Closed high-cooling-capacity liquid cooling device

Abstract

The utility model discloses a closed high-cooling-capacity liquid cooling device which is used for cooling heating equipment and comprises a bottom plate, a flow guide component, a liquid storage unit and at least one cold source unit, and the liquid storage unit and the at least one cold source unit are detachably connected to the bottom plate. The flow guide assembly can guide air to dissipate heat of the liquid storage unit and the cold source unit. A closed heat dissipation loop is formed between the liquid storage unit and the heating equipment, and a cooling medium capable of circularly flowing in the heat dissipation loop is stored in the liquid storage unit; the cold source unit comprises a refrigeration assembly and a heat exchange assembly, the heat exchange assembly communicates with the refrigeration assembly and the liquid storage unit, and the refrigeration assembly cools a cooling medium in the liquid cooling loop through the heat exchange assembly; the heat dissipation loop and the refrigerant loop which can independently operate in a closed mode are adopted to cool the manufacturing equipment, all parts are modularized, the cold source units and the liquid storage units with different powers can be replaced according to the heat dissipation requirements of the manufacturing equipment, and the size and the occupied space are small; the multiple sets of cold source units work cooperatively to meet the ultra-wide refrigerating capacity requirement, and the energy consumption and the operation cost are low.

Description

Technical Field

[0001] The present application relates to the technical field of thermal management of manufacturing equipment, and in particular to a closed high-cooling-capacity liquid cooling device. Background Art

[0002] In large factories and production lines, the operation of various mechanical equipment (such as laser equipment, communications equipment, and injection molding machines) involves significant energy conversion and heat release. If this heat is not effectively managed, it can lead to equipment overheating, compromising performance and lifespan. Overheating can also cause material deformation, component failure, and product defects, reducing product quality and production efficiency. Therefore, thermal management is crucial to the stable operation of manufacturing equipment and product quality. A well-designed thermal management system can help factories rationally allocate and utilize this energy, improving production efficiency, reducing energy consumption, and ensuring the proper functioning of mechanical equipment in high-temperature environments.

[0003] Currently, most of the methods are to build dedicated cooling towers to meet the cooling and temperature reduction requirements of equipment and avoid overheating of equipment. However, this method consumes a lot of energy, is difficult to meet the requirements of refined thermal management of equipment, and will greatly occupy the factory area, reduce the utilization rate of space, and make the equipment extremely inconvenient to move. Utility Model Content

[0004] The present application provides a closed high-cooling capacity liquid cooling device to address the deficiencies of the above-mentioned prior art, and adopts the following technical solutions:

[0005] A closed high-cooling-capacity liquid cooling device for cooling heat-generating equipment, comprising a base plate and a flow guide assembly, a liquid storage unit and at least one cold source unit detachably connected to the base plate, wherein the flow guide assembly is used to guide air to dissipate heat to the liquid storage unit and the cold source unit;

[0006] A closed heat dissipation circuit is formed between the liquid storage unit and the heat-generating device. The liquid storage unit stores a cooling medium that can circulate in the heat dissipation circuit to dissipate heat from the heat-generating device. The cold source unit is used to exchange heat with the cooling medium to reduce the temperature.

[0007] The cold source unit includes a refrigeration component and a heat exchange component. The heat exchange component is communicated with the refrigeration component and the liquid storage unit respectively. The refrigeration component cools down the cooling medium in the heat dissipation circuit through the heat exchange component.

[0008] Preferably, the liquid storage unit includes a water tank unit and a power unit. The power unit can drive the cooling medium to circulate in the heat dissipation circuit to cool the heating device. The water tank unit is used to receive and store the cooling medium.

[0009] Preferably, the water tank unit includes a hot water tank and a cold water tank, the hot water tank is used to receive the cooling medium flowing through the heat-generating device, and the cold water tank is used to receive the cooling medium flowing through the heat exchange component.

[0010] Preferably, the refrigeration component includes at least one compressor and a throttling component, and a condenser arranged at one end of the compressor, and the heat exchange component is arranged on the outer peripheral surface of the compressor; the compressor, the condenser, the throttling component and the heat exchange component are connected to form a closed refrigerant circuit, and the refrigerant circuit contains refrigerant.

[0011] Preferably, the refrigeration assembly further includes an air induction assembly, and the air induction assembly is located on one side of the condenser and is arranged opposite to the condenser.

[0012] Preferably, the hot water tank is further provided with a heat dissipation component, and the heat dissipation component is used to dissipate heat from the cooling medium in the hot water tank.

[0013] Preferably, the flow guide component is correspondingly arranged at one end of the cold source unit; the flow guide component includes a flow guide cover and an exhaust component for discharging air in the flow guide cover, and the flow guide cover is connected to the cold source unit.

[0014] Preferably, the heat exchange component is an evaporator.

[0015] Preferably, when there are at least two cold source units, the cold source units are connected in parallel in the heat dissipation circuit, and the cold source units are arranged vertically to the liquid storage unit.

[0016] Preferably, a controller is further included, and the controller is used to control the cold source unit and the liquid storage unit to work in coordination.

[0017] Compared with the prior art, the beneficial effects of this application are:

[0018] (1) It uses a heat dissipation circuit and a refrigerant circuit that can operate independently and are integrated on the base plate, with a small size and space occupation and easy installation;

[0019] (2) The refrigerant circuit cools down the cooling medium in the heat dissipation circuit by using a phase change heat transfer cooling method. The closed operation satisfies the temperature control of the manufacturing equipment. The modularization of each part can replace the power of the cold source unit and the liquid storage unit according to the heat dissipation requirements of the manufacturing equipment. The coordinated operation of multiple cold source units can meet the requirements of ultra-wide cooling capacity and the requirements of refined thermal management of the equipment, with low energy consumption and low operating costs.

[0020] (3) The guide component can guide the air to flow through the liquid storage unit and the cold source unit in sequence to dissipate heat, and guide the hot air after dissipation to one place for discharge, so as to improve the overall heat dissipation efficiency and heat dissipation effect and reduce the workload of the cold source unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a simplified schematic diagram of this application;

[0022] Figure 2 It is a three-dimensional schematic diagram of this application;

[0023] Figure 3 This is a schematic structural diagram of the cold source unit of the present application from a first perspective;

[0024] Figure 4 This is a schematic structural diagram of the cold source unit of the present application from a second perspective.

[0025] In the picture:

[0026] 100, heat dissipation circuit, 200, refrigerant circuit;

[0027] 1. Bottom plate;

[0028] 2. Cold source unit, 20. Refrigeration component, 21. Heat exchange component, 22. Compressor, 23. Throttling component, 24. Condenser, 25. Air induction component;

[0029] 3. Liquid storage unit, 31. Water tank unit, 311. Hot water tank, 312. Cold water tank, 32. Power unit, 3111. Inlet, 3121. Outlet;

[0030] 4. flow guide assembly, 41. flow guide cover, 42. exhaust assembly;

[0031] 5. Controller, 6. Connecting pipe. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described in this application are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0033] See Figures 1 to 4 , further explain this application:

[0034] A closed high-cooling-capacity liquid cooling device is used for thermal management of manufacturing equipment, which includes a refrigerant circuit 200 and a heat dissipation circuit 100. The heat dissipation circuit 100 includes a liquid storage unit 3, which stores a cooling medium for heat exchange and cooling of the heating equipment. The liquid storage unit 3 is connected to the heating equipment to form the heat dissipation circuit 100 to cool the heating equipment.

[0035] The refrigerant circuit 200 includes a cold source unit 2, and the refrigerant circuit 200 contains refrigerant; the cold source unit 2 is used to cool the cooling medium; wherein, the cold source unit 2 includes a refrigeration component and a heat exchange component 21, and the refrigeration component and the heat dissipation circuit 100 are respectively connected to the heat exchange component 21, and the refrigeration component is used to drive the refrigerant to flow in the refrigerant circuit 200, and flow through the heat exchange component 21 to exchange heat and cool the cooling medium in the heat dissipation circuit 100.

[0036] Combine Figure 3 and Figure 4 In this embodiment, the refrigeration component includes at least one compressor 22 and a throttling component 23, and a condenser 24 provided at one end of the compressor 22. The compressor 22 and the condenser are vertically arranged. When there are at least two compressors, the compressors are arranged in parallel. The heat exchange component 21 is arranged on the outer peripheral surface of the compressor, which occupies less space; the compressor 22, the condenser 24 and the throttling component 23 are connected to the heat exchange component 21 to form the refrigerant circuit 200; wherein the refrigerant circuit 200 and the heat dissipation circuit 100 are both connected through a connecting pipe 6 to allow the cooling medium and the refrigerant to flow.

[0037] When the refrigerant circuit 200 is working, the refrigerant is compressed by the compressor 22, passes through the condenser 24 in sequence to form a gas-liquid mixture, passes through the throttling component 23 to form a low-pressure liquid, enters the heat exchange component 21 to exchange heat with the cooling medium to form a low-temperature, low-pressure gas, and then returns to the compressor 22 to be re-compressed and enter the next cycle.

[0038] It also includes a base plate 1 and a guide component 4. The cold source unit 2 and the liquid storage unit 3 are respectively detachably mounted on the base plate 1. The guide component 4 and the liquid storage unit 3 are respectively arranged at both ends of the cold source unit 2. The guide component can guide the air to dissipate heat to the liquid storage unit and the cold source unit; and the modularization of each part can replace the cold source unit 2 and the liquid storage unit 3 of different power according to the heat dissipation requirements of the heating equipment. The overall space occupied is more flexible and has a wider range of applications. It can cool multiple heating devices at the same time and reduce energy consumption.

[0039] Combine Figure 2The flow guide assembly 4 and the liquid storage unit 3 are respectively arranged at both ends of the cold source unit 2. The flow guide assembly 4 includes a flow guide cover 41 and an exhaust assembly 42. The exhaust assembly can be a blower. The condensers 24 are all arranged in the flow guide cover 41. The flow guide assembly 4 can guide air to pass through the liquid storage unit 3 and the cold source unit 2 in sequence to dissipate heat. The air after dissipation is collected in the flow guide cover 41 and then uniformly guided by the exhaust assembly 42 to be discharged from one place, so as to prevent the air after dissipation from flowing through the liquid storage unit 3 and the cold source unit 2 again, thereby reducing the heat dissipation effect.

[0040] In this embodiment, the heat exchange component 21 is an evaporator.

[0041] The liquid cooling unit includes a water tank unit 31 and a power unit 32. The water tank unit 31, the power unit 32 and the heating device are connected to form a closed heat dissipation circuit 100. The water tank unit 31 is used to store the cooling medium. The power unit 32 can drive the cooling medium to circulate in the heat dissipation circuit 100 to exchange heat and cool the heating device. The power device is a pump.

[0042] Among them, the water tank unit 31 includes a hot water tank 311 and a cold water tank 312. The hot water tank 311 is used to receive the cooling medium after flowing through the heating equipment, and the cold water tank 312 is used to receive the cooling medium after flowing through the heat exchange component 21 and cooling down. The water tank unit 31 can store more cooling medium in the heat dissipation circuit 100, and can provide the cooling medium to the heat dissipation circuit 100 in time, thereby avoiding the lack of cooling medium in the heat dissipation circuit 100, thereby affecting the cooling effect of the heating equipment.

[0043] The hot water tank 311 is provided with an inlet 3111, and the cold water tank 312 is provided with an outlet 3121. The inlet 3111 and the outlet 3121 are connected to the heating device to form a closed heat dissipation circuit 100. During installation, only the heat dissipation pipes of the heating device need to be connected to the inlet 3111 and the outlet 3121, respectively, which reduces the installation difficulty. The inlet 3111 and the outlet 3121 can be added as needed.

[0044] When the heat dissipation circuit 100 is working, the power unit 32 drives the cooling medium in the hot water tank 311 to enter the heat exchange component 21 and exchange heat with the refrigerant circuit 200 for cooling down. The cooling medium after heat exchange flows to the cold water tank 312 for storage. The cooling medium flows to the heating equipment through the cold water tank 312 for heat exchange and cooling down, and finally returns to the hot water tank 311 to wait for the power unit 32 to drive.

[0045] The cooling unit 2 may further include an air induction component 25, which is a fan. The air induction component 25 is located on one side of the condenser 24, opposite to the condenser 24. The air induction component 25 is used to guide air for heat exchange with the condenser 24. The air induction component and the condenser are both located within the air deflector. During operation, the air induction component and the condenser can cooperate with the air deflector component 4 to collect the cooled air into the air deflector 41, while also dissipating heat for the liquid storage unit 3 and the cooling unit 2, thereby improving the heat dissipation effect and effectively shielding the noise of the air induction component 25.

[0046] The hot water tank 311 is also provided with a heat dissipation component, which is a heat sink; the heat dissipation component is used to dissipate heat from the cooling medium stored in the hot water tank 311, thereby reducing the temperature of the cooling medium transported to the heat exchange component 21, reducing the workload of the cold source unit 2, and thereby reducing energy consumption and operating costs.

[0047] Based on the above, when there are at least two cooling source units 2, the cooling source units 2 are connected in parallel with each other in the heat dissipation circuit 100, the cooling source units 2 are arranged perpendicularly to the liquid storage unit 3, and the cooling source units 2 are arranged in parallel with each other. In this way, when the air induction component 25 is in operation, the resistance to the heat exchange air is small, which helps to improve the heat exchange efficiency.

[0048] It also includes a controller 5, which is electrically connected to the liquid storage unit 3 and the cold source unit 2 and is used to control the operation of the power device and the refrigeration component.

Claims

1. A closed high-capacity liquid cooling device used to cool heating equipment, characterized by: It includes a bottom plate and a flow guide assembly, as well as a liquid storage unit and at least one cold source unit detachably connected to the bottom plate, wherein the flow guide assembly is used to guide air to dissipate heat to the liquid storage unit and the cold source unit; A closed heat dissipation circuit is formed between the liquid storage unit and the heat-generating device. The liquid storage unit stores a cooling medium that can circulate in the heat dissipation circuit to dissipate heat from the heat-generating device. The cold source unit is used to exchange heat with the cooling medium to reduce the temperature. The cold source unit includes a refrigeration component and a heat exchange component. The heat exchange component is communicated with the refrigeration component and the liquid storage unit respectively. The refrigeration component cools down the cooling medium in the heat dissipation circuit through the heat exchange component.

2. The closed high-cooling capacity liquid cooling device according to claim 1, characterized in that: The liquid storage unit includes a water tank unit and a power unit. The power unit can drive the cooling medium to circulate in the heat dissipation circuit to cool the heating device. The water tank unit is used to receive and store the cooling medium.

3. The closed high-cooling-capacity liquid cooling device according to claim 2, characterized in that: The water tank unit includes a hot water tank and a cold water tank. The hot water tank is used to receive the cooling medium flowing through the heat-generating device, and the cold water tank is used to receive the cooling medium flowing through the heat exchange component.

4. The closed high-cooling-capacity liquid cooling device according to claim 1, characterized in that: The refrigeration component includes at least one compressor and a throttling component, and a condenser arranged at one end of the compressor, and the heat exchange component is arranged on the outer peripheral surface of the compressor; the compressor, the condenser, the throttling component and the heat exchange component are connected to form a closed refrigerant circuit, and the refrigerant circuit contains refrigerant.

5. The closed high-cooling-capacity liquid cooling device according to claim 4, characterized in that: The refrigeration assembly further includes an air induction assembly, which is located on one side of the condenser and is arranged opposite to the condenser.

6. The closed high-cooling-capacity liquid cooling device according to claim 3, characterized in that: The hot water tank is further provided with a heat dissipation component, which is used to dissipate heat from the cooling medium in the hot water tank.

7. The closed high-cooling-capacity liquid cooling device according to claim 1, characterized in that: The flow guide component is correspondingly arranged at one end of the cold source unit; the flow guide component includes a flow guide cover and an exhaust component for discharging air in the flow guide cover, and the flow guide cover is connected to the cold source unit.

8. The closed high-cooling-capacity liquid cooling device according to claim 1, characterized in that: The heat exchange component is an evaporator.

9. The closed high-cooling-capacity liquid cooling device according to claim 1, characterized in that: When there are at least two cold source units, the cold source units are connected in parallel in the heat dissipation circuit, and the cold source units are arranged vertically to the liquid storage unit.

10. The closed high-cooling-capacity liquid cooling device according to claim 1, characterized in that: It also includes a controller, which is used to control the cold source unit and the liquid storage unit to work in coordination.

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