Side vertical antenna

Abstract

A side vertical antenna is electrically and fixedly connected to a mainboard of an electronic device and comprises a circuit board and an electrode layer. The circuit board is a square body and is provided with a front surface, a back surface, a top edge, a bottom edge and two side edges. The electrode layer is arranged on one side of the front face and one side of the back face of the circuit board. Under the condition that the structural design of an original mainboard is not damaged, the circuit board is directly, laterally, vertically, electrically and fixedly connected to the mainboard, so that the manufacturing cost of the antenna is reduced.

Description

Technical Field

[0001] The utility model relates to an antenna, in particular to a side-standing antenna which is welded on a mainboard of an electronic device in a side-standing manner. Background Art

[0002] With the increasing popularity of the internet and people's growing reliance on it, a growing number of connected devices have been developed, including Wi-Fi products, network communication products, the Internet of Things (IoT), network cameras (IP CAMs), routers, and modems. The antenna structures used in these devices mostly utilize copper foil on a circuit board with different radiating patterns to receive and transmit signals.

[0003] Currently, when soldering a vertical (or sideways) antenna to a motherboard, one or more holes must be drilled on the motherboard at the soldering location. This allows the antenna to be inserted directly into the hole in a vertical position, allowing the electrode layer on the antenna to be electrically bonded to the electrode layer at the edge of the hole. While this allows the antenna to be soldered vertically to the motherboard, it disrupts the original motherboard structure, resulting in a labor-intensive and time-consuming manufacturing process.

[0004] Therefore, how to reduce the manufacturing cost of the vertical antenna without damaging the original motherboard structure design is the main problem solved by the present invention. Utility Model Content

[0005] Therefore, the primary purpose of the present invention is to address the shortcomings of the prior art. The present invention redesigns the side-standing (or vertical) antenna by directly placing electrode layers on both the front and back sides of the antenna's circuit board. This allows the circuit board to be directly and quickly electrically secured to the motherboard in a side-standing configuration, without disrupting the original motherboard's structural design, thereby reducing the antenna's manufacturing cost.

[0006] To achieve the aforementioned objectives, the present invention provides a side-mounted antenna structure electrically secured to a motherboard of an electronic device, comprising a circuit board and an electrode layer. The circuit board is a rectangular body having a front surface, a back surface, a top edge, a bottom edge, and two side edges. The electrode layer is disposed on one side of the front and back surfaces of the circuit board.

[0007] In one embodiment of the present invention, the front surface and the back surface of the circuit board respectively have radiation layers with different pattern shapes.

[0008] In one embodiment of the present invention, the radiation layer includes a high-frequency radiation layer or a low-frequency radiation layer, or a high-frequency radiation layer and a low-frequency radiation layer.

[0009] In one embodiment of the present invention, the electrode layer includes a first electrode layer and a second electrode layer, and the first electrode layer and the second electrode layer are disposed on the edges of the bottom side of the front and back sides of the circuit board.

[0010] In one embodiment of the present invention, the first electrode layer and the second electrode layer are electrically connected to the radiation layer.

[0011] In one embodiment of the present invention, one of the first electrode layer or the second electrode layer is electrically connected to the radiation layer.

[0012] In one embodiment of the present invention, the front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first clearance area of the motherboard has a first electrode fixing layer and a second electrode fixing layer, and the first electrode fixing layer and the second electrode fixing layer are electrically fixed to the first electrode layer and the second electrode layer, respectively.

[0013] In an embodiment of the present invention, the front surface of the mainboard has a signal feeding layer coupled to the first ground layer, and the signal feeding layer is electrically connected to the first electrode fixing layer.

[0014] In one embodiment of the present invention, the signal feed layer is composed of a plurality of line segments, each line segment is electrically connected to a plurality of electrode contacts, each electrode contact is electrically connected to a matching element, or a matching element is electrically connected between the second electrode fixing layer and the first ground layer to adjust the antenna frequency characteristics.

[0015] In one embodiment of the present invention, the matching element is a capacitor or an inductor.

[0016] In one embodiment of the present invention, the electrode layer is in a strip shape and is respectively disposed on the front and back sides of the circuit board, and extends from the side edge of one side to the edge of the bottom side of the other side side.

[0017] In one embodiment of the present invention, the front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area. The first clearance area of the motherboard has two corresponding first electrode fixing layers and two corresponding second electrode fixing layers. The two corresponding first electrode fixing layers and the two corresponding second electrode fixing layers are respectively electrically fixed to the elongated electrode layers on the front and back sides of the circuit board.

[0018] In one embodiment of the present invention, the front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area. The first clearance area of the motherboard has a long strip of first electrode fixing layer and a long strip of second electrode fixing layer. The long strip of the first electrode fixing layer and the long strip of the second electrode fixing layer are electrically fixed to the long strip of the electrode layers on the front and back sides of the circuit board, respectively. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 , is an exploded schematic diagram of the antenna and the motherboard of the first embodiment of the present invention;

[0020] Figure 2 ,for Figure 1 Another perspective of the antenna and motherboard.

[0021] Figure 3 ,for Figure 1 Schematic diagram of the three-dimensional combination;

[0022] Figure 4 ,for Figure 2 Schematic diagram of the three-dimensional combination;

[0023] Figure 5 , is an exploded schematic diagram of the antenna and the motherboard of the second embodiment of the present invention;

[0024] Figure 6 , is an exploded schematic diagram of the antenna and the motherboard of the third embodiment of the present invention.

[0025] In the picture:

[0026] 10: Antenna

[0027] 1: Circuit board

[0028] 11: Front

[0029] 12: Back

[0030] 13: Top edge

[0031] 14: bottom edge

[0032] 15: Side

[0033] 2.2a: electrode layer

[0034] 21: First electrode layer

[0035] 22: Second electrode layer

[0036] 20: Motherboard

[0037] 201: First ground layer

[0038] 202: Second ground layer

[0039] 203: First Clearance Area

[0040] 204: Second Clearance Zone

[0041] 205, 205a, 205b, 205c: first electrode fixing layer

[0042] 206, 206a, 206b, 206c: second electrode fixing layer

[0043] 207:Signal feed layer

[0044] 2071: Line segment

[0045] 2072: Electrode contact. DETAILED DESCRIPTION

[0046] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0047] See also Figure 1~Figure 2 , is a schematic diagram of the antenna and motherboard of the first embodiment of the utility model and Figure 1 Schematic diagram of the antenna from another perspective. As shown in the figure: The side-standing antenna of the present invention, the antenna 10 includes: a circuit board 1 and an electrode layer 2. The antenna 10 is electrically fixed to one side of the motherboard 20 in a side-standing manner.

[0048] The circuit board 1 is a rectangular solid having a front surface 11, a back surface 12, a top edge 13, a bottom edge 14, and two side edges 15. Radiating layers (not shown) with different patterns are located on the front surface 11 and back surface 12. These radiating layers may include high-frequency radiating layers, low-frequency radiating layers, or both high-frequency and low-frequency radiating layers, for receiving and transmitting signals. In this figure, the circuit board 1 is a printed circuit board.

[0049] The electrode layer 2 is disposed on the edge of the bottom edge 14 of one side of the front surface 11 and the back surface 12 of the circuit board. The electrode layer 2 includes a first electrode layer 21 and a second electrode layer 22. The first electrode layer 21 and the second electrode layer 22 provide electrical connection to the first electrode fixing layer 205 and the second electrode fixing layer 206 on the motherboard 20. The first electrode layer 21 and the second electrode layer 22 are electrically connected to the radiation layer (not shown). Alternatively, either the first electrode layer 21 or the second electrode layer 22 is electrically connected to the radiation layer (not shown).

[0050] See also Figure 3~Figure 4 ,for Figure 1 Schematic diagram of the three-dimensional combination and Figure 2 Schematic diagram of the three-dimensional combination of Figures 1 and 2 As shown in the figure, when the antenna 10 of the present invention is used with the motherboard 20 of an electronic device, the front and back of the motherboard 20 each have a symmetrical first ground layer 201, a second ground layer 202, a first clearance area 203, and a second clearance area 204. A first electrode fixing layer 205 and a second electrode fixing layer 206 are provided on the first clearance area 203 of the motherboard 20. In addition, a signal feeding layer 207 coupled to the first ground layer 201 is provided on the front of the motherboard 20. The signal feeding layer 207 is electrically connected to the first electrode fixing layer 205. In addition, the second electrode fixing layer 206 can be electrically connected to the first ground layer 201 through a matching element (not shown) to adjust the antenna frequency characteristics.

[0051] It is worth mentioning that the signal feeding layer 207 is composed of a plurality of line segments 2071 . The line segments 2071 are electrically connected to a plurality of electrode contacts 2072 . The electrode contacts 2072 can be electrically connected to matching elements (not shown) to adjust the antenna frequency characteristics.

[0052] In this figure, the matching element is a capacitor or an inductor.

[0053] In addition, the first electrode layer 21 and the second electrode layer 22 of the circuit board 1 are in contact with the first electrode fixing layer 205 and the second electrode fixing layer 206 of the motherboard 20. After soldering in a tin furnace, the first electrode layer 21 and the second electrode layer 22 are electrically fixed to the first electrode fixing layer 205 and the second electrode fixing layer 206 of the motherboard 20.

[0054] Due to the design of the electrode layer 2 of the antenna 10, when the circuit board 1 is electrically fixed to the motherboard 20, there is no need to change the original design of the motherboard 20, and the original structure of the motherboard 20 will not be damaged. The first electrode layer 21 and the second electrode layer 22 of the antenna 10 can be quickly electrically fixed to the first electrode fixing layer 205 and the second electrode fixing layer 206 on the motherboard 20.

[0055] See also Figure 5, is an exploded schematic diagram of the antenna and motherboard of the second embodiment of the present invention. As shown in the figure, this embodiment is substantially the same as the first embodiment, differing in that the elongated electrode layer 2a of the circuit board 1 is disposed on both the front 11 and back 12 of the circuit board, extending from one side 15 to the edge of the bottom 14 of the other side 15. The first electrode fixing layer 205 and the second electrode fixing layer 206 on the motherboard 20 respectively include two corresponding first electrode fixing layers 205a and 205b and two corresponding second electrode fixing layers 206a and 206b.

[0056] After the long strip-shaped electrode layers 2a on the front surface 11 and back surface 12 of the circuit board 1 are electrically connected to the two corresponding first electrode fixing layers 205a, 205b and the two corresponding second electrode fixing layers 206a, 206b on the motherboard 20, the circuit board 1 can be firmly and electrically fixed to the motherboard 20. The structural design of the two corresponding first electrode fixing layers 205a, 205b and the two corresponding second electrode fixing layers 206a, 206b can reduce the coupling effect between the circuit board 1 and the motherboard 20 of the antenna 10, thereby improving the performance of the antenna 10.

[0057] See also Figure 6 , is an exploded schematic diagram of the antenna and motherboard of the third embodiment of the present invention. As shown in the figure, this embodiment is substantially similar to the first and second embodiments, differing in that the elongated electrode layer 2a of the circuit board 1 is disposed on the front 11 and back 12 of the circuit board, extending from one side 15 to the edge of the bottom 14 of the other side 15. The first electrode fixing layer 205 and the second electrode fixing layer 206 on the motherboard 20 are elongated first electrode fixing layer 205c and second electrode fixing layer 206c, respectively.

[0058] After the elongated electrode layers 2a on the front surface 11 and back surface 12 of the circuit board 1 are electrically connected to the elongated first electrode fixing layer 205c and the elongated second electrode fixing layer 206c of the motherboard 20, respectively, the circuit board 1 can be firmly and electrically fixed to the motherboard 20. The structural design of the elongated first electrode fixing layer 205c and the elongated second electrode fixing layer 206c can reduce the coupling effect between the circuit board 1 and the motherboard 20 of the antenna 10, thereby improving the performance of the antenna 10.

[0059] The above-described embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.

Claims

1. A side-standing antenna electrically connected to a motherboard of an electronic device, characterized in that: include: A circuit board is in the shape of a square and has a front surface, a back surface, a top edge, a bottom edge and two side edges; An electrode layer is provided on one side of the front surface and the back surface of the circuit board.

2. The side-standing antenna according to claim 1, wherein: The front side and the back side of the circuit board respectively have radiation layers with different pattern shapes.

3. The side-standing antenna according to claim 2, wherein: The radiation layer includes a high-frequency radiation layer or a low-frequency radiation layer, or a high-frequency radiation layer and a low-frequency radiation layer.

4. The side-standing antenna according to claim 3, wherein: The electrode layer includes a first electrode layer and a second electrode layer. The first electrode layer and the second electrode layer are arranged on the edges of the bottom sides of the front side and the back side of the circuit board.

5. The side-standing antenna according to claim 4, characterized in that: The first electrode layer and the second electrode layer are electrically connected to the radiation layer.

6. The side-standing antenna according to claim 4, wherein: One of the first electrode layer or the second electrode layer is electrically connected to the radiation layer.

7. The side-standing antenna according to claim 6, wherein: The front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first clearance area of the motherboard has a first electrode fixing layer and a second electrode fixing layer, and the first electrode fixing layer and the second electrode fixing layer are electrically fixed to the first electrode layer and the second electrode layer, respectively.

8. The side-standing antenna according to claim 7, wherein: The front surface of the main board has a signal feeding layer coupled with the first ground layer. The signal feeding layer is electrically connected to the first electrode fixing layer.

9. The side-standing antenna according to claim 8, wherein: The signal feeding layer is composed of a plurality of line segments, each of which is electrically connected to a plurality of electrode contacts. Each of the electrode contacts is electrically connected to a matching element, or the second electrode fixing layer and the first ground layer are electrically connected to the matching element to adjust the antenna frequency characteristics.

10. The side-standing antenna according to claim 9, wherein: The matching element is a capacitor or an inductor.

11. The side-standing antenna according to claim 1, wherein: The electrode layer is in a strip shape and is respectively arranged on the front surface and the back surface of the circuit board, and extends from the side edge of one of the electrode layers to the edge of the bottom edge of the other electrode layer.

12. The side-standing antenna according to claim 11, wherein: The front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first clearance area of the motherboard has two corresponding first electrode fixing layers and two corresponding second electrode fixing layers, and the two corresponding first electrode fixing layers and the two corresponding second electrode fixing layers are respectively electrically fixed to the long strip-shaped electrode layers on the front and back sides of the circuit board.

13. The side-standing antenna according to claim 11, wherein: The front and back sides of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area, and a second clearance area; the first clearance area of the motherboard has a long strip of first electrode fixing layer and a long strip of second electrode fixing layer, and the long strip of first electrode fixing layer and the long strip of second electrode fixing layer are respectively electrically fixed to the long strip of electrode layers on the front and back sides of the circuit board.

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