform (12), wherein the front platform (11) and the rear platform (12) are spaced apart to form a polishing area (13), so that a substrate passes from the front platform (11) through the polishing area (13) and then enters the rear platform (12); A polishing mechanism (2) comprising a first polishing roller (21) and a second polishing roller (22) respectively arranged above and below the polishing area (13), and a drive motor (23) for driving the first polishing roller (21) and the second polishing roller (22); an adjusting mechanism (3) for adjusting the distance between the first polishing roller (21) and the second polishing roller (22); A liquid infusion mechanism (4) is used for conveying polishing liquid to the polishing mechanism (2), so that the polishing liquid seeps out from the first polishing roller (21) and the second polishing roller (22).

2. The low-tin tinplate substrate surface polishing equipment according to claim 1, characterized in that: The adjustment mechanism (3) comprises a first support bearing (31) provided at both ends of the first polishing roller shaft (21), a second support bearing (32) provided at both ends of the second polishing roller shaft (22), a connecting column (33) connecting the first support bearing (31) and the second support bearing (32), and a spring (34) sleeved on the connecting column (33).

3. The low-tin tinplate substrate surface polishing equipment according to claim 2, characterized in that: It also includes a base (5), the second support bearing (32) is connected to the base (5), and the connecting column (33) is threadedly connected to the base (5) to adjust the distance between the first polishing roller shaft (21) and the base (5).

4. The low-tin tinplate substrate surface polishing device according to claim 2, characterized in that: The first polishing roller shaft (21) includes a main shaft (211), the first support bearing (31) includes an upper bearing (311) and a lower bearing (312) enclosed on the upper and lower sides of the main shaft (211), and the connecting column (33) passes through the upper bearing (311) and the lower bearing (312).

5. The low-tin tinplate substrate surface polishing equipment according to claim 3, characterized in that: A collecting cylinder (6) is provided on the base (5), and the collecting cylinder (6) is arranged below the second polishing roller shaft (22).

6. The low-tin tinplate substrate surface polishing equipment according to claim 1, characterized in that: The driving motor (23) is provided with an installation position adjustment hole (231) for moving the driving motor (23) and maintaining a distance between the driving motor (23) and the first polishing roller (21) when the first polishing roller (21) is raised or lowered.

7. The low-tin tinplate substrate surface polishing equipment according to claim 1, characterized in that: The two driving motors (23) drive the first polishing roller (21) and the second polishing roller (22) respectively; or The first polishing roller shaft (21) is provided with a first driven disc (212), the second polishing roller shaft (22) is provided with a second driven disc (221), the output shaft of the driving motor (23) is provided with a first active disc (232) and a second active disc (233) coaxially spaced apart, the first active disc (232) and the first driven disc (212) are linked together, and the second active disc (233) and the second driven disc (221) are linked together.

8. The low-tin tinplate substrate surface polishing equipment according to claim 1, characterized in that: The infusion mechanism (4) comprises a discharge valve (41) sleeved on the first polishing roller shaft (21) and the second polishing roller shaft (22); the first polishing roller shaft (21) and the second polishing roller shaft (22) are provided with a polishing sleeve (42) sleeved thereon; the polishing sleeve (42) covers the discharge valve (41).

9. The low-tin tinplate substrate surface polishing device according to claim 3, characterized in that: The base (5) is provided with a limiting groove (51) for the end of the first polishing roller (21) to be embedded, and the limiting groove (51) is used to limit the first polishing roller (21) to maintain the lifting along the axial direction of the connecting column (33).

10. The low-tin tinplate substrate surface polishing equipment according to claim 1, characterized in that: The working platform (1) is lower than the highest point of the second polishing roller (22), so that the substrate is pressed onto the second polishing roller (22).

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