Efficient heat dissipation PCB for new energy automobile lamp

Abstract

The utility model relates to the technical field of new energy automobiles, in particular to an efficient heat dissipation PCB for a new energy automobile lamp, which comprises a support frame and a circuit board main body, the lower part in the support frame is of a bottom open structure, the upper end of the support frame is provided with a placing groove, and the lower inner wall of the placing groove is provided with a plurality of heat dissipation grooves communicated with the lower part in the support frame. The circuit board body is fixedly connected into the containing groove, the lower portion in the supporting frame is fixedly connected with a cooling assembly, sliding grooves communicated with the interior of the supporting frame are formed in the front end and the rear end of the supporting frame, and an air cooling assembly is jointly connected into the two sliding grooves in a sliding mode. According to the efficient heat dissipation PCB for the new energy automobile lamp, integrated layout is achieved, occupied space is reduced, miniaturization design of the lamp is facilitated, the air cooling technology and the liquid cooling technology are combined, the temperature of the PCB is effectively reduced, the service life of the lamp is prolonged, the stability and reliability of a system are improved, and meanwhile the service life of the lamp is prolonged. The design of the air cooling assembly and the cooling assembly facilitates disassembly and replacement, and the maintenance process is simplified.

Description

Technical Field

[0001] The utility model relates to the technical field of new energy vehicles, in particular to a high-efficiency heat dissipation PCB board for new energy vehicle lamps. Background Art

[0002] In new energy vehicle lighting systems, traditional heat dissipation methods often struggle to balance the demands of efficient heat dissipation and space conservation, especially given the high power density and compact design challenges of LED lamps. Existing heat dissipation technologies, such as single air cooling or liquid cooling, while each with their own advantages, are either inefficient in effectively managing high heat loads or hinder efficient utilization of vehicle interior space due to their complex structures and bulky size. For LED chips in particular, overheating can directly lead to brightness degradation, shortened lifespan, and even system failure, severely impacting driving safety and user experience. Therefore, we propose a high-efficiency heat dissipation PCB for new energy vehicle lighting. Utility Model Content

[0003] The main purpose of the present invention is to provide a high-efficiency heat dissipation PCB board for new energy vehicle lamps, which can effectively solve the problems in the background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] An efficient heat dissipation PCB board for new energy vehicle lamps includes a support frame and a circuit board body. The lower inner portion of the support frame is an open-bottom structure. The upper end of the support frame is provided with a placement groove. The lower inner wall of the placement groove is provided with multiple heat dissipation grooves communicating with the lower inner portion of the support frame. The circuit board body is fixedly connected in the placement groove. The lower inner portion of the support frame is fixedly connected with a cooling component. The front and rear ends of the support frame are both provided with slide grooves communicating with the interior of the support frame. An air cooling component is slidably connected in the two slide grooves.

[0006] Preferably, the lower end of the circuit board body is fixedly connected to an insulating layer, the lower end of the insulating layer is fixedly connected to an aluminum substrate, and the lower end of the aluminum substrate is in contact with the lower inner wall of the placement groove.

[0007] By adopting the above technical solution: the use of the insulating layer ensures the electrical isolation between the circuit board and the metal structure, improving the safety of the entire system; the use of the aluminum substrate can carry higher current and dissipate heat more efficiently, effectively improving the heat dissipation effect of the circuit board body and effectively extending the service life of the circuit board body.

[0008] Preferably, fixing ears are fixedly installed on both the front and rear ends and the left and right sides of the support frame, and the two fixing ears on the same side are respectively located on both sides of the slide groove.

[0009] By adopting the above technical solution, it is convenient to fix and install the air-cooling component, and the structure is compact and the design is reasonable.

[0010] Preferably, the air cooling component includes a micro forward and reverse motor, and two micro forward and reverse motors are provided. The two micro forward and reverse motors are respectively fixedly installed on the fixed ears on the front and rear sides. The output end of the micro forward and reverse motor is fixedly installed with a screw rod, and the screw rod is movably connected to the two fixed ears on the same side. A transmission block is threadedly connected to the screw rod, and the opposite ends of the two transmission blocks are commonly fixedly connected to a fan.

[0011] By adopting the above technical solution: the micro forward and reverse motor drives the transmission block to move in the slide groove through the screw rod, thereby driving the fan to move back and forth left and right in the support frame, further accelerating heat dissipation and enhancing the heat dissipation effect.

[0012] Preferably, the two transmission blocks are slidably connected to the sliding grooves on the front and rear sides respectively, and the fan is located directly below the cooling assembly.

[0013] By adopting the above technical solution, the air circulation on the surface of the circuit board body is accelerated, the heat dissipation of the circuit board body is effectively accelerated, and the heat dissipation effect of the circuit board body is improved.

[0014] Preferably, the cooling assembly includes a mounting frame, which is fixedly mounted in the lower portion of the support frame and located above the fan. The mounting frame is a structure with upper and lower openings, and a cooling pipe is fixedly mounted in the mounting frame.

[0015] By adopting the above technical solution, the cooling medium inside the cooling tube installed in the installation frame absorbs heat from the circuit board body during the flow process, thereby reducing the temperature of the circuit board body.

[0016] Preferably, the cooling pipe is an S-shaped structure.

[0017] By adopting the above technical solution, the contact area with the cooling medium is increased and the heat exchange efficiency is improved.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. Combining air cooling and liquid cooling technology effectively reduces the temperature of the circuit board, extends the service life of the lamp, and improves the stability and reliability of the system. At the same time, the design of the air cooling component and the cooling component is easy to disassemble and replace, simplifying the maintenance process. The integrated layout of the support frame and cooling component reduces space occupation and facilitates the miniaturization of the lamp.

[0020] 2. The fan is driven to move back and forth in the support frame through the threaded connection between the screw rod and the transmission block, so that the fan can adjust its position, optimize the air flow distribution, further accelerate the heat dissipation, and enhance the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the utility model's high-efficiency heat dissipation PCB board for new energy vehicle lights;

[0022] Figure 2 This is a schematic diagram of the structure of the high-efficiency heat dissipation PCB board for new energy vehicle lights of this utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the air-cooling assembly of the utility model for the high-efficiency heat dissipation PCB board for new energy vehicle lights;

[0024] Figure 4 This is a schematic diagram of the structure of the cooling assembly of the high-efficiency heat dissipation PCB board for new energy vehicle lights in this utility model.

[0025] In the figure: 1. Support frame; 2. Circuit board body; 3. Cooling assembly; 31. Mounting frame; 32. Cooling pipe; 4. Slide; 5. Air cooling assembly; 51. Micro forward and reverse motor; 52. Screw; 53. Transmission block; 54. Fan; 6. Fixing ear; 7. Insulation layer; 8. Aluminum base plate; 11. Placement slot; 12. Heat dissipation slot. DETAILED DESCRIPTION

[0026] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0027] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc. should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0029] See also Figure 1-4 , the utility model provides a technical solution:

[0030] The high-efficiency heat dissipation PCB board for new energy vehicle lamps includes a support frame 1 and a circuit board body 2. The lower inner part of the support frame 1 is an open-bottom structure. The upper end of the support frame 1 is provided with a placement groove 11. The lower inner wall of the placement groove 11 is provided with multiple heat dissipation grooves 12 that communicate with the lower inner part of the support frame 1. The circuit board body 2 is fixedly connected in the placement groove 11. The lower inner part of the support frame 1 is fixedly connected with a cooling component 3. The front and rear ends of the support frame 1 are provided with a slide groove 4 that communicates with the interior of the support frame 1. The two slide grooves 4 are slidably connected with an air cooling component 5.

[0031] In this embodiment, the lower end of the circuit board body 2 is fixedly connected to the insulating layer 7 , the lower end of the insulating layer 7 is fixedly connected to the aluminum substrate 8 , and the lower end of the aluminum substrate 8 contacts the lower inner wall of the placement groove 11 .

[0032] Through the above solution: the heat generated by the circuit board body 2 is first transferred to the aluminum substrate 8. The aluminum substrate 8 can carry higher current and dissipate heat more efficiently, effectively improving the heat dissipation effect of the circuit board body 2 and effectively extending the service life of the circuit board body 2.

[0033] In this embodiment, the front and rear ends and left and right sides of the support frame 1 are fixedly installed with fixing ears 6, and the two fixing ears 6 on the same side are respectively located on both sides of the slide 4; the air cooling component 5 includes a micro forward and reverse motor 51, and there are two micro forward and reverse motors 51. The two micro forward and reverse motors 51 are respectively fixedly installed with the fixing ears 6 on the front and rear sides, and the output end of the micro forward and reverse motor 51 is fixedly installed with a screw rod 52, which is movably connected to the two fixing ears 6 on the same side. A transmission block 53 is threadedly connected to the screw rod 52, and the opposite ends of the two transmission blocks 53 are jointly fixedly connected to a fan 54; the two transmission blocks 53 are respectively slidably connected to the slides 4 on the front and rear sides, and the fan 54 is located directly below the cooling component 3; the cooling component 3 includes a mounting frame 31, which is fixedly installed on the lower inner part of the support frame 1 and above the fan 54. The mounting frame 31 is an upper and lower open structure, and a cooling pipe 32 is fixedly installed in the mounting frame 31; the cooling pipe 32 is an S-shaped structure.

[0034] Through the above scheme: the cooling medium (such as water or antifreeze) inside the cooling tube 32 will absorb heat from the circuit board body 2 during the flow process, reduce the temperature of the circuit board body 2, and at the same time start the fan 54, which is located below the cooling component 3, to accelerate the air circulation on the surface of the circuit board body 2, effectively accelerate the heat dissipation of the circuit board body 2, and improve the heat dissipation effect of the circuit board body 2. In addition, during the heat dissipation process of the fan 54, the micro forward and reverse motor 51 is started, and the micro forward and reverse motor 51 drives the transmission block 53 to move in the slide groove 4 through the screw rod 52, thereby driving the fan 54 to move back and forth left and right in the support frame 1, further accelerating heat dissipation and enhancing the heat dissipation effect.

[0035] It should be noted that the present invention is an efficient heat dissipation PCB board for new energy vehicle lamps. During use, the aluminum substrate 8 has good thermal conductivity. The heat generated by the circuit board body 2 is first transferred to the aluminum substrate 8, and then the aluminum substrate 8 transfers the heat to the cooling medium in the cooling tube 32 through the heat dissipation groove 12. The cooling medium (such as water or antifreeze) inside the cooling tube 32 absorbs the heat from the circuit board body 2 during the flow process, thereby reducing the temperature of the circuit board body 2 and starting the fan 54 at the same time. The fan 54 is located below the cooling component 3 to accelerate the air circulation on the surface of the circuit board body 2, effectively accelerating the heat dissipation of the circuit board body 2 and improving the heat dissipation effect of the circuit board body 2. During the heat dissipation process of the fan 54, the micro forward and reverse motor 51 is started. The micro forward and reverse motor 51 drives the transmission block 53 to move in the slide groove 4 through the screw rod 52, thereby driving the fan 54 to move back and forth left and right in the support frame 1, further accelerating heat dissipation and enhancing the heat dissipation effect.

[0036] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed in this invention is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency heat dissipation PCB board for new energy vehicle lamps, comprising a support frame (1) and a circuit board body (2), characterized in that: The lower part of the support frame (1) is an open bottom structure, the upper end of the support frame (1) is provided with a placement groove (11), the lower inner wall of the placement groove (11) is provided with a plurality of heat dissipation grooves (12) communicating with the lower part of the support frame (1), the circuit board body (2) is fixedly connected in the placement groove (11), the lower part of the support frame (1) is fixedly connected with a cooling component (3), the front and rear ends of the support frame (1) are provided with a slide groove (4) communicating with the interior of the support frame (1), and the two slide grooves (4) are slidably connected with an air cooling component (5) in common; The lower end of the circuit board body (2) is fixedly connected to an insulating layer (7), the lower end of the insulating layer (7) is fixedly connected to an aluminum substrate (8), and the lower end of the aluminum substrate (8) is in contact with the lower inner wall of the placement groove (11).

2. The high-efficiency heat dissipation PCB board for new energy vehicle lamps according to claim 1 is characterized in that: The support frame (1) is fixedly mounted with fixing ears (6) at both the front and rear ends and the left and right sides, and the two fixing ears (6) located on the same side are respectively located on both sides of the slide groove (4).

3. The high-efficiency heat dissipation PCB board for new energy vehicle lamps according to claim 1 is characterized in that: The air cooling component (5) includes a micro forward and reverse motor (51), and two micro forward and reverse motors (51) are provided. The two micro forward and reverse motors (51) are fixedly installed on the fixing ears (6) on the front and rear sides respectively. The output end of the micro forward and reverse motor (51) is fixedly installed with a screw rod (52), and the screw rod (52) is movably connected to the two fixing ears (6) on the same side. A transmission block (53) is threadedly connected to the screw rod (52), and the opposite ends of the two transmission blocks (53) are fixedly connected to a fan (54).

4. The high-efficiency heat dissipation PCB board for new energy vehicle lamps according to claim 3 is characterized in that: The two transmission blocks (53) are respectively slidably connected to the slide grooves (4) on the front and rear sides, and the fan (54) is located directly below the cooling assembly (3).

5. The high-efficiency heat dissipation PCB board for new energy vehicle lamps according to claim 1, characterized in that: The cooling assembly (3) includes a mounting frame (31), which is fixedly mounted on the lower portion of the support frame (1) and located above the fan (54). The mounting frame (31) is a structure with upper and lower openings, and a cooling pipe (32) is fixedly mounted in the mounting frame (31).

6. The high-efficiency heat dissipation PCB board for new energy vehicle lamps according to claim 5, characterized in that: The cooling pipe (32) has an S-shaped structure.

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