Power module, motor controller, electric drive assembly and vehicle

Abstract

The utility model relates to a power module, a motor controller, an electric drive assembly and a vehicle. The power module comprises a plastic package body; the substrate is plastically packaged in the plastic packaging body; the signal pin is arranged outside the plastic package body; and the conductive block is plastically packaged in the plastic packaging body and is electrically connected with the substrate, one side, far away from the substrate, of the conductive block is provided with a connecting end surface, and the connecting end surface is exposed out of the plastic packaging body so as to be electrically connected with the signal pin. The signal pin is electrically connected with the substrate through the conductive block, the conductive block is plastically packaged in the plastic package body, and the signal pin is located outside the plastic package body and does not make contact with the plastic package body, so that the situation that the plastic package body is broken due to inclination of the signal pin can be avoided, the reliable performance of the power module is guaranteed, and insulation failure of the power module is avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of power devices, and in particular to a power module, a motor controller, an electric drive assembly, and a vehicle. Background Art

[0002] Plastic-encapsulated power modules, due to their excellent temperature resistance, compact size, and high power density, have become the primary design option for power modules. The placement of signal pins in plastic-encapsulated power modules significantly impacts module performance. In related art, signal pins are placed in the middle of the plastic body to achieve the shortest drive path. However, if the signal pins extend directly through the plastic body, manufacturing tolerances can cause stress at the base of the pins within the plastic body when they are assembled into the circuit board holes. This can lead to cracking at the junction between the pins and the plastic body, and even cause insulation failure in the power module. Utility Model Content

[0003] To overcome the problems existing in the related art, the present disclosure provides a power module, a motor controller, an electric drive assembly and a vehicle.

[0004] According to a first aspect of an embodiment of the present disclosure, a power module is provided, comprising: a plastic package body; a substrate, plastic-encapsulated in the plastic package body; a signal pin, arranged outside the plastic package body; and a conductive block, plastic-encapsulated in the plastic package body and electrically connected to the substrate, wherein the conductive block has a connection end face on a side away from the substrate, and the connection end face is exposed outside the plastic package body to be electrically connected to the signal pin.

[0005] Optionally, the expansion coefficient of the conductive block is within a deviation range of ±5% of the expansion coefficient of the plastic package body.

[0006] Optionally, the conductive block is made of copper-molybdenum alloy, and the plastic package is made of epoxy resin.

[0007] Optionally, a concave-convex structure is formed on the circumference of the conductive block for contacting the plastic package body.

[0008] Optionally, the conductive block is cylindrical, and the concave-convex structure includes an annular groove and / or an annular boss formed in the circumference of the conductive block.

[0009] Optionally, the connecting end surface is flush with an end surface of the plastic package body.

[0010] Optionally, a solder layer is provided between the conductive block and the substrate.

[0011] Optionally, the signal pin is welded to the connection end surface.

[0012] Optionally, in a view projected along the extending direction of the signal pin, the outer contour of the conductive block surrounds the outer contour of the signal pin.

[0013] According to a second aspect of an embodiment of the present disclosure, a motor controller is provided, comprising the power module provided by the present disclosure.

[0014] According to a third aspect of an embodiment of the present disclosure, an electric drive assembly is provided, comprising the motor controller provided by the present disclosure.

[0015] According to a fourth aspect of an embodiment of the present disclosure, a vehicle is provided, comprising the electric drive assembly provided by the present disclosure.

[0016] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: the signal pin is electrically connected to the substrate through the conductive block, and the conductive block is plastic-encapsulated in the plastic package, while the signal pin is located outside the plastic package and does not come into contact with the plastic package. Therefore, the situation in which the plastic package is broken due to the tilt of the signal pin can be avoided, thereby ensuring the reliable performance of the power module and avoiding insulation failure of the power module.

[0017] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0019] Figure 1 FIG1 is a partial structural cross-sectional view of a power module according to an exemplary embodiment.

[0020] Figure 2 FIG. 4 is a schematic structural diagram of a conductive block according to an exemplary embodiment.

[0021] Figure 3 is a schematic structural diagram of a conductive block according to another exemplary embodiment.

[0022] Figure 4 FIG. 4 is a schematic structural diagram of a conductive block according to another exemplary embodiment.

[0023] Figure 5 FIG. 4 is a schematic structural diagram of a conductive block according to another exemplary embodiment.

[0024] Figure 6 FIG. 4 is a schematic structural diagram of a conductive block according to another exemplary embodiment.

[0025] Figure 7 FIG. 4 is a schematic structural diagram of a conductive block according to another exemplary embodiment.

[0026] Description of Reference Numerals

[0027] 10 - plastic package body, 20 - substrate, 21 - first copper plate, 22 - ceramic plate, 23 - second copper plate, 30 - signal pin, 40 - conductive block, 41 - connection end face, 42 - annular groove, 43 - annular boss, 50 - solder layer. DETAILED DESCRIPTION

[0028] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0029] In the prior art, a plastic-encapsulated power module generally includes a substrate, a signal pin, and a plastic encapsulation body, wherein the substrate is plastic-encapsulated in the plastic encapsulation body, and the signal pin is connected to the substrate and passes through the plastic encapsulation body. In this design, the signal pin extends from the plastic encapsulation body. This method can lead out the control signal from the nearest position of the chip, thereby eliminating the mutual inductance crosstalk between the signal traces and the power traces, and at the same time can achieve the shortest signal drive path and reduce the influence of the parasitic parameters of the drive path. However, with this method of arranging the signal pin, the signal pin will extend directly from the plastic encapsulation body. When the signal pin is assembled into the circuit board hole, due to the manufacturing tolerances of the signal pin and the circuit board hole, stress will exist at the root of the signal pin after assembly, causing the junction between the signal pin and the plastic encapsulation to crack easily. The crack propagation will cause the insulation failure of the power module.

[0030] In order to solve the above problems, the first aspect of the embodiment of the present disclosure provides a power module, such as Figure 1 As shown, the power module in the embodiment of the present disclosure includes a signal pin 30, a plastic package body 10, and a substrate 20 plastic-encapsulated in the plastic package body 10. In addition, it also includes a conductive block 40 plastic-encapsulated in the plastic package body 10. The conductive block 40 is electrically connected to the substrate 20 and can be attached to the surface of the substrate 20. The conductive block 40 has a connecting end face 41 on a side away from the substrate 20. The connecting end face 41 is exposed outside the plastic package body 10 to be electrically connected to the signal pin 30. Therefore, the signal pin 30 connected to the connecting end face 41 can be set outside the plastic package body 10, that is, there is no contact between the signal pin 30 and the plastic package body 10.

[0031] Through the above technical solution, the signal pin 30 is electrically connected to the substrate 20 through the conductive block 40, and the conductive block 40 is plastic-encapsulated in the plastic encapsulation body 10, while the signal pin 30 is located outside the plastic encapsulation body 10 and does not come into contact with the plastic encapsulation body 10. Therefore, the situation in which the plastic encapsulation body 10 is broken due to the tilt of the signal pin 30 can be avoided, thereby ensuring the reliable performance of the power module and avoiding insulation failure of the power module.

[0032] Among them, reference Figure 1 The substrate 20 may include a first copper plate 21, a second copper plate 23, and a ceramic plate 22 sandwiched between the first copper plate 21 and the second copper plate 23. The first copper plate 21, the ceramic plate 22, and the second copper plate 23 may be welded to each other. The first copper plate 21 is used to connect to the conductive block 40, and the second copper plate 23 is used to be placed on the heat sink to transfer heat to the heat sink for dissipation. The ceramic plate 22 serves as an insulating layer between the first copper plate 21 and the second copper plate 23 and has good thermal conductivity to transfer heat from the first copper plate 21 to the second copper plate 23 for dissipation.

[0033] In the disclosed embodiment, the conductive block 40 can be configured to have an expansion coefficient within a ±5% deviation range of the expansion coefficient of the plastic package 10, thereby minimizing the difference in expansion coefficient between the conductive block 40 and the plastic package 10. When the difference in expansion coefficient between the conductive block 40 and the plastic package 10 is significant, the conductive block 40 and the plastic package 10 may interact with each other during repeated hot and cold cycles, ultimately leading to cumulative damage and cracking of the junction between the conductive block 40 and the plastic package 10, thereby preventing the plastic package 10 from cracking due to interaction between the conductive block 40 and the plastic package 10.

[0034] In one embodiment, the conductive block 40 can be made of a copper-molybdenum alloy, and the plastic package body 10 can be made of an epoxy resin. Epoxy resin has good plastic sealing properties, and the copper-molybdenum alloy has good electrical conductivity, and the expansion coefficient of the copper-molybdenum alloy can be close to that of the epoxy resin.

[0035] According to one embodiment of the present disclosure, a concave-convex structure is formed on the circumference of the conductive block 40 for contact with the plastic package 10. The concave-convex structure can increase the connection area between the conductive block 40 and the plastic package 10, and the uneven bonding surface of the concave-convex structure can increase the bonding force between the conductive block 40 and the plastic package 10, ensuring that the conductive block 40 is stable and reliable within the plastic package 10, and preventing the plastic package 10 from cracking due to shaking relative to the conductive block 40.

[0036] Reference Figure 2 , the conductive block 40 can be constructed as a cylindrical shape, referring to Figure 6 and Figure 7The concave-convex structure can include an annular groove 42 or an annular boss 43 formed on the circumference of the conductive block 40, or both. The concave-convex structure of the annular groove 42 and the annular boss 43 is easier to form and can increase the bonding force around the circumference, ensuring uniform bonding force and avoiding localized weak bonding force that may lead to cracking.

[0037] In other embodiments, the conductive block 40 may be Figure 3 The quadrangular prism shown, or Figure 4 The triangular prism shown, or Figure 5 The hexagonal prism and other polyhedral prisms shown may also be variable diameter structures, which are not specifically limited in this disclosure. The concave-convex structure may also be convex or concave in other shapes, not limited to the annular boss 43 or annular groove 42 described above.

[0038] In the embodiment of the present disclosure, the connecting end face 41 can be set to be flush with the end face of the plastic package body 10 to ensure that the circumference of the conductive block 40 can be fully plastic-encapsulated and to ensure that it has good bonding force with the conductive block 40, thereby avoiding the plastic package body 10 from having a position that is not bonded to other structures and ensuring the plastic sealing strength of the plastic package body 10.

[0039] In other embodiments, the top of the plastic package body 10 may be slightly higher than the connecting end surface 41 , and plastic packaging may be performed on the surface of the connecting end surface 41 , but the plastic packaging area will not contact the signal pin 30 .

[0040] like Figure 1 As shown, a solder layer 50 may be provided between the conductive block 40 and the substrate 20. The conductive block 40 may be connected to the substrate 20 by welding, such as using tin solder, or using silver paste or copper paste used for sintering as solder.

[0041] In the embodiment of the present disclosure, the signal pin 30 can be welded to the connection end surface 41. For example, the welding can be performed by ultrasonic welding or soldering, which is not limited in the present disclosure.

[0042] To ensure sufficient mounting area for the signal pin 30, in the disclosed embodiment, the outer contour of the conductive block 40 can encompass the outer contour of the signal pin 30 when projected along the extension direction of the signal pin 30. In other words, the area of the connecting end face 41 is larger than the area of the end face of the signal pin 30 to which it is connected, thereby ensuring stable mounting of the signal pin 30.

[0043] According to a second aspect of the present disclosure, a motor controller is provided, which includes the aforementioned power module and has all the advantages of the aforementioned power module, which will not be described in detail here. Other communication of the motor controller is well known to those skilled in the art and will not be described in detail here.

[0044] According to a third aspect of an embodiment of the present disclosure, an electric drive assembly is provided, comprising a motor and the above-mentioned motor controller, and having all the beneficial effects of the above-mentioned motor controller, which will not be repeated here.

[0045] According to a fourth aspect of an embodiment of the present disclosure, a vehicle is provided, which may be an electric vehicle. The vehicle includes the above-mentioned electric drive assembly and has all the beneficial effects of the above-mentioned electric drive assembly, which will not be repeated here.

[0046] In the foregoing detailed description, reference is made to the accompanying drawings, which illustrate, by way of illustration, specific aspects of the present disclosure in which it may be practiced. In this regard, terms indicating directions or expressing positional relationships, such as "center," "longitudinal," "lateral," "length," "width," "thickness," "up," "down," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc., may be used with reference to the orientation of the figures being described. Since the components of the described devices may be positioned in a plurality of different orientations, the directional terms may be used for illustrative purposes rather than restrictive. It should be understood that other aspects may be utilized and structural or logical changes may be made without departing from the concepts of the present disclosure. Therefore, the following detailed description should not be taken in a limiting sense.

[0047] It should be understood that, unless otherwise specifically noted, the features of the various embodiments of the present disclosure described herein may be combined with each other. As used herein, the term "and / or" includes any one of the relevant listed items and any combination of any two or more thereof; similarly, "at least one of" includes any one of the relevant listed items and any combination of any two or more thereof.

[0048] It should be understood that, unless otherwise expressly specified or limited, the terms "join," "attach," "install," "connect," "connect," "fix," etc. used in the embodiments of the present disclosure should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrated; they can be mechanically connected, electrically connected, or communicable with each other; they can be directly connected, or indirectly connected through an intermediate medium, and they can be internally connected between two elements or an interactive relationship between two elements, unless otherwise expressly limited. For those skilled in the art, the specific meanings of the above terms in this article can be understood according to specific circumstances.

[0049] Additionally, the term "over" as used in reference to a component, element, or material layer being formed "over" or located "over" a surface may be used herein to mean that the component, element, or material layer is "indirectly" positioned (e.g., placed, formed, deposited, etc.) on the surface such that one or more additional components, elements, or layers are disposed between the surface and the component, element, or material layer. However, the term "over" as used in reference to a component, element, or material layer being formed "over" or located "over" a surface may alternatively have a specific meaning: the component, element, or material layer is "directly" positioned (e.g., placed, formed, deposited, etc.) on the surface, e.g., in direct contact with the surface.

[0050] Although terms such as "first", "second" and "third" may be used herein to describe various components, parts, regions, layers or sections, these components, parts, regions, layers or sections are not limited to these terms. On the contrary, these terms are only used to distinguish one component, part, region, layer or section from another component, part, region, layer or section. Therefore, without departing from the teachings of each example, the first component, part, region, layer or section mentioned in the examples described herein may also be referred to as the second component, part, region, layer or section. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one such feature. In the description herein, the meaning of "multiple" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0051] It should be understood that spatially relative terms, such as "above," "upper," "below," and "lower," are used herein to describe the relationship of one element to another element shown in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as being "above" or "upper" relative to another element would then be "below" or "lower" relative to the other element. Thus, the term "above" encompasses both above and below orientations, depending on the spatial orientation of the device. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatially relative terms used herein should be interpreted accordingly.

[0052] Furthermore, the word "exemplary" is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as "exemplary" is not necessarily to be construed as advantageous over other aspects or designs. Rather, the use of the word exemplary is intended to present concepts in a concrete manner. As used herein, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X applies to A or B" is intended to mean any of the natural inclusive permutations. That is, if X applies to A; X applies to B; or X applies to both A and B, then "X applies to A or B" satisfies any of the aforementioned instances. Furthermore, the articles "a" and "an," as used in this application and the appended claims, are generally understood to mean "one or more," unless otherwise specified or clear from the context to refer to the singular form.

[0053] Likewise, although the present disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding this specification and the accompanying drawings. The present disclosure includes all such modifications and variations and is limited only by the scope of the claims. With particular regard to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, terms used to describe such components are intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if not structurally equivalent to the disclosed structure. In addition, although particular features of the present disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations as may be desired and advantageous for any given or particular application. Furthermore, to the extent that the terms "include," "have," "have," "have," or variations thereof are used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term "comprising."

[0054] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the appended claims.

[0055] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A power module, characterized in that: include: Plastic packaging; A substrate, plastic-encapsulated in the plastic encapsulation body; A signal pin is arranged outside the plastic package body; as well as A conductive block is plastic-encapsulated in the plastic encapsulation body and electrically connected to the substrate. The conductive block has a connecting end surface on a side away from the substrate. The connecting end surface is exposed outside the plastic encapsulation body to be electrically connected to the signal pin.

2. The power module according to claim 1, wherein: The expansion coefficient of the conductive block is within a ±5% deviation range of the expansion coefficient of the plastic package body.

3. The power module according to claim 2, wherein: The conductive block is made of copper-molybdenum alloy, and the plastic package is made of epoxy resin.

4. The power module according to claim 1, wherein: A concave-convex structure is formed on the circumference of the conductive block for contacting the plastic package body.

5. The power module according to claim 4, characterized in that: The conductive block is cylindrical, and the concave-convex structure includes an annular groove and / or an annular boss formed in the circumference of the conductive block.

6. The power module according to claim 1, wherein: The connecting end surface is flush with the end surface of the plastic package body.

7. The power module according to claim 1, wherein: A solder layer is provided between the conductive block and the substrate.

8. The power module according to claim 1, wherein: The signal pin is welded to the connection end surface.

9. The power module according to claim 1, wherein: In a view projected along the extending direction of the signal pin, the outer contour of the conductive block surrounds the outer contour of the signal pin.

10. A motor controller, characterized in that: The invention comprises a power module according to any one of claims 1 to 9.

11. An electric drive assembly, characterized in that: Comprising a motor controller according to claim 10.

12. A vehicle, characterized in that: Comprising the electric drive assembly according to claim 11.

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