SMT (Surface Mount Technology) mold for accurately positioning and pasting electronic element

Abstract

The utility model relates to the field of electronic processing, and discloses an SMT mould for accurate positioning and pasting of an electronic component, which comprises a positioning plate, a positioning groove is arranged on the inner wall of the positioning plate, a positioning block is fixedly connected with the top end of the positioning plate outside the positioning groove, a positioning mechanism is arranged in the positioning plate, the positioning mechanism comprises an air pressure bin, and the air pressure bin is provided with an air inlet and an air outlet. The air pressure bin is arranged in the positioning plate and the positioning block, a sliding plate is connected to the inner wall of the air pressure bin through a piston, an air cylinder is fixedly connected to the rear end of the positioning plate, and an output shaft of the air cylinder penetrates through the inner wall of the positioning plate and is fixedly connected with the rear end of the sliding plate. According to the electronic component transfer device, through the arrangement of the positioning mechanism, the multiple clamping plates and the anti-skid gaskets can move towards the directions of the corresponding electronic components at the same time, the middles of the corresponding electronic components are clamped, and therefore it is guaranteed that the electronic components cannot fall off in the transfer process of the electronic components with different heights.

Description

Technical Field

[0001] The utility model relates to the field of electronic processing, in particular to an SMT mold for accurately positioning and pasting electronic components. Background Art

[0002] A flexible printed circuit board (FPC) is a type of printed circuit board made of a flexible insulating substrate. It features high reliability, excellent flexibility, high wiring density, light weight, and thinness. It can be bent, wound, and folded freely, and can withstand millions of dynamic bends without damaging the conductors.

[0003] Currently, in order to ensure that electronic components pasted on flexible circuit boards can achieve precise positioning, it is often necessary to transfer the electronic components to the predetermined positions through SMT molds. These molds are usually designed to match the component layout on the flexible circuit board.

[0004] At present, most of the existing SMT molds position electronic components by using the same mold as the arrangement position of the electronic components. However, since the heights of the electronic components that need to be bonded on the same flexible circuit board may be different, and most of the current existing molds can only fix the positions of the same height of the same group of different electronic components, it may lead to poor clamping effect on some electronic components with higher or lower heights, thereby affecting the precise positioning of the electronic components. Therefore, an SMT mold for precise positioning and bonding of electronic components is proposed to solve the above problem. Utility Model Content

[0005] In order to make up for the above shortcomings, the present invention provides an SMT mold for accurately positioning and pasting electronic components, aiming to improve the problem in the prior art that the different heights of electronic components may affect the fixing effect during the transfer process of the electronic components.

[0006] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solutions: an SMT mold for precisely positioning and pasting electronic components, comprising a positioning plate, an inner wall of the positioning plate being provided with a positioning groove, a top end of the positioning plate outside the positioning groove being fixedly connected to a positioning block, a positioning mechanism being provided inside the positioning plate, the positioning mechanism comprising an air pressure chamber, the air pressure chamber being provided inside the positioning plate and the positioning block, a slide being connected to a slide by a piston on the inner wall of the air pressure chamber, a cylinder being fixedly connected to the rear end of the positioning plate, and an output shaft of the cylinder passing through the inner wall of the positioning plate and being fixedly connected to the rear end of the slide.

[0007] As a further description of the above technical solution:

[0008] The inner wall piston of the air pressure chamber is connected to a slide, the inner wall of the slide is fixedly connected to a slide rod, the interior of the slide rod and the interior of the positioning plate are jointly provided with a stabilizing component, and the stabilizing component includes a control chamber, which is opened at the end of the slide rod away from the splint.

[0009] As a further description of the above technical solution:

[0010] One end of the clamping plate away from the slide is fixedly connected with a clamping plate, and one end of the clamping plate away from the slide is fixedly connected with an anti-slip pad.

[0011] As a further description of the above technical solution:

[0012] The interior of the control chamber is communicated with the interior of the air pressure chamber. The inner wall piston of the control chamber is connected to a control plate. The lower end of the control plate is elastically connected to the inner wall of the control chamber through a spring.

[0013] As a further description of the above technical solution:

[0014] The inner wall piston of the control chamber is connected with an insertion rod, and the inner wall of the positioning plate is provided with a socket.

[0015] As a further description of the above technical solution:

[0016] The midpoint of the sliding rod is arranged in a plane corresponding to the center of two planes, the top end of the positioning block and the bottom end of the positioning plate, which are corresponding to the sliding rod.

[0017] As a further description of the above technical solution:

[0018] The clamping plate is rigid, and the shape of one end of the clamping plate away from the slide bar matches the shape of the outer wall of the electronic component on the side close to the clamping plate.

[0019] As a further description of the above technical solution:

[0020] The elastic force of the spring is greater than the friction force between the slide and the air pressure chamber.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the present invention, by arranging the air pressure chamber, the slide plate, the cylinder, the slide, the slide rod, the clamping plate, and the anti-slip pad, multiple slide rods can move simultaneously, thereby enabling multiple clamping plates and the anti-slip pad to move simultaneously toward the direction of the corresponding electronic components and clamp the middle part of the corresponding electronic components, thereby ensuring that the electronic components at different heights will not fall off during the transfer process.

[0023] 2. In the present invention, the arrangement of the control compartment, control board, plug rod, socket and spring ensures that in the process of moving the electronic components, the sliding rod will not move due to shaking of the positioning plate, thereby ensuring that in the process of moving the electronic components, the fixing effect of the electronic components will not be easily changed by external forces. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional structural diagram of the overall structure of the utility model;

[0025] Figure 2 It is a schematic cross-sectional view of the three-dimensional structure of the overall structure of the present invention;

[0026] Figure 3 It is a schematic cross-sectional view of the three-dimensional structure of the overall structure of the present invention;

[0027] Figure 4 For this utility model Figure 3 Schematic diagram of the enlarged three-dimensional structure of part A.

[0028] Legend:

[0029] 1. Positioning plate; 2. Positioning slot; 3. Positioning block; 4. Positioning mechanism; 41. Air pressure chamber; 42. Slide plate; 43. Cylinder; 45. Slide; 46. Slide rod; 47. Clamp; 48. Anti-slip pad; 49. Stabilizing assembly; 491. Control chamber; 492. Control board; 493. Rod; 494. Socket; 495. Spring. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0031] Reference Figure 1 - Figure 3 The utility model provides an embodiment: an SMT mold for accurately positioning and pasting electronic components, comprising a positioning plate 1, an inner wall of the positioning plate 1 is provided with a positioning groove 2, the shape of the positioning groove 2 is consistent with the shape of the electronic component to be pasted, and the distance between each side and the edge of the electronic component when the electronic component is in the center of the positioning groove 2 is consistent, a positioning block 3 is fixedly connected to the top end of the positioning plate 1 outside the positioning groove 2, the height of the positioning block 3 is consistent with the height of the positioning plate 1 and the corresponding electronic component, and the consistent height ensures that electronic components of different heights can all obtain a better fixing effect.

[0032] Reference Figure 2 - Figure 4 The interior of the positioning plate 1 is provided with a positioning mechanism 4, which includes an air pressure chamber 41. The air pressure chamber 41 is opened inside the positioning plate 1 and the positioning block 3. The rear end of the positioning plate 1 is provided with a protrusion with a height higher than the front end. The inner wall piston of the air pressure chamber 41 is connected to a slide plate 42. The position of the slide plate 42 is set at the protrusion at the rear end of the positioning plate 1, and the rear surface of the slide plate 42 is set to a breathable material, which can ensure that the rear end area of the slide plate 42 is connected to the outside. The rear end of the positioning plate 1 is fixedly connected to a cylinder 43, and the output shaft of the cylinder 43 passes through the inner wall of the positioning plate 1 and is fixedly connected to the rear end of the slide plate 42. The inner wall piston of the air pressure chamber 41 is connected to a slide plate 45, and the outer wall of the slide plate 45 fits the inner wall of the air pressure chamber 41.

[0033] According to Figure 2 - Figure 4 The inner wall of the slide 45 is fixedly connected with a slide rod 46, and the midpoint of the slide rod 46 is set in the plane corresponding to the center of the two planes of the top of the corresponding positioning block 3 and the bottom end of the positioning plate 1. The end of the splint 47 away from the slide 45 is fixedly connected with a splint 47, and the splint 47 is rigid, and the shape of the end of the splint 47 away from the slide rod 46 matches the shape of the outer wall of the electronic component close to it. The property setting of the splint 47 ensures that the splint 47 can better fix the electronic component. The end of the splint 47 away from the slide 45 is fixedly connected with an anti-slip pad 48, and the anti-slip pad 48 is flexible. The property setting of the anti-slip pad 48 ensures that the anti-slip pad 48 can fit with the surface of the electronic component while ensuring that it will not damage the electronic component, thereby achieving the protection effect of the electronic component.

[0034] According to Figure 2 - Figure 4 The interior of the slide rod 46 and the interior of the positioning plate 1 are jointly provided with a stabilizing component 49, which includes a control chamber 491. The control chamber 491 is L-shaped and is opened at one end of the slide rod 46 away from the splint 47. The interior of the control chamber 491 is connected to the interior of the air pressure chamber 41. The inner wall piston of the control chamber 491 is connected to the control plate 492. The outer wall of the control plate 492 is in contact with the inner wall of the control chamber 491. The lower end of the control plate 492 is in contact with the inner wall of the control chamber 491. The wall is elastically connected by a spring 495, one end of the spring 495 is fixedly connected to the lower end of the control plate 492, and the other end of the spring 495 is fixedly connected to the inner wall of the control chamber 491. The elastic force of the spring 495 is greater than the friction between the slide 45 and the air pressure chamber 41. The inner wall piston of the control chamber 491 is connected to a rod 493, and a socket 494 is provided on the inner wall of the positioning plate 1. When the slide 45 contacts the inner wall of the air pressure chamber 41, the rod 493 and the socket 494 are in the same vertical plane.

[0035] Working principle: When in use, when the staff needs to paste electronic components on the flexible circuit board, the staff first places the electronic components to be pasted into the positioning groove 2 and ensures that the shape after pasting is completed matches the required shape.

[0036] After the placement is completed, the staff starts the cylinder 43 so that the output shaft of the cylinder 43 pushes the slide 42 forward, thereby reducing the space inside the air pressure chamber 41, so that the slide rod 46 and the slide 45 move toward the direction close to the middle of the positioning groove 2 under the action of air pressure, and drive the splint 47 and the anti-slip gasket 48 to move toward the direction close to the middle of the positioning groove 2, so that the electronic components inside the positioning groove 2 can be clamped by the splint 47 and the anti-slip gasket 48.

[0037] Due to the obstruction of the slide 45, when the slide 45 moves to contact the inner wall of the air pressure chamber 41, the slide rod 46 cannot continue to move, so the maximum movement distance of each slide rod 46 is limited. Therefore, under the condition of sufficient given air pressure, it can be ensured that when the clamping is completed, the electronic component is exactly in the middle of the positioning groove 2.

[0038] Since when the slide rod 46 moves to the point where it cannot move, the insertion rod 493 is exactly in the same vertical plane as the socket 494, continuing to move the slide plate 42 to increase the pressure can enable the insertion rod 493 to move downward under the drive of the pressure and enter the socket 494, thereby avoiding the insertion rod 493 from being separated from the surface of the electronic component during the shaking process due to the compression of the gas during the movement of the workpiece.

[0039] When the slide plate 42 has finished moving, the staff manually moves any clamping plate 47 to check whether it can move after being subjected to force. Due to the setting of the spring 495, the elastic force of the spring 495 needs to be overcome when the rod 493 moves, while the movement of the slide 45 and the slide rod 46 only needs to overcome the friction force. Therefore, the rod 493 can only move downward after all the clamping plates 47 and the anti-slip gaskets 48 clamp the electronic components.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An SMT mold for accurately positioning and pasting electronic components, comprising a positioning plate (1), characterized in that: The inner wall of the positioning plate (1) is provided with a positioning groove (2), and the top end of the positioning plate (1) outside the positioning groove (2) is fixedly connected to a positioning block (3), and the interior of the positioning plate (1) is provided with a positioning mechanism (4), and the positioning mechanism (4) includes an air pressure chamber (41), and the air pressure chamber (41) is provided inside the positioning plate (1) and the positioning block (3), and the inner wall piston of the air pressure chamber (41) is connected to a slide plate (42), and the rear end of the positioning plate (1) is fixedly connected to a cylinder (43), and the output shaft of the cylinder (43) passes through the inner wall of the positioning plate (1) and is fixedly connected to the rear end of the slide plate (42).

2. The SMT mold for accurately positioning and pasting electronic components according to claim 1, characterized in that: The inner wall piston of the air pressure chamber (41) is connected to a slide (45), the inner wall of the slide (45) is fixedly connected to a slide rod (46), the interior of the slide rod (46) and the interior of the positioning plate (1) are jointly provided with a stabilizing component (49), and the stabilizing component (49) includes a control chamber (491), and the control chamber (491) is opened at one end of the slide rod (46) away from the splint (47).

3. The SMT mold for accurately positioning and pasting electronic components according to claim 2, characterized in that: One end of the clamping plate (47) away from the slide (45) is fixedly connected to the clamping plate (47), and one end of the clamping plate (47) away from the slide (45) is fixedly connected to the anti-slip pad (48).

4. The SMT mold for accurately positioning and pasting electronic components according to claim 2, characterized in that: The interior of the control chamber (491) is communicated with the interior of the air pressure chamber (41), the inner wall piston of the control chamber (491) is connected to a control plate (492), and the lower end of the control plate (492) is elastically connected to the inner wall of the control chamber (491) via a spring (495).

5. The SMT mold for accurately positioning and pasting electronic components according to claim 2, characterized in that: The inner wall piston of the control chamber (491) is connected to an insertion rod (493), and the inner wall of the positioning plate (1) is provided with a socket (494).

6. The SMT mold for accurately positioning and pasting electronic components according to claim 2, characterized in that: The midpoint of the slide rod (46) is arranged in a plane corresponding to the center of the two planes of the top end of the corresponding positioning block (3) and the bottom end of the positioning plate (1).

7. The SMT mold for accurately positioning and pasting electronic components according to claim 3, characterized in that: The clamping plate (47) is rigid, and the shape of one end of the clamping plate (47) away from the slide bar (46) matches the shape of the outer wall of the electronic component on the side close to it.

8. The SMT mold for accurately positioning and pasting electronic components according to claim 4, characterized in that: The elastic force of the spring (495) is greater than the friction force between the slide (45) and the air pressure chamber (41).

Images