Mainboard heat dissipation device of video terminal

Abstract

The utility model discloses a mainboard heat dissipation device of a video terminal, which relates to the technical field of mainboard heat dissipation, and comprises a bottom plate, the lower surface of the bottom plate is provided with air holes close to the left side and the right side, and the upper surface of the bottom plate is fixedly connected with a filtering mechanism close to the left side. An isolation shell is fixedly connected to the position, close to the right side, of the upper surface of the bottom plate, a mainboard body is fixedly connected to the position, close to the right side, of the middle of the upper surface of the bottom plate, a heat dissipation mechanism is fixedly connected to the middle of the upper surface of the bottom plate, and a protective shell is fixedly connected to the position, close to the edge, of the upper surface of the bottom plate. According to the mainboard heat dissipation device of the video terminal, the cover plate is hung through the hanging rod, so that the dust filtering plate is fixed to the inner side of the mounting frame, the push block is pushed, so that the dust filtering plate can be rapidly taken out of the inner side of the mounting frame, the dust filtering plate adsorbs dust in air passing through the dust filtering plate, the interior of the protective shell is kept clean, and the service life of the mainboard heat dissipation device is prolonged. Installation is convenient, dismounting is simple, and maintenance is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of mainboard heat dissipation, in particular to a mainboard heat dissipation device of a video terminal. Background Art

[0002] Today's security industry is developing rapidly, and the application of box-type video terminals is increasing. Box-type video terminals are equipped with pan-tilt cameras and can provide users with high-definition, smooth and stable video effects. However, due to their powerful functions, conventional contact heat dissipation can no longer solve the high temperature problem, which brings great limitations to the application of the equipment.

[0003] Chinese patent document CN212936512U discloses a motherboard heat dissipation device for a video terminal, including a terminal shell and a motherboard arranged in the terminal shell. The terminal shell is also provided with an air duct and a heat sink for dissipating heat from the motherboard. The heat sink and the motherboard are spaced apart by a set gap. One end of the air duct is connected to the air outlet of the heat sink heat dissipation air duct, and the other end is connected to the air outlet hole provided on the terminal shell. A cooling fan for ventilating and dissipating heat from the motherboard is provided in the terminal shell, and the air outlet of the cooling fan is connected to the air inlet of the heat sink heat dissipation air duct. The heat dissipation effect of the motherboard in the video terminal is improved by using a non-contact structure for dissipating heat from the motherboard.

[0004] The existing technology has the following problems:

[0005] The heat dissipation mechanism is not provided with a component for filtering dust, so that the inside of the terminal housing may be filled with dust after long-term use, affecting the operation of various electrical components on the mainboard and reducing their service life. Utility Model Content

[0006] The utility model provides a mainboard heat dissipation device for a video terminal to solve the problems raised in the above background technology.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0008] A motherboard heat dissipation device for a video terminal includes a base plate, wherein air vents are provided on the lower surface of the base plate near the left and right sides, a filtering mechanism is fixedly connected to the upper surface of the base plate near the left side, an isolation shell is fixedly connected to the upper surface of the base plate near the right side, a mainboard body is fixedly connected to the right side of the middle of the upper surface of the base plate, a heat dissipation mechanism is fixedly connected to the middle of the upper surface of the base plate, and a protective shell is fixedly connected to the upper surface of the base plate near the edge.

[0009] Preferably, the filtering mechanism includes a mounting bracket, the lower side of the mounting bracket is fixedly connected to the upper surface of the base plate near the left side, the inner side of the mounting bracket is movably sleeved with a dust filter plate, the upper side of the mounting bracket is rotatably connected to the cover plate near the left side, the middle parts of the front and rear surfaces of the mounting bracket are rotatably connected to the hanging rod through the oblique rod, the lower side of the hanging rod overlaps the upper surface of the cover plate near the right side, the upper surface of the cover plate near the right side is fixedly connected with a clip strip, and the clip strip is located on the right side of the hanging rod, and the lower ends of the oblique rods at the front and rear ends of the hanging rod are fixedly connected to two first springs symmetrically distributed front and back.

[0010] Preferably, the front and rear sides of the mounting frame are slidably connected to push blocks near the bottom, and the two push blocks are fixedly connected to inclined blocks at positions near the right side of the dust filter plate.

[0011] Preferably, the inner sides of the left walls of the two push blocks are movably connected to limit rods, the left ends of the limit rods are fixedly connected to the bosses on the front and rear sides of the mounting frame close to the left side, and the outer sides of the two limit rods are movably connected to second springs, and the second spring is located on the left side of the push block.

[0012] Preferably, the heat dissipation mechanism includes a closed shell, the lower side of the closed shell is fixedly connected to the middle of the upper surface of the base plate by screws, and the main board body is located on the inner side of the closed shell, a heat dissipation fan is movably installed on the inner side of the left boss of the closed shell, a semiconductor heat sink is fixedly connected to the middle of the front and back surfaces of the inner side of the left boss of the closed shell, and the semiconductor heat sink is located on the right side of the heat dissipation fan, two temperature conduction platforms symmetrically distributed up and down are fixedly connected to the upper and lower sides of the semiconductor heat sink, and the inner side of the upper boss of the closed shell and the inner side of the closed shell are connected to the isolation shell through an air duct.

[0013] Preferably, a rubber ring is fixedly sleeved on the inner side of the sealing shell near the bottom.

[0014] Due to the adoption of the above technical solution, the present invention has achieved the following technical advancements compared to the prior art:

[0015] 1. The utility model provides a motherboard heat dissipation device for a video terminal, which adopts the cooperation of air vents, a filtering mechanism, a mounting frame, a cover plate, a hanging rod, a clamping strip, a first spring, a push block, an inclined block, a second spring, a dust filter plate and a limit rod. The cover plate is hung by the hanging rod, so that the dust filter plate is fixed on the inner side of the mounting frame. The push block is pushed, so that the dust filter plate can be quickly removed from the inner side of the mounting frame. The dust filter plate absorbs dust in the air passing through it, keeping the inside of the protective shell clean. The utility model is easy to install, simple to disassemble, and convenient to maintain.

[0016] 2. The utility model provides a motherboard heat dissipation device for a video terminal, which adopts the cooperation of an isolation shell, air vents, a motherboard body, a heat dissipation mechanism, a closed shell, a heat dissipation fan, a semiconductor heat sink, a temperature conduction platform and a rubber ring. The heat dissipation fan quickly passes air through the temperature conduction platform, causing the temperature conduction platform to cool the motherboard body. The air is then guided to the air vents on the right and discharged from the inner side of the bottom plate, so that various positions on the motherboard body can be quickly cooled, thereby extending the service life of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0018] Figure 2 It is a partial cross-sectional three-dimensional structural schematic diagram of the utility model;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of the filtering mechanism of the present invention;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of the push block portion of the utility model;

[0021] Figure 5 It is a partial cross-sectional three-dimensional structural diagram of the heat dissipation mechanism of the present invention;

[0022] Figure 6 For this utility model Figure 5 Schematic diagram of the enlarged structure of part A in the middle.

[0023] In the figure: 1. Base plate; 2. Air vent; 3. Filter mechanism; 31. Mounting frame; 32. Cover plate; 33. Hanging rod; 34. Card strip; 35. First spring; 36. Push block; 37. Inclined block; 38. Second spring; 39. Dust filter plate; 310. Limit rod; 4. Isolation shell; 5. Main board body; 6. Heat dissipation mechanism; 61. Enclosed shell; 62. Cooling fan; 63. Semiconductor heat sink; 64. Temperature conduction platform; 65. Rubber ring; 7. Protective shell. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figure 1 、 Figure 2As shown, a motherboard heat dissipation device of a video terminal includes a base plate 1, and air vents 2 are provided on the lower surface of the base plate 1 near the left and right sides. A filter mechanism 3 is fixedly connected to the upper surface of the base plate 1 near the left side, an isolation shell 4 is fixedly connected to the upper surface of the base plate 1 near the right side, a mainboard body 5 is fixedly connected to the right side of the middle of the upper surface of the base plate 1, a heat dissipation mechanism 6 is fixedly connected to the middle of the upper surface of the base plate 1, and a protective shell 7 is fixedly connected to the upper surface of the base plate 1 near the edge.

[0026] It should be noted that the protective shell 7 and the base plate 1 work together to enclose other components inside the protective shell 7, and at the same time, the two are tightly connected to prevent air from entering the inside through the gap.

[0027] like Figure 2 、 Figure 3 As shown, the filtering mechanism 3 includes a mounting bracket 31, the lower side of the mounting bracket 31 is fixedly connected to the upper surface of the base plate 1 near the left side, the inner side of the mounting bracket 31 is movably sleeved with a dust filter plate 39, the upper side of the mounting bracket 31 near the left side is rotatably connected to the cover plate 32, the middle part of the front and rear surfaces of the mounting bracket 31 is rotatably connected to the hanging rod 33 through an oblique rod, the lower side of the hanging rod 33 overlaps the upper surface of the cover plate 32 near the right side, the upper surface of the cover plate 32 near the right side is fixedly connected with a clamping strip 34, and the clamping strip 34 is located on the right side of the hanging rod 33, and the lower ends of the oblique rods at the front and rear ends of the hanging rod 33 are fixedly connected with two first springs 35 symmetrically distributed front and back.

[0028] It should be noted that the dust filter plate 39 is used to filter dust in the air passing through it. The first spring 35 is not a twisted spring, causing the first spring 35 to push the hanging rod 33 to pull the right side of the cover plate 32 downward, causing the dust filter plate 39 to be fixed.

[0029] like Figure 3 、 Figure 4 As shown, push blocks 36 are slidably connected to the front and rear sides of the mounting frame 31 near the bottom, and inclined blocks 37 are fixedly connected to the right side of the two push blocks 36 near the dust filter plate 39.

[0030] It should be noted that pushing the push block 36 causes the inclined block 37 to push the inclined rod, causing the inclined rod to rotate, thereby freeing the hanging rod 33 from the restriction of the clamping strip 34, causing the cover plate 32 to no longer be fixed, so that the dust filter plate 39 can be removed.

[0031] like Figure 3 、 Figure 4As shown, the inner sides of the left walls of the two push blocks 36 are movably connected to the limit rod 310, and the left ends of the limit rods 310 are fixedly connected to the bosses on the front and rear sides of the mounting frame 31 near the left side. The outer sides of the two limit rods 310 are movably connected to the second spring 38, and the second spring 38 is located on the left side of the push block 36.

[0032] It should be noted that the second spring 38 pushes the push block 36 forward, so that the push block 36 can be reset after being released.

[0033] like Figure 2 、 Figure 5 and Figure 6 As shown, the heat dissipation mechanism 6 includes a closed shell 61, the lower side of the closed shell 61 is fixedly connected to the middle of the upper surface of the base plate 1 by screws, and the main board body 5 is located on the inner side of the closed shell 61, and a heat dissipation fan 62 is movably installed on the inner side of the left boss of the closed shell 61, and a semiconductor heat sink 63 is fixedly connected to the middle of the front and back surfaces of the inner side of the left boss of the closed shell 61, and the semiconductor heat sink 63 is located on the right side of the heat dissipation fan 62, and two temperature conducting platforms 64 symmetrically distributed in the upper and lower sides of the semiconductor heat sink 63 are fixedly connected, and the inner side of the upper boss of the closed shell 61 and the inner side of the closed shell 61 are connected to the isolation shell 4 through an air duct.

[0034] It should be noted that the heat dissipation fan 62 drives the air to flow through itself and guides the air to the temperature conduction platform 64, causing the air to pass through the temperature conduction platform 64. When the semiconductor heat sink 63 is energized, its cold end is cooled and the hot end is heated, causing the upper temperature conduction platform 64 to be heated and the lower temperature conduction platform 64 to be cooled. The temperature conduction platform 64 is used to increase the contact area between the upper and lower sides of the semiconductor heat sink 63 and the air, so that the air on the upper side takes away the heat on the upper temperature conduction platform 64, and the air on the lower side is cooled and blown toward the main board body 5. Then the two air flows merge and are discharged from the right air vent 2.

[0035] like Figure 6 As shown, a rubber ring 65 is fixedly sleeved on the inner side of the sealing shell 61 near the bottom.

[0036] It should be noted that the rubber ring 65 is used to seal the gap between the sealing shell 61 and the bottom plate 1 to prevent air from passing therethrough.

[0037] The dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate 39 is fixed to the inner side of the mounting bracket 31, and the dust filter plate The heat fan 62 drives air to flow through itself and guides the air to the temperature guide platform 64, causing the air to pass through the temperature guide platform 64. When the semiconductor heat sink 63 is energized, its cold end cools down and the hot end heats up, causing the upper temperature guide platform 64 to be heated and the lower temperature guide platform 64 to cool down. The temperature guide platform 64 is used to increase the contact area between the upper and lower sides of the semiconductor heat sink 63 and the air, so that the upper air takes away the heat on the upper temperature guide platform 64, and the lower air is cooled and blown to the main board body 5. Then the two air flows merge and are discharged from the right air vent 2. The rubber ring 65 is used to seal the gap between the closed shell 61 and the bottom plate 1 to prevent air from passing through here. The air is quickly passed through the temperature guide platform 64 by the heat dissipation fan 62, causing the temperature guide platform 64 to cool the main board body 5. Then the air is guided to the right air vent 2 and discharged from the inner side of the bottom plate 1, so that various positions on the main board body 5 can be quickly cooled, thereby extending the service life of the components.

[0038] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A motherboard heat dissipation device for a video terminal, comprising a bottom plate (1), characterized in that: The lower surface of the base plate (1) is provided with ventilation holes (2) near the left and right sides, the upper surface of the base plate (1) is fixedly connected to a filter mechanism (3) near the left side, the upper surface of the base plate (1) is fixedly connected to an isolation shell (4) near the right side, the upper surface of the base plate (1) is fixedly connected to a mainboard body (5) at the middle right side, the upper surface of the base plate (1) is fixedly connected to a heat dissipation mechanism (6) at the middle, and the upper surface of the base plate (1) is fixedly connected to a protective shell (7) near the edge.

2. The motherboard heat dissipation device of a video terminal according to claim 1, characterized in that: The filtering mechanism (3) comprises a mounting frame (31), the lower side of the mounting frame (31) is fixedly connected to the upper surface of the base plate (1) near the left side, the inner side of the mounting frame (31) is movably sleeved with a dust filter plate (39), the upper side of the mounting frame (31) near the left side is rotatably connected to a cover plate (32), the middle part of the front and rear surfaces of the mounting frame (31) is rotatably connected to a hanging rod (33) through an oblique rod, the lower side of the hanging rod (33) is overlapped at the upper surface of the cover plate (32) near the right side, the upper surface of the cover plate (32) near the right side is fixedly connected with a clamping strip (34), and the clamping strip (34) is located on the right side of the hanging rod (33), and the lower ends of the oblique rods at the front and rear ends of the hanging rod (33) are fixedly connected to two first springs (35) symmetrically distributed front and back.

3. The motherboard heat dissipation device of a video terminal according to claim 2, characterized in that: The front and rear sides of the mounting frame (31) are both slidably connected to push blocks (36) near the bottom, and the two push blocks (36) are both fixedly connected to inclined blocks (37) near the right side of the dust filter plate (39).

4. The motherboard heat dissipation device of a video terminal according to claim 3, characterized in that: The inner sides of the left walls of the two push blocks (36) are both movably sleeved with a limiting rod (310), the left ends of the limiting rods (310) are fixedly connected to the bosses on the front and rear sides of the mounting frame (31) near the left side, and the outer sides of the two limiting rods (310) are both movably sleeved with a second spring (38), and the second spring (38) is located on the left side of the push block (36).

5. The motherboard heat dissipation device of a video terminal according to claim 1, characterized in that: The heat dissipation mechanism (6) comprises a closed shell (61), the lower side of the closed shell (61) is fixedly connected to the middle part of the upper surface of the bottom plate (1) by screws, and the main board body (5) is located on the inner side of the closed shell (61), a heat dissipation fan (62) is movably installed on the inner side of the left side boss of the closed shell (61), a semiconductor heat sink (63) is fixedly connected to the middle part of the front and back surfaces of the inner side of the left side boss of the closed shell (61), and the semiconductor heat sink (63) is located on the right side of the heat dissipation fan (62), and two temperature conducting platforms (64) symmetrically distributed in the upper and lower sides of the semiconductor heat sink (63) are fixedly connected, and the inner side of the upper side boss of the closed shell (61) and the inner side of the closed shell (61) are connected to the isolation shell (4) through an air duct.

6. The motherboard heat dissipation device of a video terminal according to claim 5, characterized in that: A rubber ring (65) is fixedly sleeved on the inner side of the sealing shell (61) near the bottom.

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