Capacitive sound head device

Abstract

The utility model discloses a capacitive sound head device, which comprises a shell, a polar plate, a sound film and a PCB (Printed Circuit Board), the shell is provided with an accommodating cavity, and the upper surface of the shell is provided with a plurality of sound inlet holes; the polar plate is arranged in the accommodating cavity; the PCB is arranged in the containing cavity and located below the voice diaphragm, and the PCB is connected with the voice diaphragm and the polar plate. The middle part of the upper surface of the shell is concaved downwards to form the concave position, the central position of the concave position protrudes upwards to form the convex part, and the concave-convex structure in the middle of the shell disperses airflow transmission flow and reduces instantaneous impact force of high and strong sound signals on the diaphragm, and the sound diaphragm is arranged in the accommodating cavity and is positioned below the polar plate, so that the sound transmission efficiency is improved. During use, airflow generated by sound source signal action firstly passes through the holes in the polar plates and then acts on the surface of the voice diaphragm, the voice diaphragm can only move and extrude in the opposite direction of the polar plates, the distance between the two polar plates is only increased, and diaphragm flapping and even diaphragm sticking caused by instantaneous overload are avoided, so that the sound effect is ensured, and the phenomena of distortion, wheat spraying and the like are effectively prevented.

Description

Technical Field

[0001] The utility model relates to the field of sound heads, in particular to a capacitive sound head device. Background Art

[0002] The capacitive sound head is based on a structure composed of two parallel metal plates. The two metal plates and the gap between them form a capacitor. One electrode of the capacitive sound head is composed of a fixed metal plate, which is generally called the electrode plate. For the electret sound head, it is generally called the back electrode plate. The other is composed of a very thin non-metallic film with metal evaporated on the surface, which is generally also called a sound membrane or diaphragm. When the user is in use, the energy of the airflow formed by the received signal source will act on the sound membrane or diaphragm. Under the action of external force, the sound membrane or diaphragm will form displacement and deformation. At the same time as it displaces, the capacity of the capacitor between the two plates will change, and then generate an electrical signal output, thereby completing the sound-to-electricity conversion.

[0003] Because the diaphragm is composed of an extremely thin non-metallic film with a metal vapor-deposited on its surface, it is extremely sensitive to force, allowing it to pick up even the smallest external sounds. This characteristic, in specific applications, manifests itself in condenser microphones' high reception sensitivity, wide frequency response range, large dynamic range, and low distortion. The gap between the two plates of a condenser capsule is extremely small, typically between 20-100μm. Due to this high reception sensitivity and wide frequency response range, when used at close range, strong or loud signals within the receivable signal range can cause a transient overload. This close gap between the two electrodes can cause the diaphragm to flutter or even stick to the membrane, resulting in reduced capsule performance and microphone popping. Therefore, improvements to existing condenser capsules are necessary. Utility Model Content

[0004] In view of this, the present invention addresses the deficiencies in the prior art and its main purpose is to provide a capacitive sound head device that can solve the problem that the existing capacitive sound head is prone to instantaneous overload, causing the gap between the two electrodes to be too close, forming a film-like phenomenon, or even a film-sticking phenomenon, thereby causing the sound head characteristics to deteriorate and causing the microphone to spray.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A capacitive sound head device includes a housing, a plate, a sound diaphragm, and a PCB board; the housing has a accommodating cavity, the middle portion of the upper surface of the housing is concave to form a recessed position, the center position of the recess is raised to form a convex portion, the upper surface of the housing is provided with a plurality of sound inlet holes, and the plurality of sound inlet holes are arranged at intervals in the circumferential direction with the convex portion as the center; the plate is arranged in the accommodating cavity; the sound diaphragm is arranged in the accommodating cavity and is located below the plate, and a capacitor space is formed between the sound diaphragm and the plate; the PCB board is arranged in the accommodating cavity and is located below the sound diaphragm, and the PCB board is connected to the aforementioned sound diaphragm and the plate.

[0007] As a preferred solution, a dustproof net is provided on the top surface of the accommodating cavity, and the dustproof net covers the sound inlet hole to prevent dust from entering the accommodating cavity through the sound inlet hole and causing damage to the internal structure.

[0008] As a preferred solution, it further includes a steel mesh layer, which is arranged in the accommodating cavity and located above the pole plate, and the steel mesh layer covers the sound inlet hole. The steel mesh layer can divide the airflow and reduce the instantaneous impact of loud and strong sounds on the sound membrane.

[0009] As a preferred solution, the steel mesh layer is formed by stacking at least two steel meshes, and the two steel meshes can be steel meshes of different densities to further divide the airflow.

[0010] As a preferred solution, a support ring is provided between the steel mesh layer and the electrode plate, the upper surface of the support ring is in contact with the steel mesh layer, and the lower surface of the support ring is in contact with the electrode plate.

[0011] As a preferred solution, a gasket is provided in the capacitor space.

[0012] As a preferred solution, a damping structure is provided between the PCB board and the sound diaphragm, and the damping structure includes a damping sheet and a damping plate. The damping sheet is provided close to the sound diaphragm, and the damping plate is fitted with the lower surface of the damping sheet.

[0013] As a preferred solution, a connecting ring is provided between the PCB board and the damping structure.

[0014] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0015] By forming a concave portion in the middle of the upper surface of the housing, and a convex portion at the center of the concave portion, the concave-convex structure in the middle of the housing disperses the airflow, reducing the instantaneous impact of loud and strong sounds on the diaphragm. Furthermore, the diaphragm is positioned within the accommodating cavity below the plate. When the user speaks, the airflow first passes through the holes in the plate before acting on the surface of the diaphragm. The diaphragm can only move in the opposite direction of the plate, increasing the distance between the two plates. This prevents the diaphragm from flapping or even sticking due to instantaneous overload, thereby ensuring sound quality and preventing distortion and microphone spray. This effectively addresses the drawbacks of traditional structures, enabling large and medium-sized condenser sound capsules to achieve excellent results in close-talking applications (size specifications: diameter 14mm or larger).

[0016] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional view of a preferred embodiment of the present utility model.

[0018] Description of the accompanying drawings:

[0019] 10. Housing 101, accommodating cavity

[0020] 102. concave position 103. convex part

[0021] 104, sound hole 20, plate

[0022] 30, sound film 40, PCB board

[0023] 51. Dustproof net 52. Insulation sheet

[0024] 53. Gasket 54. Connecting ring

[0025] 55. Support ring 60. Damping structure

[0026] 61. Damping sheet 62. Damping plate

[0027] 70. Steel mesh layer 71. Steel mesh. DETAILED DESCRIPTION

[0028] Please refer to Figure 1 As shown, it shows the specific structure of a preferred embodiment of the present invention, including a housing 10, a plate 20, a sound membrane 30 and a PCB board 40.

[0029] The shell 10 has a accommodating cavity 101, and the middle part of the upper surface of the shell 10 is concave to form a concave position 102, and the center position of the concave position 102 is convex to form a convex portion 103. The upper surface of the shell 10 is provided with a plurality of sound inlet holes 104, and the plurality of sound inlet holes 104 are arranged at intervals in the circumferential direction with the convex portion 103 as the center of the circle; in this embodiment, the top surface of the accommodating cavity 101 is provided with a dustproof net 51, and the dustproof net 51 covers the sound inlet holes 104 to prevent dust from entering the accommodating cavity 101 through the sound inlet holes 104, resulting in a decrease in internal acoustic performance; in addition, the side walls of the accommodating cavity 101 are provided with insulating sheets 52.

[0030] The electrode plate 20 is disposed in the accommodating cavity.

[0031] The sound diaphragm 30 is disposed in the accommodating cavity 101 and is located below the electrode plate 20 , and a capacitor space is formed between the sound diaphragm 30 and the electrode plate 20 . In this embodiment, a gasket 53 is disposed in the capacitor space.

[0032] The PCB board 40 is arranged in the accommodating cavity 101 and is located below the sound diaphragm 30, and the PCB board 40 is connected to the aforementioned sound diaphragm 30 and the electrode plate 20; in this embodiment, a damping structure 60 is arranged between the PCB board 40 and the sound diaphragm 30, and the damping structure 60 includes a damping sheet 61 and a damping plate 62, the damping sheet 61 is arranged close to the sound diaphragm 30, and the damping plate 62 is fitted with the lower surface of the damping sheet 61; and a connecting ring 54 is arranged between the PCB board 40 and the damping structure 60.

[0033] It further includes a steel mesh layer 70, which is arranged in the accommodating cavity 101 and located above the pole plate 20. Specifically, the steel mesh layer 70 is sandwiched between the dustproof net 51 and the pole plate 20, and the steel mesh layer 70 covers the sound inlet 102. The steel mesh layer 70 can divide the airflow and reduce the instantaneous impact of loud and strong sounds on the sound membrane. The steel mesh layer 70 is formed by at least two stacked steel meshes 71. The two steel meshes 71 can use steel meshes of different densities to further divide the airflow; and a support ring 55 is provided between the steel mesh layer 70 and the pole plate 20. The upper surface of the support ring 55 is in contact with the steel mesh layer 70, and the lower surface of the support ring 55 is in contact with the pole plate 10.

[0034] The working process of this embodiment is described in detail as follows:

[0035] First, when the user is using it, the airflow formed by the pressure of the picked up sound signal enters the accommodating cavity 101 from the sound inlet hole 104. When entering, the convex portion 103 disperses the transmission flow of the airflow. After entering, the steel mesh layer 70 further divides the airflow. The airflow first passes through the holes on the electrode plate 20 and then acts on the surface of the sound membrane 30. The sound membrane 30 can only move and squeeze in the direction away from the electrode plate 20, thereby increasing the distance between the two. Compared with the traditional design where the sound membrane is set above the electrode plate, the sound membrane 30 will not be too close to the electrode plate 20 to cause the membrane to flutter or even stick to the membrane.

[0036] The key design points of this utility model are: by forming a concave portion in the middle of the upper surface of the housing, and forming a convex portion at the center of the concave portion, the concave-convex structure in the middle of the housing disperses the airflow transmission flow, reducing the instantaneous impact force of loud and strong sounds on the diaphragm. In addition, the sound diaphragm is arranged in the accommodating cavity and located below the electrode plate. When the user speaks, the airflow first passes through the holes in the electrode plate and then acts on the surface of the sound diaphragm. The sound diaphragm can only move and squeeze in the opposite direction of the electrode plate. The distance between the two electrode plates will only increase, and the membrane will not be fluttered or even stuck due to instantaneous overload, thereby ensuring the sound effect and preventing distortion, microphone spraying, etc. The disadvantages of traditional structures are effectively addressed, so that large and medium-sized condenser sound heads can achieve good results in close-talking applications (size specifications: diameter 14 or above).

[0037] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A capacitive sound head device, characterized by: It includes a shell, a pole plate, a sound membrane and a PCB board; the shell has a accommodating cavity, the middle part of the upper surface of the shell is concave to form a recessed position, the center position of the recessed position is convex to form a convex portion, and the upper surface of the shell is provided with a plurality of sound inlet holes, and the plurality of sound inlet holes are arranged circumferentially with the convex portion as the center; the pole plate is arranged in the accommodating cavity; the sound membrane is arranged in the accommodating cavity and is located below the pole plate, and a capacitor space is formed between the sound membrane and the pole plate; the PCB board is arranged in the accommodating cavity and is located below the sound membrane, and the PCB board is connected to the aforementioned sound membrane and the pole plate.

2. The capacitive sound head device according to claim 1, characterized in that: The top surface of the accommodating cavity is provided with a dustproof net, which covers the sound inlet hole.

3. The capacitive sound head device according to claim 1, characterized in that: The invention further comprises a steel mesh layer, which is arranged in the accommodating cavity and above the pole plate, and the steel mesh layer covers the sound inlet hole.

4. The capacitive sound head device according to claim 3, characterized in that: The steel mesh layer is formed by stacking at least two steel meshes.

5. The capacitive sound head device according to claim 3, characterized in that: A support ring is provided between the steel mesh layer and the electrode plate, wherein the upper surface of the support ring is in contact with the steel mesh layer, and the lower surface of the support ring is in contact with the electrode plate.

6. The capacitive sound head device according to claim 1, characterized in that: A gasket is arranged in the capacitor space.

7. The capacitive sound head device according to claim 1, characterized in that: A damping structure is provided between the PCB board and the sound diaphragm. The damping structure includes a damping sheet and a damping plate. The damping sheet is provided close to the sound diaphragm, and the damping plate is fitted with the lower surface of the damping sheet.

8. The capacitive sound head device according to claim 7, characterized in that: A connecting ring is provided between the PCB board and the damping structure.

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