Spraying structure of multilayer circuit board solder mask developing machine

The water collection and filtration system are solved through the water collection and collection mechanism and filtration system, and the problem of wastewater discharge blockage in the spray structure of the multi-layer circuit board welding mask developer is realized, automatic collection and efficient filtration of wastewater are achieved, and operation convenience and equipment life are improved.

CN223207320UActive Publication Date: 2025-08-08JIANGXI SHANXU PRECISION CIRCUIT CO LTD
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Patent Information

Application Number
CN202421422195.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-20
Publication Date
2025-08-08
Estimated Expiration
2034-06-20

AI Technical Summary

Technical Problem

The existing multi-layer circuit board welding mask developer spray structure generates a large amount of wastewater during spraying, resulting in easy blockage of drain pipes and needs to be manually cleaned, which affects the convenience of the operator.

Method used

A multi-layer circuit board welding mask developer spray structure is designed, including a water collection collection mechanism, a diversion pipe, a filter mesh, a buffer plate and an anti-rust coating. Through the cooperation of components such as the water collection tray, a sewer pipe, a water collection tank, and a wastewater automatic collection and filtration are realized to prevent the drainage pipe from being blocked.

Benefits of technology

Automatic collection and efficient filtration and discharge of wastewater are realized, avoiding drainage pipe blockage, and improving operator convenience and equipment service life.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223207320U_ABST
Patent Text Reader

Abstract

The utility model discloses a spray structure of a multilayer circuit board solder resist developer, which comprises a solder resist developer, a device shell is arranged at the bottom of the solder resist developer, a workbench is arranged on the front side of the device shell in a sliding manner, a lifting assembly is fixedly connected to the surface of the device shell, a support plate is fixedly connected to the top of the lifting assembly, and the support plate is fixedly connected to the bottom of the device shell. Through the arrangement of the fixing plate, auxiliary supporting can be carried out on the flow guide pipe, the situation that the flow guide pipe is prone to large shaking in the working process is prevented, through the arrangement of the buffer plate, water flow can be buffered, the situation that the bottom of the water collecting tank is impacted by large water flow is prevented, and through the arrangement of the handle, the water collecting tank is convenient to use. According to the sewer pipe convenient to pull, a user can pull the filter screen more conveniently, the comfort level of the user is improved, and water on the surface of the water collecting disc can be guided through the arrangement of the flow guide groove so that the water can enter the sewer pipe more efficiently.
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Description

Technical Field

[0001] The utility model relates to the technical field of multi-layer circuit boards, in particular to a spray structure of a solder resist developer for a multi-layer circuit board. Background Art

[0002] A multilayer circuit board (PCB) is a printed circuit board (PCB) with electrical connections arranged on different layers. Its structure typically consists of 3 to 16, or even more, stacked copper foil layers with interstitial spaces for interconnection. This design makes the wiring of multilayer PCBs more complex than single- or double-sided PCBs, significantly reducing the size of the board. Multilayer PCBs offer high density, high reliability, low electromagnetic radiation, and space savings. The production process involves multiple steps, including drawing the circuit diagram, fabricating the internal layers, chemical etching, laminating the layers, mechanical drilling, and copper plating within the holes. Multilayer PCBs are widely used in various fields, including communications equipment, computer equipment, the automotive industry, industrial control, and aerospace. In communications equipment, multilayer PCBs are used in the design and manufacture of routers, switches, and network storage products, meeting the requirements of high-speed data transmission and stable circuit design. In computer equipment, multilayer PCBs increase the number of circuit layers, reduce crosstalk and interference, and improve computer performance and reliability. In the automotive industry, multilayer PCBs provide higher integration and better impedance control for automotive electronic systems, meeting the requirements of high reliability and high performance. In the fields of industrial control and aerospace, multilayer circuit boards provide accurate and stable circuit designs to meet the needs of high stability and high reliability.

[0003] At present, the existing multi-layer circuit board solder mask developer spray structure generates a large amount of wastewater when spraying the multi-layer circuit board. The wastewater is currently collected and stored simply, and it is easy to cause the drain pipe to be blocked when the wastewater is discharged. The user needs to manually clean the blockage, which affects the convenience of the operator. Therefore, a multi-layer circuit board solder mask developer spray structure is proposed to solve the above problem. Utility Model Content

[0004] 1. Technical problems to be solved by the utility model

[0005] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a spray structure for a multi-layer circuit board solder mask developer, aiming to solve the problem that the existing multi-layer circuit board solder mask developer spray structure generates a large amount of wastewater when spraying the multi-layer circuit boards. At present, the wastewater is simply collected and stored, and when the wastewater is discharged, it is easy to cause the drain pipe to be blocked, requiring the user to manually clean the blockage, affecting the convenience of the operator.

[0006] 2. Technical solution

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A spray structure of a multi-layer circuit board solder mask developer includes a solder mask developer, a device shell is installed at the bottom of the solder mask developer, a workbench is slid on the front of the device shell, a lifting assembly is fixedly connected to the surface of the device shell, the top of the lifting assembly is fixedly connected to a support plate, the top of the support plate is fixedly connected to a support frame, the top of the support frame is fixedly connected to the bottom of the workbench, a spray assembly is fixedly connected to the left side of the device shell, the top of the spray assembly is connected to a filling port, the rear side of the bottom of the spray assembly is connected to a connecting valve, the bottom of the spray assembly is connected to a spray head, and the surface of the workbench is fixedly connected to a water collection mechanism.

[0009] As a preferred solution of the present invention, the water collecting mechanism includes a water collecting pan, which is fixedly connected to the surface of the workbench, and the bottom of the water collecting pan is fixedly connected to a water collecting box, and the bottom of the water collecting pan is connected to a sewer pipe, and the bottom of the sewer pipe extends to the interior of the water collecting box, and the interior of the water collecting box is fixedly connected to a water diversion plate, and the inner side of the water diversion plate is fixedly connected to a guide pipe, and the interior of the guide pipe is clamped with a filter screen, and the front side of the inner wall of the water collecting box is fixedly connected to a water level detector, and the bottom of the water level detector is fixedly connected to a connecting line, and the bottom of the connecting line is fixedly connected to an electromagnetic control valve, and the front of the electromagnetic control valve passes through the front of the water collecting box and is connected to a manual drain valve, and a maintenance door is provided on the outside of the water collecting box.

[0010] As a preferred solution of the present invention, both sides of the guide pipe are fixedly connected with fixing plates, and the surfaces of the fixing plates are fixedly connected to the inner wall of the water collecting tank.

[0011] As a preferred solution of the present invention, a buffer plate is fixedly connected to the interior of the water collecting tank, and the buffer plate is used in conjunction with the water collecting tank.

[0012] As a preferred solution of the present invention, a handle is fixedly connected to the top of the filter screen, and the handle is used in conjunction with the filter screen.

[0013] As a preferred solution of the present invention, a guide groove is provided on the top of the water collecting tray, and the bottom of the guide groove is connected to the top of the sewer pipe.

[0014] As a preferred solution of the present invention, the surface of the water collecting tank is provided with an anti-rust coating, and the anti-rust coating is used in conjunction with the water collecting tank.

[0015] 3. Beneficial effects

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] The utility model can provide auxiliary support for the guide pipe through the setting of the fixed plate to prevent the guide pipe from shaking greatly during operation; can buffer the water flow through the setting of the buffer plate to prevent the water flow from impacting the bottom of the water collecting tank; can facilitate the user to pull the filter screen more conveniently through the setting of the handle, thereby improving the user's comfort; can guide the water on the surface of the water collecting tray through the setting of the guide groove to make it more efficiently enter the interior of the sewer pipe; can protect the water collecting tank through the setting of the rust-proof coating, thereby improving the service life of the water collecting tank; put the multi-layer circuit board on the top of the workbench, and then cooperate with the water collecting mechanism to spray through the spraying work, so that the operator does not need to manually operate to collect and filter the wastewater, and the spray wastewater is efficiently filtered and discharged, and there will be no phenomenon of drain pipe blockage, and it will not affect the convenience of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the overall structure of a spray structure of a multi-layer circuit board solder resist developer according to the present invention;

[0019] Figure 2 This is a schematic diagram of the lifting component structure of a spray structure of a multi-layer circuit board solder resist developer according to the present invention;

[0020] Figure 3 This is a schematic diagram of the water collecting tank structure of the spray structure of the multi-layer circuit board solder resist developer of the utility model;

[0021] Figure 4 This is a schematic diagram of a spray assembly of a spray structure of a multi-layer circuit board solder resist developer according to the present invention;

[0022] Figure 5 This is a schematic cross-sectional view of the water collecting tank of the spray structure of a multi-layer circuit board solder resist developer according to the present invention.

[0023] In the figure: 1. Device housing; 101. Workbench; 102. Solder mask developer; 2. Lifting assembly; 201. Support plate; 202. Support frame; 3. Spray assembly; 301. Filling port; 302. Connecting valve; 303. Spray head; 4. Water collection mechanism; 401. Water collection tray; 402. Water collection tank; 403. Drain pipe; 404. Water guide plate; 405. Diversion pipe; 406. Filter; 407. Water level detector; 408. Connecting line; 409. Solenoid control valve; 410. Manual drain valve; 411. Maintenance door; 5. Fixing plate; 6. Buffer plate; 7. Handle; 8. Diversion groove; 9. Anti-rust coating. DETAILED DESCRIPTION

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] Example:

[0026] See also Figure 1-5 , this embodiment provides a spray structure of a multi-layer circuit board solder resist developer, including a solder resist developer 102, a device shell 1 is installed at the bottom of the solder resist developer 102, a workbench 101 is slidably provided on the front of the device shell 1, a lifting component 2 is fixedly connected to the surface of the device shell 1, the top of the lifting component 2 is fixedly connected to a support plate 201, the top of the support plate 201 is fixedly connected to a support frame 202, the top of the support frame 202 is fixedly connected to the bottom of the workbench 101, a spray component 3 is fixedly connected to the left side of the device shell 1, the top of the spray component 3 is connected to a filling port 301, the rear side of the bottom of the spray component 3 is connected to a connecting valve 302, the bottom of the spray component 3 is connected to a spray head 303, and a water collection mechanism 4 is fixedly connected to the surface of the workbench 101. When in use, the spray structure of the multi-layer circuit board solder resist developer can lift and spray solder resist on multi-line circuit boards through the arrangement of the lifting component 2 and the spray component 3, thereby improving the working efficiency of the solder resist developer 102.

[0027] In this embodiment, if Figure 5 As shown, the water collection mechanism 4 includes a water collecting tray 401, which is fixedly connected to the surface of the workbench 101. The bottom of the water collecting tray 401 is fixedly connected to a water collecting box 402. The bottom of the water collecting tray 401 is connected to a downpipe 403. The bottom of the downpipe 403 extends to the inside of the water collecting box 402. The inside of the water collecting box 402 is fixedly connected to a water guide plate 404. The inner side of the water guide plate 404 is fixedly connected to a guide pipe 405. The inside of the guide pipe 405 is clamped with a filter screen 406. A water level detector 407 is fixedly connected to the front side of the inner wall of 402, a connecting line 408 is fixedly connected to the bottom of the water level detector 407, an electromagnetic control valve 409 is fixedly connected to the bottom of the connecting line 408, the front of the electromagnetic control valve 409 passes through the front of the water collecting tank 402 and is connected to a manual drain valve 410, and a maintenance door 411 is provided on the outside of the water collecting tank 402. Through the setting of the water collecting mechanism 4, the waste water flushed after spraying can be collected and filtered, and can be quickly discharged.

[0028] In this embodiment, if Figure 5As shown, both sides of the guide tube 405 are fixedly connected with a fixing plate 5, the surface of the fixing plate 5 is fixedly connected to the inner wall of the water collecting tank 402, and the inside of the water collecting tank 402 is fixedly connected with a buffer plate 6, which is used in conjunction with the water collecting tank 402. Through the arrangement of the fixing plate 5 and the buffer plate 6, the guide tube 405 can be auxiliary supported to prevent the guide tube 405 from shaking greatly during operation, and the water flow can be buffered to prevent the large water flow from impacting the bottom of the water collecting tank 402.

[0029] In this embodiment, if Figure 5 The top of the filter 406 is fixedly connected with a handle 7, which is used in conjunction with the filter 406. A guide groove 8 is provided on the top of the water collecting tray 401, and the bottom of the guide groove 8 is connected to the top of the sewer pipe 403. Through the setting of the handle 7, the user can pull the filter 406 more conveniently, thereby improving the user's comfort. The water on the surface of the water collecting tray 401 is diverted so that it can enter the interior of the sewer pipe 403 more efficiently.

[0030] In this embodiment, if Figure 5 As shown, the surface of the water collecting tank 402 is provided with an anti-rust coating 9, which is used in conjunction with the water collecting tank 402. The setting of the anti-rust coating 9 can protect the water collecting tank 402 and improve the service life of the water collecting tank 402.

[0031] Working principle: When the spray structure of the multi-layer circuit board solder resist developer is in use, first, the lifting component 2 adjusts the support plate 201, and the support plate 201 drives the workbench 101 to move upward through the support frame 202. When it moves to a suitable position, the multi-layer circuit board is placed on the surface of the workbench 101 and processed by the solder resist developer 102. At the same time, the spray component 3 and the spray head 303 are turned on for spraying. The waste water after spraying enters the interior of the water collection tray 401 and enters the sewer pipe 403 through the guide groove 8. The sewer pipe 403 guides the water to the water guide plate 404 and enters the filter screen 406 for filtration. The filtered water flows through the buffer plate 6 into the interior of the water collection tank 402. The water level detector 407 detects the water level. When the water level is too high, the electromagnetic control valve 409 is controlled by the connecting line 408 to drain the water, and the water can also be drained by the manual drain valve 410.

[0032] All technical features in this embodiment can be freely combined according to actual needs.

[0033] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A multi-layer circuit board solder resist developer spray structure, comprising a solder resist developer (102), characterized in that: The bottom of the solder resist developer (102) is provided with a device shell (1), a workbench (101) is slidably mounted on the front of the device shell (1), a lifting assembly (2) is fixedly connected to the surface of the device shell (1), a support plate (201) is fixedly connected to the top of the lifting assembly (2), a support frame (202) is fixedly connected to the top of the support plate (201), the top of the support frame (202) is fixedly connected to the bottom of the workbench (101), a spray assembly (3) is fixedly connected to the left side of the device shell (1), the top of the spray assembly (3) is connected to a filling port (301), the rear side of the bottom of the spray assembly (3) is connected to a connecting valve (302), the bottom of the spray assembly (3) is connected to a spray head (303), and a water collection mechanism (4) is fixedly connected to the surface of the workbench (101).

2. The spray structure of a multi-layer circuit board solder resist developer according to claim 1, characterized in that: The water collecting mechanism (4) comprises a water collecting tray (401), the water collecting tray (401) is fixedly connected to the surface of the workbench (101), the bottom of the water collecting tray (401) is fixedly connected to a water collecting box (402), the bottom of the water collecting tray (401) is connected to a downpipe (403), the bottom of the downpipe (403) extends to the inside of the water collecting box (402), the inside of the water collecting box (402) is fixedly connected to a water guide plate (404), the inner side of the water guide plate (404) is fixedly connected to a flow guide pipe (405), A filter screen (406) is clamped inside the guide pipe (405), a water level detector (407) is fixedly connected to the front side of the inner wall of the water collecting tank (402), a connecting line (408) is fixedly connected to the bottom of the water level detector (407), an electromagnetic control valve (409) is fixedly connected to the bottom of the connecting line (408), the front of the electromagnetic control valve (409) passes through the front of the water collecting tank (402) and is connected to a manual drain valve (410), and a maintenance door (411) is provided on the outside of the water collecting tank (402).

3. The spray structure of a multi-layer circuit board solder resist developer according to claim 2, characterized in that: Both sides of the flow guide pipe (405) are fixedly connected to fixed plates (5), and the surfaces of the fixed plates (5) are fixedly connected to the inner wall of the water collecting tank (402).

4. The spray structure of a multi-layer circuit board solder resist developer according to claim 2, characterized in that: A buffer plate (6) is fixedly connected to the interior of the water collecting box (402), and the buffer plate (6) is used in conjunction with the water collecting box (402).

5. The spray structure of a multi-layer circuit board solder resist developer according to claim 2, characterized in that: A handle (7) is fixedly connected to the top of the filter screen (406), and the handle (7) is used in conjunction with the filter screen (406).

6. The spray structure of a multi-layer circuit board solder resist developer according to claim 2, characterized in that: A guide groove (8) is provided on the top of the water collecting tray (401), and the bottom of the guide groove (8) is communicated with the top of the downpipe (403).

7. The spray structure of a multi-layer circuit board solder resist developer according to claim 2, characterized in that: The surface of the water collecting box (402) is provided with an anti-rust coating (9), and the anti-rust coating (9) is used in conjunction with the water collecting box (402).