Wafer positioning device and film sticking machine

Abstract

The utility model provides a wafer positioning device and a film sticking machine. The wafer positioning device comprises a wafer table tray and a positioning mechanism, the wafer table tray is provided with a station matched with the single-cut wafer in shape; the positioning mechanism comprises a first positioning pin, a second positioning pin, a third positioning pin and a driving component of the first positioning pin, the second positioning pin, the third positioning pin and the driving component, the first positioning pin and the second positioning pin are located at the edging position of the station, and the third positioning pin is located at the arc edge of the station. The linear distance between the first positioning pin and the second positioning pin is smaller than the edging length of the single-cut wafer, and the linear distance between the third positioning pin and the first positioning pin and the linear distance between the third positioning pin and the second positioning pin are both larger than the edging length of the single-cut wafer. The first positioning pin, the second positioning pin and the third positioning pin can be driven to do self-rotation motion in the same direction; the problem that the surface cleanliness of the wafer is affected due to the fact that hands contact the front face of the wafer can be avoided, and quality and performance are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer positioning device and a film laminating machine. Background Art

[0002] Wafers are the fundamental materials for the production of a variety of semiconductor products, including integrated circuits, optoelectronic components, and sensors. Primarily made of semiconductor materials such as silicon (Si), gallium arsenide (GaAs), and silicon carbide (SiC), they are widely used in fields such as information communications, computers, consumer electronics, automotive electronics, and industrial control. With the development of emerging technologies such as the Internet of Things, artificial intelligence, and 5G communications, the demand for high-performance, low-power semiconductor products is growing, driving the continuous advancement of wafer manufacturing technology.

[0003] In the current wafer production process, in order to prevent the wafer from being contaminated or scratched during processing and transportation, to ensure the integrity and cleanliness of the wafer, thereby ensuring the quality and performance of the final semiconductor product and improving the product yield and reliability, a protective film is generally applied to the wafer surface (in this utility model, the front or back of the wafer) according to the requirements of different manufacturing processes during the wafer production process. This not only protects the semiconductor structure that has been manufactured on the film surface during the processing and manufacturing of the other side of the wafer, but also prevents the wafer from being contaminated or scratched during subsequent transportation. The specific film application steps are as follows: (1) Wafer positioning: Place the wafer on a dedicated tray or platform to ensure that it is positioned correctly and stably; (2) Film processing: Apply a protective film to the wafer surface; (3) Cutting excess film: Cut off excess film material.

[0004] In the prior art, wafer positioning in the above-mentioned film laminating operation steps is generally completed manually, that is, after placing the wafer on a dedicated tray or platform, the wafer is manually moved to adjust its position on the tray or platform so that it is placed on the set film laminating station, and then the subsequent film laminating process and cutting of the residual material are carried out. This method of relying on manual movement of the wafer to complete wafer positioning mainly has the following three problems: (1) During the manual movement operation, the human hand will inevitably touch the wafer surface. At this time, the wafer surface is not yet protected by the film, so it is easy to contaminate the wafer surface pattern, thereby affecting the cleanliness of the wafer surface, resulting in a decrease in the yield rate and affecting the quality and performance of the product; (2) Manual positioning is time-consuming, affecting product production efficiency, and increasing labor costs; (3) The manual positioning method relies heavily on the operator's technical level and judgment ability, and the positioning effect cannot be guaranteed, which is not conducive to the quality consistency control of the product. Utility Model Content

[0005] The utility model provides a wafer positioning device that can realize the automatic positioning of single-cut wafers, improve production efficiency, enhance product quality, and reduce production costs. The specific technical solution is as follows:

[0006] A wafer positioning device is used for positioning a single-cut wafer, wherein the edge of the single-cut wafer consists of an aligned edge and an arc edge, and comprises a wafer table and a positioning mechanism; the wafer table is provided with a work station adapted to the shape of the single-cut wafer; the positioning mechanism comprises a first positioning pin, a second positioning pin, a third positioning pin and a driving component thereof, the first positioning pin and the second positioning pin are located at the aligned edge of the work station, the third positioning pin is located at the arc edge of the work station, and the straight-line distance between the first positioning pin and the second positioning pin is less than the aligned edge length of the single-cut wafer, and the straight-line distance between the third positioning pin and the first positioning pin and the second positioning pin is greater than the aligned edge length of the single-cut wafer; the driving component comprises a rotating driving component, which can drive the first positioning pin, the second positioning pin and the third positioning pin to self-rotate in the same direction.

[0007] Furthermore, the driving component also includes a lifting driving component, and the lifting driving component can drive the first positioning pin, the second positioning pin, and the third positioning pin to move up and down.

[0008] Furthermore, the driving component further includes a transverse driving component, and the transverse driving component can drive the first positioning pin, the second positioning pin, and the third positioning pin to move transversely on the wafer table.

[0009] Furthermore, the first positioning pin, the second positioning pin and the third positioning pin are cylinders made of stainless steel.

[0010] Furthermore, it also includes a wafer pushing jig; the wafer pushing jig can contact the arc edge side of the single-cut wafer and push the single-cut wafer to move.

[0011] Furthermore, the pushing head of the wafer pushing fixture is provided with an arc surface adapted to the arc edge side surface of the single-cut wafer.

[0012] Furthermore, a vacuum adsorption component is provided below the working position of the wafer table.

[0013] The wafer positioning device provided by the present invention can realize the automatic positioning of the single-cut wafer through the mutual cooperation between the wafer table, the first positioning pin, the second positioning pin, the third positioning pin and the rotating drive component, without the need for manual movement operation for positioning, and has the following beneficial effects: (1) It can avoid the problem of contamination of the wafer surface pattern due to human hand contact with the wafer surface, which affects the cleanliness of the wafer surface, and can improve the product yield, improve the quality and performance of the product; (2) Automatic positioning can shorten the positioning time, thereby improving the production efficiency of the wafer and reducing labor costs; (3) The automatic positioning effect is better, which is conducive to the quality consistency control of the product.

[0014] Furthermore, by setting the lifting drive component to drive the first positioning pin, the second positioning pin, and the third positioning pin to move up and down on the wafer table, the interference of the positioning pins can be avoided, and subsequent processing operations can be more convenient, thereby further improving the reliability of the wafer positioning device; by setting the transverse movement drive component to drive the first positioning pin, the second positioning pin, and the third positioning pin to move laterally on the wafer table, the size and shape of the workstation on the wafer table can be adjusted according to actual needs, and the positioning requirements of single-cut wafers of more different specifications can be adapted, thereby improving the versatility of the wafer positioning device.

[0015] Furthermore, by setting up a sheet pushing jig, and the pushing head of the sheet pushing jig is provided with an arc surface adapted to the arc side surface of the single-cut wafer, the sheet pushing jig can contact the arc side surface of the single-cut wafer and push it to move, and play an auxiliary positioning role during the rotation movement of the single-cut wafer, which can further avoid human hands from touching the front side of the wafer, further improve product yield, improve product quality and performance, and also improve positioning efficiency and positioning effect.

[0016] Furthermore, by setting up a vacuum adsorption component to suck the single-cut wafer tightly onto the work station of the wafer table, when the positioning mechanism completes the positioning of the single-cut wafer, starting the vacuum adsorption component can prevent the single-cut wafer from shifting in position during subsequent processing and affecting the processing quality, thereby improving the positioning effect and improving the product processing quality.

[0017] The utility model also provides a wafer laminating machine that can realize automatic positioning and laminating of single-cut wafers, thereby improving production efficiency, enhancing product quality, and reducing production costs. The specific technical solution is as follows:

[0018] A wafer laminating machine is used for laminating single-cut wafers, comprising a film conveying device, a roller device and a wafer positioning device described above; the film conveying device can be used to convey a protective film to a laminating station, and the roller device can move laterally in accordance with the surface of the single-cut wafer to cover the protective film on the surface of the single-cut wafer.

[0019] Furthermore, it also includes a cutting device, which includes a cross-cutting knife and a circular cutting knife; the cross-cutting knife can cut the protective film horizontally, and the circular cutting knife can rotate and cut the protective film along the arc edge of the single-cut wafer.

[0020] Furthermore, it also includes a control panel, on which switch buttons for controlling the wafer positioning device, the film conveying device, and the roller device are provided.

[0021] The wafer positioning device and film laminating machine provided by the utility model can complete the automatic positioning and film laminating processing of the single-cut wafer through the mutual cooperation between the wafer positioning device, film conveying device, roller device and cutting device, thereby improving the film laminating efficiency of the single-cut wafer, while improving the product yield and improving the quality and performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 Schematic diagram of single-cut wafer structure.

[0023] Figure 2 Schematic diagram of the wafer positioning device structure.

[0024] Figure 3 Schematic diagram of the working status of the wafer positioning device Figure 1 .

[0025] Figure 4 Schematic diagram of the working status of the wafer positioning device Figure 2 .

[0026] Figure 5 This is a schematic diagram of the wafer lamination machine structure.

[0027] The figures are marked as follows: 1 is a single-cut wafer, 11 is an aligned edge, 12 is an arc edge, 2 is a wafer table, 3 is a positioning mechanism, 31 is a first positioning pin, 32 is a second positioning pin, 32 is a third positioning pin, 4 is a film pushing fixture, 5 is a film conveying device, 6 is a roller device, 7 is a cutting device, 71 is a cross-cutting knife, 72 is a circular cutting knife, and 8 is a control panel. DETAILED DESCRIPTION

[0028] The following further describes the specific embodiments of the present invention in conjunction with the accompanying drawings. For ease of description, the terms "front," "back," "front," "backward," "left," "right," "top," "bottom," "up," "down," "inside," "outside," and "inner" used in the present invention to indicate positions or locations are based on the positions or locations shown in the accompanying drawings. These terms are intended solely to facilitate description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention or the actual orientation of the product or device during production, use, or sale. Furthermore, the terms "first," "second," and "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features referred to. Furthermore, in the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "disposed," "connected," "fixed," and "composed" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integration; they can refer to direct connections or indirect connections through an intermediary. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0029] The utility model provides a wafer positioning device, which can be used for positioning a single-cut wafer 1, such as Figure 1 As shown, the single-cut wafer 1 is generally circular in shape, and has an obvious flush cut on the edge. Therefore, the edge of the single-cut wafer 1 consists of a flush edge 11 and an arc edge 12. Of course, it can also be used in the positioning of other similar products, and there is no limitation here.

[0030] like Figure 2 As shown, the wafer positioning device includes a wafer table 2 and a positioning mechanism 3; the wafer table 2 can be used to support the single-cut wafer 1 to be film-mounted, and the wafer table 2 is also provided with a station ( Figure 2The dotted line portion) indicates that the workstation is the same as the single-cut wafer 1, having the same aligned edges and arc edges; the positioning mechanism 3 is arranged on the wafer table 2, and the positioning mechanism 3 includes a first positioning pin 31, a second positioning pin 32, a third positioning pin 33 and a driving component thereof, the driving component includes a rotation driving component, the rotation driving component can drive the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to rotate in the same direction (such as all rotating clockwise or all rotating counterclockwise); wherein, the first positioning pin 31 and the second positioning pin 32 are located at The third positioning pin 33 is located at the arc edge of the work station, and the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 satisfy the following positional relationship: (1) the straight-line distance between the first positioning pin 31 and the second positioning pin 32 is slightly less than the length of the straight-line edge 11 of the single-cut wafer 1; (2) the straight-line distance between the third positioning pin 33 and the first positioning pin 31 is greater than the length of the straight-line edge 11 of the single-cut wafer 1; (3) the straight-line distance between the third positioning pin 33 and the second positioning pin 32 is also greater than the length of the straight-line edge 11 of the single-cut wafer 1.

[0031] When the single-cut wafer 1 needs to be processed, such as during film lamination, the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 are driven by the rotation drive component to rotate in the same direction, and then the single-cut wafer 1 is placed on the wafer table 2. Figure 3 As shown, when the side of the arc edge 12 of the single-cut wafer 1 contacts the positioning pins in the positioning mechanism 3 (as described in this embodiment, the arc edge 12 of the single-cut wafer 1 contacts the first positioning pin 31 and the third positioning pin 33), the self-rotating movement of the positioning pins in the positioning mechanism 3 will drive the single-cut wafer 1 to rotate together until the aligned edge 11 of the single-cut wafer 1 reaches the aligned edge of the work station, as shown. Figure 4 As shown, the edge 11 of the single-cut wafer 1 will be stuck by the first positioning pin 31 and the second positioning pin 32 located at the edge of the work station, thereby stopping the continued rotation movement, thereby realizing the positioning of the single-cut wafer 1. At this time, the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 stop the self-rotation movement.

[0032] The wafer positioning device with the above structure can realize automatic positioning of the single-kerf wafer 1 through the mutual cooperation between the wafer table 2, the first positioning pin 31, the second positioning pin 32, the third positioning pin 33 and the rotation drive component, without the need for manual movement operation for positioning, and has the following beneficial effects:

[0033] (1) It can avoid the problem of contamination of wafer surface patterns caused by human hand contact, which affects the cleanliness of the wafer surface, and can improve product yield, quality and performance of the product; (2) Automatic positioning can shorten the positioning time, thereby improving wafer production efficiency and reducing labor costs; (3) Automatic positioning has better effect, which is conducive to product quality consistency control.

[0034] In some embodiments, the driving component also includes a lifting driving component, and the lifting driving component can be a driving component such as a motor, which is not limited here; the lifting driving component can drive the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to move up and down on the wafer table 2, thereby driving the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to be lowered to below the upper surface of the wafer table 2, or raised to above the upper surface of the wafer table 2, so that they can contact the side of the single-cut wafer 1.

[0035] The wafer positioning device adopts the above structure, and by setting the lifting drive component to drive the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to move up and down on the wafer table 2, the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 can be lowered to below the upper surface of the single-cut wafer 1 or below the upper surface of the wafer table 2 when there is no need to position the wafer or the wafer has been completed, thereby avoiding the interference of the positioning pins, making subsequent processing operations more convenient, and further improving the reliability of the wafer positioning device.

[0036] In some embodiments, the driving component also includes a transverse driving component, which can drive the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to move laterally on the wafer table 2, that is, to move forward and backward or left and right, thereby changing the position of the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 on the wafer table 2.

[0037] The wafer positioning device adopts the above structure, by setting the transverse driving component to drive the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 to move laterally on the wafer table 2, so that the positions of the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 can be moved according to the diameter size, the length of the edge 11, etc. of the single-cut wafer 1, so that the size and shape of the work station on the wafer table 2 can be adjusted according to actual needs, and it can adapt to the positioning requirements of the single-cut wafer 1 of more different specifications, thereby improving the versatility of the wafer positioning device.

[0038] In some embodiments, the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 are cylinders made of stainless steel. The stainless steel material has moderate hardness and good durability, which can improve the service life of the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33, thereby improving the reliability of the wafer positioning device.

[0039] In some embodiments, the wafer positioning device also includes a wafer pushing jig 4; the wafer pushing jig can contact the side of the arc edge 12 of the single-cut wafer 1 and push the single-cut wafer 1 to move, and can be used to move the single-cut wafer 1, and play an auxiliary positioning role when the first positioning pin 31, the second positioning pin 32, and the third positioning pin 33 position the single-cut wafer 1; the wafer pushing jig 4 can be pushed manually or automatically pushed by a driving component.

[0040] The wafer positioning device with the above structure, through the setting of the pusher jig 4, when the single-cut wafer 1 is placed on the wafer table 2, if the single-cut wafer 1 cannot be placed at one time at a position where the side of its arc edge 12 can contact the positioning pin in the positioning mechanism 3, the pusher jig 4 can contact the side of the arc edge 12 of the single-cut wafer 1 and push the single-cut wafer 1 to move, and push the single-cut wafer 1 to a position where the side of its arc edge can contact the positioning pin in the positioning mechanism 3 (i.e., Figure 3 ), and plays an auxiliary positioning role during the rotation of the single-cut wafer 1, preventing the single-cut wafer 1 from deviating, thereby further avoiding the problem of contamination of the wafer front pattern due to human hand contact with the wafer front, affecting the cleanliness of the wafer surface, and improving the product yield, product quality and performance, and also improving the positioning efficiency and positioning effect.

[0041] In some embodiments, as Figure 2 The pushing head of the pushing jig 4 is provided with an arc surface adapted to the side of the arc edge 12 of the single-cut wafer 1, that is, the arc surface on the pushing head is consistent with the radius and height of the side of the arc edge 12 of the single-cut wafer 1, so that it can fit the side of the arc edge 12 of the single-cut wafer 1.

[0042] In the wafer positioning device adopting the above structure, the push head is the key component on the pushing jig 4, which is responsible for directly contacting and pushing the wafer. Therefore, by setting an arc surface on the pushing head that is adapted to the side of the arc edge 12 of the single-cut wafer 1, the pushing jig 4 and the single-cut wafer 1 can be better fitted when pushing the single-cut wafer 1, thereby improving the reliability of the wafer positioning device.

[0043] In some embodiments, a vacuum adsorption component (not shown in the figure) is provided below the working position of the wafer table 2 , and the vacuum adsorption component can suck the single-cut wafer 1 tightly onto the working position of the wafer table 2 .

[0044] The wafer positioning device using the above structure sucks the single-cut wafer 1 tightly onto the work station of the wafer table 2 by setting the vacuum adsorption component. After the positioning mechanism 3 completes the positioning of the single-cut wafer 1, starting the vacuum adsorption component can prevent the single-cut wafer 1 from shifting in position during subsequent processing and affecting the processing quality. Therefore, the positioning effect can be improved and the product processing quality can be improved.

[0045] The present invention also provides a wafer laminating machine that can be used for laminating a single-cut wafer 1. Specifically, Figure 5 As shown, the wafer laminating machine includes a film conveying device 5, a roller device 6 and any one of the wafer positioning devices described above; wherein, a laminating station adapted to the shape of the single-cut wafer 1 is provided on the wafer table 2 of the wafer positioning device, and the film conveying device 5 can be used to convey the protective film to the laminating station, and the roller device 6 can move laterally in accordance with the surface of the single-cut wafer 1, thereby covering the protective film on the surface of the single-cut wafer 1 to complete the laminating of the single-cut wafer 1.

[0046] The wafer laminating machine adopting the above structure can complete the automatic positioning and laminating processing of the single-cut wafer 1 through the mutual cooperation between the wafer positioning device, the film conveying device 5 and the roller device 6, thereby improving the laminating efficiency of the single-cut wafer 1, while improving the product yield and improving the quality and performance of the product.

[0047] In some embodiments, the wafer laminating machine further includes a cutting device 7, which includes a transverse cutting knife 71 and a circular cutting knife 72; wherein, the transverse cutting knife 71 can cut the protective film transversely, and the circular cutting knife 72 can rotate, thereby cutting the protective film along the arc edge 12 of the single-cut wafer 1.

[0048] The wafer laminating machine adopting the above structure can cut off the excess film material after the laminating operation of the single-cut wafer 1 is completed through the mutual cooperation between the cross-cutting knife 71 and the circular cutting knife 72. Compared with manual cutting, it can improve production efficiency and product quality.

[0049] In some embodiments, the wafer laminating machine also includes a control panel 8 (in this embodiment, the control panel 8 is arranged in front of the wafer laminating machine, and can also be arranged at other positions of the wafer laminating machine in actual application), and the control panel is provided with switch buttons that can control the wafer positioning device, the film conveying device 5, and the roller device 6, so that the wafer laminating machine can be operated more conveniently and quickly, thereby improving the convenience of operation.

[0050] The above embodiments are merely preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Any equivalent changes based on the shape, structure and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer positioning device for positioning a single-cut wafer (1), wherein the edge of the single-cut wafer (1) consists of a flush edge (11) and an arc edge (12), characterized in that: The invention comprises a wafer table (2) and a positioning mechanism (3); a workstation adapted to the shape of the single-cut wafer (1) is provided on the wafer table (2); the positioning mechanism (3) comprises a first positioning pin (31), a second positioning pin (32), a third positioning pin (33) and a driving component thereof, wherein the first positioning pin (31) and the second positioning pin (32) are located at the flush edge of the workstation, the third positioning pin (33) is located at the arc edge of the workstation, and a straight-line distance between the first positioning pin (31) and the second positioning pin (32) is less than the flush edge (11) length of the single-cut wafer (1), and a straight-line distance between the third positioning pin (33) and the first positioning pin (31) and the second positioning pin (32) is greater than the flush edge (11) length of the single-cut wafer (1); the driving component comprises a rotation driving component, which can drive the first positioning pin (31), the second positioning pin (32) and the third positioning pin (33) to self-rotate in the same direction.

2. The wafer positioning device according to claim 1, characterized in that: The driving component further comprises a lifting driving component, and the lifting driving component can drive the first positioning pin (31), the second positioning pin (32), and the third positioning pin (33) to move upward and downward.

3. The wafer positioning device according to claim 1, wherein: The driving component further includes a transverse driving component, which can drive the first positioning pin (31), the second positioning pin (32), and the third positioning pin (33) to move transversely on the wafer table (2).

4. The wafer positioning device according to claim 1, wherein: The first positioning pin (31), the second positioning pin (32), and the third positioning pin (33) are cylinders made of stainless steel.

5. The wafer positioning device according to any one of claims 1 to 4, characterized in that: It also includes a wafer pushing jig (4); the wafer pushing jig can contact the side of the arc edge (12) of the single-cut wafer (1) and push the single-cut wafer (1) to move.

6. The wafer positioning device according to claim 5, characterized in that: The pushing head of the wafer pushing jig (4) is provided with an arc surface adapted to the side surface of the arc edge (12) of the single-cut wafer (1).

7. The wafer positioning device according to any one of claims 1 to 4, characterized in that: A vacuum adsorption component is provided below the working position of the wafer table (2).

8. A wafer laminating machine for laminating a single-cut wafer (1), characterized in that: It comprises a film conveying device (5), a roller device (6) and a wafer positioning device as described in any one of claims 1 to 7; the film conveying device (5) can be used to convey a protective film to a film laminating station, and the roller device (6) can move laterally in accordance with the surface of the single-cut wafer (1) to cover the protective film on the surface of the single-cut wafer (1).

9. The wafer mounting machine according to claim 8, characterized in that: The invention also includes a cutting device (7), wherein the cutting device (7) includes a transverse cutting knife (71) and a circular cutting knife (72); the transverse cutting knife (71) can cut the protective film transversely, and the circular cutting knife (72) can rotate and cut the protective film along the arc edge (12) of the single-cut wafer (1).

10. The wafer mounting machine according to claim 8, characterized in that: It also includes a control panel (8), on which switch buttons capable of controlling the wafer positioning device, the film conveying device (5), and the roller device (6) are provided.

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