Input device and supporting module thereof

Abstract

The utility model discloses an input device and a supporting module thereof. The input device comprises the supporting module and keys. The supporting module comprises an intermediate plate and a first buffer piece. The interposer has a first edge. The first buffer is disposed at a first edge of the interposer. The key is disposed through the interposer. Therefore, the support module is formed by the intermediate plate and the first buffer piece in advance, so that the assembly of the intermediate plate and the first buffer piece can be completed at the same time when the support module is assembled, and the assembly procedure is simplified.

Description

Technical Field

[0001] The utility model relates to an input device and a supporting module thereof. Background Art

[0002] Typically, input devices include at least a plurality of buttons. When a button is pressed, it typically generates an impact force. This impact force often produces noise and poor feedback. Therefore, improving the aforementioned conventional issues has been a goal for those skilled in the art. Utility Model Content

[0003] Therefore, the present invention proposes an input device and a supporting module thereof, which can improve the aforementioned conventional problems.

[0004] One embodiment of the present invention provides an input device. The input device includes a support module and a key. The support module includes an intermediate plate and a first buffer. The intermediate plate has a first edge. The first buffer is disposed on the first edge of the intermediate plate. The key is disposed through the intermediate plate. Because the intermediate plate and the first buffer are pre-assembled into the support module, the intermediate plate and the first buffer can be assembled simultaneously during assembly of the support module, simplifying the assembly process.

[0005] Another embodiment of the present invention provides an input device. The input device includes a support module and a button. The support module includes a circuit board and a buffer. The buffer is disposed on the circuit board. The button is disposed on and electrically connected to the circuit board. Because the circuit board and the buffer are pre-assembled into the support module, the circuit board and the buffer can be assembled simultaneously during assembly of the support module, simplifying the assembly process.

[0006] Another embodiment of the present invention provides a support module. The support module includes an intermediate board, a circuit board, and a first buffer. The intermediate board has a first edge. The circuit board is disposed relative to the intermediate board, with a first surface of the intermediate board facing the circuit board. The first buffer is disposed at the first edge, and the hardness of the intermediate board is different from the hardness of the first buffer.

[0007] In order to better understand the above and other aspects of the present invention, the following embodiments are specifically described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a schematic diagram of an input device 100 according to an embodiment of the present invention;

[0009] Figure 2A and 2B for Figure 1 Exploded views of the input device 100 at different viewing angles;

[0010] Figure 3 for Figure 2A An exploded view of the support module 110;

[0011] Figure 4A for Figure 1 A top view of the input device 100;

[0012] Figure 4B for Figure 4A A cross-sectional view of the input device 100 along direction 3B-3B';

[0013] Figure 5 This is a schematic diagram of a support module 210 according to another embodiment of the present invention;

[0014] Figure 6 This is a schematic diagram of a support module 310 according to another embodiment of the present invention;

[0015] Figure 7 FIG. 2 is a schematic diagram of an input device 200 according to another embodiment of the present invention. DETAILED DESCRIPTION

[0016] Please refer to Figures 1 to 4B , Figure 1 is a schematic diagram of an input device 100 according to an embodiment of the present invention. Figure 2A and 2B for Figure 1 Exploded views of the input device 100 at different viewing angles, Figure 3 for Figure 2A An exploded view of the support module 110, Figure 4A for Figure 1 A top view of the input device 100 is shown, and Figure 4B for Figure 4A 3B-3B' is a cross-sectional view of the input device 100.

[0017] like Figures 1-2B As shown, the input device 100 is, for example, a keyboard or other input device including buttons. The input device 100 includes a housing (e.g., including at least a first shell 102 and a second shell 104), at least one first fixing member 106, a support module 110, at least one button 120, a circuit board 130, at least one second fixing member 135, and a second buffer member 140.

[0018] like Figure 2A 、 2BAs shown in Figures 4B and 4B , the first shell 102 and the second shell 104 can be docked. For example, the first fixing member 106 can be a screw that passes through the first shell 102 and screws into the second shell 104 to fix the relative position of the first shell 102 and the second shell 104. The support module 110, the circuit board 130, and the second buffer member 140 can be disposed within the housing, for example, in the space between the first shell 102 and the second shell 104. In addition, the second shell 104 has an opening 104a to allow the button 120 to pass through. In this embodiment, the first shell 102 is, for example, a lower shell, and the second shell 104 is, for example, an upper shell.

[0019] like Figure 4B As shown, the first shell 102 includes a first abutting portion 1021, a bottom portion 1022, and an outer portion 1023. The outer portion 1023 and the first abutting portion 1021 are connected to the bottom portion 1022, and the first abutting portion 1021 is closer to the circuit board 130 than the outer portion 1023. The second shell 104 includes a second abutting portion 1041 and an outer portion 1042 connected thereto. In this embodiment, the outer portion 1023 of the first shell 102 abuts the outer portion 1042 of the second shell 104. The first abutting portion 1021 and the second abutting portion 1041 are respectively located on opposite sides of the support module 110 to clamp the support module 110. In this embodiment, the second abutting portion 1041 is, for example, the upper portion of the second shell 104. Furthermore, the inner side of the shell has at least one abutting portion that contacts the support module 110. For example, the abutting portion may contact the first buffer member 112 of the support module 110. For example, the first abutting portion 1021 of the first shell 102 and / or the second abutting portion 1041 of the second shell 104 may contact the first buffer 112. The first abutting portion 1021 of the first shell 102 and the second abutting portion 1041 of the second shell 104 may abut opposite sides of the first buffer 112 respectively.

[0020] like Figures 1-2B As shown, the support module 110 includes an intermediate plate 111 and at least one first buffer member 112. The intermediate plate 111 has a first edge 111e1, and the first buffer member 112 is disposed on the first edge 111e1 of the intermediate plate 111. The button 120 can be placed through the intermediate plate 111. In this embodiment, the intermediate plate 111 and the at least one first buffer member 112 are preassembled to form the support module 110. This allows the intermediate plate 111 and the first buffer member 112 to be assembled simultaneously during assembly of the support module 110, simplifying the assembly process.

[0021] In another embodiment, the support module 110 includes an intermediate board 111, at least one first buffer 112, and a circuit board 130. That is, the circuit board 130 is a subassembly of the support module 110. The intermediate board 111 and the circuit board 130 may be disposed opposite to each other.

[0022] like Figure 4B As shown, the support module 110 can be disposed between the first shell 102 and the second shell 104. For example, the first abutting portion 1021 of the first shell 102 and the second abutting portion 1041 of the second shell 104 are respectively located on opposite sides of the support module 110 to clamp the support module 110, such as the first buffer 112.

[0023] like Figure 4B As shown, the support module 110 can be disposed between the first shell 102 and the second shell 104. For example, the first shell 102 includes a first abutting portion 1021, and the second shell 104 includes a second abutting portion 1041. The first abutting portion 1021 and the second abutting portion 1041 are respectively located on opposite sides of the first buffer 112 to clamp the first buffer 112. In addition, the first shell 102 further includes a bottom 1022 and an outer portion 1023, wherein the outer portion 1023 and the first abutting portion 1021 are connected to the bottom 1022, and the first abutting portion 1021 is closer to the circuit board 130 than the outer portion 1023. The second shell 104 further includes an outer portion 1042, and the second abutting portion 1041 is connected to the outer portion 1042. In this embodiment, the second abutting portion 1041 is, for example, the upper portion of the second shell 104.

[0024] like Figure 2A and 2B As shown, the interposer 111 has at least one first through-hole 111a (e.g., which can serve as an opening for the support module 110) to allow the button 120 to pass through. The first through-hole 111a exposes a portion of the surface of the circuit board 130. The button 120 can be positioned corresponding to the first through-hole 111a. In one embodiment, the inner dimension of the first through-hole 111a can be substantially equal to or smaller than an outer dimension of the button 120 (or switch 121), allowing the button 120 (or switch 121) to engage with the first through-hole 111a, thereby fixing the relative position between the interposer 111 and the button 120. In another embodiment, the inner dimension of the first through-hole 111a can also be larger than the outer dimension of the button 120 (or switch 121). The main body of the interposer 111 is, for example, a flat plate. In one embodiment, the interposer 111 is a flat plate with positioning / engaging portions, such as bent or protruding portions. The interposer 111 can be manufactured using methods such as stamping or injection molding. In terms of material, the interposer 111 is, for example, a metal plate or a polymer (such as plastic) plate.

[0025] In another embodiment, the interposer 111 may be a circuit board. For example, the interposer 111 includes at least one circuit structure, the key 120 may be electrically connected to the circuit structure, and / or the input device 100 may selectively omit the circuit board 130 .

[0026] like Figure 2A 、 2BAs shown in Figures 4B and 4B, in this embodiment, the intermediate plate 111 and the first buffer member 112 can be in direct contact. In terms of process, after the intermediate plate 111 is formed, the first buffer member 112 can be formed on the intermediate plate 111 using double-material injection molding technology. In addition, the first buffer member 112 is made of elastic or deformable materials such as rubber, foam, silicone, polymer resin, etc. Due to the buffering effect of the first buffer member 112, when the button 120 is pressed, there will be a gentle rebound feedback feel. In addition, although Figure 3 The intermediate board 111 and the first buffer member 112 are shown exploded. This is to more clearly illustrate the structures of the first buffer member 112 and the intermediate board 111 . In reality, the first buffer member 112 and the intermediate board 111 cannot be easily separated.

[0027] In terms of hardness, the hardness of the intermediate plate 111 and the hardness of the first buffer 112 may be different, or may be the same. In one embodiment, the hardness of the first buffer 112 is lower than the hardness of the intermediate plate 111 .

[0028] like Figure 2A 、 2B , 3 and 4B, the intermediary board 111 has a first surface 111b and a second surface 111u opposite to each other, wherein the first surface 111b faces the circuit board 130 or the second buffer 140, and the second surface 111u faces the keycap 122 or the second shell 104. The first buffer 112 extends from the first surface 111u to the second surface 111b of the intermediary board 111. The first buffer 112 is disposed on two opposite sides of the intermediary board 111. For example, the first buffer 112 can clamp the first surface 111b and the second surface 111u of the intermediary board 111, thereby increasing the contact area between the first buffer 112 and the intermediary board 111 and improving the bonding between the first buffer 112 and the intermediary board 111.

[0029] like Figure 4B As shown, a portion of the interposer 111 protrudes beyond the edge of the circuit board 130, and the first buffer 112 may be located outside the edge of the circuit board 130. For example, the interposer 111 further has a third edge 111e3 opposite the first edge 111e1, as well as second and fourth edges 111e2 and 111e4 opposite to each other. The first edge 111e1 connects the second and fourth edges 111e2 and 111e4, and the third edge 111e3 also connects the second and fourth edges 111e2 and 111e4. The edge of the interposer 111 protrudes beyond the edge of the circuit board 130. For example, at least one of the first edge 111e1, second edge 111e2, third edge 111e3, and fourth edge 111e4 of the interposer 111 protrudes beyond the corresponding edge of the circuit board 130.

[0030] like Figures 2A-2BAs shown, there are multiple first buffer members 112, and these first buffer members 112 can be configured separately. One or more of these first buffer members 112 can be configured on at least one of the second edge 111e2, the third edge 111e3, and the fourth edge 111e4. In this embodiment, the first edge 111e1 is described as the short side of the intermediary board 111, and the second edge 111e2 is described as the long side of the intermediary board 111. However, in another embodiment, the first edge 111e1 can be the long side of the intermediary board 111, and the second edge 111e2 can be the short side of the intermediary board 111. In other embodiments, one of the first edge 111e1, the second edge 111e2, the third edge 111e3, and the fourth edge 111e4 can be any side of the intermediary board 111. To provide uniform support, the oppositely arranged first buffer members 112 can be arranged symmetrically. For example, the first buffer member 112 disposed on the first edge 111e1 and the first buffer member 112 disposed on the third edge 111e3 may be symmetrically arranged, and / or the first buffer member 112 disposed on the second edge 111e2 and the first buffer member 112 disposed on the fourth edge 111e4 may be symmetrically arranged. "Symmetrical arrangement" herein refers, for example, to symmetry in number and / or position. However, the present invention does not limit the number and / or arrangement positions of the first buffer members 112. Furthermore, the first buffer members 112 may be structurally similar or identical.

[0031] like Figures 2A-2B As shown, each key 120 includes a switch 121 and a keycap 122. The switch 121 is disposed on and electrically connected to the circuit board 130, while the keycap 122 can be connected to (e.g., inserted into) the switch 121. When the keycap 122 is pressed, the switch 121 is triggered to perform the corresponding function. When the keycap 122 is released, the switch 121 rebounds to return to the untriggered state. In this embodiment, the switch 121 is, for example, snap-fitted to the circuit board 130.

[0032] like Figure 4B As shown, the circuit board 130 has at least one opening 130a, and the switch 121 of the button 120 can be positioned corresponding to the opening 130a. For example, the pin 1211 of the switch 121 can be inserted into the opening 130a of the circuit board 130. In this embodiment, the circuit board 130 can be a subassembly of the support module 110, but the present invention is not limited to this.

[0033] In another embodiment, the input device 100 further includes at least one socket (not shown). The socket can be soldered to the first side 130b of the circuit board 130 and electrically connected to the circuit board 130, with a socket exposed from the second side 130u of the circuit board 130. The switch 121 can be inserted into the socket of the socket from the second side 130u of the circuit board 130 to be electrically connected to the circuit board 130 via the socket.

[0034] like Figure 2A 、 2B As shown, the circuit board 130 and the support module 110 can be fixed to each other. For example, the second fixing member 135 is a screw that can pass through the circuit board 130 and screw into the support module 110 to fix the relative position of the circuit board 130 and the support module 110. In one embodiment, the support module 110 further includes at least one fixing post 115 that can be fixed to the first surface 111b of the interposer 111. The second fixing member 135 can pass through the circuit board 130 and screw into the fixing post 115 of the support module 110 to fix the relative position of the circuit board 130 and the interposer 111.

[0035] like Figure 2A 、 2B As shown in Figures 3 and 4B, the second buffer member 140 can be disposed between the interposer 111 and the circuit board 130. For example, the second buffer member 140 can be disposed between the first surface 111b of the interposer 111 and the second surface 130u of the circuit board 130. The second buffer member 140 can be disposed on at least a portion of the surface of the circuit board 130, such as at least a portion of the second surface 130u. In other embodiments, any buffer material located between the interposer 111 and the circuit board 130 (including the portion of the first buffer member 112 located on the first surface 111b) can be considered the second buffer member 140 of the present application. The second buffer member 140 can be disposed on the first surface 111b of the interposer 111. The second buffer member 140 is located between the first buffer members 112, for example, the first buffer members 112 surround the second buffer member 140. In this embodiment, the second buffer member 140 can be formed separately and then disposed between the interposer 111 of the support module 110 and the circuit board 130. In addition, the second buffer member 140 may be in direct contact with the first surface 111 b of the interposer 111 , or may be in indirect contact with the first surface 111 b of the interposer 111 through other components (eg, an adhesive layer or other components).

[0036] like Figure 2A 、 2BAs shown in Figures 3 and 4B, the second buffer member 140 has at least one second through hole 140a. The second through hole 140a may expose a portion of the surface of the circuit board 130. The second through hole 140a allows the switch 121 to pass through, preventing interference between the second buffer member 140 and the switch 121. The aforementioned button 120 may be positioned corresponding to the second through hole 140a. In one embodiment, the second through hole 140a of the second buffer member 140 aligns with or overlaps the first through hole 111a of the interposer 111, forming an opening, and the button 120 may be positioned corresponding to this opening. Furthermore, the material of the second buffer member 140 may be the same as that of the first buffer member 112. The second buffer member 140 may absorb noise, reduce vibration, and / or fill gaps caused by height differences between different components. Furthermore, the length of the second buffer member 140 may be shorter than the length of the interposer 111. For example, the length of the second buffer member 140 in one direction (e.g., the X-axis or the Y-axis) may be shorter than the length of the interposer 111 in the same direction. In addition, the entire projection area of the second buffer 140 (eg, along the Z-axis) onto the intermediate plate 111 may at least partially overlap with the intermediate plate 111 , but the present invention is not limited thereto.

[0037] In one method of assembling the input device 100, the pins 1211 of the switch 121 can be inserted into the circuit board 130, and solder paste 137 can be formed to connect the pins 1211 of the switch 121 to the circuit board 130. The second buffer member 140 is then assembled between the support module 110 and the circuit board 130, and the keycap 122 and switch 121 are assembled, and the first shell 102 and second shell 107 are assembled. The assembled structure is then heated (e.g., by furnace soldering) to melt the solder paste and solder the pins 1211 of the switch 121 to the circuit board 130. Because the interposer 111 and at least one first buffer member 112 can be pre-assembled into the support module 110, the interposer 111 and the first buffer member 112 can be assembled simultaneously during assembly of the support module 110, simplifying the overall assembly process. Furthermore, as long as the support module 110 of the present invention is employed, other methods of assembling the input device 100 can achieve the same simplified assembly process.

[0038] In the aforementioned embodiment, the switch 121 and the circuit board 130 are connected by solder paste as an example. However, in another embodiment, the switch 121 can be hot-plugged into the circuit board 130 .

[0039] Please refer to Figure 5 , which is a schematic diagram of a support module 210 according to another embodiment of the present invention. The support module 110 of the aforementioned input device 100 can be replaced by support module 210. Support module 210 includes an intermediate board 111 and a first buffer 212. Support module 210 includes the same or similar technical features as the aforementioned support module 110, with at least one difference being that the first buffer 212 is structurally different from the first buffer 112.

[0040] like Figure 5 As shown, the number of the first buffer member 212 is single. The first buffer member 212 is, for example, a ring member that can continuously extend from one edge of the intermediate plate 111 to the other edge. In this embodiment, the first buffer member 212 is a closed ring member that can continuously extend along the first edge 111e1, the second edge 111e2, the third edge 111e3 and the fourth edge 111e4 of the intermediate plate 111 (the first edge 111e1, the second edge 111e2, the third edge 111e3 and the fourth edge 111e4 are shown in FIG. Figure 3 ), for example, the first buffer member 212 extends continuously from the first edge 111e1 to the second edge 111e2, continuously from the second edge 111e2 to the third edge 111e3, continuously from the third edge 111e3 to the fourth edge 111e4, and continuously from the fourth edge 111e4 to the first edge 111e1 to form a closed ring member. In another embodiment, the first buffer member 212 is an open ring member that may extend continuously along some of the first edge 111e1, the second edge 111e2, the third edge 111e3, and the fourth edge 111e4 of the intermediate plate 111. For example, the first buffer member 212 extends continuously from the first edge 111e1 to the second edge 111e2 to form an open ring member. In other embodiments, there are a plurality of first buffer members 212, wherein each first buffer member 212 extends from one edge of the intermediate plate 111 to the other edge. Furthermore, the manufacturing methods and / or materials of the intermediate board 111 and the first buffer member 212 are similar to or the same as those of the aforementioned intermediate board 111 and the first buffer member 112 , and are not further described herein.

[0041] Furthermore, the assembly method for an input device utilizing support module 210 is identical or similar to the assembly method for an input device utilizing support module 110 described above, and will not be further elaborated here. Similarly, since interposer 111 and first buffer member 212 pre-assemble support module 210, assembly of interposer 111 and first buffer member 212 can be completed simultaneously during assembly of support module 210, simplifying the overall assembly process. Furthermore, other different assembly methods can still achieve the same simplified assembly process.

[0042] In addition, in another embodiment, the supporting module 210 includes an intermediate board 111, a first buffer member 212 and a circuit board 130 (the circuit board 130 is shown in FIG. Figure 2A ), that is, the circuit board 130 is a subcomponent of the support module 210.

[0043] Please refer to Figure 6, which is a schematic diagram of a support module 310 according to another embodiment of the present invention. The support module 110 and second buffer 140 of the aforementioned input device 100 can be replaced with the support module 310. The support module 310 includes an intermediate board 111, at least one first buffer 112, and a second buffer 140. In this embodiment, the second buffer 140 corresponds to at least one edge of the intermediate board 111 (e.g., at least one of the first edge 111e1, the second edge 111e2, the third edge 111e3, and the fourth edge 111e4) and is disposed opposite the first buffer 112.

[0044] The support module 310 includes the same or similar technical features as the aforementioned support module 110 , with at least one difference being that the intermediate plate 111 , at least one first buffer component 112 , and the second buffer component 140 of the support module 310 may be an integrally formed structure.

[0045] In terms of process, after forming the intermediate plate 111, double-injection molding technology can be used to form the first buffer member 112 and the second buffer member 140 on the intermediate plate 111, wherein the first buffer member 112 and the second buffer member 140 can be formed at the same time (for example, in the same set of molds), but can also be formed at different times (for example, in two different sets of molds).

[0046] The assembly method for an input device utilizing support module 310 is identical or similar to the assembly method for the input device utilizing support module 110 described above and will not be further described here. Because interposer 111, first buffer member 112, and second buffer member 140 are preassembled into support module 310, the interposer 111, first buffer member 112, and second buffer member 140 can be assembled simultaneously during assembly of support module 310, simplifying the overall assembly process. Furthermore, other assembly methods can still achieve the same simplified assembly process.

[0047] In addition, in another embodiment, the supporting module 310 includes an intermediate board 111, at least one first buffer 112, a second buffer 140 and a circuit board 130 (the circuit board 130 is shown in FIG. Figure 2A ), that is, the circuit board 130 is a subcomponent of the support module 310.

[0048] Although not shown, in another embodiment, Figure 5 The intermediate plate 111 and the first buffer member 212 are Figure 6 The second cushioning member 140 can be an integrally formed structure. Regarding the process, after forming the intermediate plate 111, a double-injection molding technique can be used to form the first cushioning member 212 and the second cushioning member 140 on the intermediate plate 111. The first cushioning member 212 and the second cushioning member 140 can be formed simultaneously (e.g., in the same mold), or can be formed at different times (e.g., in two different molds).

[0049] Please refer to Figure 7 , which is a schematic diagram of an input device 200 according to another embodiment of the present invention. Input device 200 includes a first housing 102, a second housing 104, at least one first fixing member 106 (not shown), a support module 410, at least one button 120, a circuit board 130, at least one second fixing member 135 (not shown), and at least one solder paste 137 (not shown).

[0050] The supporting module 410 includes the same or similar technical features as the aforementioned supporting module 110 , with at least one difference being that the supporting module 410 omits the intermediate plate 111 and the second buffer 140 .

[0051] like Figure 7 As shown, the first shell 102 includes a first abutting portion 1021, a bottom portion 1022, and an outer portion 1023. The outer portion 1023 and the first abutting portion 1021 are connected to the bottom portion 1022, and the first abutting portion 1021 is closer to the circuit board 130 than the outer portion 1023. Unlike the aforementioned input device 100, the first abutting portion 1021 of the first shell 102 of the input device 200 abuts the circuit board 130. The second shell 104 includes a second abutting portion 1041 and an outer portion 1042 connected thereto. In this embodiment, the outer portion 1023 of the first shell 102 abuts the outer portion 1042 of the second shell 104. The first abutting portion 1021 and the second abutting portion 1041 are located on opposite sides of the support module 110 to clamp the support module 410. In this embodiment, the second abutting portion 1041 is, for example, located at the upper portion of the second shell 104.

[0052] like Figure 7 As shown, the support module 410 includes a circuit board 130 and at least one first buffer member 412. The circuit board 130 and the at least one first buffer member 412 of the support module 410 can be an integrally formed structure. The first buffer member 412 can be configured on at least a portion of the surface of the circuit board 130, such as at least a portion of the second surface 130u and at least a portion of the first surface 130b. In this embodiment, the first buffer member 412 can be in direct contact with the circuit board 130. In terms of process, after the circuit board 130 is formed, a double-shot molding technology can be used to form the first buffer member 412 on the circuit board 130. In another embodiment, similar to the aforementioned first buffer member 212, the first buffer member 412 of the support module 410 can be a ring member, such as an open ring member or a closed ring member.

[0053] In summary, embodiments of the present invention provide an input device and a support module therefor, comprising at least two components, wherein the at least two components can be integrally formed using a suitable process. In one embodiment, the support module includes, for example, at least two of an interposer, a first buffer, a second buffer, and a circuit board. Thus, since the at least two components can be pre-assembled into the support module, the at least two components can be assembled simultaneously during assembly of the support module, simplifying the assembly process. Furthermore, the interposer can be a circuit board (e.g., including at least one circuit structure) or a carrier board without circuit functionality.

[0054] In summary, although the present invention has been disclosed above with reference to the embodiments, these are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations are possible without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended patent claims.

Claims

1. An input device, characterized in that: include: A support module, comprising: an interposer having a first edge; and a first buffer member disposed on the first edge of the intermediate board; and A button is configured through the intermediary board; A housing is provided, wherein the intermediate plate and the first buffer component are located inside the housing, wherein the inner side of the housing has a contact portion, and the contact portion contacts the first buffer component.

2. The input device according to claim 1, wherein The intermediate plate and the first buffer component are integrally formed, or the intermediate plate is in direct contact with the first buffer component.

3. The input device according to claim 1, wherein The intermediate board further has a second edge, and the supporting module includes: The plurality of first buffer members are separately disposed on the first edge and the second edge of the intermediate board.

4. The input device according to claim 1, wherein The intermediate board further has a second edge, and the first buffer component continuously extends from the first edge to the second edge.

5. The input device according to claim 1, wherein The support module further includes: a circuit board electrically connected to the button; and A second buffer is disposed between the intermediate board and the circuit board, wherein the intermediate board has a first through hole, the second buffer has a second through hole corresponding to the first through hole, and the button is disposed corresponding to the first through hole and the second through hole.

6. The input device according to claim 1, wherein The intermediate board includes a circuit structure, the button is electrically connected to the circuit structure, and the first buffer is configured on two opposite sides of the intermediate board.

7. An input device, characterized in that: include: A support module, comprising: a circuit board; and a buffer member disposed on the circuit board; and a button, disposed on and electrically connected to the circuit board; A shell body, the supporting module is located inside the shell body, wherein the inner side of the shell body has an abutting portion, and the abutting portion contacts the buffer component.

8. The input device according to claim 7, wherein: The buffer component is arranged on at least a portion of the surface of the circuit board.

9. The input device according to any one of claims 1 to 8, wherein: The supporting module has an opening. The key includes a key cap and a switch. The key cap is connected to the switch, and the switch is arranged corresponding to the opening.

10. A support module, characterized in that: include: an interposer having a first edge; a circuit board disposed relative to the intermediary board, with a first surface of the intermediary board facing the circuit board; as well as A first buffer is disposed on the first edge. The hardness of the intermediate board is different from that of the first buffer.

11. The support module according to claim 10, wherein: The intermediate plate and the first buffer are integrally formed. The intermediate plate has a first surface and a second surface opposite to each other. The first buffer extends from the first surface to the second surface corresponding to the first edge.

12. The support module according to claim 10, wherein: A portion of the intermediate board protrudes from an edge of the circuit board, and the first buffer component is located outside the edge of the circuit board.

13. The support module according to claim 10, wherein: The intermediate board has a second edge connected to the first edge, and the supporting module includes: The plurality of first buffer members are separately disposed on the first edge and the second edge of the intermediate board.

14. The support module according to claim 10, wherein: The intermediary board has a first through hole, and the first through hole exposes a portion of the surface of the circuit board.

15. The support module according to any one of claims 10 to 14, characterized in that: The support module further includes: A second buffer is disposed corresponding to the first surface of the intermediary board. The second buffer has a second through hole. The second through hole exposes a portion of the surface of the circuit board.

16. The support module according to claim 15, wherein: The length of the second buffer member in one direction is smaller than the length of the intermediate plate in the same direction. The first through hole of the intermediate plate is aligned with the second through hole of the second buffer member to form an opening.

17. The support module according to claim 15, wherein: The second buffer component is corresponding to the first edge of the intermediate plate and is disposed opposite to the first buffer component. The first buffer component, the second buffer component and the intermediate plate are an integrally formed structure.

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