Semiconductor cleaning device and cleaning equipment

Abstract

The utility model provides a semiconductor cleaning device and cleaning equipment, and the cleaning device comprises a liquid inlet shaft assembly which is provided with a liquid inlet channel and comprises a liquid inlet shaft and a rotating shaft connected with the liquid inlet shaft in a sleeving manner, and the rotating shaft is configured to rotate relative to the liquid inlet shaft; the spraying assembly comprises at least two pipelines, and the at least two pipelines comprise a spraying pipe and an auxiliary pipe which are respectively communicated with the liquid inlet channel; the spraying pipe is configured to be provided with a plurality of spraying openings for spraying cleaning liquid to drive the spraying pipe to rotate relative to the liquid inlet shaft through counter-acting force, the spraying pipe rotates in a non-mechanical-driving mode, the cleaning effect of cleaning the semiconductor device through the cleaning liquid can be improved, and the cleaning device is simple in structure and low in cost; a spraying opening is further formed in the auxiliary pipe, so that under the condition that it is guaranteed that the whole cleaning device has enough counter-acting force to rotate, the coverage area of the cleaning liquid sprayed by the spraying assembly is guaranteed through the spraying opening and the spraying opening, and the cleaning effect on the semiconductor device is achieved.

Description

[0001] Explanation on claiming priority: This application claims priority based on the patent application filed in China on June 27, 2024 with application number 2024214864770 and patent name "A semiconductor cleaning device and cleaning equipment". Technical Field

[0002] The present application relates to the field of semiconductor cleaning processing technology, and in particular to a semiconductor cleaning device and cleaning equipment. Background Art

[0003] As the integration density of integrated circuits increases, semiconductor devices are placing higher demands on semiconductor process equipment. During the semiconductor process, semiconductors require extensive cleaning to ensure their cleanliness. Cleaning machines are often used to prevent particles from contaminating other components.

[0004] Currently, semiconductor device cleaning methods are primarily categorized into immersion cleaning and spray cleaning. During immersion cleaning, the cleaning liquid within the tank is filtered and recycled, only filtering out particulate matter from the liquid while remaining within the tank itself. This can lead to particles remaining in the corners and crevices of the tank, thus impacting the subsequent cleaning of semiconductor devices. Spray cleaning, on the other hand, involves spraying the cleaning liquid across the surface of the semiconductor device. The cleaned liquid is then filtered and treated to meet standards before being reused. This method, widely used, does not impact the subsequent cleaning of semiconductor devices.

[0005] However, during the actual cleaning process, it was found that when the spray device is driven to rotate by a driving mechanism, such as a combination of a motor, a cylinder and a transmission part, solid particles are generated by friction between the driving mechanism and the various components. These particles flow through the surface of the semiconductor device along with the cleaning liquid sprayed by the spray device, resulting in poor cleaning effect of the semiconductor device and even damage to the surface of the semiconductor device. In addition, the cleaning liquid splashes into the driving mechanism, resulting in a reduced service life of the driving mechanism and even corrosion of the driving mechanism, making it unusable. Utility Model Content

[0006] In view of this, the embodiments of the present application provide a method for solving at least one group of problems existing in the background technology.

[0007] A semiconductor cleaning device, comprising:

[0008] A liquid inlet shaft assembly having a liquid inlet channel, comprising a liquid inlet shaft and a rotating shaft sleeved with the liquid inlet shaft, wherein the rotating shaft is configured to rotate relative to the liquid inlet shaft;

[0009] The spray assembly includes at least two pipes, wherein the at least two pipes include a spray pipe and an auxiliary pipe respectively connected to the liquid inlet channel; the spray pipe has a connecting end and a closed end, the connecting end is connected to the liquid inlet channel, the spray pipe is linear, and each of the spray pipes is evenly spaced along its axis.

[0010] The spray pipe is configured with a plurality of spray ports to spray cleaning liquid so as to drive the spray pipe to rotate relative to the liquid inlet shaft by reaction force;

[0011] The auxiliary pipe is provided with a spray port, the cleaning liquid is sprayed from the spray port and diffused along a first preset angle of the spray port to have a first spray area, the cleaning liquid is sprayed from the spray port and extends along a second preset angle of the spray port to have a second spray area, the first preset angle is greater than the second preset angle, so that the first spray area is larger than the second spray area.

[0012] Optionally, in the above-mentioned semiconductor cleaning device, several of the injection nozzles are circular.

[0013] Optionally, in the semiconductor cleaning device, there is an angle between a center line perpendicular to the injection port and a horizontal plane, and the angle is 45 degrees.

[0014] Optionally, in the above-mentioned semiconductor cleaning device, the spray pipes are arranged in pairs, and each pair of the spray pipes are symmetrically arranged around the center of the liquid inlet axis.

[0015] Optionally, in the above-mentioned semiconductor cleaning device, the diameter of each injection port is in the range of 1.5-2.5 mm.

[0016] Optionally, in the above-mentioned semiconductor cleaning device, the spray pipe is integrally formed.

[0017] Optionally, in the above-mentioned semiconductor cleaning device, the auxiliary tubes are arranged in pairs, the paired auxiliary tubes are symmetrically arranged around the center of the liquid inlet axis, and the angles between any two adjacent tubes are equal.

[0018] Optionally, in the semiconductor cleaning device, each of the auxiliary tubes is provided with at least two spray ports;

[0019] The auxiliary pipe includes a straight pipe connected to the liquid inlet channel and a bent pipe connected to the straight pipe, and at least two spraying ports are respectively provided on the straight pipe and the bent pipe.

[0020] Optionally, the semiconductor cleaning device mentioned above further includes a locking member, which is configured to lock and fix the spray pipe and the rotating shaft or loosen the spray pipe and the rotating shaft so that the spray pipe can rotate relative to the liquid inlet shaft.

[0021] The present application also discloses a semiconductor cleaning device, comprising a cleaning chamber and a cleaning device, wherein the cleaning device is installed in the cleaning chamber;

[0022] Wherein, the cleaning device is any one of the semiconductor cleaning devices described above.

[0023] The beneficial effects of the present application are as follows: the present application provides a liquid inlet shaft having a liquid inlet channel, a rotating shaft sleeved with the liquid inlet shaft, and a spray pipe and an auxiliary pipe connected to the liquid inlet channel, wherein a plurality of spray ports are provided on the spray pipe, so that the spray pipe can rotate relative to the liquid inlet shaft under the reaction force generated by the spraying of cleaning liquid from the plurality of spray ports. The rotation of the spray pipe without mechanical drive can improve the cleaning effect of the cleaning liquid on the semiconductor device, and the cleaning device has a simple structure and low cost.

[0024] The auxiliary tube is further provided with a spray port, and the cleaning liquid is sprayed from the spray port and diffused along a first preset angle of the spray port to form a first spray area. The cleaning liquid is sprayed from the spray port and extends along a second preset angle of the spray port to form a second spray area. The first preset angle is greater than the second preset angle, so that the first spray area is larger than the second spray area. Thus, while ensuring that the entire cleaning device has sufficient reaction force to rotate, the spray port and the spray port can also ensure that the coverage area of the cleaning liquid sprayed by the spray assembly is achieved, thereby achieving a cleaning effect on the semiconductor device.

[0025] Furthermore, by setting the injection ports to be circular, the spray pipe can obtain a greater reaction force, thereby accelerating the rotation speed of the spray pipe, and thus achieving a better cleaning effect for the semiconductor device.

[0026] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other objects, features and advantages of the present invention will become more apparent through a more detailed description of exemplary embodiments of the present invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present invention.

[0028] Figure 1 This is a schematic structural diagram of a semiconductor cleaning device according to an embodiment of the present application;

[0029] Figure 2 A cross-sectional view of a semiconductor cleaning device according to an embodiment of the present application;

[0030] Figure 3 This is a schematic structural diagram of a semiconductor cleaning device according to an embodiment of the present application;

[0031] Figure 4 This is a cross-sectional view of a semiconductor cleaning device shown in an embodiment of the present application.

[0032] Reference numerals:

[0033] 100-cleaning equipment, 20-cleaning device, 30-loading port, 40-unloading port;

[0034] 1-liquid inlet shaft assembly, 11-liquid inlet channel, 12-liquid inlet shaft, 13-rotating shaft;

[0035] 2-spray assembly, 21-spray pipe, 211-connecting end, 212-closed end, 213-injection port, 22-auxiliary pipe, 221-spray port, 222-straight pipe, 223-elbow pipe. DETAILED DESCRIPTION

[0036] The exemplary embodiments disclosed in the present application will be described in more detail below. In the description below, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described; that is, all features of the actual embodiments are not described here, and well-known functions and structures are not described in detail.

[0037] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it can be directly on, adjacent to, connected to, or coupled to the other element or layer, or there can be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one group of elements, components, regions, layers, or parts from another group of elements, components, regions, layers, or parts. Therefore, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part. And when the second element, component, region, layer, or part is discussed, it does not necessarily mean that the first element, component, region, layer, or part is present in the present application.

[0038] Spatially relative terms such as "below," "beneath," "beneath," "beneath," "above," "upper," etc., may be used herein for convenience to describe the relationship of one set of elements or features to other elements or features shown in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientations shown in the figures.

[0039] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present application. When used herein, the singular forms "a", "a group of" and " / the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, identify the presence of features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] In order to fully understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0041] refer to Figure 3 and Figure 4 As shown, an embodiment of the present application provides a semiconductor cleaning device 20 suitable for cleaning semiconductor devices. The cleaning device 20 includes a liquid inlet shaft assembly 1 and a spray assembly 2. The liquid inlet shaft assembly 1 has a liquid inlet channel 11. One end of the liquid inlet channel 11 is connected to another cleaning liquid storage device, and the other end is connected to the spray assembly 2. The cleaning liquid stored in the cleaning liquid storage device is transferred to the liquid inlet channel 11, and then output to the semiconductor device through the spray assembly 2 for cleaning.

[0042] In this embodiment, the semiconductor device is a furnace tube. In other embodiments, the semiconductor device may also be a wafer box, a mask box or other semiconductor devices.

[0043] Specifically, the liquid inlet shaft assembly 1 includes a liquid inlet shaft 12 and a rotating shaft 13 sleeved with the liquid inlet shaft 12. The rotating shaft 13 is configured to rotate relative to the liquid inlet shaft 12. It can also be understood that the liquid inlet shaft 12 and the rotating shaft 13 are both hollow, and the two are connected to form the liquid inlet channel 11. The rotating shaft 13 can rotate relative to the liquid inlet shaft 12 under the action of an external force.

[0044] The spray assembly 2 includes at least two pipes. Among them, at least two pipes include a spray pipe 21 connected to the liquid inlet channel 11. The spray pipe 21 has a connecting end 211 and a closed end 212. The connecting end 211 is an open end for connecting to the liquid inlet channel 11. It should be noted that the spray pipes 21 are arranged in pairs, and each pair of spray pipes 21 are symmetrically arranged around the center of the liquid inlet axis 12 so that the cleaning device 20 is balanced. In this embodiment, a group of spray pipes 21 is provided. In other embodiments, the number of spray pipes 21 is not specifically limited and is determined according to actual conditions.

[0045] In an optional embodiment, the spray pipe 21 is arranged in a straight line, and each spray pipe 21 is provided with a plurality of injection ports 213 spaced apart along its axial direction; the spray pipe 21 is configured so that the plurality of injection ports 213 spray cleaning liquid to drive the spray pipe 21 to rotate relative to the liquid inlet shaft 12 by reaction force, so as to improve the cleaning effect on the semiconductor device.

[0046] In an optional embodiment, the plurality of injection ports 213 provided on each spray pipe 21 can be arranged at even intervals or at uneven intervals. When the plurality of injection ports 213 are arranged at even intervals, the pressure fluctuation in the spray pipe 21 is relatively small, which helps to maintain the stable operation of the entire cleaning device; when the plurality of injection ports 213 are arranged at uneven intervals, since the torque on the side close to the connection end is small, while the torque on the side close to the closed end is large, in this embodiment, the distance between two adjacent injection ports 213 gradually decreases from the connection end to the closed end, and the distance between each two adjacent injection ports 213 can be unequal. By arranging the injection ports 213 more densely near the closed end, the problem of slow rotation speed caused by large torque can be offset, thereby ensuring that the reaction force on the entire spray pipe 21 is uniform and consistent, achieving better results.

[0047] In this embodiment, several injection ports 213 are configured in a circular shape. By configuring the injection ports 213 in a circular shape, the circular injection ports 213 have a uniform circular opening, and the cleaning liquid is uniformly sprayed in all directions from the center point of the circular opening. Because the injection ports 213 are uniformly circular, the cleaning liquid has the same velocity variation in all directions. This means that the velocity variation of the cleaning liquid is relatively uniform, and momentum variations are generated in all directions, resulting in a larger total reaction force. This in turn ensures that the spray pipe 21 can rotate while achieving a certain rotational speed, thereby improving the cleaning effect on semiconductor devices.

[0048] Under the same conditions, if the nozzle 213 is set to other shapes, for example, the nozzle 213 is fan-shaped or conical, or the cleaning liquid ejected from the nozzle 213 is similar to a fan or cone, the cleaning liquid will be ejected from the narrower end to the wider end. Due to the shape of the nozzle 213, the speed of the cleaning liquid in the fan-shaped or conical nozzle 213 changes significantly. The speed of the cleaning liquid in the fan-shaped or conical nozzle 213 will gradually increase, but its speed changes at different positions are different. Normally, the speed of the cleaning liquid at the wider end of the fan-shaped or conical nozzle 213 is higher, and the speed at the narrower end is lower. This means that the speed of the sprayed cleaning liquid changes unevenly, and the momentum changes at different positions may offset each other, resulting in a smaller total reaction force, resulting in a situation where the cleaning liquid ejected from the fan-shaped or conical nozzle 213 is unable to drive the spray pipe 21 to rotate due to insufficient power, or the spray pipe 21 rotates slowly.

[0049] In an alternative embodiment, an angle is formed between the centerline perpendicular to the nozzle 213 and the horizontal plane. In this embodiment, the angle is 45 degrees to achieve a rotational speed that is more consistent with the operation of the cleaning apparatus 20 and the cleaning effect on the semiconductor devices. Of course, in other embodiments, the orientation of the circular nozzle 213 can be adjusted according to actual conditions.

[0050] The adjustment method can be: when processing the spray pipe 21, the opening angle of the injection port 213 is directly changed to make the adjustment. It can also be: locking or releasing the spray pipe 21 and the rotating shaft 13 by a locking member. Specifically, the locking member is configured to be able to lock and fix the spray pipe 21 and the rotating shaft 13 or release the spray pipe 21 and the rotating shaft 13 so that the spray pipe 21 can rotate relative to the liquid inlet shaft 12. When it is necessary to adjust the angle of the injection port 213, the locking member is released, and after the spray pipe 21 is rotated to the target angle relative to the rotating shaft 13, a force is applied to the locking member to fix the spray pipe 21 and the rotating shaft 13.

[0051] In an optional embodiment, the diameter of each circular injection port 213 ranges from 1.5 mm to 2.5 mm.

[0052] In an optional embodiment, each spray pipe 21 is integrally formed, which can eliminate connection points and seams, thereby improving the strength and rigidity of the overall structure and ensuring the sealing of the spray pipe 21, preventing the pressure generated by the cleaning liquid in the spray pipe 21 from leaking from the seams, resulting in low pressure of the cleaning liquid ejected from the injection port 213, low kinetic energy and failure to achieve a good cleaning effect; and the one-piece molded spray pipe 21 is relatively simple in processing technology, and the continuity and uniformity of the overall structure contribute to the long life and durability of the spray pipe 21.

[0053] In an optional embodiment, at least two pipes further include an auxiliary pipe 22 connected to the liquid inlet channel. Auxiliary pipes 22 are provided with spray ports 221. Cleaning liquid is ejected from spray ports 221 and diffuses along a first predetermined angle of the spray ports 221 to form a first spray area. Cleaning liquid is ejected from the spray ports and extends along a second predetermined angle of the spray ports to form a second spray area. The first predetermined angle is greater than the second predetermined angle, such that the first spray area is larger than the second spray area. Alternatively, the cleaning liquid ejected from circular spray ports 213 forms a linear pattern, while the cleaning liquid ejected from spray ports 221 forms a fan-shaped pattern. Furthermore, in this embodiment, the liquid ejected from spray ports 221 is directed downward. This arrangement allows spray ports 221 to provide a larger cleaning area, compensating for the problem of cleaning liquid ejected from spray ports 213 not being able to fully clean the semiconductor devices. This achieves both rapid rotation of the cleaning apparatus 20 and satisfactory cleaning of the semiconductor devices. In this embodiment, each set of auxiliary pipes 22 includes two separate auxiliary pipes 22, symmetrically arranged along the liquid inlet channel 11. In other embodiments, the number and position of the auxiliary tubes 22 are not limited.

[0054] In an optional embodiment, each auxiliary tube 22 is provided with at least two spray ports 221. The auxiliary tube 22 includes a straight tube 222 connected to the liquid inlet channel 11 and a curved tube 223 connected thereto. The two spray ports 221 are provided on the straight tube 222 and the curved tube 223, respectively, to ensure that the cleaning liquid can clean a circular area centered on the liquid inlet channel 11 and with the length of a group of auxiliary tubes 22 as a radius. It should be noted that in this embodiment, the cleaning device 20 also includes several wide-angle nozzles, each having a nozzle that serves as the aforementioned spray port 221. In other embodiments, other types of spray ports 221 may also be provided.

[0055] The present application also provides a semiconductor cleaning device 100, referring to Figure 1-Figure 3 As shown, the semiconductor cleaning equipment 100 includes but is not limited to cleaning, drying and other processes for semiconductor devices.

[0056] In an optional embodiment, the semiconductor cleaning equipment 100 includes a cleaning chamber and a cleaning device 20, wherein the cleaning device 20 is installed in the cleaning chamber to clean the semiconductor devices in the cleaning chamber.

[0057] In an optional embodiment, semiconductor cleaning equipment 100 includes a loading port 30, a cleaning unit, and a discharge port 40. The loading port 30 is used to load semiconductor devices to be cleaned into the cleaning unit. The cleaning unit can clean the semiconductor devices, and the cleaned semiconductor devices are discharged from the discharge port 40. It should be noted that in this embodiment, the loading port 30 and the discharge port 40 are the same to simplify the structure and reduce the footprint of the cleaning equipment.

[0058] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations of the claims. Various modifications and variations may be made to the above embodiments without departing from the scope of the present disclosure. Similarly, the various technical features of the above embodiments may be arbitrarily combined to form additional embodiments of the present application that may not be explicitly described. Therefore, the above embodiments merely illustrate several implementations of the present application and do not limit the scope of protection of the patent application.

Claims

1. A semiconductor cleaning device, characterized in that: include: A liquid inlet shaft assembly having a liquid inlet channel, comprising a liquid inlet shaft and a rotating shaft sleeved with the liquid inlet shaft, wherein the rotating shaft is configured to rotate relative to the liquid inlet shaft; The spray assembly includes at least two pipes, wherein the at least two pipes include a spray pipe and an auxiliary pipe respectively connected to the liquid inlet channel; the spray pipe has a connecting end and a closed end, the connecting end is connected to the liquid inlet channel, the spray pipe is linear, and each of the spray pipes is provided with a plurality of injection ports spaced apart along its axis; The spray pipe is configured with a plurality of spray ports to spray cleaning liquid so as to drive the spray pipe to rotate relative to the liquid inlet shaft by reaction force; The auxiliary pipe is provided with a spray port, the cleaning liquid is sprayed from the spray port and diffused along a first preset angle of the spray port to have a first spray area, the cleaning liquid is sprayed from the spray port and extends along a second preset angle of the spray port to have a second spray area, the first preset angle is greater than the second preset angle, so that the first spray area is larger than the second spray area.

2. The semiconductor cleaning device according to claim 1, wherein: The plurality of injection ports are all circular.

3. The semiconductor cleaning device according to claim 1, wherein: There is an angle between a center line perpendicular to the injection port and a horizontal plane, and the angle is 45 degrees.

4. The semiconductor cleaning device according to claim 1, wherein: The spray pipes are arranged in pairs, and each pair of the spray pipes is symmetrically arranged around the center of the liquid inlet axis.

5. The semiconductor cleaning device according to claim 1, wherein: The diameter of each injection port is in the range of 1.5-2.5 mm.

6. The semiconductor cleaning device according to claim 1, wherein: The spray pipe is integrally formed.

7. The semiconductor cleaning device according to claim 1, wherein: The auxiliary pipes are arranged in pairs, and the paired auxiliary pipes are symmetrically arranged around the center of the liquid inlet axis, and the angles between any two adjacent pipes are equal.

8. The semiconductor cleaning device according to claim 7, wherein: Each of the auxiliary pipes is provided with at least two spraying ports; The auxiliary pipe includes a straight pipe connected to the liquid inlet channel and a bent pipe connected to the straight pipe, and at least two spraying ports are respectively provided on the straight pipe and the bent pipe.

9. The semiconductor cleaning device according to claim 1, wherein: The cleaning device further includes a locking member, which is configured to lock and fix the spray pipe and the rotating shaft or loosen the spray pipe and the rotating shaft so that the spray pipe can rotate relative to the liquid inlet shaft.

10. A semiconductor cleaning device, characterized in that: It comprises a cleaning chamber and a cleaning device, wherein the cleaning device is installed in the cleaning chamber; Wherein, the cleaning device is a semiconductor cleaning device according to any one of claims 1-9.

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