Full-automatic pot culture substrate uniform pressing and cup filling equipment
Through the integrated design of fully automatic potted matrix uniform pressing cup equipment, the problem of insufficient weighting of the matrix in the potted container is solved, and the automatic weighing, compacting and filling of the matrix is realized, which improves the efficiency and quality of potted plant production.
Patent Information
- Application Number
- CN202422385190.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2034-09-29
AI Technical Summary
The existing potted matrix uniform pressing cup equipment lacks the weighing function of the matrix in the potted container, making it difficult to inject quantitative matrix into the container.
A fully automatic potted substrate uniform pressing cup equipment is designed, including a base, L-shaped back plate, limiting groove, compacting mechanism, displacement mechanism, weighing mechanism and material guiding mechanism to realize automatic weighing, compacting and uniform loading of the substrate.
Automatic weighing, compacting and filling of potted substrates is realized, production efficiency and quality are improved, matrix accumulation and blockage are avoided, and the density and aesthetics of the substrate in potted containers are improved.
Smart Images

Figure CN223207620U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of potting substrate uniform pressure cupping equipment, in particular to a full-automatic potting substrate uniform pressure cupping equipment. Background Art
[0002] A potting medium uniform filling machine is a mechanical device specifically designed to evenly fill medium (such as nutrient soil or humus) into potting containers (such as flower pots and nutrient bowls). This equipment is widely used in gardening, flower cultivation, and vegetable seedling cultivation, significantly improving filling efficiency, reducing labor intensity, and ensuring uniformity and consistency of the medium.
[0003] However, existing potting substrate uniform pressure cupping equipment often does not have a weighing function for the substrate put into the potting container, so it is inconvenient to inject a fixed amount of substrate into the potting container. Utility Model Content
[0004] The utility model provides a fully automatic potting substrate uniform pressure cupping device, which aims to solve the problem proposed in the above background technology that the existing potting substrate uniform pressure cupping device often has no weighing function for the substrate put into the potting container, making it inconvenient to inject a fixed amount of substrate into the potting container.
[0005] To solve the above problems, the present invention is implemented as follows: a fully automatic potting substrate uniform pressure cupping device, comprising: a base; an L-shaped back plate fixedly mounted on the base; a limiting groove provided on the base; a compacting mechanism provided on the top inner wall of the L-shaped back plate, the compacting mechanism being used to compact the substrate; a displacement mechanism and a weighing mechanism mounted on the base, the displacement mechanism being used to control the lateral movement of the weighing mechanism, the weighing mechanism being used to weigh the substrate; a material guiding mechanism mounted on the L-shaped back plate, the material guiding mechanism being used to guide the substrate at a uniform speed.
[0006] Preferably, the compacting mechanism includes: a hydraulic cylinder fixedly mounted on the inner wall of the top of the L-shaped back plate; and a pressure plate fixedly mounted on the output rod of the hydraulic cylinder.
[0007] Preferably, the displacement mechanism includes: a servo motor fixedly mounted on one side of the base; a screw rotatably mounted on the inner wall of the base and fixedly connected to the output shaft of the servo motor; a sliding plate threadedly sleeved on the screw, and the sliding plate is slidably connected to the inner walls on both sides of the limit groove.
[0008] Preferably, a plurality of limiting rods are fixedly mounted on the inner wall of the base, and the plurality of limiting rods are all slidably connected to the sliding plate.
[0009] Preferably, the weighing mechanism includes: a rectangular plate fixedly mounted on the sliding plate; a plurality of sliding rods slidably mounted on the rectangular plate; a support plate fixedly mounted on the top ends of the plurality of sliding rods; a plurality of annular weighing sensors slidably mounted on the plurality of sliding rods; and a plurality of limit blocks fixedly mounted on the bottom ends of the plurality of sliding rods.
[0010] Preferably, a circular groove is formed on the support plate, and a potted container is provided on the circular groove.
[0011] Preferably, the material guiding mechanism includes: a material guiding barrel fixedly mounted on the L-shaped back plate; a feeding hopper arranged on the material guiding barrel; an auger rotatably mounted on the inner wall of the material guiding barrel; and a driving motor fixedly mounted on one side of the material guiding barrel and connected to the auger.
[0012] Preferably, a discharge port is provided at the bottom of the material guide barrel, a material guide port is provided on the L-shaped back plate, the opening position of the material guide port corresponds to the discharge port, a material guide tube is fixedly installed on the top inner wall of the L-shaped back plate, the installation position of the material guide tube corresponds to the material guide port, and a controller is installed on the top of the material guide barrel.
[0013] Compared with related technologies, the fully automatic potting substrate uniform pressure cupping equipment provided by the utility model has the following beneficial effects:
[0014] Compared with the existing technology, the fully automatic potting substrate uniform pressure cupping equipment provided by this solution has a base as the supporting foundation of the entire equipment, and the base firmly carries all other components to ensure the stability and safety of the equipment during operation. The L-shaped back plate is fixedly installed on the base, and the limit groove is used to guide and limit the sliding plate. The compacting mechanism uses mechanical force to evenly compact the substrate, effectively improving the compactness and stability of the potting substrate, which is beneficial to the growth of plant roots and the absorption of nutrients. The design of the compacting mechanism makes the compaction process more uniform and efficient, avoiding the problems of unevenness and high labor intensity caused by traditional manual compaction. The displacement mechanism is responsible for controlling the lateral movement of the potting container, so that the equipment can compact the substrate after the substrate is put into the potting container in turn. The material guiding mechanism adopts a uniform material guiding design, which can stably and continuously transport the substrate to the cup filling position, avoiding the problems of substrate accumulation and blockage during the transportation process. At the same time, the uniform material guiding also helps to achieve uniform filling of the substrate, improving the overall aesthetics and practicality of the potted plants.
[0015] In summary, the fully automatic potting substrate uniform pressure cupping equipment of the present invention realizes the automation of the entire process of potting substrate filling, compacting and weighing through integrated design and efficient automated operation, significantly improving the efficiency and quality of potted production. The equipment has the advantages of compact structure, easy operation, stable performance, etc., and is an important technological innovation in the field of potted plant production. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the main structure of a fully automatic potted plant substrate uniform pressure cupping device provided by the utility model;
[0017] Figure 2 for Figure 1 Schematic diagram of the three-dimensional assembly structure of the weighing mechanism and potting container;
[0018] Figure 3 for Figure 1 Schematic diagram of the enlarged structure of part A shown in FIG.
[0019] Figure numerals: 1. base; 2. L-shaped back plate; 3. limit groove; 4. hydraulic cylinder; 5. pressure plate; 6. servo motor; 7. screw; 8. sliding plate; 9. limit rod; 10. rectangular plate; 11. sliding rod; 12. support plate; 13. annular weighing sensor; 14. limit block; 15. circular groove; 16. potting container; 17. material guide barrel; 18. feeding hopper; 19. auger; 20. drive motor; 21. discharge port; 22. material guide port; 23. material guide pipe; 24. controller. DETAILED DESCRIPTION
[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein in the specification of the application are for the purpose of describing specific embodiments only and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the description of the above-mentioned drawings, as well as any variations thereof, are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order; the terms "inside", "outside", "left", and "right" indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention.
[0021] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0022] The present invention provides a fully automatic potting medium uniform pressure cupping device. Figure 1-3 As shown, the fully automatic potting substrate uniform pressure cupping equipment includes: a base 1; an L-shaped backboard 2 fixedly mounted on the base 1; a limiting groove 3 provided on the base 1; a compacting mechanism provided on the top inner wall of the L-shaped backboard 2, the compacting mechanism being used to compact the substrate; a displacement mechanism and a weighing mechanism mounted on the base 1, the displacement mechanism being used to control the lateral movement of the weighing mechanism, the weighing mechanism being used to weigh the substrate; a material guiding mechanism mounted on the L-shaped backboard 2, the material guiding mechanism being used to uniformly guide the substrate.
[0023] In this embodiment, the base 1 serves as the supporting foundation of the entire device. The base 1 firmly carries all other components to ensure the stability and safety of the device during operation. The L-shaped back plate 2 is fixedly mounted on the base 1. The limiting groove 3 is used to guide and limit the sliding plate 8. The compacting mechanism uniformly compacts the substrate through mechanical force, effectively improving the compactness and stability of the potting substrate, which is beneficial to the growth of plant roots and the absorption of nutrients. The design of the compacting mechanism makes the compaction process more uniform and efficient, avoiding the problems of unevenness and high labor intensity caused by traditional manual compaction. The displacement mechanism is responsible for controlling the lateral movement of the potting container 16, so that the device can compact the substrate after the substrate is put into the potting container 16 in turn. The material guiding mechanism adopts a uniform material guiding design, which can stably and continuously transport the substrate to the cup filling position, avoiding the problems of accumulation and blockage of the substrate during the transportation process. At the same time, the uniform material guiding also helps to achieve uniform filling of the substrate, improving the overall aesthetics and practicality of the potted plant.
[0024] In summary, the fully automatic potting substrate uniform pressure cupping equipment of the present invention realizes the automation of the entire process of potting substrate filling, compacting and weighing through integrated design and efficient automated operation, significantly improving the efficiency and quality of potted production. The equipment has the advantages of compact structure, easy operation, stable performance, etc., and is an important technological innovation in the field of potted plant production.
[0025] In a further preferred embodiment of the present invention, the compacting mechanism includes: a hydraulic cylinder 4 fixedly mounted on the top inner wall of the L-shaped back plate 2; and a pressure plate 5 fixedly mounted on the output rod of the hydraulic cylinder 4.
[0026] In this embodiment, the hydraulic cylinder 4 can drive the pressing plate 5 to move up and down, thereby compacting the substrate in the potting container 16 .
[0027] In a further preferred embodiment of the present invention, the displacement mechanism includes: a servo motor 6 fixedly mounted on one side of the base 1; a screw 7 rotatably mounted on the inner wall of the base 1 and fixedly connected to the output shaft of the servo motor 6; a sliding plate 8 threadedly sleeved on the screw 7, and the sliding plate 8 is slidably connected to the inner walls on both sides of the limit groove 3.
[0028] In this embodiment, the servo motor 6 drives the screw 7 to rotate, which can drive the sliding plate 8 to move laterally. The sliding plate 8 drives the potting container 16 to move laterally through the weighing mechanism.
[0029] In a further preferred embodiment of the present invention, a plurality of limiting rods 9 are fixedly mounted on the inner wall of the base 1 , and the plurality of limiting rods 9 are all slidably connected to the sliding plate 8 .
[0030] In this embodiment, the sliding plate 8 can be guided and limited by a plurality of limiting rods 9 .
[0031] In a further preferred embodiment of the present invention, the weighing mechanism includes: a rectangular plate 10 fixedly mounted on the sliding plate 8; a plurality of sliding rods 11 slidably mounted on the rectangular plate 10; a support plate 12 fixedly mounted on the top ends of the plurality of sliding rods 11; a plurality of annular weighing sensors 13 respectively slidably mounted on the plurality of sliding rods 11; and a plurality of limit blocks 14 respectively fixedly mounted on the bottom ends of the plurality of sliding rods 11.
[0032] In this embodiment, the substrate in the potting container 16 can be weighed in real time by a plurality of annular weighing sensors 13 , thereby facilitating the controller 24 to control the material guiding mechanism to put a fixed amount of substrate into the potting container 16 .
[0033] In a further preferred embodiment of the present invention, a circular groove 15 is formed on the support plate 12 , and a potting container 16 is provided on the circular groove 15 .
[0034] In this embodiment, a potting container 16 can be placed through the circular groove 15 .
[0035] In a further preferred embodiment of the present invention, the material guiding mechanism includes: a material guiding cylinder 17 fixedly mounted on the L-shaped back plate 2; a feeding hopper 18 arranged on the material guiding cylinder 17; an auger 19 rotatably mounted on the inner wall of the material guiding cylinder 17; and a driving motor 20 fixedly mounted on one side of the material guiding cylinder 17 and connected to the auger 19.
[0036] In this embodiment, the substrate can be introduced into the guide cylinder 17 through the feeding hopper 18 , and the substrate can be uniformly guided to the discharge port 21 by driving the auger 19 to rotate by the driving motor 20 .
[0037] In a further preferred embodiment of the present invention, a discharge port 21 is provided at the bottom of the material guide barrel 17, a material guide port 22 is provided on the L-shaped back plate 2, and the opening position of the material guide port 22 corresponds to the discharge port 21. A material guide tube 23 is fixedly installed on the top inner wall of the L-shaped back plate 2, and the installation position of the material guide tube 23 corresponds to the material guide port 22. A controller 24 is installed on the top of the material guide barrel 17.
[0038] In this embodiment, the substrate can be put into the potting container 16 through the discharge port 21 , the guide port 22 and the guide pipe 23 , and the device can be operated and controlled by the controller 24 .
[0039] In summary, compared with related technologies, this device can not only put the substrate into the potting container, but also has the function of weighing the substrate put into the potting container, can inject a fixed amount of substrate into the potting container, and has the function of compacting the substrate.
[0040] In the several embodiments provided in this application, it should be understood that the disclosed device can be implemented in other ways.
[0041] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope to be protected by the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making any creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also fall within the scope to be protected by the present invention.
Claims
1. A fully automatic potting medium uniform pressure cupping device, characterized in that: include: base; An L-shaped back panel fixedly mounted on the base; A limiting groove is provided on the base; A compacting mechanism is provided on the inner wall of the top of the L-shaped back plate, and is used to compact the matrix; A displacement mechanism and a weighing mechanism installed on the base, wherein the displacement mechanism is used to control the lateral movement of the weighing mechanism, and the weighing mechanism is used to weigh the substrate; A material guiding mechanism is installed on the L-shaped back plate, and is used to guide the substrate at a uniform speed.
2. The fully automatic potting substrate uniform pressure cupping device according to claim 1, characterized in that: The compacting mechanism comprises: A hydraulic cylinder fixedly mounted on the top inner wall of the L-shaped back plate; A pressure plate is fixedly mounted on the output rod of the hydraulic cylinder.
3. The fully automatic potting medium uniform pressure cupping device according to claim 1, characterized in that: The displacement mechanism comprises: a servo motor fixedly mounted on one side of the base; a screw rotatably mounted on the inner wall of the base and fixedly connected to the output shaft of the servo motor; A sliding plate is threadedly sleeved on the screw rod, and the sliding plate is slidably connected to the inner walls on both sides of the limiting groove.
4. The fully automatic potting medium uniform pressure cupping device according to claim 3, characterized in that: A plurality of limiting rods are fixedly mounted on the inner wall of the base, and the plurality of limiting rods are all slidably connected to the sliding plate.
5. The fully automatic potting substrate uniform pressure cupping device according to claim 3, characterized in that: The weighing mechanism comprises: a rectangular plate fixedly mounted on the sliding plate; a plurality of sliding rods slidably mounted on the rectangular plate; A support plate fixedly mounted on the top ends of the plurality of sliding rods; a plurality of annular weighing sensors respectively slidably sleeved on the plurality of sliding rods; A plurality of limit blocks are respectively fixedly mounted on the bottom ends of the plurality of sliding rods.
6. The fully automatic potting medium uniform pressure cupping device according to claim 5, characterized in that: A circular groove is formed on the support plate, and a potted container is arranged on the circular groove.
7. The fully automatic potting substrate uniform pressure cupping device according to claim 1, characterized in that: The material guiding mechanism comprises: A material guide cylinder fixedly mounted on the L-shaped back plate; A feeding hopper provided on the material guiding cylinder; Rotating the auger installed on the inner wall of the guide barrel; A drive motor is fixedly mounted on one side of the material guide barrel and connected to the auger.
8. The fully automatic potting medium uniform pressure cupping device according to claim 7, characterized in that: A discharge port is provided at the bottom of the material guide barrel, and a material guide port is provided on the L-shaped back plate, the opening position of the material guide port corresponds to the discharge port, a material guide pipe is fixedly installed on the top inner wall of the L-shaped back plate, the installation position of the material guide pipe corresponds to the material guide port, and a controller is installed on the top of the material guide barrel.