Wafer aging oven based on semiconductor cooling mode

Abstract

The utility model discloses a wafer aging oven based on a semiconductor cooling mode, and relates to the technical field of wafer testing, the wafer aging oven comprises an aging test assembly, the aging test assembly comprises an aging oven body, the aging oven body is internally provided with a placing cavity, the back surface of the aging oven body is provided with a semiconductor cooler in an embedded manner, and the semiconductor cooler is connected with the placing cavity. And an electromagnet and an electric heating plate are fixedly mounted in the aging oven body and located in the inner cavity of the placement cavity. The beneficial effects of the utility model are that through the arrangement of the wafer bearing assembly, the device has the advantage of uniform rotation, can enable a plurality of movable frames to rotate synchronously under the driving of a gear motor so as to enable a wafer between side baffles to rotate circumferentially, can control an electromagnet to be electrified, and enables a displacement ring to move up and down flexibly under the cooperation of a magnetic ring, thereby improving the working efficiency. Therefore, the placement inclination angles of a plurality of wafers can be changed, the heating uniformity of the wafers is better during a high-temperature test, and actual test requirements are better met.

Description

Technical Field

[0001] The utility model relates to the field of wafer testing, in particular to a wafer aging box based on a semiconductor cooling method. Background Art

[0002] A wafer aging chamber is a device specifically used for accelerated aging testing of semiconductor wafers. It can test wafers in a simulated harsh environment to evaluate their performance and reliability under long-term use conditions. It is widely used in the semiconductor manufacturing industry, especially playing an important role in new product development, quality control and material improvement.

[0003] Basic wafer aging chambers do not have the function of rotation testing. When testing in a high-temperature aging environment, the wafer's heating uniformity is generally poor, affecting the overall test uniformity and presenting certain limitations.

[0004] In summary, a wafer aging box based on semiconductor cooling is proposed to solve the above problems. Utility Model Content

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the name of the utility model of this application to avoid blurring the purpose of this section, the abstract of the specification and the name of the utility model, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In view of the above problems and / or the problems existing in the prior art, the present utility model is proposed.

[0007] Therefore, the technical problem to be solved by the present invention is that the basic wafer aging box does not have the function of rotation testing. When testing in a high-temperature aging environment, the heating uniformity of the wafer is generally poor, which affects the overall test uniformity and has certain limitations.

[0008] In order to solve the above technical problems, the present invention provides the following technical solutions: a wafer aging box based on a semiconductor cooling method, comprising an aging test assembly, the aging test assembly comprising an aging box body, a placement cavity is provided inside the aging box body, a semiconductor refrigerator is embedded on the back surface of the aging box body, an electromagnet and an electric heating plate are fixedly installed in the inner cavity of the aging box body and located in the placement cavity, a reduction motor is embedded in the inner cavity of the aging box body and located in the placement cavity, and a rotating disk is fixedly installed on the output end of the reduction motor;

[0009] The wafer carrying assembly includes a fixed carrying part and a movable angle-changing part. The fixed carrying part includes a positioning column. The top and bottom of the surface of the positioning column are both sleeved with auxiliary plates. The opposite sides of the two auxiliary plates are fixedly connected with vertical rods, and the surface of the vertical rods is fixedly sleeved with a fixed frame; the movable angle-changing part includes a displacement ring, the outer ring of the displacement ring is fixedly connected with a connecting seat, and the surface of the connecting seat is movably sleeved with a movable frame.

[0010] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, the cooling end of the semiconductor refrigerator is located in the inner cavity of the placement cavity, the heat dissipation end of the semiconductor refrigerator is located on the rear side of the aging box body, and the number of the fixed frame and the movable frame is the same.

[0011] As a preferred solution of the semiconductor cooling-based wafer aging box of the present invention, a positioning block is fixedly connected to the center of the top of the rotating disk, and an empty slot is opened at the center of the auxiliary disk located above.

[0012] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, a guide groove is opened through the surface of the fixed frame, and a bump is fixedly connected to the surface of the movable frame, and the outer diameter of the bump is larger than the inner diameter of the guide groove.

[0013] As a preferred solution of the semiconductor cooling-based wafer aging box of the present invention, the surface of the movable frame is in sliding contact with the connection of the guide groove, and a movable rod is movably installed on the inner wall of the movable frame.

[0014] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, the surfaces of the movable rods are respectively provided with movable plates and torsion springs, and the surfaces of the movable plates are fixedly connected to the connection points of the movable rods.

[0015] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, one end of the torsion spring is fixedly connected to the surface of the movable frame, and the other end of the torsion spring is fixedly connected to the surface of the movable plate.

[0016] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, the top of the movable plate is fixedly connected with a side baffle, and the surface of the side baffle is fixedly installed with an anti-slip sponge strip.

[0017] As a preferred solution of the semiconductor cooling-based wafer aging box of the present invention, a magnetic ring is fixedly embedded on the top of the uppermost displacement ring, and the magnetic ring is adapted to the electromagnet.

[0018] As a preferred solution of the wafer aging box based on semiconductor cooling method described in the present invention, a sealed door is movably installed on the left side of the front surface of the aging box body, and a control panel is fixedly installed on the right side of the front surface of the aging box body.

[0019] The beneficial effects of the present invention are as follows: by setting up a wafer carrying component, it has the advantage of rotational homogenization, and can make multiple movable frames rotate synchronously under the drive of a reduction motor, so that the wafers between the side baffles rotate in a circular manner. At the same time, the electromagnet can be controlled to be energized, and with the cooperation of the magnetic ring, the displacement ring can be flexibly moved up and down, thereby changing the inclination angle of multiple wafers. During high-temperature testing, the wafers are heated more uniformly, which is more in line with actual testing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. Among them:

[0021] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0022] Figure 2 This is a side perspective view of the structure of the utility model when it is cut away;

[0023] Figure 3 This is a three-dimensional diagram of the utility model when the local structure is separated;

[0024] Figure 4 This is a three-dimensional diagram of the movable angle-changing member of the utility model when separated. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, cross-sectional views of device structures may be partially enlarged and not to scale when describing embodiments of the present invention. Furthermore, the schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0028] Furthermore, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0029] Example 1

[0030] Reference Figures 1 to 4 The present embodiment provides a wafer aging box based on a semiconductor cooling method, including an aging test component 100. The aging test component 100 includes an aging box body 101. A placement cavity 101a is provided inside the aging box body 101. A semiconductor refrigerator 101b is embedded on the back surface of the aging box body 101. An electromagnet 101c and an electric heating plate 101d are fixedly installed inside the aging box body 101 and in the inner cavity of the placement cavity 101a. A reduction motor 101f is embedded in the inner cavity of the aging box body 101 and in the inner cavity of the placement cavity 101a. A rotating disk 101e is fixedly installed on the output end of the reduction motor 101f.

[0031] Furthermore, the cooling end of the semiconductor cooler 101 b is located in the inner cavity of the placement cavity 101 a , and the heat dissipation end of the semiconductor cooler 101 b is located at the rear side of the aging chamber body 101 .

[0032] Furthermore, a positioning block 101e-1 is fixedly connected to the center of the top of the rotating disk 101e, a sealing door 103 is movably installed on the left side of the front surface of the aging box body 101, and a control panel 102 is fixedly installed on the right side of the front surface of the aging box body 101.

[0033] It also includes a wafer carrying assembly 200, which includes a fixed carrying part 201 and a movable angle-changing part 202. The fixed carrying part 201 includes a positioning column 201a, and the top and bottom of the surface of the positioning column 201a are both sleeved with auxiliary plates 201b. The connection between the auxiliary plates 201b and the positioning column 201a is fixedly connected, and the opposite sides of the two auxiliary plates 201b are fixedly connected with vertical rods 201c, and the surface of the vertical rods 201c is fixedly sleeved with a fixed frame 201d; the movable angle-changing part 202 includes a displacement ring 202a, and the outer ring of the displacement ring 202a is fixedly connected with a connecting seat 202b, and the surface of the connecting seat 202b is movably sleeved with a movable frame 202e.

[0034] Furthermore, the number of the fixed racks 201d and the movable racks 202e is the same, and an empty slot 201b-1 is provided at the center of the auxiliary plate 201b located above.

[0035] Furthermore, a guide groove 201d-1 is formed through the surface of the fixed frame 201d, and a protrusion 202e-1 is fixedly connected to the surface of the movable frame 202e. The outer diameter of the protrusion 202e-1 is larger than the inner diameter of the guide groove 201d-1.

[0036] Furthermore, the surface of the movable frame 202e is in sliding contact with the connection portion of the guide groove 201d-1, and a movable rod 202c is movably mounted on the inner wall of the movable frame 202e.

[0037] Furthermore, the surface of the movable rod 202c is respectively sleeved with a movable plate 202d and a torsion spring 202f, and the surface of the movable plate 202d is fixedly connected to the connection point of the movable rod 202c.

[0038] Furthermore, one end of the torsion spring 202f is fixedly connected to the surface of the movable frame 202e, and the other end of the torsion spring 202f is fixedly connected to the surface of the movable plate 202d.

[0039] Furthermore, the top of the movable plate 202d is fixedly connected to a side baffle 202d-1, and the surface of the side baffle 202d-1 is fixedly installed with an anti-slip sponge strip 202d-11.

[0040] Furthermore, a magnetic ring 202a-1 is fixedly embedded on the top of the uppermost displacement ring 202a, and the magnetic ring 202a-1 is adapted to the electromagnet 101c.

[0041] The material of the magnetic ring 202a-1 is aluminum nickel cobalt magnet, which has the characteristics of high magnetic flux density, good temperature stability and good corrosion resistance. It can cooperate with the electromagnet 101c. When the electromagnet 101c is energized, the magnetic ring 202a-1 and the electromagnet 101c can repel or attract each other according to the direction of the current passed into the electromagnet 101c. In order to flexibly change the direction of the current passed into the electromagnet 101c, a current commutator needs to be installed.

[0042] A rectangular groove is provided at the center of the bottom of the positioning column 201a for use with the positioning block 101e-1, so that the rotating disk 101e and the positioning column 201a can rotate synchronously when the positioning column 201a and the positioning block 101e-1 are docked.

[0043] The inner ring of the displacement ring 202a is in sliding contact with the surface of the positioning post 201a.

[0044] It should be noted that by setting the semiconductor cooler 101b and the electric heating plate 101d, they can respectively play the role of cooling and heating when the two are working, so as to adjust the test temperature in the placement cavity 101a well. By setting the reduction motor 101f and the rotating disk 101e, the wafer carrying assembly 200 can be placed and carried by the rotating disk 101e. When the reduction motor 101f is working, the wafer carrying assembly 200 can be rotated in a circle. By setting the positioning column 201a, the displacement ring 200 can be adjusted. 02a is guided to move up and down. By setting the magnetic ring 202a-1 and the electromagnet 101c, the magnetic ring 202a-1 can drive the displacement ring 202a to move flexibly when the electromagnet 101c is powered. The moving direction of the displacement ring 202a depends on the positive and negative poles of the magnetic ring 202a-1 and the positive and negative poles of the electromagnet 101c when it is powered. By setting the empty slot 201b-1, the space requirement of the uppermost displacement ring 202a and part of the movable frame 202e can be met, so that the uppermost position The moving ring 202a can contact the electromagnet 101c, and by setting the vertical rod 201c, it can be connected to the auxiliary plate 201b and the fixed frame 201d, thereby ensuring the installation stability of the fixed frame 201d. By setting the guide groove 201d-1, the sliding space requirement of the movable frame 202e can be met. By setting the protrusion 202e-1, the movable frame 202e can be prevented from separating from the fixed frame 201d. By setting the connecting seat 202b, the movable installation requirement of the movable frame 202e can be met. By setting the movable rod 20 2c, the movable plate 202d can be positioned and installed. By setting the torsion spring 202f, the movable plate 202d can be provided with torque, and then the movable plate 202d can be maintained in a vertical state without external force. By setting the side baffle 202d-1 and the anti-slip sponge strip 202d-11, the wafer can be positioned and placed, and due to the existence of the anti-slip sponge strip 202d-11, it can elastically contact with the wafer to avoid scratches on the wafer surface, and the elastic design can increase the contact friction with the wafer to prevent the wafer from moving at will.

[0045] When in use, the wafer carrying assembly 200 is in a flexibly detachable state. Outside the aging box body 101, the staff can conveniently place multiple wafers between the side baffles 202d-1. The wafers are elastically positioned and clamped by the anti-slip sponge strips 202d-11, and then the wafer carrying assembly 200 is moved. With the assistance of the positioning moment block 101e-1, the wafer carrying assembly 200 is placed in the placement chamber 101a and on the rotating disk 101e. The sealing door 103 is closed and the electric heating plate 101d or the semiconductor refrigerator 101b is controlled to work, and the test temperature in the placement chamber 101a is flexibly adjusted. During the test, the reduction motor 101f is controlled to work and drive the rotating disk 101e to rotate, so that the entire wafer carrying assembly 200 rotates in a circle, and the wafer is heated and evenly tested in a circular manner. The electromagnet 101c can be energized and operated, and the direction of the magnetic pole of the electromagnet 101c can be flexibly changed according to the direction of the current passed into the electromagnet 101c. With the cooperation of the magnetic ring 202a-1, the displacement ring 202a can be flexibly displaced on the positioning column 201a. Since one end of the movable frame 202e is placed in the guide groove 201d-1 and slides in the guide groove 201d-1, and the other end of the movable frame 202e moves up and down with the displacement ring 202a, the inclination angle of the movable frame 202e can be flexibly changed. At this time, with the cooperation of the wafer's own weight, when the movable frame 202e is in a tilted state, the wafer will drive the movable plate 202d to rotate a certain angle, and the torsion spring 202f is in a tightened state, which can further change the wafer inclination angle and further improve the wafer aging uniformity.

[0046] In summary, by setting up the wafer supporting assembly 200, the advantage of rotational homogenization is achieved. Under the drive of the reduction motor 101f, multiple movable frames 202e can be rotated synchronously, so that the wafers between the side baffles 202d-1 can rotate in a circular manner. At the same time, the electromagnet 101c can be controlled to be energized, and with the cooperation of the magnetic ring 202a-1, the displacement ring 202a can be flexibly displaced up and down, thereby changing the inclination angles of multiple wafers. During high-temperature testing, the wafers are heated more uniformly, which is more in line with actual testing requirements.

[0047] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, and parameter values (e.g., temperature, pressure, etc.), mounting arrangements, use of materials, colors, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure of performing the function described herein, and is not only structurally equivalent but also an equivalent structure. Without departing from the scope of the present invention, other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0048] Additionally, in order to provide a concise description of example embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0049] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0050] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, and all of these should be included in the scope of the claims of the present invention.

Claims

1. A wafer aging chamber based on semiconductor cooling, characterized by: include, An aging test assembly (100) comprises an aging box body (101), a placement cavity (101a) is provided inside the aging box body (101), a semiconductor refrigerator (101b) is embedded and installed on the back surface of the aging box body (101), an electromagnet (101c) and an electric heating plate (101d) are fixedly installed inside the aging box body (101) and in the inner cavity of the placement cavity (101a), a reduction motor (101f) is embedded and installed inside the aging box body (101) and in the inner cavity of the placement cavity (101a), and a rotating disk (101e) is fixedly installed at the output end of the reduction motor (101f); A wafer bearing assembly (200) comprises a fixed bearing member (201) and a movable angle-changing member (202); the fixed bearing member (201) comprises a positioning column (201a); the top and bottom surfaces of the positioning column (201a) are sleeved with auxiliary disks (201b); the two auxiliary disks (201b) are fixedly connected to vertical rods (201c) on opposite sides; the surfaces of the vertical rods (201c) are fixedly sleeved with a fixed frame (201d); the movable angle-changing member (202) comprises a displacement ring (202a); the outer ring of the displacement ring (202a) is fixedly connected to a connecting seat (202b); the surface of the connecting seat (202b) is movably sleeved with a movable frame (202e).

2. The wafer aging chamber based on semiconductor cooling method according to claim 1, characterized in that: The cooling end of the semiconductor cooler (101b) is located in the inner cavity of the placement cavity (101a), the heat dissipation end of the semiconductor cooler (101b) is located at the rear side of the aging box body (101), and the number of the fixed frame (201d) and the movable frame (202e) is the same.

3. The wafer aging chamber based on semiconductor cooling method according to claim 2, characterized in that: A positioning block (101e-1) is fixedly connected at the center of the top of the rotating disk (101e), and an empty slot (201b-1) is provided at the center of the auxiliary disk (201b) located above.

4. The wafer aging chamber based on semiconductor cooling method according to claim 3, characterized in that: A guide groove (201d-1) is provided through the surface of the fixed frame (201d), and a protrusion (202e-1) is fixedly connected to the surface of the movable frame (202e), wherein the outer diameter of the protrusion (202e-1) is larger than the inner diameter of the guide groove (201d-1).

5. The wafer aging chamber based on semiconductor cooling method according to claim 4, characterized in that: The surface of the movable frame (202e) is in sliding contact with the connection point of the guide groove (201d-1), and a movable rod (202c) is movably mounted on the inner wall of the movable frame (202e).

6. The wafer aging chamber based on semiconductor cooling method according to claim 5, characterized in that: The surfaces of the movable rod (202c) are respectively sleeved with a movable plate (202d) and a torsion spring (202f), and the surface of the movable plate (202d) is fixedly connected to the connection point of the movable rod (202c).

7. The wafer aging chamber based on semiconductor cooling method according to claim 6, characterized in that: One end of the torsion spring (202f) is fixedly connected to the surface of the movable frame (202e), and the other end of the torsion spring (202f) is fixedly connected to the surface of the movable plate (202d).

8. The semiconductor cooling-based wafer aging chamber according to claim 7, characterized in that: The top of the movable plate (202d) is fixedly connected to a side baffle (202d-1), and the surface of the side baffle (202d-1) is fixedly installed with an anti-slip sponge strip (202d-11).

9. The semiconductor cooling-based wafer aging chamber according to claim 8, characterized in that: A magnetic ring (202a-1) is fixedly embedded on the top of the uppermost displacement ring (202a), and the magnetic ring (202a-1) is compatible with the electromagnet (101c).

10. The wafer aging chamber based on semiconductor cooling method according to claim 9, characterized in that: A sealing door (103) is movably installed on the left side of the front surface of the aging box body (101), and a control panel (102) is fixedly installed on the right side of the front surface of the aging box body (101).

Images