Wafer automatic feeding device and wafer bale breaker

Abstract

The utility model relates to the technical field of automation equipment, in particular to an automatic wafer feeding device and a wafer bale breaker. The utility model provides an automatic wafer feeding device which is used for taking out wafers stored in a packaging box. Wherein the packaging boxes are stacked on the tray in stacks and located in the cache area; the wafer automatic feeding device comprises an AGV transfer trolley, a bearing platform, a first material taking mechanism and a second material taking mechanism. The AGV transfer trolley is used for transferring the tray bearing the packaging box in the cache area to the bearing platform; the first material taking mechanism is used for grabbing the packaging box on the tray and transferring the packaging box to the second material taking mechanism; and the second material taking mechanism is used for taking out the wafers in the packaging box. Through cooperation of the AGV transfer trolley, the first material taking mechanism and the second material taking mechanism, wafers in the packaging box in the buffer area can be automatically taken out, manual intervention is not needed in the whole process, the automation degree is high, the production efficiency is higher, and meanwhile the production cost is lower.

Description

Technical Field

[0001] The utility model relates to the technical field of automation equipment, in particular to an automatic wafer loading device and a wafer unpacking machine. Background Art

[0002] Solar cell wafers are the core component of solar cells. They are made by processing semiconductor material (usually silicon) into thin slices, which are then subjected to a series of processing steps to ultimately create devices that convert sunlight into electricity. Solar cell wafers typically come in stacks of multiple wafers and packaged in boxes. Existing technology often relies on manual removal of wafers from the packaging, resulting in low efficiency and high costs. Furthermore, manual handling increases the probability of wafer damage. Utility Model Content

[0003] (1) The problem to be solved by the present invention is that the existing wafer unpacking is mostly done manually, which is inefficient, costly, and easily damages the wafer.

[0004] (2) Technical solution

[0005] In order to solve the above technical problems, an embodiment of the present invention provides an automatic wafer loading device for taking out wafers stored in a packaging box; wherein the packaging boxes are stacked on a tray and located in a buffer area;

[0006] The wafer automatic loading device includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism and a second material picking mechanism;

[0007] The AGV transfer vehicle is used to transfer the pallet carrying the packaging box in the buffer area to the carrying platform;

[0008] The first picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second picking mechanism;

[0009] The second material taking mechanism is used to take out the wafers from the packaging box.

[0010] Furthermore, the carrying platform includes a fifth driving member, a carrying plate and a base;

[0011] One side of the carrying plate is used to carry the tray, and the other side is rotatably disposed on the base and is transmission-connected to the fifth driving member. The fifth driving member is used to drive the carrying plate to rotate.

[0012] Furthermore, the first material picking mechanism includes a first mechanical arm, a material picking box, a first suction cup and a first driving member;

[0013] The material taking box is arranged at the end of the first mechanical arm, and the first mechanical arm is used to drive the material taking box to move;

[0014] The material picking box has a first end and a second end opposite to each other, and the first end of the material picking box is open; the first suction cup is arranged in the material picking box, and the first driving member is arranged on the material picking box and connected to the first suction cup; the first suction cup can adsorb the packaging box, and the first driving member is used to drive the first suction cup to move between the first end and the second end of the material picking box.

[0015] Furthermore, the packaging box is provided with a box cover, which is provided on the packaging box and is used to open or close the packaging box;

[0016] The first material taking mechanism further includes a second suction cup;

[0017] The second suction cup is arranged in the material taking box body and is located on the top wall of the material taking box body. The second suction cup is used to absorb the box cover.

[0018] Furthermore, the packaging box and the box cover are fixed by adhesive tape;

[0019] The first material-retrieving mechanism further includes a tape cutting assembly, which is arranged on the material-retrieving box and is used for cutting the tape.

[0020] Furthermore, the tapping tape assembly includes a cutter head and a second driving member;

[0021] The second driving member is fixed on the material picking box, and the cutter head is arranged on the second driving member; openings are provided on both sides of the material picking box at positions matching the tape, and the second driving member drives the cutter head to extend into the material picking box through the openings and cut the tape or leave the material picking box.

[0022] Furthermore, the second material taking mechanism includes a mounting seat and a clamping assembly;

[0023] The clamping assembly includes a third driving member, a first clamping jaw and two second clamping jaws;

[0024] The first clamping jaw is connected to the third driving member, the third driving member and the two second clamping jaws are all provided on the mounting base, the two second clamping jaws are respectively located on both sides of the first clamping jaw, and the two second clamping jaws are both made of flexible material;

[0025] The third driving member is used to drive the first clamping jaw to move, so that the first clamping jaw can extend into the packaging box and clamp the wafers in the packaging box, and send the taken-out wafers to the two second clamping jaws.

[0026] Furthermore, it also includes a support assembly;

[0027] After the clamping assembly takes out the wafer, it can drive the wafer to flip into a horizontal state; the supporting assembly is arranged on the mounting seat and is used to support the wafer when the wafer is in a horizontal state.

[0028] Further, the support assembly includes a fourth driving member and a support member;

[0029] The fourth driving member is arranged on the mounting seat, the supporting member is connected to the fourth driving member, and the fourth driving member is used to drive the supporting member to move so that the supporting member moves to the bottom of the wafer and supports the wafer when the wafer is in a horizontal state.

[0030] Another embodiment of the present invention further provides a wafer unpacking machine, comprising the automatic wafer loading device described in any of the above embodiments.

[0031] Beneficial effects of the utility model:

[0032] The utility model provides an automatic chip loading device, which is used to take out chips stored in a packaging box; wherein the packaging boxes are stacked in piles on a pallet and are located in a buffer area; the automatic chip loading device includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism and a second material picking mechanism; the AGV transfer vehicle is used to transfer the pallet carrying the packaging boxes in the buffer area to the carrying platform; the first material picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second material picking mechanism; the second material picking mechanism is used to take out the chips in the packaging box.

[0033] Through the cooperation of the AGV transfer vehicle, the first material picking mechanism and the second material picking mechanism, the chips in the packaging box in the buffer area can be automatically taken out without human intervention throughout the process, with a high degree of automation. Compared with existing technologies, the production efficiency is higher and the production cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 A schematic structural diagram of a first material-retrieving mechanism provided in an embodiment of the present utility model;

[0036] Figure 2 A schematic structural diagram of a second material-retrieving mechanism provided in an embodiment of the present utility model;

[0037] Figure 3 The schematic diagram of the structure of the second material picking mechanism provided in the embodiment of the present invention when grabbing the wafer. Figure 3 In the process, the wafer is in a horizontal state.

[0038] Icons: 11- material picking box; 12- first suction cup; 13- first driving member; 14- second suction cup; 15- cutter head; 16- second driving member;

[0039] 21-mounting seat; 22-first clamping jaw; 23-second clamping jaw; 24-fourth driving member; 25-support member; 26-third driving member;

[0040] 3-Wafer. DETAILED DESCRIPTION

[0041] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0042] like Figures 1 to 3 As shown, one embodiment of the utility model provides an automatic chip loading device for taking out chips 3 stored in a packaging box; wherein the packaging boxes are stacked on a pallet and located in a buffer area; the automatic chip loading device includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism and a second material picking mechanism; the AGV transfer vehicle is used to transfer the pallet carrying the packaging boxes in the buffer area to the carrying platform; the first material picking mechanism is used to grab the packaging boxes on the pallet and transfer the packaging boxes to the second material picking mechanism; the second material picking mechanism is used to take out the chips 3 in the packaging box.

[0043] The automatic wafer loading device provided in this embodiment is used to remove wafers 3 stored in packaging boxes, thereby realizing automatic loading of wafers 3. The wafers 3 are stored in packaging boxes, and several packaging boxes are stacked on pallets. A buffer area is divided within the production workshop, and several pallets carrying packaging boxes are stored in the buffer area. Optionally, the pallet can be a wooden pallet or a plastic pallet, which can be transported by a forklift, or the pallet can be a pallet with running wheels on the bottom, which can be transported by a trailer.

[0044] In this embodiment, the automatic wafer loading device comprises an AGV (Automated Guided Vehicle) transfer vehicle, a carrying platform, a first retrieving mechanism, and a second retrieving mechanism. The AGV transfer vehicle is a forklift capable of reciprocating between a buffer area and the carrying platform, and is used to transfer pallets containing packaging boxes from the buffer area to the carrying platform. The first retrieving mechanism is located on the carrying platform and is used to remove the packaging boxes stacked on the pallet one by one in the order in which they were stacked, and then transfer the removed packaging boxes to the second retrieving mechanism; the second retrieving mechanism is used to remove the wafers 3 from the packaging boxes.

[0045] The automatic chip loading device provided in this embodiment can automatically take out the chips 3 in the packaging box of the buffer area through the cooperation of the AGV transfer vehicle, the first material picking mechanism and the second material picking mechanism, without any human intervention in the whole process, and has a high degree of automation; compared with the existing technology, the production efficiency is higher and the production cost is lower.

[0046] The wafer automatic loading device provided by the embodiment of the present invention has a carrying platform including a fifth driving member, a carrying plate and a base; one side of the carrying plate is used to carry the tray, and the other side is rotatably arranged on the base and is transmission-connected to the fifth driving member, and the fifth driving member is used to drive the carrying plate to rotate.

[0047] In this embodiment, the aforementioned supporting platform includes a fifth drive member, a supporting plate, and a base. The supporting plate is a plate-shaped structure, which is rotatably mounted on the base. The fifth drive member is also mounted on the base and is in transmission connection with the supporting plate, and is used to drive the supporting plate to rotate on the base. By providing a rotatable supporting plate, when the first material picking mechanism grabs the packaging box, the supporting plate can drive the tray located on the supporting plate to rotate according to the grabbing situation of the first material picking mechanism, thereby reducing the travel of the first robotic arm of the first material picking mechanism and facilitating the grabbing of the packaging box. At the same time, since the first robotic arm can grab the packaging box through the material picking box body 11 without excessive movement, it can also reduce the space occupied by the automatic wafer loading device, facilitating the layout of the automatic loading device.

[0048] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 1 As shown, the first material picking mechanism includes a first robotic arm, a material picking box 11, a first suction cup 12 and a first driving member 13; the material picking box 11 is arranged at the end of the first robotic arm, and the first robotic arm is used to drive the material picking box 11 to move; the material picking box 11 has a first end and a second end relative to each other, and the first end of the material picking box 11 is open; the first suction cup 12 is arranged in the material picking box 11, and the first driving member 13 is arranged on the material picking box 11 and connected to the first suction cup 12; the first suction cup 12 can adsorb the packaging box, and the first driving member 13 is used to drive the first suction cup 12 to move between the first end and the second end of the material picking box 11.

[0049] The above-mentioned first material picking mechanism includes a first robotic arm, a material picking box 11, a first suction cup 12 and a first driving member 13. Among them, the first robotic arm is composed of multiple arm sections, and two adjacent arm sections can rotate or slide relative to each other. The structure and principle of the first robotic arm are conventional technologies in this field, so they are not described here. The material picking box 11 is arranged on the first robotic arm. The material picking box 11 can suck the packaging boxes stacked on the pallet into the material picking box 11. The first robotic arm is used to drive the material picking box 11 to move so that the material picking box 11 can remove the packaging boxes one by one in the stacking order. At the same time, the first robotic arm can also drive the material picking box 11 to transfer the packaging boxes to the second material picking mechanism. Optionally, the first material picking mechanism can also be provided with a conveyor belt, which can also achieve the purpose of transferring the packaging boxes to the second material picking mechanism. The material picking box 11 has a first end and a second end relative to each other, and the first end of the material picking box 11 is open, and the packaging box can enter the material picking box 11 through the first end of the material picking box 11, and be output outward through the first end of the material picking box 11; optionally, the first driving member 13 can be a telescopic cylinder such as an air cylinder or an oil cylinder. At this time, the first driving member 13 is arranged in the material picking box 11 and fixed to the second end of the material picking box 11, and the first suction cup 12 is connected to the first driving member 13, and the first suction cup 12 is arranged pointing to the first end of the material picking box 11. The first driving member 13 is used to drive the first suction cup 12 to move along the first end of the material picking box 11 to the second end in the material picking box 11, and to drive the first suction cup 12 to move along the second end of the material picking box 11 to the first end in the material picking box 11. During use, the first robotic arm drives the picking box 11 to move so that the first end of the picking box 11 is located at the packaging box. After the picking box 11 reaches the predetermined position, the first suction cup 12 is activated and sucks the packaging box. The first driving member 13 drives the first suction cup 12 to move toward the second end of the picking box 11, so that the packaging box enters the picking box 11 from the first end of the picking box 11; thereafter, the first robotic arm drives the picking box 11 to move so that the picking box 11 moves to the second picking mechanism. The first driving member 13 drives the first suction cup 12 to move toward the first end of the picking box 11 to push the packaging box out of the picking box 11 for subsequent operations. In this embodiment, the picking box 11, the first driving member 13 and the first suction cup 12 cooperate to grab the packaging box, which can protect the packaging box from damage and has higher reliability. The packaging box will not fall from the picking box 11.

[0050] In this embodiment, when the first driving member 13 is a telescopic cylinder, the first driving member 13 needs to be disposed within the material picking box 11, which will occupy the internal space of the material picking box 11. Therefore, preferably, the first driving member 13 is a linear module, which is disposed outside the material picking box 11. Two linear modules are provided, and the two linear modules are disposed opposite each other to improve the stability of the first suction cup 12. The slider of the linear module is connected to the first suction cup 12 through a long hole provided on the material picking box 11, and drives the first suction cup 12 to reciprocate within the material picking box 11. It should be noted that the extension direction of the long hole is parallel to the axial direction of the material picking box 11.

[0051] It is understandable that, in this embodiment, the first driving member 13 can also be configured as a combination of a driving motor, a gear, and a rack, which can also achieve the purpose of driving the first suction cup 12 to reciprocate between the first end and the second end of the material picking box 11 in this embodiment. Specifically, the rack is provided on the inner side wall of the material picking box 11 and is parallel to the circumferential direction of the material picking box 11. The gear is provided at the output end of the driving motor and meshes with the rack. The first suction cup 12 is fixed to the driving motor. The driving motor drives the gear to rotate, thereby achieving the purpose of driving the first suction cup 12 to move along the extension direction of the rack, thereby achieving the purpose of driving the first suction cup 12 to reciprocate between the first end and the second end of the material picking box 11.

[0052] It is understandable that, in this embodiment, the first picking mechanism can also cooperate with the gripper through the robotic arm, which can also achieve the purpose of taking the packaging boxes stacked in piles on the pallet one by one in a preset order in this embodiment.

[0053] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 1 As shown, the packaging box is provided with a box cover, which is provided on the packaging box and is used to open or close the packaging box; the first material picking mechanism also includes a second suction cup 14; the second suction cup 14 is provided in the material picking box body 11 and is located on the top wall of the material picking box body 11, and the second suction cup 14 is used to adsorb the box cover.

[0054] Furthermore, in this embodiment, the upper end of the packaging box is open, and the open end of the packaging box is provided with a lid for opening or closing the packaging box to protect the wafers 3 inside the packaging box. To enable separation of the lid from the packaging box, the first retrieving mechanism further includes a second suction cup 14. The second suction cup 14 is disposed within the retrieving box body 11 and is located on the top wall of the retrieving box body 11. The second suction cup 14 is used to suck up the lid above the packaging box after the packaging box enters the retrieving box body 11. In this way, when the packaging box is pushed out of the retrieving box body 11, the lid will not leave the retrieving box body 11 along with the packaging box.

[0055] Optionally, in this embodiment, the second suction cup 14 can suck up the box cover above the packaging box through its own strong suction force, or a telescopic cylinder such as a pneumatic cylinder, an oil cylinder or an electric cylinder can be provided to drive the second suction cup 14 to move toward or away from the box cover, so as to facilitate the second suction cup 14 to suck up the box cover, thereby separating the box cover from the packaging box and facilitating subsequent operations.

[0056] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 1 As shown, the packaging box and the box cover are fixed by tape; the first material-retrieving mechanism also includes a tape cutting assembly, which is arranged on the material-retrieving box body 11 and is used to cut the tape.

[0057] Furthermore, in this embodiment, the packaging box and its lid are secured with tape to prevent separation during transport. To enhance the automation of the wafer automatic loading system, the first retrieving mechanism also includes a tape cutting assembly for automatically cutting the tape between the packaging box and its lid after the packaging box enters the retrieving box 11, facilitating subsequent separation of the lid from the packaging box by the second suction cup 14, thereby improving production efficiency.

[0058] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 1 As shown, the tape cutting assembly includes a cutter head 15 and a second drive member 16; the second drive member 16 is fixed to the material picking box 11, and the cutter head 15 is provided on the second drive member 16; openings are provided on both sides of the material picking box 11 at positions matching the tape, and the second drive member 16 drives the cutter head 15 to extend into the material picking box 11 through the opening and cut the tape or leave the material picking box 11.

[0059] Specifically, in this embodiment, the tape cutting assembly includes a cutter head 15 and a second drive member 16. The cutter head 15 is used to cut the tape; the second drive member 16 can be a telescopic cylinder such as a pneumatic cylinder, an oil cylinder, or an electric cylinder. The second drive member 16 is fixedly mounted outside the retrieving box 11. The cutter head 15 is connected to the second drive member 16. Through the telescopic movement of the second drive member 16, the cutter head 15 can extend through the opening into the retrieving box 11 to cut the tape, or exit the retrieving box 11 through the opening to avoid interfering with the entry or ejection of the packaging box.

[0060] It can be understood that in this embodiment, the second driving member 16 can also be a motor, which drives the cutter head 15 to swing through the rocker arm, which can also achieve the purpose of driving the cutter head 15 in this embodiment to extend into the material collection box 11 through the opening to cut the tape or exit the material collection box 11 through the opening.

[0061] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 2 and Figure 3As shown, the second material picking mechanism includes a mounting base 21 and a clamping assembly; the clamping assembly includes a third driving member 26, a first clamping jaw 22 and two second clamping jaws 23; the first clamping jaw 22 is connected to the third driving member 26, and the third driving member 26 and the two second clamping jaws 23 are all arranged on the mounting base 21, and the two second clamping jaws 23 are respectively located on both sides of the first clamping jaw 22, and the material of the two second clamping jaws 23 is a flexible material; the third driving member 26 is used to drive the first clamping jaw 22 to move, so that the first clamping jaw 22 can extend into the packaging box and clamp the chip 3 in the packaging box, and send the taken out chip 3 to the two second clamping jaws 23.

[0062] In this embodiment, the above-mentioned second material-picking mechanism includes a mounting seat 21 and a clamping assembly. The mounting seat 21 is in the shape of a plate or a frame structure, and is used to install the clamping assembly. The clamping assembly is used to take out the wafer 3 in the packaging box. Specifically, the clamping assembly includes a third driving member 26, a first clamping jaw 22 and a second clamping jaw 23. The third driving member 26 is fixed on the mounting seat 21, and the third driving member 26 is a telescopic cylinder such as an oil cylinder, an air cylinder or an electric cylinder. The first clamping jaw 22 is mounted on the third driving member 26, and the third driving member 26 is used to drive the first clamping jaw 22 to move. There are two second clamping jaws 23, and the two second clamping jaws 23 are respectively arranged on both sides of the first clamping jaw 22. Moreover, the second clamping jaw 23 is made of a flexible material such as rubber or silicone. During use, the third drive member 26 first drives the first clamping jaw 22 to extend so that the first clamping jaw 22 can extend into the packaging box and clamp the wafer 3. After the first clamping jaw 22 clamps the wafer 3, the third drive member 26 begins to retract to remove the wafer 3 from the packaging box. Since the second clamping jaws 23 are located on both sides of the first clamping jaw 22, the third drive member 26 retracts to allow the wafer 3 to enter the operating area of the second clamping jaws 23. When the wafer 3 enters the operating area of the second clamping jaws 23, the two second clamping jaws 23 operate and clamp the wafer 3. At this time, the first clamping jaw 22 can be released or continue to clamp the wafer 3. In this embodiment, after the clamping assembly removes the wafer 3, the wafer 3 needs to be transported to other processes. In order to prevent surface wear of the wafer 3 during transportation, the second clamping jaw 23 is provided to clamp the wafer 3. However, during the process of removing the wafer 3 from the packaging box, the second clamping jaw 23 has a weak clamping force and cannot remove the wafer 3, so the first clamping jaw 22 is provided to clamp the wafer 3. The cooperation between the first clamping jaw 22 and the second clamping jaw 23 can protect the surface of the wafer 3 from scratches and other quality problems to the greatest extent.

[0063] In this embodiment, the second pick-up mechanism further comprises a robotic arm, with a mounting base 21 fixedly mounted at the end of the robotic arm. The robotic arm is capable of driving the mounting base 21 to move, thereby transporting the wafer 3 to a subsequent process. The robotic arm in this embodiment is comprised of multiple segments, with adjacent segments capable of relative rotation or sliding. The structure and principles of the robotic arm are conventional in the art and will not be further described here.

[0064] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 2 and Figure 3 As shown, it also includes a support assembly; after the clamping assembly takes out the wafer 3, it can drive the wafer 3 to flip into a horizontal state; the support assembly is provided on the mounting seat 21, for supporting the wafer 3 when the wafer 3 is in a horizontal state.

[0065] In this embodiment, when the gripping assembly removes the wafer 3, the wafer 3 is in a vertical position. In order to transport the wafer 3 to the subsequent process, the aforementioned robotic arm is required to drive the mounting base 21 to flip, thereby flipping the wafer 3 from the vertical position to the horizontal position. However, when the wafer 3 is in the horizontal position, the wafer 3 is easily broken if only one edge of the wafer 3 is clamped by the aforementioned gripping assembly. At the same time, the gripping assembly is loaded heavily, and there is a risk that the wafer 3 may fall off. Therefore, the material removal device also includes a support assembly for supporting the wafer 3 when the wafer 3 is in the horizontal position, preventing the wafer 3 from breaking or falling off, thereby providing a certain degree of protection for the wafer 3.

[0066] The wafer automatic loading device provided by the embodiment of the present invention is as follows: Figure 2 and Figure 3 As shown, the support assembly includes a fourth driving member 24 and a support member 25; the fourth driving member 24 is arranged on the mounting seat 21, and the support member 25 is connected to the fourth driving member 24. The fourth driving member 24 is used to drive the support member 25 to move, so that the support member 25 moves to the bottom of the chip 3 and supports the chip 3 when the chip 3 is in a horizontal state.

[0067] In this embodiment, the support assembly includes a fourth drive member 24 and a support member 25. The fourth drive member 24 is fixed to the mounting base 21 and is a telescopic cylinder such as an air cylinder, an oil cylinder, or an electric cylinder. The support member 25 is connected to the fourth drive member 24 and is used to drive the support member 25 to move so that when the wafer 3 is in a horizontal state, the support member 25 moves below the wafer 3 and supports the wafer 3. When the wafer 3 is in a vertical state, the support member 25 moves away from the wafer 3. The coordination of the fourth drive member 24 and the support member 25 provides a high degree of automation, can protect the wafer 3, and prevent the wafer 3 from breaking or falling off.

[0068] It can be understood that in this embodiment, the fourth driving member 24 can also be a motor, which drives the support member 25 to rotate. When the chip 3 is in a horizontal state, the support member 25 rotates to the bottom of the chip 3, which can also achieve the purpose of supporting the chip 3 in this embodiment.

[0069] Another embodiment of the present invention further provides a wafer 3 unpacking machine, comprising the automatic loading device described in any of the above embodiments.

[0070] In the description of this utility model, it should be noted that the terms "upper" and "lower" and other terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0071] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0072] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer automatic loading device for taking out wafers (3) stored in a packaging box; wherein: The packaging boxes are stacked on a pallet and located in a buffer area; Characterized in that the wafer automatic loading device comprises: an AGV transfer vehicle, a carrying platform, a first material picking mechanism and a second material picking mechanism; The AGV transfer vehicle is used to transfer the pallet carrying the packaging box in the buffer area to the carrying platform; The first picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second picking mechanism; The second material taking mechanism is used to take out the wafer (3) from the packaging box.

2. The automatic wafer loading device according to claim 1, characterized in that: The carrying platform includes a fifth driving member, a carrying plate and a base; One side of the carrying plate is used to carry the tray, and the other side is rotatably disposed on the base and is transmission-connected to the fifth driving member. The fifth driving member is used to drive the carrying plate to rotate.

3. The automatic wafer loading device according to claim 1, characterized in that: The first material-retrieving mechanism comprises a first mechanical arm, a material-retrieving box (11), a first suction cup (12) and a first driving member (13); The material taking box (11) is arranged at the end of the first mechanical arm, and the first mechanical arm is used to drive the material taking box (11) to move; The material picking box (11) has a first end and a second end opposite to each other, and the first end of the material picking box (11) is open; the first suction cup (12) is arranged in the material picking box (11), and the first driving member (13) is arranged on the material picking box (11) and connected to the first suction cup (12); the first suction cup (12) can absorb the packaging box, and the first driving member (13) is used to drive the first suction cup (12) to move between the first end and the second end of the material picking box (11).

4. The automatic wafer loading device according to claim 3, characterized in that: The packing box is provided with a box cover, which is provided on the packing box and is used to open or close the packing box; The first material taking mechanism further includes a second suction cup (14); The second suction cup (14) is arranged in the material taking box (11) and is located on the top wall of the material taking box (11). The second suction cup (14) is used to absorb the box cover.

5. The automatic wafer loading device according to claim 4, characterized in that: The packaging box and the box cover are fixed by adhesive tape; The first material taking mechanism also includes a tape cutting assembly, which is arranged on the material taking box (11) and is used for cutting the tape.

6. The automatic wafer loading device according to claim 5, characterized in that: The tapping tape assembly comprises a cutter head (15) and a second driving member (16); The second driving member (16) is fixed on the material taking box (11), and the cutter head (15) is arranged on the second driving member (16); openings are provided on both sides of the material taking box (11) at positions matching the tape, and the second driving member (16) drives the cutter head (15) to extend into the material taking box (11) through the openings and cut the tape or leave the material taking box (11).

7. The automatic wafer loading device according to any one of claims 1 to 6, characterized in that: The second material taking mechanism comprises a mounting seat (21) and a clamping assembly; The clamping assembly comprises a third driving member (26), a first clamping jaw (22) and two second clamping jaws (23); The first clamping jaw (22) is connected to the third driving member (26), the third driving member (26) and the two second clamping jaws (23) are both arranged on the mounting seat (21), the two second clamping jaws (23) are respectively located on both sides of the first clamping jaw (22), and the material of the two second clamping jaws (23) is a flexible material; The third driving member (26) is used to drive the first clamping jaw (22) to move, so that the first clamping jaw (22) can extend into the packaging box and clamp the wafer (3) in the packaging box, and send the taken-out wafer (3) to the two second clamping jaws (23).

8. The automatic wafer loading device according to claim 7, characterized in that: Also included is a support assembly; After the clamping assembly takes out the wafer (3), it can drive the wafer (3) to flip into a horizontal state; the supporting assembly is arranged on the mounting seat (21) and is used to support the wafer (3) when the wafer (3) is in a horizontal state.

9. The automatic wafer loading device according to claim 8, characterized in that: The support assembly includes a fourth driving member (24) and a support member (25); The fourth driving member (24) is provided on the mounting seat (21), and the supporting member (25) is connected to the fourth driving member (24). The fourth driving member (24) is used to drive the supporting member (25) to move, so that the supporting member (25) moves to the bottom of the wafer (3) and supports the wafer (3) when the wafer (3) is in a horizontal state.

10. A wafer (3) unpacking machine, characterized in that: It comprises the automatic wafer loading device as described in any one of claims 1 to 9.

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