Small-spacing die-casting module of COB (Chip On Board) packaging lamp panel

By adopting the installation frame design in the COB packaged lamp panel, the problems of insufficient flatness and high cost are solved, and high precision assembly and low cost production are achieved.

CN223216201UActive Publication Date: 2025-08-12PANZHIHUA TENGCAI OPTOELECTRONICS CO LTD +1
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Patent Information

Application Number
CN202422639379.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-31
Publication Date
2025-08-12
Estimated Expiration
2034-10-31

AI Technical Summary

Technical Problem

In the manufacturing of existing COB packaged lamp panels, the assembly accuracy of the module is not high, the flatness between the lamp panels is insufficient and the production cost is high.

Method used

The installation frame design is adopted, and a uniform platform and reinforcement strip are set on the back of the installation frame, and a long groove is set on the front, combining die-cast aluminum material to improve processing accuracy and mechanical strength.

Benefits of technology

It improves the assembly accuracy and flatness of the module, reduces production costs, and is suitable for the splicing of small-pitch COB packaged lamp panels.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the technical field of LEDs, and relates to a small-spacing die-casting module of a COB packaging lamp panel, which comprises a lamp panel body, an adapter plate, a rear cover plate and a mounting frame, wherein the plurality of lamp panel bodies are arranged on the front surface of the mounting frame; platforms are uniformly arranged at the peripheral edge of the back surface of the mounting frame at intervals, the platforms are higher than the back surface of the mounting frame, the top surfaces of the platforms are positioned on the same plane, the platforms are propped against the rear cover plate, and the rear cover plate is fixedly connected with the mounting frame; the COB packaging module has the advantages that due to the fact that the installation frame is adopted, the long groove is formed in the front face of the installation frame, and the platform and the reinforcing strips are arranged on the back face of the installation frame, the precision of the installation frame is easier to guarantee in the machining process, the installation frame is smoother, meanwhile, the mechanical strength is larger, the production cost is lower, the assembling precision of the module can be improved, and the COB packaging module is more suitable for assembling small-interval COB packaging lamp panels. And the flatness is higher.
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Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a small-pitch die-casting module for a COB packaged lamp board. Background Art

[0002] With the rapid development of LED lighting technology, COB (Chip on Board) packaging technology has been widely used in the lighting industry due to its advantages such as high luminous efficacy, low thermal resistance, and compact structure. However, in existing COB packaging light board manufacturing technology, how to improve module assembly accuracy, ensure flatness and stability between light boards, and reduce production costs have always been urgent issues to be solved.

[0003] In the traditional COB package light panel manufacturing process, the light panel body, adapter board, and rear cover are usually manufactured separately, and then assembled manually or through semi-automated equipment. This assembly method often suffers from low assembly precision. Due to manual errors, the gaps between the light panels are large, affecting the overall aesthetics and lighting effect.

[0004] To solve the above problems, some existing technologies attempt to use die-casting dies to improve assembly accuracy and stability. However, existing die-casting dies often have the following shortcomings:

[0005] 1. The design of existing modules is too complicated, which makes processing difficult and the cost high;

[0006] 2. Due to the limitation of module structure, it is difficult to ensure the flatness between light panels;

[0007] 3. The structural design of some modules is not reasonable, which leads to problems such as deformation during use.

[0008] Therefore, it is necessary to develop a die-casting module that is more suitable for COB packaged light panels. Utility Model Content

[0009] (1) Technical issues to be resolved

[0010] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a small-pitch die-casting module for a COB packaged light board, which solves the technical problem that the flatness of the prior module is not ideal.

[0011] (2) Technical solution

[0012] In order to achieve the above-mentioned purpose, the main technical solutions adopted by this utility model include:

[0013] The present application provides a small-pitch die-casting module for a COB packaged light board, comprising a light board body, an adapter plate, a rear cover plate, and a mounting frame;

[0014] Among them, there are several light panel bodies, which are placed on the front of the installation frame, and the two are installed together;

[0015] Platforms are evenly spaced around the edges of the back of the mounting frame. The platforms are higher than the back of the mounting frame, and the top surfaces of the platforms are on the same plane. The platforms are in contact with the rear cover, and the rear cover is fixedly connected to the mounting frame.

[0016] The adapter plate is installed between the rear cover and the mounting frame. The adapter plate is electrically connected to the light board body, and its back side is exposed from the rear cover.

[0017] Optionally, the mounting frame includes a frame and longitudinal beams connected to opposite sides of the frame, the frame is provided with a platform, and the back of the longitudinal beam is provided with reinforcement strips along its length, and the platform and the reinforcement strips are higher than the plane of the back of the mounting frame.

[0018] Optionally, the front side of the mounting frame is provided with long grooves along the side frames and longitudinal beams.

[0019] Optionally, mounting ears are evenly arranged on the inner side of the frame, threads are arranged inside the mounting ears, and the magnet screws pass through the rear cover plate in sequence and are connected to the mounting ear threads.

[0020] Optionally, the rear cover is provided with an air-avoiding groove.

[0021] Optionally, four light board bodies are provided, which are sequentially mounted on the mounting frame, and a connector is provided on the back of the light board body, which is plug-connected to the adapter board.

[0022] Optionally, the platform includes a right-angled platform and a strip-shaped platform, and the right-angled platform is provided at a right angle of the frame.

[0023] Optionally, the light board body is a COB packaged light board, and the mounting frame is made of die-cast aluminum.

[0024] (3) Beneficial effects

[0025] The beneficial effects of the present invention are as follows: a small-pitch die-cast module of a COB packaged light board of the present invention adopts a mounting frame, a long groove is provided on the front of the mounting frame, and a platform and a reinforcement strip are provided on the back thereof. It is easier to ensure the accuracy of the mounting frame during processing, making it more flat. At the same time, the mechanical strength of the mounting frame is greater and the production cost is lower. Compared with the existing technology, the use of such a mounting frame can greatly improve the assembly accuracy of the module, and is more suitable for splicing small-pitch COB packaged light boards, with higher flatness. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is one of the three-dimensional schematic diagrams of a module of an embodiment of a small-pitch die-casting module for a COB packaged light board of the present invention;

[0027] Figure 2 This is a second schematic perspective view of a module of an embodiment of a small-pitch die-casting module for a COB packaged light board according to the present invention;

[0028] Figure 3 This is a schematic diagram of the module decomposition of an embodiment of a small-pitch die-casting module for a COB packaged light board of the present invention;

[0029] Figure 4 This is a schematic rear view of a module of an embodiment of a small-pitch die-casting module for a COB packaged light board of the present invention;

[0030] Figure 5 for Figure 4 Schematic diagram of the module along AA;

[0031] Figure 6 for Figure 4 Schematic diagram of the module along BB;

[0032] Figure 7 This is one of the three-dimensional schematic diagrams of a light board mounting frame of an embodiment of a small-pitch die-casting module for a COB packaged light board of the present invention;

[0033] Figure 8 This is the second three-dimensional schematic diagram of the lamp board mounting frame of an embodiment of a small-pitch die-casting module of a COB packaged lamp board of the present invention.

[0034] [Description of Reference Numerals]

[0035] 1. Light board body; 11. Connectors;

[0036] 2. Mounting frame; 21. Longitudinal beam; 22. Frame; 23. Mounting ears; 24. Platform; 25. Reinforcement strip; 26. Long slot;

[0037] 3. Adapter board;

[0038] 4. Rear cover; 41. Airtight groove; 42. Magnet screw. DETAILED DESCRIPTION

[0039] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below with reference to the accompanying drawings and through specific embodiments. Figure 3 With reference to the orientation, the direction of the light board body 1 is the "front" and the direction of the rear cover 4 is the "back".

[0040] The embodiment of the present invention proposes a small-pitch die-casting module for a COB packaged light board, comprising a light board body, an adapter plate and a back cover plate, and also a mounting frame; wherein, a plurality of light board bodies are provided and placed on the front of the mounting frame, and the two are installed together; platforms are evenly spaced around the edges of the back of the mounting frame, the platforms are higher than the back of the mounting frame, and the top surfaces of each platform are on the same plane, the platforms are in contact with the back cover plate, and the back cover plate is fixedly connected to the mounting frame; the adapter plate is installed at a position between the back cover plate and the mounting frame, the adapter plate is electrically connected to the light board body, and its back side is exposed from the back cover plate; due to the use of the mounting frame, a long groove is provided on the front of the mounting frame, and a platform and a reinforcement strip are provided on the back thereof, which makes it easier to ensure the accuracy of the mounting frame during processing and make it more flat. At the same time, the mechanical strength of the mounting frame is greater and the production cost is lower. Compared with the prior art, the use of such a mounting frame can greatly improve the assembly accuracy of the module, is more suitable for splicing COB packaged light boards with small pitches, and has higher flatness.

[0041] To better understand the above technical solution, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a clearer and more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0042] Example:

[0043] Reference Figures 1 to 3 The present application provides a small-pitch die-casting module for a COB packaged light board, including a light board body 1, an adapter plate 3, a rear cover plate 4 and a mounting frame 2.

[0044] Among them, the light board body 1 is a COB packaged light board, there are several of them, and they are placed on the front of the installation frame 2, and the two are installed together.

[0045] See Figure 3 In this embodiment, four light panel bodies 1 are provided, which are sequentially mounted on the mounting frame 2. Connectors 11 are provided on the back of the light panel bodies 1, which plug into the adapter board 3. In production applications, the number of light panel bodies 1 can be adjusted based on actual needs. The light panel bodies 1 can be mounted on the mounting frame 2 using magnets.

[0046] See Figure 7Platforms 24 are evenly spaced around the edges of the back of the mounting frame 2. The platforms 24 are higher than the back of the mounting frame 2, and the top surfaces of the platforms 24 are on the same plane. The platforms 24 abut against the rear cover 4, which is fixedly connected to the mounting frame 2. The provision of the platforms 24 makes it easier to control the precision of the mounting frame 2, reduces the difficulty in manufacturing and processing the mounting frame 2, and ensures the assembly precision and flatness of the module.

[0047] See Figures 4 to 6 The adapter plate 3 is installed between the rear cover plate 4 and the mounting frame 2. The adapter plate 3 is electrically connected to the light board body 1, and the connector on the back thereof is exposed from the rear cover plate 4.

[0048] See Figure 7 In some feasible solutions, the mounting frame 2 includes a frame 22 and a longitudinal beam 21 connected to the opposite side of the frame 22. The frame 22 is provided with a platform 24. The back of the longitudinal beam 21 is provided with a reinforcement strip 25 along its length. The platform 24 and the reinforcement strip 25 are higher than the plane of the back of the mounting frame 2.

[0049] See Figure 8 In some feasible solutions, the front of the mounting frame 2 is provided with a long groove 26 along the frame 22 and the longitudinal beam 21. Providing the long groove 26 can save production raw materials, while enhancing the mechanical strength of the mounting frame 2 and facilitating production and processing.

[0050] See Figure 3 In actual application, mounting ears 23 are evenly arranged on the inner side of the frame 22, and threads are set in the mounting ears 23. The magnet screws 42 pass through the rear cover 4 and are threadedly connected to the mounting ears 23 to install the mounting frame 2 and the rear cover 4 together.

[0051] See Figure 1 and Figure 3 The rear cover plate 4 is provided with an air-avoiding groove 41 to facilitate the connector of the adapter plate 3 to extend from the rear cover plate 4.

[0052] See Figure 7 In actual use, platforms 24 include rectangular and strip-shaped platforms. The rectangular platforms 24 are located at right angles to the frame 22, while the strip-shaped platforms 24 are located at other locations on the frame 22, including where the frame 22 connects to the longitudinal beam 21 and at the midpoint of the other opposite side of the frame 22. The provision of platforms 24, reinforcement strips 25, and elongated slots 26 not only improves the smoothness of module assembly but also enhances the operational stability of the mounting frame 2, providing greater mechanical strength.

[0053] In actual production, the mounting frame 2 is made of die-cast aluminum, and may also be made of other alloys.

[0054] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0055] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0056] In the present invention, unless otherwise expressly specified or limited, when a first feature is “above” or “below” a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, when a first feature is “above,” “above,” or “above” a second feature, it may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is “below,” “below,” or “below” a second feature, it may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0057] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "embodiment", "example", "specific example" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0058] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A small-pitch die-casting module for a COB packaged light board, comprising a light board body (1), an adapter plate (3) and a rear cover plate (4), characterized in that: Also included is a mounting frame (2); Wherein, the light panel bodies (1) are provided in plurality and are placed on the front of the mounting frame (2), and the two are mounted together; Platforms (24) are evenly spaced around the edges of the back of the mounting frame (2), the platforms (24) are higher than the back of the mounting frame (2), and the top surfaces of the platforms (24) are on the same plane, the platforms (24) are in contact with the rear cover (4), and the rear cover (4) is fixedly connected to the mounting frame (2); The adapter plate (3) is installed between the rear cover plate (4) and the mounting frame (2); the adapter plate (3) is electrically connected to the light panel body (1), and its back side is exposed from the rear cover plate (4).

2. The fine-pitch die-casting module for a COB packaged light board according to claim 1, characterized in that: The mounting frame (2) comprises a frame (22) and a longitudinal beam (21) connected to opposite sides of the frame (22); the frame (22) is provided with the platform (24); the back of the longitudinal beam (21) is provided with a reinforcing strip (25) along its length; the platform (24) and the reinforcing strip (25) are higher than the plane on which the back of the mounting frame (2) is located.

3. The fine-pitch die-casting module for a COB packaged light board according to claim 2, characterized in that: The front surface of the installation frame (2) is provided with a long groove (26) along the frame (22) and the longitudinal beam (21).

4. The fine-pitch die-casting module for a COB packaged light board according to claim 3, characterized in that: Mounting ears (23) are evenly arranged on the inner side of the frame (22), and threads are arranged inside the mounting ears (23). Magnet screws (42) pass through the rear cover plate (4) in sequence and are threadedly connected to the mounting ears (23).

5. The fine-pitch die-casting module for a COB packaged light board according to claim 4, characterized in that: The rear cover plate (4) is provided with a space-avoiding groove (41).

6. The fine-pitch die-casting module for a COB packaged light board according to claim 5, characterized in that: The light panel body (1) is provided with four pieces, which are sequentially mounted on the mounting frame (2); a connector (11) is provided on the back of the light panel body (1) and is plug-connected to the adapter board (3).

7. The fine-pitch die-casting module for a COB packaged light board according to claim 6, characterized in that: The platforms (24) include right-angled and strip-shaped platforms, and the right-angled platform (24) is arranged at a right angle of the frame (22).

8. The fine-pitch die-casting module for a COB packaged light board according to claim 1, characterized in that: The lamp panel body (1) is a COB packaged lamp panel, and the mounting frame (2) is made of die-cast aluminum.