Chip detection fixing module

By designing the connecting contact points and compression components in the chip detection fixed module, the problem of unstable contact strength between the PCB board and the chip is solved, and more accurate chip detection is achieved.

CN223205530UActive Publication Date: 2025-08-08SUZHOU JINGONG SEMICONDUCTOR TECHNOLOGY CO LTD
View PDF 1 Cites 0 Cited by

Patent Information

Application Number
CN202422346352.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-25
Publication Date
2025-08-08
Estimated Expiration
2034-09-25

AI Technical Summary

Technical Problem

In the prior art, the contact strength between the PCB board and the chip is affected by the installation strength of the PCB board, resulting in unstable detection results.

Method used

A chip detection fixing module is designed, including a support seat and an upper cover. By setting a connecting contact point and a pressing assembly on the upper cover, the pressing assembly applies pressure to the PCB board to ensure that the PCB board is closely fitted with the upper cover.

Benefits of technology

Ensure the contact strength between the PCB board and the chip, and improve the accuracy and stability of detection.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223205530U_ABST
    Figure CN223205530U_ABST
Patent Text Reader

Abstract

The utility model provides a chip detection fixing module, which is applied to the field of chip detection appliances, and is characterized in that the chip detection fixing module comprises a supporting seat, a mounting seat used for mounting a chip is arranged on the supporting seat, the mounting seat comprises a lower shell and an upper cover hinged to the lower shell, a plurality of connecting contacts are arranged on the upper cover in a penetrating manner, a PCB is fixed on the upper cover, and the connecting contacts are connected with the PCB. The connecting contacts are used for connecting the chip and the PCB; the pressing assembly is arranged on the supporting seat and is used for applying pressure pointing to the upper cover to the PCB so as to enhance the contact strength between the PCB and the connecting contacts; the device has the technical effects that the contact strength of the PCB and the chip can be ensured, so that the detection quality is ensured.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the field of chip detection tools, in particular to a chip detection fixing module. Background Art

[0002] The chip must undergo quality inspection before leaving the factory to determine whether it meets the usage standards.

[0003] At present, the Chinese invention patent application with publication number CN118549794A discloses a jet microchannel testing device for high-power chips, including an upper cover and a lower frame, the lower frame is hinged to the upper cover, a testing mechanism is installed at the lower end of the lower frame, a chip is placed on the testing mechanism, the lower end and the upper end of the upper cover are respectively equipped with a jet microchannel mechanism and a clamping mechanism, the jet microchannel mechanism includes a test cover frame, a jet microchannel is installed at the center of the test cover frame, the jet microchannel includes a jet structure, a partition is installed in the jet structure, and the partition separates the jet structure into an upper flow cavity. and a lower flow cavity, a plurality of jet holes are provided on the partition, a cover plate is installed at the upper end of the upper flow cavity, an inlet connected to the upper flow cavity is installed on the cover plate, a microfluidic bottom plate is installed at the lower end of the lower flow cavity, a plurality of triangular bosses are distributed on the microfluidic bottom plate, the testing mechanism includes a chip limiting frame installed at the lower end of the lower frame, a socket middle plate is installed at the lower end of the chip limiting frame, a socket bottom plate is installed at the lower end of the socket middle plate, and a PCB board is installed at the lower end of the socket bottom plate; specifically, the chip is placed in the testing mechanism, and the solder balls at the bottom of the chip are connected to the PCB board through the elastic probes in the testing mechanism.

[0004] An existing patent discloses a fluidic microchannel testing device for high-power chips. As can be seen from its description and drawings, its PCB board is fixed to the socket midplate by screws, and then the solder balls on the bottom of the chip are connected to the PCB board through elastic probes in the test mechanism. The problem is that whether the contact between the PCB board and the chip is good is seriously affected by the installation strength of the PCB board. If the human operation is improper or the installation strength of the PCB board is insufficient, the contact between the PCB board and the chip will be affected, thereby affecting the test results. The inventor aims to provide a solution to this problem. Utility Model Content

[0005] The purpose of the utility model is to provide a chip detection fixing module, which has the advantage of being able to ensure the contact strength between the PCB board and the chip, thereby ensuring the detection quality.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides the following technical solutions: a chip detection fixed module, comprising:

[0007] A support base, wherein a mounting base for mounting a chip is provided on the support base, the mounting base includes a lower shell and an upper cover hinged to the lower shell, a plurality of connection contacts are provided through the upper cover, a PCB board is fixed on the upper cover, and the connection contacts are used to connect the chip and the PCB board; and,

[0008] A pressing component is provided on the support seat and is used to apply pressure to the PCB board directed toward the upper cover to strengthen the contact strength between the PCB board and the connection contacts.

[0009] Through the above technical solution, during testing, the mounting seat is opened, the chip is placed in the mounting seat, and the upper cover is closed. At this time, the connection contacts connect the PCB board and the chip. Then the clamping component applies pressure to the PCB board directed towards the upper cover, so that the PCB board and the upper cover fit tightly together, ensuring the contact strength between the PCB board and the chip. Even when the PCB board and the upper cover are not fixed stably, the PCB board and the chip can still be in close contact, thereby ensuring that the chip can be tested more accurately.

[0010] In one embodiment of the present invention, the clamping assembly includes: a rotating frame hinged to the support base, the rotating frame is fastened to the support base by a buckle; a swivel threadedly connected to the support base, and the swivel rotates to apply pressure to the PCB board.

[0011] Through the above technical solution, after the chip is placed in the mounting seat, the rotating frame is rotated and fastened, and the rotating frame is fastened and fixed to the support seat by the snap buckle. Then, the rotating ring is rotated to move the rotating ring along its axial direction, thereby applying pressure to the PCB board and pressing the PCB board against the upper cover, thereby ensuring the contact strength between the PCB board and the upper cover.

[0012] In one embodiment of the present invention, an operating handle is fixed on the rotating ring.

[0013] By means of the above technical solution, the rotational force arm is increased, thereby saving physical strength.

[0014] In one embodiment of the present invention, a positioning groove is provided on the support base, and the mounting base is placed in the positioning groove to achieve positioning of the mounting base.

[0015] Through the above technical solution, when installing the mounting seat, the mounting seat can be placed in the positioning groove, and the mounting seat can be fixed on the support seat by applying pressure to the PCB board by the clamping component.

[0016] In one embodiment of the present invention, the upper cover is provided with a plurality of mounting holes for fixing the PCB board, and the PCB board is fixed to the upper cover by screws.

[0017] The above technical solution makes it easy to install and remove the PCB board.

[0018] As described above, the chip detection fixing module of the present invention has the following beneficial effects:

[0019] During testing, the mounting seat is opened, the chip is placed in the mounting seat, and the upper cover is closed. At this time, the connection contacts connect the PCB board and the chip. Then the clamping assembly applies pressure to the PCB board pointing to the upper cover, so that the PCB board and the upper cover fit tightly together, ensuring the contact strength between the PCB board and the chip. Even if the PCB board and the upper cover are not fixed stably, the PCB board and the chip can still be in close contact, thereby ensuring that the chip can be tested more accurately. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Shown is a structural schematic diagram of a chip detection fixing module disclosed in an embodiment of the present utility model.

[0021] Figure 2 Shown is a partial exploded schematic diagram of a chip detection fixing module disclosed in an embodiment of the present utility model.

[0022] Description of the technical feature numbers in the accompanying drawings:

[0023] 1. Support base; 2. Mounting base; 3. Lower shell; 4. Upper cover; 5. Connection contacts; 6. PCB board; 7. Clamping assembly; 8. Rotating frame; 9. Swivel; 10. Buckle; 11. Positioning slot; 12. Bottom plate; 13. Vertical support plate. DETAILED DESCRIPTION

[0024] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand the other advantages and functions of the present invention from the contents disclosed in this specification. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless there is a conflict.

[0025] See also Figure 1 The present invention provides a chip detection fixed module, comprising:

[0026] The support base 1 includes a base plate 12 and two vertical support plates 13 fixed to the upper surface of the base plate 12.

[0027] See also Figure 1 and Figure 2A mounting base 2 for mounting a chip is provided on the support base 1, and a positioning groove 11 for placing the mounting base 2 is provided on the upper surface of the base plate 12. The mounting base 2 includes a lower shell 3 and an upper cover 4 hinged to the lower shell 3. When installing, the lower shell 3 is placed in the positioning groove 11 to realize the positioning of the mounting base 2, thereby playing a role in rapid positioning and rapid assembly; a plurality of connecting contacts 5 are provided through the upper cover 4, and the connecting contacts 5 correspond one-to-one to the contacts of the chip to be tested. The upper cover 4 is provided with a plurality of mounting holes for fixing the PCB board 6. The PCB board 6 is fixed to the upper cover 4 by screws, and the connecting contacts 5 connect the chip and the PCB board 6 with electrical signals.

[0028] See also Figure 1 , and also includes a clamping component 7 arranged on the support base 1, which is used to apply pressure to the PCB board 6 directed toward the upper cover 4 to strengthen the contact strength between the PCB board 6 and the connection contact 5. The clamping component 7 includes: a rotating frame 8 of a vertical support frame hinged to the support base 1, and the rotating frame 8 is fastened to another vertical support frame by a buckle 10; a rotating ring 9 threadedly connected to the support base 1, and the rotating ring 9 moves along its axial direction when rotating, thereby squeezing the PCB board 6 after rotation and applying pressure to the PCB board 6.

[0029] See also Figure 1 An operating handle is fixed on the swivel 9. The operating handle is arranged in a rod shape, one end of which is fixed on the swivel 9. The length direction of the operating handle is arranged along the radial direction of the swivel 9. The operating handle is used to increase the rotation arm, thereby reducing the force required to rotate the swivel 9 and reducing physical exertion.

[0030] During testing, the present invention opens the mounting seat 2, places the chip in the mounting seat 2, and then closes the upper cover 4. At this time, the connection contacts 5 connect the PCB board 6 to the chip. Then, the rotating frame 8 is rotated and buckled, and the rotating frame 8 is buckled and fixed to the support seat 1 through the buckle 10. Then, the rotating ring 9 is rotated by the operating handle to displace the rotating ring 9 along its axial direction, thereby applying pressure to the PCB board 6 and pressing the PCB board 6 against the upper cover 4, thereby ensuring the contact strength between the PCB board 6 and the upper cover 4. Even if the PCB board 6 and the upper cover 4 are not fixed stably, it can ensure that the PCB board 6 is in close contact with the chip, thereby ensuring that the chip can be tested more accurately.

[0031] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any equivalent modifications or variations made by persons skilled in the art without departing from the spirit and technical concepts disclosed herein shall be encompassed by the claims of the present invention.

Claims

1. A chip detection fixed module, characterized in that: include: A support base (1), wherein a mounting base (2) for mounting a chip is provided on the support base (1), the mounting base (2) comprises a lower shell (3) and an upper cover (4) hinged to the lower shell (3), a plurality of connection contacts (5) are provided through the upper cover (4), a PCB (6) is fixed on the upper cover (4), and the connection contacts (5) are used to connect the chip and the PCB (6); and, A pressing component (7) is provided on the support seat (1) and is used to apply pressure directed toward the upper cover (4) to the PCB board (6) to strengthen the contact strength between the PCB board (6) and the connection contact (5).

2. The chip detection fixing module according to claim 1, characterized in that: The pressing assembly (7) comprises: a rotating frame (8) hinged to the support seat (1), the rotating frame (8) being fastened and fixed to the support seat (1) via a buckle (10); and a rotating ring (9) threadedly connected to the support seat (1), the rotating ring (9) applying pressure to the PCB board (6) when rotating.

3. The chip detection fixing module according to claim 2, characterized in that: An operating handle is fixed on the rotating ring (9).

4. The chip detection fixing module according to claim 1, characterized in that: A positioning groove (11) is provided on the support seat (1), and the mounting seat (2) is placed in the positioning groove (11) to achieve positioning of the mounting seat (2).

5. The chip detection fixing module according to claim 1, characterized in that: The upper cover (4) is provided with a plurality of mounting holes for fixing the PCB board (6), and the PCB board (6) is fixed to the upper cover (4) by screws.

Citation Information

Patent Citations

  • Jet flow micro-channel testing device for high-power-consumption chip

    CN118549794A