Food processor with good heat dissipation effect

Abstract

The utility model discloses a food processor with a good heat dissipation effect, which relates to the field of life electric appliances, and comprises a machine body, a cup body arranged on the machine body and provided with a crushing cavity, a crushing device arranged in the crushing cavity, a brushless motor arranged at the bottom of the cup body and in transmission connection with the crushing device, and a circuit board, the circuit board comprises a circuit board body and a power module I-GBT matched with the brushless motor, the I-GBT comprises a chip, a first cooling fin is arranged on the chip, the circuit board further comprises a second cooling fin, and the second cooling fin covers the first cooling fin, so that heat generated by the chip can be quickly led out through the first cooling fin, and the heat generated by the chip can be quickly dissipated out through the second cooling fin. The heat dissipation efficiency of the chip is improved, and the temperature rise of the IGBT is reduced. And meanwhile, the heat dissipated outwards through the first heat dissipation fins can be further dissipated outwards rapidly through the second heat dissipation fins, and the heat dissipation effect of the chip is effectively improved by means of dual heat dissipation of the first heat dissipation fins and the second heat dissipation fins.

Description

Technical Field

[0001] The utility model relates to the technical field of household electrical appliances, in particular to a food processor with good heat dissipation effect. Background Art

[0002] With the development of society and the improvement of living standards, people's pursuit of dietary diversity and healthy diet is constantly increasing. As a result, various industrial food processing machines have gradually become smaller and entered thousands of households. For example, soymilk machines not only meet people's demand for healthy and nutritious diets, but also greatly improve people's quality of life, and are therefore popular among people.

[0003] Existing food processing machines usually include a machine body, and a cup body forming a crushing chamber is arranged inside the machine body, and a crushing device for processing materials is arranged inside the cup body. A motor is arranged at the bottom of the cup body, and the motor is connected to the crushing device. The crushing device is driven by the motor to work, thereby processing and crushing the materials inside the cup body, that is, in the crushing chamber. In order to achieve control of the motor and other components and to ensure smooth processing, the food processing machine must be equipped with a circuit board that controls the operation of the motor and other components. The operating temperature of the electronic components on the circuit board directly determines its service life and stability. During operation, the circuit board will generate a certain amount of heat, which will cause the internal temperature of the circuit board to rise rapidly. The continuous heating of the circuit board may cause the components on the circuit board to fail due to overheating, thereby affecting the performance of the food processing machine and reducing its working reliability. In order to improve the heat dissipation effect of the circuit board, a heat sink is usually provided on the circuit board to achieve effective heat dissipation of the circuit board. The power module IGBT on the circuit board is the main component that generates heat on the circuit board. Although the above-mentioned heat sink can quickly dissipate heat for most electronic devices after covering the circuit board, the temperature rise of the IGBT is still relatively high. After long-term use, it will cause serious aging or even damage of the IGBT, resulting in a significant shortening of its service life, which seriously affects the consumer experience. Utility Model Content

[0004] The purpose of the utility model is to provide a food processing machine with good heat dissipation effect, so as to solve the problem that the IGBT on the circuit board of the existing food processing machine has poor heat dissipation capacity, resulting in obvious temperature rise and accelerated aging.

[0005] To achieve the above-mentioned objectives, the present invention provides a food processing machine with good heat dissipation effect, comprising a machine body, a cup body provided on the machine body and having a grinding chamber, a grinding device provided in the grinding chamber, and a brushless motor provided at the bottom of the cup body and transmission-connected to the grinding device. The food processing machine also comprises a circuit board, the circuit board comprises a circuit board body and a power module IGBT cooperating with the brushless motor, the IGBT comprises a chip, a first heat sink is provided on the chip, the circuit board also comprises a second heat sink, and the second heat sink covers the first heat sink.

[0006] The present application sets up a brushless motor, and with the help of the characteristics of the brushless motor, when the user uses the food processor to process food, the noise of the motor rotation is lower, thereby achieving the effect of noise reduction. At the same time, the brushless motor can realize variable frequency control, so that the food processor can control the brushless motor to output different speeds according to different food ingredients and processing processes, which can make the processing effect of food ingredients better and more complete, and improve the taste of the food output. In addition, the brushless motor occupies less space, which helps to improve the compactness of the internal structure of the whole machine, reduce the space occupied by the food processor, and facilitate user storage.

[0007] A first heat sink is also provided on the IGBT chip. Specifically, the first heat sink directly contacts and covers the chip, allowing heat generated by the chip to be rapidly dissipated outward through the first heat sink, thereby improving the chip's heat dissipation efficiency, reducing the temperature rise of the IGBT, and maintaining the IGBT's operating temperature within a reasonable range. This effectively prevents significant temperature rises that could lead to severe aging or even damage of the IGBT, thereby increasing the IGBT's service life. Furthermore, a second heat sink covers the first heat sink, allowing heat dissipated outward through the first heat sink to be further rapidly dissipated outward through the second heat sink. The dual heat dissipation of the first and second heat sinks effectively enhances the chip's heat dissipation. Furthermore, the second heat sink covers the entire IGBT, thereby improving the heat dissipation efficiency and reducing its temperature rise.

[0008] In a preferred implementation of a food processor with good heat dissipation effect, the coverage area S1 of the chip by the first heat sink and the surface area S2 of the chip facing the first heat sink satisfy: 1 / 4≤S1 / S2≤1.

[0009] By setting the coverage area S1 of the first heat sink to the chip and the surface area S2 of the chip facing the first heat sink to satisfy: 1 / 4≤S1 / S2≤1, the situation where the coverage area of the first heat sink to the chip is smaller than the surface area of the chip facing the first heat sink, resulting in less heat dissipation from the chip by the first heat sink and poor heat dissipation effect is avoided, thereby ensuring that the coverage area of the first heat sink to the chip is appropriate, thereby ensuring the heat dissipation effect of the first heat sink and further reducing the temperature rise of the chip.

[0010] In a preferred implementation of a food processor with good heat dissipation effect, the chip includes a high-pressure area and a low-pressure area, and the first heat sink at least partially covers the high-pressure area.

[0011] By setting the first heat sink to at least partially cover the high-voltage area, the high-voltage area on the chip that generates more heat can be timely and effectively dissipated through the coverage of the first heat sink, effectively reducing the temperature rise of the chip. At the same time, the size of the first heat sink can be reduced so that it can fit into the high-voltage area, thereby reducing the production cost of the first heat sink.

[0012] In a preferred implementation of a food processor with good heat dissipation effect, the chip is divided into a high-pressure area and a low-pressure area along its central axis, and the first heat sink extends along the central axis of the chip and is offset close to the high-pressure area.

[0013] By extending the first heat sink along the central axis of the chip and offsetting it closer to the high-voltage area, the first heat sink can cover more areas of the high-voltage area in the axial direction of the chip, which helps to increase the coverage area of the high-voltage area by the first heat sink under the same area, thereby reducing the production cost of the first heat sink and further improving the heat dissipation effect of the high-voltage area.

[0014] In a preferred implementation of a food processor with good heat dissipation effect, the coverage area S1 of the first heat sink on the chip and the coverage area S3 of the second heat sink on the circuit board body satisfy: 1 / 10≤S1 / S3≤1 / 4.

[0015] By setting the coverage area S1 of the first heat sink on the chip and the coverage area S3 of the second heat sink on the circuit board body to satisfy: 1 / 10≤S1 / S3≤1 / 4, the situation that the coverage area of the first heat sink on the chip is smaller than the coverage area of the second heat sink on the circuit board body, resulting in the first heat sink covering the chip being smaller and unable to achieve effective heat dissipation, is avoided; at the same time, the situation that the coverage area of the first heat sink on the chip is too large relative to the coverage area of the second heat sink on the circuit board body, resulting in the second heat sink being smaller and its heat dissipation effect on the entire circuit board being worse, is avoided.

[0016] In a preferred implementation of a food processor with good heat dissipation effect, the second heat sink includes a heat sink body and a plurality of heat sink fins connected to the heat sink body, the first side of the heat sink body is attached to the first heat sink, and the second side of the heat sink body is provided with a plurality of heat sink fins side by side.

[0017] By configuring the second heat sink to include a heat sink body and multiple heat fins connected to the heat sink body, and the first side of the heat sink body being attached to the first heat sink, the heat on the chip derived from the first heat sink can be directly transferred to the heat sink body, thereby improving the heat transfer efficiency. At the same time, multiple heat fins are arranged side by side on the second side of the heat sink body, so that the heat transferred to the heat sink body can be quickly dissipated outward through the heat sink fins. At the same time, multiple heat fins are provided, which further increases the contact area between the second heat sink and the outside world, allowing more cold air to pass through the second heat sink and take away the heat on the second heat sink, which helps to further improve the heat dissipation effect.

[0018] In a preferred implementation of a food processor with good heat dissipation effect, heat dissipation gaps are formed between the heat dissipation fins, and the extension direction of the first heat dissipation fin is the same as the extension direction of the heat dissipation gaps.

[0019] By making the extension direction of the first heat sink the same as the extension direction of the heat sink gap, when the external cold air flows along the extension direction of the heat sink gap under the guidance of the heat sink gap, the cold air can also flow along the extension direction of the first heat sink, thereby greatly increasing the amount of cold air passing through the first heat sink per unit time, thereby improving the heat dissipation effect of the cold air on the first heat sink.

[0020] In a preferred implementation of a food processor with good heat dissipation effect, the heat dissipation gap at least partially overlaps with the first heat dissipation fin.

[0021] By setting the heat dissipation gap to at least partially overlap with the first heat sink, when the cold air passes through the heat dissipation gap to dissipate heat to the heat sink body, after the cold air quickly dissipates the heat dissipation of the heat sink body in the heat dissipation gap, the first heat sink aligned with this part of the heat dissipation body can simultaneously achieve rapid heat dissipation, which helps to further improve the heat dissipation effect of the chip.

[0022] In a preferred implementation of a food processor with good heat dissipation effect, a heat dissipation gap is formed between each heat dissipation fin, and a heat dissipation channel connected to the outside world is also formed in the body. The circuit board is located in the heat dissipation channel, and the extension direction of the heat dissipation gap is the same as the airflow direction in the heat dissipation channel.

[0023] By aligning the extension direction of the heat dissipation gap with the airflow direction in the heat dissipation channel, the heat sink avoids blocking the flow of cold air, thereby ensuring smooth and rapid flow of gas in the heat dissipation gap, achieving efficient utilization of cold air, and further improving the heat dissipation effect of the IGBT.

[0024] In a preferred implementation of a food processor with good heat dissipation effect, the heat dissipation channel includes an air inlet and an air outlet, and the IGBT is arranged on a side close to the air inlet.

[0025] By arranging the IGBT on the side close to the air inlet, the cold air entering the heat dissipation channel through the air inlet can pass through the IGBT more quickly, thereby achieving effective heat dissipation of the IGBT. This avoids the situation where the IGBT is far away from the air inlet, resulting in the cold air passing through the IGBT after completing the heat dissipation of other components, causing a small temperature difference between the cold air and the IGBT, and ultimately leading to poor heat dissipation effect of the cold air on the IGBT. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0027] Figure 1 This is a cross-sectional view of a food processing machine in one embodiment of the present invention;

[0028] Figure 2 This is a schematic structural diagram of a circuit board in one embodiment of the present invention;

[0029] Figure 3 This is a structural diagram of a circuit board at another angle in one embodiment of the present invention;

[0030] Figure 4 This is a cross-sectional view of a machine body in another embodiment of the present invention;

[0031] Figure 5 This is an exploded view of the machine body in another embodiment of the present invention.

[0032] List of parts and reference numerals:

[0033] 1-body, 11-air inlet, 12-air outlet; 2-cup body, 21-crushing chamber; 3-crushing device; 4-brushless motor; 5-circuit board, 51-circuit board body, 52-chip; 6-second heat sink, 61-heat sink body, 62-heat sink fins, 63-heat sink gap; 7-heat sink channel; 8-first heat sink. DETAILED DESCRIPTION

[0034] In order to more clearly illustrate the overall concept of the present invention, a detailed description is given below in combination with the accompanying drawings by way of examples.

[0035] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific implementation methods disclosed below.

[0036] like Figures 1 to 5 As shown, the utility model provides a food processing machine with good heat dissipation effect, including a machine body 1, a cup body 2 provided on the machine body 1 and having a grinding chamber 21, a grinding device 3 provided in the grinding chamber 21, and a brushless motor 4 provided at the bottom of the cup body 2 and transmission-connected to the grinding device 3. The food processing machine also includes a circuit board 5, the circuit board 5 includes a circuit board body 51 and a power module IGBT matched with the brushless motor 4, the IGBT includes a chip 52, the chip 52 is provided with a first heat sink 8, the circuit board 5 also includes a second heat sink 6, and the second heat sink 6 covers the first heat sink 8.

[0037] The present application sets up a brushless motor 4, and with the help of the characteristics of the brushless motor 4, when the user uses the food processor to process food, the noise of the motor rotation is lower, thereby achieving the effect of noise reduction. At the same time, the brushless motor 4 can realize variable frequency control, so that the food processor can control the brushless motor 4 to output different speeds according to different food ingredients and processing processes, which can make the processing effect of food ingredients better and more complete, and improve the taste of the food output. In addition, the brushless motor 4 occupies a small space, which helps to improve the compactness of the internal structure of the whole machine, reduce the space occupied by the food processor, and facilitate user storage.

[0038] A first heat sink 8 is also provided on the IGBT chip 52. Specifically, the first heat sink 8 directly contacts and covers the chip 52, allowing heat generated by the chip 52 to be rapidly dissipated outward through the first heat sink 8. This helps improve the heat dissipation efficiency of the chip 52, reduces the temperature rise of the IGBT, and maintains the IGBT's operating temperature within a reasonable range. This effectively prevents the IGBT from experiencing significant temperature rise, leading to severe aging or even damage, and helps extend the IGBT's service life. Furthermore, a second heat sink 6 covers the first heat sink 8, allowing heat dissipated outward through the first heat sink 8 to be further rapidly dissipated outward through the second heat sink 6. The dual heat dissipation of the first heat sink 8 and the second heat sink 6 effectively improves the heat dissipation effect of the chip 52. Furthermore, the second heat sink 6 covers the entire IGBT, thereby improving the heat dissipation efficiency of the entire IGBT and reducing its temperature rise.

[0039] It should be noted that the present application does not make any specific restrictions on the material and structure of the first heat sink 8. As a preferred embodiment of the present application, Figure 2 As shown, the first heat sink 8 is in the shape of a long strip and is attached to the chip 52 . At the same time, the first heat sink 8 is preferably a ceramic sheet, which helps to further improve the heat dissipation effect of the first heat sink 8 .

[0040] As a preferred embodiment of the present application, the coverage area S1 of the first heat sink 8 on the chip 52 and the surface area S2 of the chip 52 facing the first heat sink 8 satisfy: 1 / 4≤S1 / S2≤1.

[0041] By setting the coverage area S1 of the first heat sink 8 on the chip 52 and the surface area S2 of the chip 52 facing the first heat sink 8 to satisfy: 1 / 4≤S1 / S2≤1, the situation where the coverage area of the first heat sink 8 on the chip 52 is smaller than the surface area of the chip 52 facing the first heat sink 8, resulting in less heat dissipation from the chip 52 by the first heat sink 8 and poor heat dissipation effect is avoided, and the coverage area of the first heat sink 8 on the chip 52 is ensured to be appropriate, thereby ensuring the heat dissipation effect of the first heat sink 8 and further reducing the temperature rise of the chip 52.

[0042] As a preferred embodiment of the present application, Figure 2 As shown, the chip 52 includes a high-voltage area and a low-voltage area, and the first heat sink 8 at least partially covers the high-voltage area.

[0043] By setting the first heat sink 8 to at least partially cover the high-voltage area, the high-voltage area on the chip 52 that generates higher heat can be timely and effectively dissipated through the coverage of the first heat sink 8, effectively reducing the temperature rise of the chip 52. At the same time, the size of the first heat sink 8 can be reduced so that it can fit into the high-voltage area, thereby reducing the production cost of the first heat sink 8.

[0044] Further, if Figure 2 As shown, the chip 52 is divided into a high-pressure area and a low-pressure area along its central axis. The first heat sink 8 extends along the central axis of the chip 52 and is offset close to the high-pressure area.

[0045] By extending the first heat sink 8 along the central axis of the chip 52 and offsetting it closer to the high-voltage area, the first heat sink 8 can cover more areas of the high-voltage area in the axial direction of the chip 52, which helps to increase the coverage area of the high-voltage area by the first heat sink 8 under the same area, thereby reducing the production cost of the first heat sink 8 while further improving the heat dissipation effect of the high-voltage area.

[0046] As a preferred embodiment of the present application, the coverage area S1 of the first heat sink 8 on the chip 52 and the coverage area S3 of the second heat sink 6 on the circuit board body 51 satisfy: 1 / 10≤S1 / S3≤1 / 4.

[0047] By setting the coverage area S1 of the first heat sink 8 on the chip 52 and the coverage area S3 of the second heat sink 6 on the circuit board body 51 to satisfy: 1 / 10≤S1 / S3≤1 / 4, it is avoided that the coverage area of the first heat sink 8 on the chip 52 is smaller than the coverage area of the second heat sink 6 on the circuit board body 51, resulting in the first heat sink 8 having a smaller coverage area on the chip 52 and making it unable to achieve effective heat dissipation; at the same time, it is avoided that the coverage area of the first heat sink 8 on the chip 52 is too large relative to the coverage area of the second heat sink 6 on the circuit board body 51, resulting in the second heat sink 6 being smaller and its heat dissipation effect on the entire circuit board 5 being worse.

[0048] It should be noted that the present application does not specifically limit the structure of the second heat sink 6. As a preferred embodiment of the present application, Figure 2 、 Figure 3 As shown, the second heat sink 6 includes a heat sink body 61 and a plurality of heat dissipating fins 62 connected to the heat sink body 61 . The first side of the heat sink body 61 is attached to the first heat sink 8 , and the second side of the heat sink body 61 is provided with a plurality of heat dissipating fins 62 side by side.

[0049] By configuring the second heat sink 6 to include a heat sink body 61 and a plurality of heat fins 62 connected to the heat sink body 61, and the first side surface of the heat sink body 61 is attached to the first heat sink 8, the heat on the chip 52 derived from the first heat sink 8 can be directly transferred to the heat sink body 61, thereby improving the heat transfer efficiency. At the same time, a plurality of heat fins 62 are arranged side by side on the second side surface of the heat sink body 61, so that the heat transferred to the heat sink body 61 can be quickly transmitted outward through the heat sink fins 62. At the same time, there are multiple heat fins 62, which further increases the contact area between the second heat sink 6 and the outside world, allowing more cold air to pass through the second heat sink 6 and take away the heat on the second heat sink 6, which helps to further improve the heat dissipation effect.

[0050] Furthermore, a heat dissipation gap 63 is formed between each heat dissipation fin 62 , and the extension direction of the first heat dissipation fin 8 is the same as the extension direction of the heat dissipation gap 63 .

[0051] By making the extension direction of the first heat sink 8 the same as the extension direction of the heat dissipation gap 63, when the external cold air flows along the extension direction of the heat dissipation gap 63 under the guidance of the heat dissipation gap 63, the cold air can also flow along the extension direction of the first heat sink 8, thereby greatly increasing the amount of cold air passing through the first heat sink 8 per unit time, thereby improving the heat dissipation effect of the cold air on the first heat sink 8.

[0052] It should be noted that the present application does not specifically limit the relative position of the heat dissipation gap 63 and the first heat sink 8. As a preferred embodiment of the present application, Figure 2As shown, the heat dissipation gap 63 at least partially overlaps with the first heat dissipation fin 8 .

[0053] By setting the heat dissipation gap 63 to at least partially overlap with the first heat sink 8, when the cold air passes through the heat dissipation gap 63 to dissipate heat to the heat sink body 61, after the cold air quickly dissipates heat to the heat sink body 61 in the heat dissipation gap 63, the first heat sink 8 aligned with this part of the heat dissipation body can simultaneously achieve rapid heat dissipation, which helps to further improve the heat dissipation effect of the chip 52.

[0054] As a preferred embodiment of the present invention, Figure 4 As shown, a heat dissipation gap 63 is formed between each heat dissipation fin 62, and a heat dissipation channel 7 connected to the outside is also formed in the body 1. The circuit board 5 is located in the heat dissipation channel 7, and the extension direction of the heat dissipation gap 63 is the same as the airflow direction in the heat dissipation channel 7.

[0055] By making the extension direction of the heat dissipation gap 63 the same as the airflow direction in the heat dissipation channel 7, the heat sink avoids blocking the circulation of cold air, thereby ensuring that the gas flows smoothly and quickly in the heat dissipation gap 63, achieving efficient utilization of cold air, and further improving the heat dissipation effect of the IGBT.

[0056] Further, if Figure 4 As shown, the heat dissipation channel 7 includes an air inlet 11 and an air outlet 12 , and the IGBT is arranged on a side close to the air inlet 11 .

[0057] By arranging the IGBT on the side close to the air inlet 11, the cold air entering the heat dissipation channel 7 through the air inlet 11 can pass through the IGBT faster, thereby achieving effective heat dissipation of the IGBT, and avoiding the situation where the IGBT is far away from the air inlet 11, resulting in the cold air passing through the IGBT after completing the heat dissipation of other components, resulting in a small temperature difference between the cold air and the IGBT, and ultimately leading to poor heat dissipation effect of the cold air on the IGBT.

[0058] It should be noted that this application does not specifically limit the structure of the food processor. Figure 1 As shown, the cup body 2 and the brushless motor 4 can be both arranged in the body 1; Figure 4 As shown, the cup body 2 is detachably connected to the machine body 1, and the brushless motor 4 is arranged in the machine body 1, which will not be described in detail here.

[0059] The technical solutions protected by this utility model are not limited to the above-described embodiments. It should be noted that the combination of the technical solutions of any one embodiment with the technical solutions of one or more other embodiments falls within the scope of protection of this utility model. Although the above description of this utility model has been provided in detail using general instructions and specific embodiments, it is obvious to those skilled in the art that modifications or improvements can be made based on this utility model. Therefore, such modifications or improvements made without departing from the spirit of this utility model are within the scope of protection claimed by this utility model.

Claims

1. A food processor with good heat dissipation effect, comprising a machine body, a cup body provided on the machine body and having a grinding chamber, a grinding device provided in the grinding chamber, and a brushless motor connected to the grinding device, characterized in that: The food processor also includes a circuit board, which includes a circuit board body and a power module IGBT that cooperates with the brushless motor. The IGBT includes a chip, and a first heat sink is provided on the chip. The first heat sink is in the shape of a long strip and is attached to the chip.

2. A food processor with good heat dissipation effect according to claim 1, characterized in that: The first heat sink is a ceramic sheet.

3. A food processor with good heat dissipation effect according to claim 1, characterized in that: The chip includes a high-voltage area and a low-voltage area, and the first heat sink at least partially covers the high-voltage area.

4. A food processor with good heat dissipation effect according to claim 3, characterized in that: The chip is divided into the high-pressure area and the low-pressure area along the central axis thereof, and the first heat sink extends along the central axis of the chip.

5. The food processor with good heat dissipation effect according to claim 3, characterized in that: The chip is biased close to the high voltage area.

6. A food processor with good heat dissipation effect according to claim 1, characterized in that: The coverage area S1 of the chip by the first heat sink and the surface area S2 of the chip facing the first heat sink satisfy the following conditions: 1 / 4≤S1 / S2≤1.

7. The food processor with good heat dissipation effect according to claim 1, characterized in that: The circuit board includes a second heat sink, which includes a heat sink body and a plurality of heat sink fins connected to the heat sink body. The first side of the heat sink body is attached to the first heat sink, and the second side of the heat sink body is provided with a plurality of heat sink fins side by side.

8. A food processor with good heat dissipation effect according to claim 7, characterized in that: A heat dissipation gap is formed between each of the heat dissipation fins, and an extension direction of the first heat dissipation fin is the same as an extension direction of the heat dissipation gap.

9. The food processor with good heat dissipation effect according to claim 1, characterized in that: A heat dissipation channel is provided in the machine body, and the heat dissipation channel includes an air inlet and an air outlet. The IGBT is arranged on a side close to the air inlet.

10. The food processor with good heat dissipation effect according to claim 1, characterized in that: The cup body is detachably connected to the machine body, and the brushless motor is arranged in the machine body.

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