Pressing equipment for rubber sheet mold

Abstract

The utility model discloses rubber sheet mold pressing equipment, which belongs to the technical field of rubber sheet production and comprises a hydraulic cylinder, a mounting frame is fixedly mounted at the upper end of the hydraulic cylinder, a lifting platform is fixedly mounted at the upper end of a telescopic rod of the hydraulic cylinder and in the mounting frame, and a lower mold plate is arranged above the lifting platform. Two mounting fixing frames are symmetrically and fixedly mounted at the left end and the right end of the lifting platform, each mounting fixing frame is composed of a fixing base plate and an anti-disengaging stop block, the anti-disengaging stop blocks are fixedly mounted at the inner ends of the fixing base plates, and the lower die plate is slidably mounted on the two mounting fixing frames at the same time. Meanwhile, the lower mold plate is installed on the installation fixing frame in a sliding mode, the lower mold plate can slide to the semiconductor refrigeration equipment to be cooled, and therefore the cooling speed of the rubber sheets on the lower mold plate can be increased, and the production efficiency of the rubber sheets can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of rubber sheet production, in particular to a device for molding rubber sheets. Background Art

[0002] The rubber molding process is a process of placing the mixed rubber blank in a mold and pressing it with a flat vulcanizing press under specified time, pressure, and temperature conditions. The molding process is also widely used in the production of rubber sheets. As a commonly used equipment for vulcanization molding, the vulcanization molding machine has developed at a relatively fast speed. In the existing patent application with application number CN202021127212.3, a vulcanization molding machine for molded rubber seals is proposed, which uses a cooling component to cool the rubber product. However, its cooling component is an air-cooled device, and the cooling effect is poor, which will result in poor cooling effect of the rubber product, and then the cooling efficiency of the rubber product will be low, which will eventually reduce the efficiency of rubber product production, so it needs to be improved. Utility Model Content

[0003] The main purpose of the utility model is to provide a rubber sheet molding device, which can effectively solve the problems in the background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A device for molding rubber sheets, comprising a hydraulic cylinder, a mounting frame being fixedly mounted on the upper end of the hydraulic cylinder, a lifting platform being fixedly mounted on the upper end of the telescopic rod of the hydraulic cylinder and within the mounting frame, a lower template being arranged above the lifting platform, two mounting brackets being symmetrically fixedly mounted on the left and right ends of the lifting platform, the mounting brackets being composed of a fixed base plate and an anti-slip block, the anti-slip block being fixedly mounted on the inner end of the fixed base plate, the lower template being slidably mounted on the two mounting brackets at the same time, two semiconductor refrigeration devices being fixedly mounted on the two mounting brackets and on the front side of the lifting platform, and the lower template being movable to the upper end of the semiconductor refrigeration device.

[0006] Preferably, the hydraulic cylinder is connected to the hydraulic station through a pipeline, a control cabinet is fixedly installed on one side of the installation frame, and an upper template is fixedly installed in the installation frame and above the lower template.

[0007] Preferably, a heating plate is fixedly mounted on the upper end of the lifting platform, the lower template is located at the upper end of the heating plate, a handle is fixedly mounted on the front end of the lower template, and two guide rail grooves are symmetrically provided at the left and right ends of the lower template.

[0008] Preferably, the fixed base plate on the mounting bracket is fixedly connected to the lifting platform, and the anti-slip block is located above the heating plate provided at the upper end of the lifting platform.

[0009] Preferably, the anti-slip blocks on the mounting bracket are simultaneously located in two guide rail grooves symmetrically opened at the left and right ends of the lower template.

[0010] Preferably, the semiconductor refrigeration device is composed of a semiconductor refrigeration plate, a heat sink and a heat dissipation fan. The heat sink is fixedly installed at the lower end of the semiconductor refrigeration plate, and the heat dissipation fan is fixedly installed at the lower end of the heat sink.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] By setting up a mounting bracket, setting up a semiconductor refrigeration device on the mounting bracket, and sliding the lower template on the mounting bracket, the lower template can be slid onto the semiconductor refrigeration device for cooling, thereby increasing the cooling speed of the rubber sheet on the lower template and further increasing the production efficiency of the rubber sheet. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the utility model after the installation bracket and semiconductor refrigeration equipment are removed;

[0015] Figure 3 This is a disassembled diagram of the lower template and the mounting bracket of the utility model;

[0016] Figure 4 This is a schematic structural diagram of the semiconductor refrigeration equipment of the present invention.

[0017] In the figure: 1. Installation frame; 2. Lower template; 3. Installation bracket; 4. Semiconductor refrigeration equipment; 5. Hydraulic cylinder; 6. Hydraulic station; 7. Control cabinet; 8. Upper template; 9. Handle; 10. Guide rail groove; 11. Fixed base plate; 12. Anti-slip block; 13. Semiconductor refrigeration plate; 14. Heat sink; 15. Cooling fan; 16. Lifting platform. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0019] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4As shown, a rubber sheet molding device includes a hydraulic cylinder 5, the upper end of the hydraulic cylinder 5 is fixedly installed with a mounting frame 1, the upper end of the telescopic rod of the hydraulic cylinder 5 and a lifting platform 16 are fixedly installed in the mounting frame 1, and a lower template 2 is arranged above the lifting platform 16, the hydraulic cylinder 5 is connected to the hydraulic station 6 through a pipeline, a control cabinet 7 is fixedly installed on one side of the mounting frame 1, an upper template 8 is fixedly installed in the mounting frame 1 and above the lower template 2, a heating plate is fixedly installed on the upper end of the lifting platform 16, the lower template 2 is located at the upper end of the heating plate, and a handle 9 is fixedly installed at the front end of the lower template 2. Two guide rail grooves 10 are symmetrically provided at the left and right ends of the lower template 2. When in use, the rubber material is first placed in the mold cavity in the lower template 2, and then the lower template 2 is heated by the heating plate, and the lower template 2 is pushed upward by the hydraulic cylinder 5. Finally, the rubber material in the lower template 2 is heated and pressurized in cooperation with the upper template 8 so that the rubber material is cured and formed in the mold cavity of the lower template 2.

[0020] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 As shown, two mounting brackets 3 are symmetrically fixedly installed on the left and right ends of the lifting platform 16, and the mounting brackets 3 are composed of a fixed base plate 11 and an anti-slip block 12. The anti-slip block 12 is fixedly installed on the inner end of the fixed base plate 11, and the lower template 2 is slidably installed on the two mounting brackets 3 at the same time. Two semiconductor refrigeration devices 4 are fixedly installed on the two mounting brackets 3 and on the front side of the lifting platform 16. The lower template 2 can be moved to the upper end of the semiconductor refrigeration device 4. The fixed base plate 11 on the mounting bracket 3 is fixedly connected to the lifting platform 16. The anti-slip block 12 is located above the heating plate set at the upper end of the lifting platform 16. The anti-slip block 12 on the mounting bracket 3 is simultaneously located in two guide rail grooves 10 symmetrically opened on the left and right ends of the lower template 2. The semiconductor refrigeration device 4 is composed of a semiconductor refrigeration plate 13, a heat sink 14 and a cooling fan 15. The heat sink 14 It is fixedly installed at the lower end of the semiconductor refrigeration plate 13, and the cooling fan 15 is fixedly installed at the lower end of the heat sink 14. After the rubber material in the mold cavity of the lower template 2 is solidified and formed, the hydraulic cylinder 5 is used to reset the lower template 2 downward, and then the lower template 2 can be pulled forward by the handle 9, so that the lower template 2 moves forward along the mounting bracket 3, and then the lower template 2 moves to the upper end of the semiconductor refrigeration device 4, and finally the lower template 2 contacts the cold end of the semiconductor refrigeration plate 13. At this time, the lower template 2 will be quickly cooled down. By setting the mounting bracket 3, the semiconductor refrigeration device 4 is set on the mounting bracket 3, and the lower template 2 is slidably installed on the mounting bracket 3, the lower template 2 can be slid onto the semiconductor refrigeration device 4 for cooling, thereby improving the cooling speed of the rubber sheet on the lower template 2, and thus improving the production efficiency of the rubber sheet.

[0021] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention. The scope of protection claimed in this utility model is defined by the attached claims and their equivalents.

Claims

1. A rubber sheet molding device, comprising a hydraulic cylinder (5), a mounting frame (1) fixedly mounted on the upper end of the hydraulic cylinder (5), a lifting platform (16) fixedly mounted on the upper end of the telescopic rod of the hydraulic cylinder (5) and within the mounting frame (1), a lower template (2) being arranged above the lifting platform (16), characterized in that: Two mounting brackets (3) are symmetrically fixedly installed at the left and right ends of the lifting platform (16), and the mounting brackets (3) are composed of a fixed base plate (11) and an anti-slip block (12). The anti-slip block (12) is fixedly installed on the inner end of the fixed base plate (11). The lower template (2) is slidably installed on the two mounting brackets (3) at the same time. Two semiconductor refrigeration devices (4) are fixedly installed on the two mounting brackets (3) and on the front side of the lifting platform (16). The lower template (2) can be moved to the upper end of the semiconductor refrigeration device (4).

2. The rubber sheet molding device according to claim 1, characterized in that: The hydraulic cylinder (5) is connected to the hydraulic station (6) via a pipeline. A control cabinet (7) is fixedly installed on one side of the installation frame (1). An upper template (8) is fixedly installed inside the installation frame (1) and above the lower template (2).

3. The rubber sheet molding device according to claim 2, characterized in that: A heating plate is fixedly mounted on the upper end of the lifting platform (16), the lower template (2) is located at the upper end of the heating plate, a handle (9) is fixedly mounted on the front end of the lower template (2), and two guide rail grooves (10) are symmetrically provided at the left and right ends of the lower template (2).

4. The rubber sheet molding device according to claim 3, characterized in that: The fixed base plate (11) on the mounting bracket (3) is fixedly connected to the lifting platform (16), and the anti-slip block (12) is located above the heating plate provided at the upper end of the lifting platform (16).

5. The rubber sheet molding device according to claim 4, characterized in that: The anti-slip stopper (12) on the mounting bracket (3) is simultaneously located in two guide rail grooves (10) symmetrically opened at the left and right ends of the lower template (2).

6. The rubber sheet molding device according to claim 5, characterized in that: The semiconductor refrigeration device (4) is composed of a semiconductor refrigeration fin (13), a heat sink (14) and a heat dissipation fan (15), wherein the heat sink (14) is fixedly mounted on the lower end of the semiconductor refrigeration fin (13), and the heat dissipation fan (15) is fixedly mounted on the lower end of the heat sink (14).

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