Molecular sieve base material cutting machine

Abstract

The utility model discloses a molecular sieve base material cutting machine, which belongs to the field of molecular sieve processing, and comprises a rack, and a conveying roller way, a guide module, a cutting table and a cutting module which are arranged on the rack, and the conveying direction of the conveying roller way faces the cutting table; the guide module comprises a guide rail and a guide wheel, the guide rail is arranged above the conveying roller way and extends in the conveying direction of the conveying roller way, and the guide wheel is arranged on the guide rail; and the cutting table is arranged between the two guide rails, is in contact with the guide wheels and a roll shaft of the conveying roller way at the same time, and is used for placing a molecular sieve base material. The molecular sieve base material cutting machine solves the problem that the shape and the size of a molecular sieve base material cut by an existing cutting machine are deviated.

Description

Technical Field

[0001] The utility model relates to the field of molecular sieve processing, in particular to a molecular sieve substrate cutting machine. Background Art

[0002] Molecular sieve substrates have good adsorption properties and selectively absorb moisture, so they are often used as desiccants. In order to obtain molecular sieve substrates of the required size, a cutting machine is required to cut the molecular sieve substrates.

[0003] Existing cutting machines use rollers to transport the molecular sieve substrate to the position of the cutter, and then use the cutter to cut the molecular sieve substrate. However, in the process of using the roller to transport the molecular sieve substrate, the placement angle of the molecular sieve substrate may deviate, thereby causing the cutting path to deviate, so that the shape and size of the cut molecular sieve substrate do not meet the requirements. Utility Model Content

[0004] In order to overcome the defects of the prior art, the utility model provides a molecular sieve substrate cutting machine to solve the above problems.

[0005] The technical solution adopted by the utility model to solve the technical problem is: a molecular sieve substrate cutting machine, comprising a frame and a conveying roller arranged on the frame, a guide module, a cutting table and a cutting module, wherein the conveying direction of the conveying roller is toward the cutting table;

[0006] The guide module includes a guide rail and a guide wheel, wherein the guide rail is arranged above the conveying roller and extends along the conveying direction of the conveying roller, and the guide rail is provided with a guide wheel;

[0007] The cutting table is arranged between two guide rails and is in contact with the guide wheel and the roller shaft of the conveying roller at the same time. The cutting table is used for placing the molecular sieve substrate.

[0008] Preferably, the guide module further includes a connecting member, one end of which is connected to the guide rail, and the other end of which is connected to the frame, so that the guide module is suspended above the conveyor roller.

[0009] Optionally, the cutting table includes a table top and a support beam, wherein the support beam is arranged on the lower surface of the table top, the side wall of the support beam contacts the guide wheel, and the bottom surface of the support beam contacts the roller shaft of the conveyor roller.

[0010] Specifically, the cutting table further includes a turntable, which is disposed on the upper surface of the table and rotatably connected to the table.

[0011] It is worth noting that a cutting guide groove is provided on the upper surface of the turntable.

[0012] Specifically, the cutting module includes a lifting gantry, cutting wheels and cutting lines. The cutting wheels are distributed on the side walls of the lifting gantry so as to be perpendicular to the conveying direction of the conveyor roller. The cutting wheels are transmission-connected to the cutting lines, and all cutting wheels are located in a circular ring surrounded by the cutting lines.

[0013] The beneficial effect of the utility model is that: in the molecular sieve substrate cutting machine, by arranging guide rails and guide wheels above the conveyor roller, the roller shaft of the conveyor roller provides power to drive the cutting table toward the cutting module, and the guide wheels on the guide rails are used to guide the cutting table, so that the placement angle of the molecular sieve substrate placed on the cutting table will not deviate, thereby ensuring that the shape and size of the molecular sieve substrate cut by the cutting module meet the requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A top view of a molecular sieve substrate cutting machine in one embodiment of the present invention;

[0015] Figure 2 This is a structural diagram of a conveying roller and a guide module in one embodiment of the present utility model;

[0016] Figure 3 This is a schematic structural diagram of a conveying roller, a guide module, and a cutting table in one embodiment of the present invention;

[0017] Figure 4 This is a left side view of a cutting module in one embodiment of the present invention;

[0018] Figure 5 This is a schematic structural diagram of the cooperation between the cutting wheel, the cutting line and the conveying roller in one embodiment of the present invention;

[0019] In the figure: 1 frame; 2 conveyor roller; 3 guide module; 31 guide rail; 32 guide wheel; 33 connecting piece; 4 cutting table; 41 table top; 42 support beam; 43 turntable; 431 cutting guide groove; 5 cutting module; 51 lifting gantry; 52 cutting wheel; 53 cutting line. DETAILED DESCRIPTION

[0020] The following further describes specific embodiments of the present invention in conjunction with the accompanying drawings. It should be noted that the descriptions of these embodiments are intended to aid understanding of the present invention and do not constitute limitations on the present invention. Furthermore, the technical features involved in the various embodiments of the present invention described below may be combined with one another as long as they do not conflict with one another.

[0021] like Figure 1-5As shown, a molecular sieve substrate cutting machine includes a frame 1 and a conveying roller 2, a guide module 3, a cutting table 4 and a cutting module 5 arranged on the frame 1, wherein the conveying direction of the conveying roller 2 is toward the cutting table 4;

[0022] The guide module 3 includes a guide rail 31 and a guide wheel 32. The guide rail 31 is arranged above the conveying roller 2 and extends along the conveying direction of the conveying roller 2. The guide rail 31 is provided with a guide wheel 32.

[0023] The cutting platform 4 is disposed between the two guide rails 31 and is in contact with the guide wheel 32 and the roller shaft of the conveying roller 2 at the same time. The cutting platform 4 is used to place the molecular sieve substrate.

[0024] In the molecular sieve substrate cutting machine, a guide rail 31 and a guide wheel 32 are provided above the conveyor roller 2, and the roller shaft of the conveyor roller 2 provides power to drive the cutting table 4 toward the cutting module 5. The guide wheel 32 on the guide rail 31 is used to guide the cutting table 4 so that the placement angle of the molecular sieve substrate placed on the cutting table 4 will not deviate, thereby ensuring that the shape and size of the molecular sieve substrate cut by the cutting module 5 meet the requirements.

[0025] It is worth noting that if Figure 2 and 3 As shown, the guide module 3 further includes a connecting member 33, one end of which is connected to the guide rail 31, and the other end of which is connected to the frame 1, so that the guide module 3 is suspended above the conveyor roller 2. The connecting member 33 can be a connecting rod or a connecting block. The supporting function of the connecting member 33 is used to suspend the guide rail 31 on the frame 1, so that the guide wheel 32 is located above the conveyor roller 2 to play a guiding role without interfering with the operation of the conveyor roller 2.

[0026] Optional, such as Figure 3 As shown, the cutting table 4 includes a table top 41 and a support beam 42. The support beam 42 is arranged on the lower surface of the table top 41. The side wall of the support beam 42 is in contact with the guide wheel 32 to realize the guiding function of the guide wheel 32. The bottom surface of the support beam 42 is in contact with the roller shaft of the conveyor roller 2 to realize the function of driving the conveyor roller 2 forward.

[0027] Preferably, the cutting table 4 further includes a turntable 43, which is disposed on the upper surface of the table 41 and is rotatably connected to the table 41. By rotating the turntable 43, the placement angle of the molecular sieve substrate can be actively changed, thereby cutting out a shape that meets the requirements.

[0028] Specifically, the upper surface of the turntable 43 is provided with cutting guide grooves 431. The provision of the cutting guide grooves 431 enables the blade of the cutting module 5 to completely penetrate the molecular sieve substrate on the turntable 43, thereby completing the cutting. Preferably, multiple cutting guide grooves 431 are staggered, with the staggered positions being located at the center of the turntable 43.

[0029] It is worth noting that if Figure 4 and 5 As shown, the cutting module 5 includes a lifting gantry 51, a cutting wheel 52 and a cutting line 53. The cutting wheels 52 are distributed on the side walls of the lifting gantry 51 so as to be perpendicular to the conveying direction of the conveyor roller 2. The cutting wheels 52 are connected to the cutting line 53 by transmission, and all the cutting wheels 52 are located in a circle surrounded by the cutting line 53. The lifting gantry 51 spans directly above the conveyor roller 2. The lifting method of the lifting gantry 51 adopts the existing lifting method, which can be cylinder driven or motor driven gear driven. The cutting wheel 52 is driven to rotate by the motor, and the cutting wheel 52 and the cutting line 53 form a linear cutting method, which is convenient for cutting the molecular sieve substrate.

[0030] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It is apparent to those skilled in the art that various changes, modifications, substitutions, and variations to these embodiments may be made without departing from the principles and spirit of the present invention, and these changes and modifications still fall within the scope of protection of the present invention.

Claims

1. A molecular sieve substrate cutting machine, characterized in that: It includes a frame and a conveying roller, a guide module, a cutting table and a cutting module arranged on the frame, wherein the conveying direction of the conveying roller is toward the cutting table; The guide module includes a guide rail and a guide wheel, wherein the guide rail is arranged above the conveying roller and extends along the conveying direction of the conveying roller, and the guide rail is provided with a guide wheel; The cutting table is arranged between two guide rails and is in contact with the guide wheel and the roller shaft of the conveying roller at the same time. The cutting table is used for placing the molecular sieve substrate.

2. A molecular sieve substrate cutting machine according to claim 1, characterized in that: The guide module further includes a connecting member, one end of which is connected to the guide rail, and the other end of which is connected to the frame, so that the guide module is suspended above the conveying roller.

3. The molecular sieve substrate cutting machine according to claim 1, characterized in that: The cutting table includes a table top and a support beam. The support beam is arranged on the lower surface of the table top. The side wall of the support beam contacts the guide wheel, and the bottom surface of the support beam contacts the roller shaft of the conveying roller.

4. The molecular sieve substrate cutting machine according to claim 3, characterized in that: The cutting table further includes a turntable, which is disposed on the upper surface of the table and rotatably connected to the table.

5. The molecular sieve substrate cutting machine according to claim 4, characterized in that: A cutting guide groove is provided on the upper surface of the turntable.

6. The molecular sieve substrate cutting machine according to claim 1, characterized in that: The cutting module includes a lifting gantry, cutting wheels and cutting lines. The cutting wheels are distributed on the side walls of the lifting gantry so as to be perpendicular to the conveying direction of the conveyor roller. The cutting wheels are transmission-connected to the cutting lines, and all cutting wheels are located in a circular ring surrounded by the cutting lines.

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