Low-power-consumption amplifier

Abstract

The utility model relates to the technical field of amplifier structures, and discloses a low-power-consumption amplifier which comprises a bottom part, a protective shell, a circuit board and a heat dissipation device, a second connecting block is arranged at the end, correspondingly connected with the bottom part, of the protective shell, and a first connecting block connected with the second connecting block in a matched mode is arranged at the end, correspondingly connected with the protective shell, of the bottom part. A circuit board is arranged at the end, correspondingly connected with the protective shell, of the bottom part, heat dissipation devices are arranged in a rectangle formed by the bottom part and the protective shell and located on the two end faces of the circuit board, the heat dissipation devices can conduct efficient heat dissipation and cooling on the interior when the amplifier works, the service life of the amplifier is prolonged, and internal power consumption is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of amplifier structures, in particular to a low-power amplifier. Background Art

[0002] An amplifier is an electronic device that is primarily used to amplify the amplitude of an input signal, making its output signal larger. Amplifiers play a key role in a variety of electronic devices, including audio equipment, wireless communications, sensors, and medical instruments, and come in many different categories.

[0003] Amplifiers generate heat when working, especially in high-power applications, causing excess power loss. Excessive heat will affect the performance and reliability of the amplifier and may cause device failure. For this reason, we propose a low-power amplifier. Utility Model Content

[0004] (1) Technical problems solved

[0005] In view of the deficiencies in the prior art, the present invention provides a low-power amplifier to solve the above-mentioned problems.

[0006] (2) Technical solution

[0007] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a low-power amplifier, comprising a bottom component, a protective shell, a circuit board and a heat dissipation device, wherein the protective shell is provided with a second connecting block at one end corresponding to the bottom component, and the bottom component is provided with a first connecting block cooperating with the second connecting block at one end corresponding to the protective shell, the bottom component is provided with a circuit board at one end corresponding to the protective shell, and a heat dissipation device is provided on both end surfaces of the circuit board inside the rectangle formed by the bottom component and the protective shell.

[0008] Preferably, the bottom component is a rectangular frame as a whole, and support seats are provided at the four corners of the end of the bottom component away from the protective shell, and the end face of the bottom component corresponding to the support seat is a rectangular opening, and two axially symmetrically distributed limit blocks are provided at the corresponding end of the rectangular opening inside the bottom component, and two axially symmetrically distributed connection holes five are provided on the limit blocks, and a matching block is provided at the end of the bottom component corresponding to the connection to the circuit board, and the matching block has connection holes two at all four corners, and a connection hole one is provided on the four corners of the connection block one at the end of the bottom component corresponding to the connection to the protective shell.

[0009] Preferably, the heat dissipation device consists of three parts, namely two fans, a thermal conductive silicone layer and a copper heat sink. The end of the heat dissipation device corresponding to the connection to the protective shell is two fans distributed in an axially symmetrical manner, and the end of the heat dissipation corresponding to the connection to the bottom component is a thermal conductive silicone layer and a copper heat sink, and the thermal conductive silicone layer is between the copper heat sink and the circuit board.

[0010] Preferably, a rectangular groove is provided on the end surface of the copper heat sink corresponding to the connection circuit board, which cooperates with the thermal conductive silicone layer, and connection holes four are provided at the four corners of the end of the copper heat sink corresponding to the connection bottom component, which are connected to the connection holes five through adapter screws, and a group of equidistantly distributed heat dissipating fins are provided on the end of the copper heat sink facing away from the circuit board, which cooperate with the rectangular opening at the bottom of the bottom component.

[0011] Preferably, the protective shell has connecting holes 3 at four corners of the connecting block 2 at one end corresponding to the bottom component, which are connected to the connecting hole 1 through an adapter bolt. Two connecting frames that are axially symmetrically distributed and connected to the fan are provided inside the protective shell, and a group of protective nets are provided at one end corresponding to the connecting frame inside the protective shell. A group of ventilation slots 1 are provided at the end of the outside of the protective shell opposite to the protective net, and two groups of ventilation slots 2 that are axially symmetrically distributed are provided on the two end surfaces of the outside of the protective shell that are perpendicular to the ventilation slot 1.

[0012] Preferably, the four corners of one end of the circuit board corresponding to the connection bottom component are provided with connection holes that are connected to the second connection hole through an adapter screw, and a plurality of components are provided on one end of the circuit board corresponding to the protective shell.

[0013] (3) Beneficial effects

[0014] Compared with the prior art, the present invention provides a low-power amplifier with the following advantages:

[0015] This low-power amplifier uses two fans and a copper heat sink to efficiently dissipate heat from the circuit board and components inside the amplifier, significantly reducing the internal temperature of the amplifier during operation and mitigating the effects of reduced service life of internal components or excessive power consumption caused by excessively high internal temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the low-power amplifier of the utility model;

[0017] Figure 2 This is a cross-sectional schematic diagram of the low-power amplifier of the utility model;

[0018] Figure 3 This is a schematic diagram of the bottom component of the utility model;

[0019] Figure 4 This is a schematic diagram of the protective shell of the utility model;

[0020] Figure 5 This is a schematic diagram of the copper heat sink of the present invention.

[0021] In the figure: 1. Bottom part; 2. Protective shell; 3. Fan; 4. Circuit board; 5. Components; 6. Thermal conductive silicone layer; 7. Copper heat sink; 8. Support seat; 9. Limit block; 10. Matching block; 11. Connection block one; 12. Connection hole one; 13. Connection hole two; 14. Protective net; 15. Connection frame; 16. Connection block two; 17. Connection hole three; 18. Ventilation slot one; 19. Ventilation slot two; 20. Rectangular slot; 21. Heat sink fin; 22. Connection hole four; 23. Connection hole five. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] See also Figure 1-5 A low-power amplifier includes a bottom component 1, a protective shell 2, a circuit board 4 and a heat dissipation device. The protective shell 2 is provided with a second connecting block 16 at one end corresponding to the connection with the bottom component 1, and the bottom component 1 is provided with a first connecting block 11 that cooperates with the second connecting block 16 at one end corresponding to the connection with the protective shell 2. The bottom component 1 is provided with a circuit board 4 at one end corresponding to the connection with the protective shell 2, and a heat dissipation device is provided on both end surfaces of the circuit board 4 inside the rectangle formed by the bottom component 1 and the protective shell 2.

[0024] Furthermore, the bottom component 1 is a rectangular frame as a whole, and support seats 8 are provided at the four corners of the end of the bottom component 1 facing away from the protective shell 2, and the end face of the bottom component 1 corresponding to the support seat 8 is a rectangular opening. Two axially symmetrically distributed limit blocks 9 are provided at the corresponding rectangular opening end inside the bottom component 1, and two axially symmetrically distributed connection holes 5 23 are provided on the limit blocks 9. The inside of the bottom component 1 is provided with a matching block 10 at the end corresponding to the connection to the circuit board 4, and the matching block 10 has connection holes 2 13 at all four corners, and the end of the bottom component 1 corresponding to the connection to the protective shell 2 has connection holes 12 at the four corners of the connection block 11. The support seat 8 vacates the amplifier, so that the heat dissipation fins 21 on the copper heat sink 7 connected to the inside of the bottom component 1 can be in contact with the air over a large area, thereby enhancing heat dissipation.

[0025] Furthermore, the heat dissipation device is composed of three parts, namely two fans 3, a thermally conductive silicone layer 6 and a copper heat sink 7. The heat dissipation device is connected to one end of the protective shell 2 with two fans 3 distributed axially symmetrically, and the heat dissipation is connected to one end of the bottom component 1 with a thermally conductive silicone layer 6 and a copper heat sink 7. The thermally conductive silicone layer 6 is between the copper heat sink 7 and the circuit board 4. The thermally conductive silicone layer 6 can efficiently transfer a large amount of heat on the circuit board 4 to 7, and cooperate with the heat dissipation fins 21 to efficiently dissipate heat and reduce internal power consumption.

[0026] Furthermore, a rectangular groove 20 is provided on the end surface of the copper heat sink 7 corresponding to the connection with the circuit board 4, which cooperates with the thermal conductive silicone layer 6, and four connection holes 22 are provided at the four corners of the end of the copper heat sink 7 corresponding to the connection with the bottom component 1, which are connected to the five connection holes 23 through matching screws. A group of equidistantly distributed heat dissipating fins 21 are provided on the end of the copper heat sink 7 facing away from the circuit board 4, which cooperate with the rectangular opening at the bottom of the bottom component 1.

[0027] Furthermore, the protective shell 2 has four corners of the connecting block 2 16 at one end corresponding to the bottom part 1, and is provided with connecting holes 3 17 that are connected to the connecting holes 12 through matching bolts. The protective shell 2 is provided with two axially symmetrical connecting frames 15 that are connected to the fan 3, and the protective shell 2 is provided with a group of protective nets 14 at one end corresponding to the connecting frame 15. The outside of the protective shell 2 is provided with a group of ventilation slots 18 at the end opposite to the protective net 14, and two groups of ventilation slots 2 19 that are axially symmetrically distributed are provided on the two end surfaces of the outside of the protective shell 2 that are perpendicular to the ventilation slots 18. The protective net 14 not only plays a ventilation role, but also protects the two fans 3 and multiple components 5 on the circuit board 4.

[0028] Furthermore, the four corners of the end of the circuit board 4 corresponding to the connection bottom component 1 are provided with connection holes that are connected to the second connection hole 13 through adapter screws, and the end of the circuit board 4 corresponding to the protective shell 2 is provided with multiple components 5.

[0029] Working principle: Install the low-power amplifier correctly according to the diagram, that is, select the appropriate screws to connect with the copper heat sink 7 through the four connection holes 5 on the limit block 9 inside the bottom part 1, and evenly apply a layer of thermal conductive silicone layer 6 on the rectangular groove 20 at one end of the copper heat sink 7 corresponding to the circuit board 4. Then, fix the circuit board 4 with the appropriate screws and the connection holes 2 13. Place the two appropriate fans 3 in the two connection frames 15 inside the protective shell 2. Finally, close the bottom part 1 and the protective shell 2 and connect them with the appropriate bolts. The assembly connection is completed. When the amplifier is working, the two fans 3 inside it start working, blowing external cold air in through the protective net 14 opposite to the connection frame 15, and exhausting it through the ventilation slot 1 18 and the two ventilation slots 2 19 on the other three sides of the protective shell 2, thereby accelerating the circulation of air inside the amplifier and reducing the internal temperature. In addition, the copper heat sink 7 in contact with the circuit board 4 efficiently transfers the heat generated by the circuit board 4 to the copper heat sink 7 through the thermal conductive silicone layer 6. The heat is then efficiently dissipated by a group of heat dissipation fins 21 at the bottom of the copper heat sink 7, thereby improving internal working efficiency and reducing its internal power consumption.

[0030] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A low-power amplifier, comprising a base member (1), a protective shell (2), a circuit board (4), and a heat dissipation device, characterized in that: The protective shell (2) is provided with a second connecting block (16) at one end corresponding to the bottom part (1), and the bottom part (1) is provided with a first connecting block (11) that cooperates with the second connecting block (16) at one end corresponding to the protective shell (2). The bottom part (1) is provided with a circuit board (4) at one end corresponding to the protective shell (2), and heat dissipation devices are provided on both end surfaces of the circuit board (4) inside the rectangle formed by the bottom part (1) and the protective shell (2).

2. The low-power amplifier according to claim 1, wherein: The bottom component (1) is a rectangular frame as a whole. The four corners of the end of the bottom component (1) facing away from the protective shell (2) are provided with support seats (8), and the end surface of the bottom component (1) corresponding to the support seat (8) is a rectangular opening. Two axially symmetrically distributed limiting blocks (9) are provided inside the bottom component (1) corresponding to the rectangular opening end, and two axially symmetrically distributed connecting holes (23) are provided on the limiting blocks (9). The end of the bottom component (1) corresponding to the circuit board (4) is provided with a matching block (10), and the matching block (10) has connecting holes (13) at all four corners. The four corners of the connecting block (11) at the end of the bottom component (1) corresponding to the protective shell (2) are provided with connecting holes (12).

3. The low-power amplifier according to claim 1, wherein: The heat dissipation device is composed of three parts, namely two fans (3), a heat-conducting silicone layer (6) and a copper heat dissipation plate (7). One end of the heat dissipation device corresponding to the connection with the protective shell (2) is composed of two fans (3) distributed in an axisymmetric manner. One end of the heat dissipation device corresponding to the connection with the bottom component (1) is composed of the heat-conducting silicone layer (6) and the copper heat dissipation plate (7), and the heat-conducting silicone layer (6) is between the copper heat dissipation plate (7) and the circuit board (4).

4. The low-power amplifier according to claim 3, wherein: The copper heat sink (7) is provided with a rectangular groove (20) on the end surface corresponding to the circuit board (4) and matched with the heat-conducting silicone layer (6), and the copper heat sink (7) is provided with four connection holes (22) at the four corners of the end corresponding to the bottom component (1) and matched with the connection holes (23) through matching screws. The end of the copper heat sink (7) facing away from the circuit board (4) is provided with a group of heat sink fins (21) distributed at equal intervals and matched with the rectangular opening at the bottom of the bottom component (1).

5. The low-power amplifier according to claim 2, wherein: The protective shell (2) is provided with connection holes (17) at four corners of the connection block (16) at one end corresponding to the bottom component (1), and the connection holes (17) are connected to the connection holes (12) through matching bolts. The protective shell (2) is provided with two connection frames (15) symmetrically distributed and connected to the fan (3). The protective shell (2) is provided with a group of protective nets (14) at one end corresponding to the connection frames (15). The protective shell (2) is provided with a group of ventilation slots (18) at one end opposite to the protection net (14). The protective shell (2) is provided with two groups of ventilation slots (19) symmetrically distributed on both end surfaces of the protective shell (2) perpendicular to the ventilation slots (18).

6. The low-power amplifier according to claim 1, wherein: The four corners of one end of the circuit board (4) corresponding to the connection bottom component (1) are provided with connection holes that are connected to the second connection hole (13) through adapter screws, and a plurality of components (5) are provided at one end of the circuit board (4) corresponding to the protective shell (2).

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