Radiator

Abstract

The utility model discloses a radiator which is suitable for being thermally coupled to a heat source and comprises a heat conduction base. The heat conduction base is provided with a first surface, a second surface and a flow guide surface. The second surface is opposite to the first surface. The first surface is at least partially recessed towards the second surface to form an accommodating groove. The two opposite sides of the flow guide face are connected to the first face and the second face respectively. The joint of the flow guide face and the second face is closer to the containing groove than the joint of the flow guide face and the first face. The accommodating groove is used for accommodating a heat source. The heat conducting base is used for being thermally coupled to a heat source through the containing groove.

Description

Technical Field

[0001] The utility model relates to a radiator, in particular to a radiator with a guide surface. Background Art

[0002] With the rapid advancement of technology, the computing power of various electronic components has increased significantly, generating significant amounts of heat. Excessive heat generated by electronic components during operation can easily damage them, further impacting their reliability. Therefore, heat sinks are required to dissipate excess heat.

[0003] For example, electronic components can be cooled by a spray liquid cooling system to maintain the performance and service life of the electronic components. The so-called spray liquid cooling system refers to the heat dissipation of the heat source by spraying coolant on the heat source through a high-pressure nozzle. At this time, the coolant will flow vertically along the heat dissipation device of the spray liquid cooling system to form falling film cooling (Falling Film Cooling). However, the heat dissipation device of the current spray liquid cooling system is only attached to the top of the heat source, which can easily cause dry burning and overheating of the heat source. In addition, in the spray liquid cooling system, when the coolant flows vertically and hits the heat dissipation device, it will cause the coolant to splash outward, and the cooling fluid cannot be fully utilized and the heat dissipation efficiency is reduced. Therefore, how to improve the heat dissipation efficiency of the radiator is one of the problems that R&D personnel should solve. Utility Model Content

[0004] The utility model provides a radiator to improve the heat dissipation efficiency of the radiator.

[0005] The heat sink disclosed in one embodiment of the present invention is suitable for thermally coupling to a heat source and includes a heat-conducting base. The heat-conducting base has a first surface, a second surface, and a flow-guiding surface. The second surface faces away from the first surface. The first surface is at least partially recessed toward the second surface to form a receiving groove. Opposite sides of the flow-guiding surface are respectively connected to the first surface and the second surface. The connection between the flow-guiding surface and the second surface is closer to the receiving groove than the connection between the flow-guiding surface and the first surface. The receiving groove is used to accommodate the heat source. The heat-conducting base is used to thermally couple to the heat source through the receiving groove.

[0006] The invention further comprises a plurality of heat dissipation structures, wherein the heat dissipation structures protrude from the second surface of the heat conductive base.

[0007] Wherein, the heat dissipation structure is in the shape of a square column.

[0008] The guide surface is a plane, and the angle between the guide surface and the first surface is an acute angle.

[0009] The included angle between the guide surface and the first surface is greater than or equal to 0 degrees and less than or equal to 45 degrees.

[0010] Wherein, the guide surface is a curved surface.

[0011] The thermally conductive base has a groove bottom surface and an annular groove side surface surrounding the accommodating groove. The annular groove side surface is connected to the periphery of the groove bottom surface. The annular groove side surface includes multiple planar segments and multiple arc surface segments. The arc surface segments are respectively located at the corners of the accommodating groove. The planar segments are respectively connected to the arc surface segments so that the planar segments and the arc surface segments together surround the accommodating groove.

[0012] The thermally conductive base has a groove bottom surface and an annular groove side surface surrounding the accommodating groove, and the annular groove side surface is connected to the periphery of the groove bottom surface. The thermally conductive base further has a first side surface and a first through-hole. The opposite sides of the first side surface are respectively connected to the first surface and the second surface, and the first side surface and the guide surface are respectively located on different sides of the thermally conductive base, and the first through-hole is respectively connected to the first side surface and the annular groove side surface.

[0013] The thermal conductive base further has a second side surface and a second through hole. The opposite sides of the second side surface are respectively connected to the first surface and the second surface, and the second side surface, the first side surface and the guide surface are respectively located on different sides of the thermal conductive base. The second through hole is respectively connected to the second side surface and the side surface of the annular groove.

[0014] The first side surface and the guide surface are respectively located on adjacent sides of the heat conducting base.

[0015] The second side surface and the flow guiding surface are respectively located on opposite sides of the heat conducting base.

[0016] According to the heat sink of the above embodiment, because the heat-conducting base of the heat sink encloses the heat source and the heat sink is provided with an inclined guide surface, the guide surface can guide the wall flow formed by the cooling fluid to flow through the second surface of the heat sink to effectively dissipate heat from the heat source. This can also reduce the chance of the cooling fluid splashing outward due to impact with the heat sink, thereby further fully utilizing the cooling fluid. In this way, the heat dissipation efficiency of the heat sink can be improved.

[0017] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the scope of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional schematic diagram of a radiator according to an embodiment of the present utility model.

[0019] Figure 2 for Figure 1 Another three-dimensional schematic diagram of the radiator.

[0020] Figure 3 for Figure 1 Schematic cross-sectional view of the radiator.

[0021] Figure 4 for Figure 1 Another cross-sectional schematic diagram of the radiator.

[0022] Figure 5 For cooling fluid to flow through Figure 1 Schematic cross-sectional view of the radiator.

[0023] Wherein, the reference numerals:

[0024] 10: Radiator

[0025] 11: Thermal base

[0026] 111: First side

[0027] 112: Side 2

[0028] 113: guide surface

[0029] 114: Groove bottom

[0030] 115: side of annular groove

[0031] 1151: Plane segment

[0032] 1152: arc segment

[0033] 116: First side

[0034] 117: Second side

[0035] 118: First piercing

[0036] 119: Second piercing

[0037] 12: Heat dissipation structure

[0038] 20: Heat Source

[0039] 30: Circuit Board

[0040] A~D: Direction

[0041] L: Cooling fluid

[0042] M: Angle

[0043] R: Accommodating groove DETAILED DESCRIPTION

[0044] See also Figure 1 and Figure 2 . Figure 1 It is a three-dimensional schematic diagram of a radiator according to an embodiment of the present utility model. Figure 2 for Figure 1Another three-dimensional schematic diagram of the radiator.

[0045] The heat sink 10 of this embodiment is, for example, mounted on an upright circuit board (not shown) within a server and is adapted to be thermally coupled to a heat source (not shown) mounted on the circuit board. The heat source may be, for example, a chip. Thermal coupling refers to thermal contact or connection via other heat-conducting media. The heat sink 10 includes a thermally conductive base 11 and a plurality of heat dissipation structures 12. The thermally conductive base 11 has a first surface 111, a second surface 112, a guide surface 113, and a receiving recess R.

[0046] Please also refer to Figure 3 . Figure 3 for Figure 1 Schematic cross-sectional view of the heat sink. The second surface 112 is opposite to the first surface 111 and the heat source. The guide surface 113 is, for example, a plane, and is used to guide the flow of a cooling fluid (not shown). The cooling fluid is, for example, an electronic fluoride liquid. The opposite sides of the guide surface 113 are respectively connected to the first surface 111 and the second surface 112. The connection between the guide surface 113 and the second surface 112 is, for example, closer to the accommodating groove R than the connection between the guide surface 113 and the first surface 111. The angle M between the guide surface 113 and the first surface 111 is, for example, an acute angle, and is greater than or equal to 0 degrees and less than or equal to 45 degrees. For example, the angle M between the guide surface 113 and the first surface 111 is 28.3 degrees. In addition, the guide surface 113 is not perpendicular to the second surface 112. In this way, the guide surface 113 can guide the cooling fluid to flow to the second surface 112.

[0047] Please also refer to Figure 4 . Figure 4 for Figure 1 Another cross-sectional schematic diagram of a heat sink. The accommodating groove R is located on the first surface 111 of the thermally conductive base 11. In detail, the thermally conductive base 11 has a groove bottom surface 114 and an annular groove side surface 115 surrounding the accommodating groove R. The annular groove side surface 115 is connected to the periphery of the groove bottom surface 114. The annular groove side surface 115 includes a plurality of planar segments 1151 and a plurality of arcuate segments 1152. These arcuate segments 1152 are respectively located at the corners of the accommodating groove R. These planar segments 1151 are respectively connected to these arcuate segments 1152, so that these planar segments 1151 and these arcuate segments 1152 together surround the accommodating groove R.

[0048] The accommodating groove R is used to accommodate a heat source, allowing the heat-conducting base 11 to enclose the heat source. Furthermore, the groove bottom surface 114 is thermally coupled to the heat source. These heat dissipation structures 12 are, for example, heat-conducting protrusions, and are, for example, square-shaped. These heat dissipation structures 12 protrude from the second surface 112 of the heat-conducting base 11 to transfer heat from the heat source to the cooling fluid.

[0049] In this embodiment, the cooling fluid will flow through the upright heat sink 10 along the wall of the circuit board, thereby forming a wall flow. Compared with a general upright heat sink, the heat sink does not cover the heat source, so the wall flow will not flow through the second side of the heat sink, thereby reducing the cooling efficiency. In addition, there is no inclined guide surface, so when the wall flow flows to the heat sink, the cooling fluid hits the heat sink and splashes outward, which not only causes waste of cooling fluid, but also reduces the cooling efficiency. In this embodiment, the heat-conducting base 11 of the heat sink 10 covers the heat source, and the heat sink 10 is provided with a guide surface 113. The advantage is that the guide surface 113 can be used to guide the wall flow formed by the cooling fluid to flow through the second side 112 of the heat sink 10. In addition, the inclined guide surface 113 can also reduce the chance of the cooling fluid splashing outward due to hitting the heat sink 10, so as to further fully utilize the cooling fluid. In this way, the heat dissipation efficiency of the heat sink 10 can be improved.

[0050] In this embodiment, the thermally conductive base 11 may further include a first side surface 116, a first through-hole 118, a second side surface 117, and a second through-hole 119. Opposite sides of the first side surface 116 are respectively connected to the first surface 111 and the second surface 112, and the first side surface 116 and the guide surface 113 are, for example, located on adjacent sides of the thermally conductive base 11. The first through-hole 118 is respectively connected to the first side surface 116 and the annular groove side surface 115.

[0051] Opposite sides of the second side surface 117 are respectively connected to the first side surface 111 and the second side surface 112. The second side surface 117 and the first side surface 116 are respectively located on opposite sides of the thermally conductive base 11. The second side surface 117 and the flow guide surface 113 are, for example, respectively located on opposite sides of the thermally conductive base 11. The second through-holes 119 are respectively connected to the second side surface 117 and the annular groove side surface 115.

[0052] In this embodiment, the guide surface 113 is a plane, but the present invention is not limited thereto. In other embodiments, the guide surface may also be a curved surface.

[0053] In this embodiment, the heat dissipation structures 12 are in the shape of square columns, but the present invention is not limited thereto. In other embodiments, the heat dissipation structures 12 may also be in the shape of cylinders.

[0054] See also Figure 5 . Figure 5 For cooling fluid to flow through Figure 1Schematic cross-sectional view of a heat sink. In this embodiment, the heat sink 10 is arranged on an upright circuit board 30. First, the cooling fluid L flows on the wall surface of the circuit board 30 to form a wall flow, and flows along direction A to the guide surface 113 of the heat-conducting base 11 in the heat sink 10. Then, the cooling fluid L flows to the guide surface 113, and is guided by the guide surface 113 to flow along direction B to the second surface 112 of the heat-conducting base 11 in the heat sink 10. Then, the cooling fluid L flows along direction C on the second surface 112. At this time, the heat source 20 arranged on the circuit board 30 and located in the accommodating groove R transfers heat to the cooling fluid L through the second surface 112 and these heat dissipation structures 12. Then, the cooling fluid L that absorbs heat flows along direction D and leaves the heat sink 10.

[0055] According to the heat sink of the above embodiment, because the heat-conducting base of the heat sink encloses the heat source and the heat sink is provided with an inclined guide surface, the guide surface can guide the wall flow formed by the cooling fluid to flow through the second surface of the heat sink to effectively dissipate heat from the heat source. This can also reduce the chance of the cooling fluid splashing outward due to impact with the heat sink, thereby further fully utilizing the cooling fluid. In this way, the heat dissipation efficiency of the heat sink can be improved.

[0056] Of course, the present invention may have many other embodiments. Without departing from the spirit and essence of the present invention, technicians familiar with the field may make various corresponding changes and modifications based on the present invention, but these corresponding changes and modifications should all fall within the scope of protection of the claims of the present invention.

Claims

1. A heat sink, adapted to be thermally coupled to a heat source, characterized in that: The radiator contains: A heat-conducting base has a first surface, a second surface, and a flow-conducting surface. The second surface faces away from the first surface, and the first surface is at least partially recessed toward the second surface to form a receiving groove. Opposite sides of the flow-conducting surface are respectively connected to the first surface and the second surface, and the connection between the flow-conducting surface and the second surface is closer to the receiving groove than the connection between the flow-conducting surface and the first surface. The receiving groove is used to accommodate the heat source, and the heat-conducting base is thermally coupled to the heat source through the receiving groove.

2. The radiator according to claim 1, characterized in that The device further comprises a plurality of heat dissipation structures, wherein the heat dissipation structures protrude from the second surface of the heat conductive base.

3. The radiator according to claim 2, characterized in that The heat dissipation structure is in the shape of a square column.

4. The radiator according to claim 1, wherein The guide surface is a plane, and an angle between the guide surface and the first surface is an acute angle.

5. The radiator according to claim 4, characterized in that The included angle between the guide surface and the first surface is greater than or equal to 0 degrees and less than or equal to 45 degrees.

6. The radiator according to claim 1, characterized in that The guide surface is a curved surface.

7. The radiator according to claim 1, characterized in that The thermal conductive base has a groove bottom surface and an annular groove side surface surrounding the accommodating groove. The annular groove side surface is connected to the periphery of the groove bottom surface. The annular groove side surface includes multiple planar segments and multiple arc surface segments. The arc surface segments are respectively located at the corners of the accommodating groove. The planar segments are respectively connected to the arc surface segments so that the planar segments and the arc surface segments together surround the accommodating groove.

8. The radiator according to claim 1, wherein The thermally conductive base has a groove bottom surface and an annular groove side surface surrounding the accommodating groove, the annular groove side surface is connected to the periphery of the groove bottom surface, and the thermally conductive base further has a first side surface and a first through-hole, the opposite sides of the first side surface are respectively connected to the first surface and the second surface, and the first side surface and the guide surface are respectively located on different sides of the thermally conductive base, and the first through-hole is respectively connected to the first side surface and the annular groove side surface.

9. The radiator according to claim 8, characterized in that The thermal conductive base further has a second side surface and a second through hole. The opposite sides of the second side surface are respectively connected to the first surface and the second surface, and the second side surface, the first side surface and the guide surface are respectively located on different sides of the thermal conductive base. The second through hole is respectively connected to the second side surface and the side surface of the annular groove.

10. The radiator according to claim 9, characterized in that The first side surface and the flow guiding surface are respectively located on adjacent sides of the heat conducting base.

11. The radiator according to claim 9, characterized in that The second side surface and the flow guiding surface are respectively located on opposite sides of the heat conducting base.

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