Computer host compact in structure and good in heat dissipation

By optimizing the layout of liquid-cooled connection pipes and cooling fans inside the computer host, the problem of messy water-cooled connection pipes is solved, and compact and efficient heat dissipation inside the host is achieved.

CN223205834UActive Publication Date: 2025-08-08SUZHOU GEOMETRIC FUTURE CREATIVE TECH CO LTD
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Patent Information

Application Number
CN202422558178.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-23
Publication Date
2025-08-08
Estimated Expiration
2034-10-23

AI Technical Summary

Technical Problem

The messy distribution of water-cooled connection pipes in existing computer hosts leads to confusion in the arrangement of the hosts. Multiple groups of water-cooled heat dissipation discharges cannot be connected in series with the circulating water circuit, affecting the heat dissipation efficiency.

Method used

Set up a liquid-cooling connection pipe between the liquid-cooled cooling head and the liquid-cooled cooling fan group inside the host to optimize the position and layout of the heat dissipation fan, including the connection between the liquid-cooled cooling fan group 2 and the liquid-cooled cooling fan group 1, and add a heat dissipation fan to improve the heat dissipation effect.

Benefits of technology

It realizes compact arrangement inside the host and improves heat dissipation effect, which is suitable for promotion and use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a computer host compact in structure and good in heat dissipation, and belongs to the technical field of computer heat dissipation. The computer host compact in structure and good in heat dissipation comprises a host body, a front side face, an upper side face and a right side face, a main board is fixed in the host body, a liquid cooling head is fixed to the position, corresponding to a CPU, of the main board, and a second liquid cooling heat dissipation row fan set is additionally arranged between the liquid cooling head and the first liquid cooling heat dissipation row fan set. The liquid cooling heat dissipation row fan group II not only shortens the length of the liquid cooling connecting pipe between the liquid cooling head and the liquid cooling heat dissipation row fan group I, so that the arrangement in the host is more compact, but also can improve the heat dissipation effect in the host. Meanwhile, the first cooling fan and the third cooling fan are arranged on the right side face of the host body, the second cooling fan is arranged on the lower side face of the host body, coordination work can be achieved, the cooling effect of the host is improved under the condition that the interior of the host is compact, and the host is suitable for application and popularization.
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Description

Technical Field

[0001] The utility model relates to a computer host with a compact structure and good heat dissipation, belonging to the technical field of computer heat dissipation. Background Art

[0002] There are two common methods for cooling personal computers: air cooling and water cooling. Air cooling uses fans installed within the computer chassis to create airflow and dissipate heat. Water cooling utilizes circulating water to rapidly dissipate heat from components. In typical water-cooled computer systems, the CPU is cooled by water. However, the liquid cooling pipes in the water-cooling accessories are inevitably cluttered and disorganized within the system, making it difficult to connect multiple radiators in series to circulate the water for improved cooling efficiency. Utility Model Content

[0003] In order to overcome the defects existing in the background technology, the technical solution adopted by the utility model to solve its technical problems is: a computer host with a compact structure and good heat dissipation, including a host body, a front side, an upper side and a right side, a motherboard is fixed inside the host body, and a liquid-cooled cold head is fixed on the motherboard corresponding to the CPU, the liquid-cooled cold head and the liquid-cooled heat dissipation fan group 2 are connected together by a liquid-cooling connecting pipe 2, the liquid-cooled heat dissipation fan group 2 and the liquid-cooled heat dissipation fan group 1 are connected together by a liquid-cooling connecting pipe 1, the liquid-cooled heat dissipation fan group 1 is fixed on the upper side inside the host body, and the liquid-cooled heat dissipation fan group 2 is fixed on the rear side inside the host body.

[0004] Preferably, at least two groups of cooling fans are provided in the liquid cooling heat dissipation fan group 1.

[0005] Preferably, at least one group of cooling fans is provided in the second liquid cooling cooling fan group.

[0006] Preferably, a power button is provided on the front side of the host body.

[0007] Preferably, support blocks are provided at both ends of the bottom of the lower side of the host body.

[0008] Preferably, a cooling fan 1 and a cooling fan 3 are provided on the right side of the host body.

[0009] Preferably, a first cooling fan and a second cooling fan are provided on the lower side of the host body.

[0010] The present invention designs a computer host with a compact structure and good heat dissipation. A mainboard is fixed inside the mainboard, and a liquid cooling head is fixed on the mainboard corresponding to the CPU. A second liquid cooling fan group is added between the liquid cooling head and the first liquid cooling fan group. The presence of the second liquid cooling fan group not only shortens the length of the liquid cooling connecting pipe between the liquid cooling head and the first liquid cooling fan group, making the arrangement inside the mainboard more compact, but also improves the heat dissipation effect inside the mainboard. At the same time, the right side of the mainboard is provided with a first cooling fan and a third cooling fan, and the lower side of the mainboard is provided with a second cooling fan, which can work in coordination, improving the heat dissipation effect of the mainboard while the internal structure of the mainboard is compact, and is suitable for popularization and use. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the structure of a computer host with a compact structure and good heat dissipation in the utility model;

[0013] Figure 2 This is a schematic diagram of the internal structure of a computer host with a compact structure and good heat dissipation. Figure 1 ;

[0014] Figure 3 This is a schematic diagram of the internal structure of a computer host with a compact structure and good heat dissipation. Figure 2 ;

[0015] Figure 4 This is a schematic diagram of the internal structure of a computer host with a compact structure and good heat dissipation. Figure 3 ;

[0016] Figure 5 This is a schematic diagram of the internal structure of a computer host with a compact structure and good heat dissipation. Figure 4 ;

[0017] Among them: 1: host body; 2: support block; 3: power button; 4: front side; 5: upper side; 6: right side; 7: rear side; 8: liquid cooling head; 9: liquid cooling fan group 1; 10: liquid cooling fan group 2; 11: liquid cooling connecting pipe 1; 12: liquid cooling connecting pipe 2; 13: cooling fan 1; 14: lower side; 15: cooling fan 2; 16: cooling fan 3; 17: motherboard. DETAILED DESCRIPTION

[0018] The present invention will now be described in further detail with reference to the accompanying drawings, which are simplified schematic diagrams that illustrate the basic structure of the present invention in a schematic manner, and thus only show components related to the present invention.

[0019] For specific embodiment 1, please refer to Figure 1-5 A computer host with a compact structure and good heat dissipation includes a host body 1, a front side 4, an upper side 5 and a right side 6. A motherboard 17 is fixed inside the host body 1. A liquid cooling head 8 is fixed on the motherboard 17 corresponding to the CPU. The liquid cooling head 8 is connected to the liquid cooling fan group 2 10 through a liquid cooling connecting pipe 2 12. The liquid cooling fan group 2 10 is connected to the liquid cooling fan group 1 9 through a liquid cooling connecting pipe 11. The liquid cooling fan group 1 9 is fixed on the upper side of the host body 1. On the surface 5, the liquid-cooled heat dissipation fan group 2 10 is fixed on the rear side 7 inside the host body 1, and at least two groups of heat dissipation fans are provided in the liquid-cooled heat dissipation fan group 1; at least one group of heat dissipation fans is provided in the liquid-cooled heat dissipation fan group 2; a power button 3 is provided on the front side 4 of the host body 1, and support blocks 2 are provided at both ends of the bottom of the lower side 14 of the host body 1. A heat dissipation fan 13 and a heat dissipation fan 3 16 are provided on the right side 6 of the host body 1, and a heat dissipation fan 13 and a heat dissipation fan 2 15 are provided on the lower side 14 of the host body 1.

[0020] The present invention designs a computer host with a compact structure and good heat dissipation. A motherboard 17 is fixed to the interior of the host body 1. A liquid-cooled cold head 8 is fixed to the motherboard 17 corresponding to the CPU. A second liquid-cooled heat dissipation fan group 10 is added between the liquid-cooled cold head 8 and the first liquid-cooled heat dissipation fan group 9. The presence of the second liquid-cooled heat dissipation fan group 10 not only shortens the length of the liquid-cooled connecting pipe between the liquid-cooled cold head 8 and the first liquid-cooled heat dissipation fan group 9, making the arrangement inside the host more compact, but also improves the heat dissipation effect inside the host. At the same time, a first heat dissipation fan 13 and a third heat dissipation fan 16 are provided on the right side 6 of the host body 1. A second heat dissipation fan 15 is provided on the lower side 14 of the host body 1. These fans can work in coordination, improving the heat dissipation effect of the host while maintaining a compact interior, making it suitable for widespread use.

[0021] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A computer host with a compact structure and good heat dissipation, comprising a host body (1), a front side (4), an upper side (5) and a right side (6), characterized in that: A motherboard (17) is fixed inside the host body (1), and a liquid cooling head (8) is fixed on the motherboard (17) corresponding to the CPU. The liquid cooling head (8) is connected to the second liquid cooling fan group (10) through a second liquid cooling connecting pipe (12), and the second liquid cooling fan group (10) is connected to the first liquid cooling fan group (9) through a first liquid cooling connecting pipe (11). The first liquid cooling fan group (9) is fixed on the upper side (5) inside the host body (1), and the second liquid cooling fan group (10) is fixed on the rear side (7) inside the host body (1).

2. A computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: At least two groups of cooling fans are provided in the liquid cooling heat dissipation fan group 1 (9).

3. The computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: At least one group of cooling fans is provided in the liquid cooling heat dissipation fan group 2 (10).

4. The computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: A power button (3) is provided on the front side (4) of the host body (1).

5. The computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: Support blocks (2) are provided at both ends of the bottom of the lower side surface (14) of the host body (1).

6. The computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: A cooling fan 1 (13) and a cooling fan 3 (16) are provided on the right side (6) of the host body (1).

7. The computer host with a compact structure and good heat dissipation according to claim 1, characterized in that: A first heat dissipation fan (13) and a second heat dissipation fan (15) are provided on the lower side (14) of the host body (1).