Middle frame, middle frame assembly and electronic equipment

Abstract

The utility model discloses a middle frame, a middle frame assembly and electronic equipment. The middle frame comprises a side frame and a heat dissipation plate. A protection cavity is defined by the frame. At least part of the heat dissipation plate is arranged in the protection cavity, and the heat dissipation plate is fixedly connected with the frame. The heat dissipation plate is provided with a containing cavity used for containing the uniform temperature plate and a limiting groove formed in the side wall of the containing cavity. The bottom of the containing cavity is provided with a first heat dissipation face, and the bottom of the limiting groove is provided with a second heat dissipation face. And the second heat dissipation surface is arranged above the first heat dissipation surface relative to the opening of the accommodating cavity in the thickness direction of the heat dissipation plate. The middle frame can increase the heat dissipation area with the vapor chamber under the condition that the strength is ensured, facilitates the improvement of the heat dissipation efficiency of the vapor chamber, and improves the temperature rise experience of the electronic equipment.

Description

Technical Field

[0001] The present disclosure relates to the field of electronic technology, and in particular to a middle frame, a middle frame assembly, and an electronic device. Background Art

[0002] Electronic devices such as mobile phones and tablets have become essential technology products in people's lives, learning, and entertainment. With the development of electronic devices, the temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0003] In related technologies, electronic devices use vapor chambers to improve the heat dissipation efficiency of heat source components (such as CPUs). However, in traditional solutions, to meet the requirements of lightweight and thin mobile terminal designs, the middle frame is provided with hollow holes to avoid the vapor chamber. This can easily lead to insufficient middle frame strength and a small heat dissipation area between the vapor chamber and the middle frame, which is not conducive to transferring heat from the vapor chamber to the middle frame for heat dissipation, resulting in a poor temperature rise experience for the electronic device. Utility Model Content

[0004] The present disclosure provides a middle frame, a middle frame assembly, and an electronic device. The middle frame can increase the heat dissipation area with a vapor chamber while ensuring strength, thereby improving the heat dissipation efficiency of the vapor chamber and enhancing the temperature rise experience of the electronic device.

[0005] The technical solution is as follows:

[0006] According to a first aspect of an embodiment of the present disclosure, a middle frame is provided, which is applied to an electronic device, wherein the electronic device includes a temperature equalizing plate. The middle frame includes a frame and a heat dissipation plate. The frame is surrounded by a protective cavity. At least part of the heat dissipation plate is arranged in the protective cavity, and the heat dissipation plate is fixedly connected to the frame. The heat dissipation plate is provided with a receiving cavity for accommodating the temperature equalizing plate and a limiting groove arranged on the side wall of the receiving cavity. The bottom of the receiving cavity is provided with a first heat dissipation surface, and the bottom of the limiting groove is provided with a second heat dissipation surface. Along the thickness direction of the heat dissipation plate, relative to the opening of the receiving cavity, the second heat dissipation surface is arranged above the first heat dissipation surface.

[0007] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0008] After the middle frame is assembled with the heat spreader, the body of the heat spreader is embedded in the accommodating cavity and cooperates with the first heat dissipation surface for thermal conduction, thereby increasing the heat dissipation area between the heat spreader and the heat sink, facilitating the transfer of heat to the heat sink for heat dissipation, and improving the heat dissipation efficiency. At the same time, the skirt of the heat spreader is embedded in the limiting groove and cooperates with the second heat dissipation surface for thermal conduction. In this way, the skirt is used to achieve a fixed connection between the heat spreader and the middle frame, and the skirt is used to increase the heat dissipation area between the heat spreader and the heat sink, facilitating the transfer of heat to the heat sink for heat dissipation, and further improving the heat dissipation efficiency. In the thickness direction of the heat sink, relative to the opening of the accommodating cavity, the second heat dissipation surface is arranged above the first heat dissipation surface, so that the heat sink has sufficient thickness in the limiting groove, which can ensure the strength of the middle frame. In this way, the middle frame can increase the heat dissipation area with the heat spreader while ensuring strength, which is beneficial to improving the heat dissipation efficiency of the heat spreader.

[0009] The technical solution of the present disclosure is further described below:

[0010] In one embodiment, the limiting groove is at least partially annular and is arranged around the edge of the accommodating cavity.

[0011] In one embodiment, the limiting grooves include a plurality of limiting grooves, which are spaced apart along the circumference of the accommodating cavity.

[0012] In one embodiment, the heat dissipation plate and / or the frame are made of metal.

[0013] In one embodiment, the heat dissipation plate is provided with a battery installation area, and the first heat dissipation surface is provided with a hollow hole. On the orthographic projection surface in the thickness direction of the heat dissipation plate, the hollow hole and the battery installation area at least partially overlap.

[0014] In one embodiment, the second heat dissipation surface is adjacent to at least a portion of an edge of the hollow hole.

[0015] In one embodiment, the heat dissipation plate is provided with a mainboard mounting area, and on the orthographic projection surface in the thickness direction of the heat dissipation plate, at least a portion of the first heat dissipation surface overlaps with the mainboard mounting area.

[0016] According to a second aspect of the embodiments of the present disclosure, a middle frame assembly is further provided, comprising a heat spreader and the middle frame of any of the above-described embodiments. The heat spreader includes a plate body and a skirt adjacent to an edge of the plate body. At least a portion of the plate body is embedded in the accommodating cavity and thermally engages with the first heat dissipation surface. The skirt has a thickness less than that of the plate body. The skirt is secured to a retaining groove and thermally engages with the second heat dissipation surface.

[0017] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0018] When the middle frame is assembled with the temperature equalizer, the plate body of the temperature equalizer is embedded in the accommodating cavity and cooperates with the first heat dissipation surface for thermal conduction. The skirt is embedded in the limiting groove and is fixedly connected to the middle frame. When the middle frame assembly is used to dissipate heat from the heat source device, the heat of the heat source device is transferred to the plate body, and the plate body cooperates with the first heat dissipation surface for thermal conduction to facilitate the transfer of heat to the heat dissipation plate for heat dissipation, thereby improving the heat dissipation efficiency. At the same time, the plate body can also transfer heat to the skirt, and use the skirt to increase the heat dissipation area of the temperature equalizer and the heat dissipation plate, facilitating the transfer of heat to the heat dissipation plate for heat dissipation, further improving the heat dissipation efficiency. The thickness of the skirt is less than the thickness of the plate body, so that the skirt occupies a small space in the thickness of the heat dissipation plate, which can ensure the strength of the middle frame. In this way, the middle frame assembly has good heat dissipation efficiency and sufficient strength.

[0019] The technical solution of the present disclosure is further described below:

[0020] In one embodiment, the plate body includes a protruding body extending beyond the skirt, the protruding body being embedded within the accommodating cavity. The protruding body includes a third heat dissipation surface that thermally conducts with the first heat dissipation surface, and a heat dissipation side surface surrounding the third heat dissipation surface. The third heat dissipation surface is in contact with the first heat dissipation surface, and the heat dissipation side surface is in thermally conduction with the sidewalls of the accommodating cavity.

[0021] In one embodiment, the skirt includes a first limiting body adjacent to the plate body and a second limiting body bent and connected to the first limiting body. The limiting groove includes a first groove adapted to the first limiting body and a second groove adapted to the second limiting body.

[0022] In one embodiment, the middle frame assembly further includes a thermally conductive adhesive layer, and the plate body and / or the skirt are bonded and fixed to the heat dissipation plate via the thermally conductive adhesive layer.

[0023] In one embodiment, the thermally conductive adhesive layer is sandwiched between the board body and the first heat dissipation surface.

[0024] And / or, the thermally conductive adhesive layer includes a thermally conductive adhesive layer, and the thermally conductive adhesive layer includes a thermally conductive adhesive layer sandwiched between the skirt and the second heat dissipation surface.

[0025] According to a third aspect of the embodiments of the present disclosure, an electronic device is also provided, comprising a heat source device and a middle frame assembly in any of the above embodiments, wherein the heat source device is arranged in the middle frame and cooperates with the board body for heat conduction.

[0026] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0027] When the electronic device is in use, the heat source device is set in the middle frame and cooperates with the board body for thermal conduction. The heat generated by the heat source device is transferred to the board body, and the board body cooperates with the first heat dissipation surface for thermal conduction to transfer the heat to the heat sink for heat dissipation, thereby improving the heat dissipation efficiency. At the same time, the board body can also transfer heat to the skirt, using the skirt to increase the heat dissipation area of the temperature equalizing plate and the heat sink, facilitating the transfer of heat to the heat sink for heat dissipation, and further improving the heat dissipation efficiency. In this way, the middle frame assembly can promptly diffuse the heat generated by the heat source device, avoid local overheating, and improve the temperature rise experience of the electronic device.

[0028] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which constitute a part of the present disclosure, are used to provide a further understanding of the present disclosure. The exemplary embodiments of the present disclosure and their descriptions are used to explain the present disclosure and do not constitute an improper limitation to the present disclosure.

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 FIG. 1 is a schematic structural diagram of an electronic device shown in an embodiment.

[0032] Figure 2 for Figure 1 An exploded diagram of the middle frame assembly and heat source device is shown.

[0033] Figure 3 Schematic diagram of the structure of the middle frame assembly shown in one embodiment.

[0034] Figure 4 for Figure 3 The exploded diagram of the structure of the middle frame assembly is shown.

[0035] Figure 5 FIG1 is a half-sectional schematic diagram of a middle frame assembly shown in an embodiment after cutting through the first heat dissipation surface along the thickness direction of the heat dissipation plate.

[0036] Figure 6 FIG1 is a half-sectional schematic diagram of a middle frame assembly shown in an embodiment after the hollow hole is cut along the thickness direction of the heat dissipation plate. FIG1 is a half-sectional schematic diagram of a middle frame assembly shown in an embodiment.

[0037] Figure 7FIG1 is a half-sectional schematic diagram of a middle frame assembly shown in another embodiment after cutting the first heat dissipation surface along the thickness direction of the heat dissipation plate.

[0038] Figure 8 FIG1 is a partial enlarged schematic diagram of a middle frame assembly shown in an embodiment after the hollow hole is cut along the thickness direction of the heat dissipation plate. FIG1 is a partial enlarged schematic diagram of a middle frame assembly shown in an embodiment.

[0039] Figure 9 The performance comparison chart of this application and traditional solutions is shown in the figure.

[0040] Figure 10 FIG. 1 is a schematic diagram of the internal hardware structure of an electronic device shown in an embodiment.

[0041] Description of reference numerals:

[0042] 10. Electronic device; 11. Processing component; 12. Memory; 13. Power supply component; 14. Multimedia component; 15. Audio component; 16. Input / output interface; 17. Sensor component; 18. Communication component; 10a. Middle frame component; 100. Middle frame; 110. Frame; 111. Protective cavity; 120. Heat dissipation plate; 121. Accommodating cavity; 1211. First heat dissipation surface; 101. Hollow hole; 122. Limiting groove; 1221. Second heat dissipation surface; 1222. First groove; 1223. Second groove; 123. Battery installation area; 124. Motherboard installation area; 200. Temperature averaging plate; 210. Board body; 211. Protrusion; 2111. Third heat dissipation surface; 2112. Heat dissipation side; 220. Skirt; 221. First limiting body; 222. Second limiting body; 300. Thermal conductive adhesive layer; 10b. Heat source device. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present disclosure and do not limit the scope of protection of the present disclosure.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0045] Electronic devices such as mobile phones and tablet computers have become indispensable technological products in people's lives, studies and entertainment. With the development of electronic devices, the internal structure is becoming more and more compact. Although the performance of related devices is becoming more and more powerful, the heat generated is also increasing. For example, the number of cores of the CPU (Central Processing Unit) of electronic devices has increased, the performance is increasing, and the heat generated is increasing. This can easily lead to local overheating of electronic devices and affect the temperature rise experience. This poses an increasingly high challenge to the heat dissipation performance of electronic devices. The temperature rise experience has gradually become an important consideration for consumers when purchasing electronic devices.

[0046] In related technologies, electronic devices use a heat spreader to improve the heat dissipation efficiency of heat source devices (such as CPUs, etc.). In traditional solutions, in order to meet the requirements of the lightweight and thin design of mobile terminals, the middle frame is provided with hollow holes to avoid the heat spreader, resulting in a small heat dissipation area between the heat spreader and the middle frame, which is not conducive to transferring the heat from the heat spreader to the middle frame for heat dissipation, and thus resulting in a poor temperature rise experience for the electronic device. For example, when the area of the heat spreader is large, in order to meet the requirements of the lightweight and thin design of mobile terminals, the board body on the middle frame for installing the heat spreader will be completely hollowed out, and the skirt of the heat spreader will be used to connect to the middle frame, which results in a small heat dissipation area between the heat spreader and the middle frame, which is not conducive to transferring the heat from the heat spreader to the middle frame for heat dissipation.

[0047] Based on this, the present disclosure provides a middle frame that can increase the heat dissipation area with the temperature vapor chamber, which is beneficial to improving the heat dissipation efficiency of the temperature vapor chamber and enhancing the temperature rise experience of the electronic device.

[0048] In order to better understand the middle frame of the present disclosure, a mobile terminal using the middle frame assembly is used for illustration.

[0049] like Figure 1 as well as Figure 2 As shown, the present disclosure discloses an electronic device 10, which may be a mobile phone, a tablet computer, an e-reader, a laptop computer, a vehicle-mounted device, etc., and includes a middle frame assembly 10a and a heat source device 10b.

[0050] Among them, such as Figures 3 to 6As shown, the middle frame assembly 10a includes a middle frame 100 and a temperature equalizing plate 200. The middle frame 100 includes a frame 110 and a heat dissipation plate 120. The frame 110 is surrounded by a protective cavity 111. At least a portion of the heat dissipation plate 120 is disposed in the protective cavity 111, and the heat dissipation plate 120 is fixedly connected to the frame 110. The heat dissipation plate 120 is provided with a receiving cavity 121 for accommodating the temperature equalizing plate 200 and a limiting groove 122 provided on the side wall of the receiving cavity 121. A first heat dissipation surface 1211 is provided at the bottom of the receiving cavity 121, and a second heat dissipation surface 1221 is provided at the bottom of the limiting groove 122. Along the thickness direction of the heat dissipation plate 120, relative to the opening of the receiving cavity 121, the second heat dissipation surface 1221 is provided above the first heat dissipation surface 1211. Thus, along the thickness direction of the heat sink 120, the second heat sink surface 1221 is positioned above the first heat sink surface 1211 relative to the opening of the accommodating cavity 121. This ensures that the heat sink 120 has sufficient thickness within the retaining groove 122, thereby ensuring the strength of the middle frame 100. Furthermore, the coordination between the first heat sink surface 1211 and the second heat sink surface 1221 increases the heat dissipation area with the vapor chamber 200, thereby improving the heat dissipation efficiency of the vapor chamber 200.

[0051] like Figure 4 as well as Figure 6 As shown, the vapor chamber 200 includes a plate body 210 and a skirt 220 adjacent to the edge of the plate body 210. At least a portion of the plate body 210 is embedded in the accommodating cavity 121 and thermally engages with the first heat dissipation surface 1211. The thickness of the skirt 220 is less than that of the plate body 210. The skirt 220 is secured in the retaining groove 122 and thermally engages with the second heat dissipation surface 1221. As such, the thickness of the skirt 220 is less than that of the plate body 210, so that the skirt 220 occupies less space within the thickness of the heat dissipation plate 120, thereby ensuring the strength of the middle frame 100. When the middle frame 100 is assembled with the vapor chamber 200, the plate body 210 of the vapor chamber 200 is embedded in the accommodating cavity 121 and thermally engages with the first heat dissipation surface 1211. The skirt 220 is embedded in the retaining groove 122 and thermally engages with the second heat dissipation surface 1221. This ensures that the middle frame assembly 10a has good heat dissipation efficiency and sufficient strength.

[0052] When the electronic device 10 is in use, the heat source device 10b is arranged on the middle frame 100 and cooperates with the plate body 210 for thermal conduction. The heat generated by the heat source device 10b is transferred to the plate body 210, and the plate body 210 cooperates with the first heat dissipation surface 1211 for thermal conduction to facilitate the transfer of heat to the heat sink 120 for heat dissipation, thereby improving the heat dissipation efficiency. At the same time, the plate body 210 can also transfer heat to the skirt 220, and use the skirt 220 to increase the heat dissipation area of the temperature equalizing plate 200 and the heat dissipation plate 120, so as to facilitate the transfer of heat to the heat sink 120 for heat dissipation, further improving the heat dissipation efficiency. In this way, the middle frame 100 can increase the heat dissipation area with the temperature equalizing plate 200, so as to facilitate the timely dissipation of the heat of the temperature equalizing plate 200. In addition, the middle frame assembly 10a can be used to promptly diffuse the heat generated by the heat source device 10b, avoid local overheating, and improve the temperature rise experience of the electronic device 10.

[0053] like Figure 1 As shown, the thickness direction of the heat sink 120 is the Z-axis direction. Figure 5 as well as Figure 6 As shown, the thickness direction of the heat dissipation plate 120 and the thickness direction of the temperature homogenizing plate 200 are arranged in the same direction, both in the Z-axis direction.

[0054] In the embodiment of the present disclosure, the heat source component 10 b refers to a component in the electronic device 10 that radiates more heat.

[0055] In practical applications, the heat radiated by a component is generally positively correlated with its power consumption. The greater the power consumption of a component, the greater the heat radiated. Accordingly, the heat source device in the present disclosure can be a device in an electronic device whose power consumption exceeds M% of the total power consumption of the device, where M can be 30, 40, etc.

[0056] In some embodiments, the heat source device may include a central processing unit (CPU), a processing device integrating processing and storage functions, a power supply component (e.g., a battery), etc. Of course, the heat source device may also be other devices, such as an image sensor, etc., and the embodiments of the present disclosure are not specifically limited to this.

[0057] In the disclosed embodiments, the middle frame can be the supporting structure of the electronic device. In addition to integrating the vapor chamber 200, at least some components of the electronic device can be directly or indirectly mounted on the middle frame to assemble the electronic device. For example, the control motherboard can be mounted on the middle frame.

[0058] Optionally, in some embodiments, the heat sink can be disposed inside the electronic device, and the edge of the frame can be designed to be part of the housing of the electronic device. When the frame serves as the housing of the electronic device, it can protect the electronic device.

[0059] It should be noted that part or all of the middle frame can be made of metal or alloy material (for example, aluminum alloy). Of course, the material of the middle frame can also be other, and this embodiment of the present disclosure does not specifically limit this.

[0060] In some embodiments, the heat dissipation plate 120 and / or the frame 110 are made of metal, thereby making the middle frame 100 have good strength and heat dissipation performance.

[0061] like Figure 4 As shown, in some embodiments, the limiting groove 122 is at least partially annular and is disposed around the edge of the accommodating cavity 121. This allows the area of the limiting groove 122 to be increased while ensuring the strength of the middle frame 100, thereby maximizing the area of the second heat dissipation surface 1221. This in turn increases the heat dissipation area of the heat sink 120 and the vapor chamber 200, thereby improving the heat dissipation efficiency of the middle frame assembly 10a.

[0062] In some embodiments, multiple limiting grooves are provided, spaced apart along the circumference of the accommodating cavity. Thus, the limiting grooves are adapted to the skirt and can be flexibly provided along the circumference of the accommodating cavity. This maximizes the area of the second heat dissipation surface while ensuring the strength of the middle frame, thereby increasing the heat dissipation area of the heat sink and vapor chamber, and improving the heat dissipation efficiency of the middle frame assembly.

[0063] like Figure 4 As shown, in some embodiments, the heat sink 120 has a battery mounting area 123, and the first heat dissipation surface 1211 has a hollow hole 101. In the orthographic projection of the heat sink 120 in the thickness direction, the hollow hole 101 at least partially overlaps with the battery mounting area 123. Thus, the provision of the hollow hole 101 can reduce the weight of the middle frame 100 while allowing the thickness of the heat sink 120 to be used for the battery, thereby increasing the battery volume and improving the battery life of the electronic device 10.

[0064] like Figure 4 As shown, in some embodiments, the plate body 210 is arranged to cover the hollow hole 101. The battery of the electronic device 10 cooperates with the plate body 210 for heat dissipation. In this way, when the electronic device 10 is fast charging or super fast charging, the heat spreader 200 can also be used to dissipate heat from the battery, preventing the battery from overheating and affecting its charging efficiency. It can also prevent the electronic device 10 from locally overheating due to battery heat during charging.

[0065] like Figure 4 as well as Figure 6 As shown, in some embodiments, the second heat dissipation surface 1221 is adjacent to at least a portion of the edge of the hollow hole 101 .

[0066] In some embodiments, the heat sink 120 is provided with a motherboard mounting area 124. In an orthographic projection of the heat sink 120 in the thickness direction, at least a portion of the first heat dissipation surface 1211 overlaps with the motherboard mounting area 124. Thus, after the motherboard (e.g., a control motherboard) of the electronic device 10 is mounted in the motherboard mounting area 124, heat generated by the motherboard can be dissipated simultaneously with the vapor chamber 200, thereby preventing localized overheating of the motherboard.

[0067] like Figure 6 As shown, in some embodiments, the plate body 210 includes a protrusion 211 disposed protruding from the skirt 220, and the protrusion 211 is embedded in the accommodating cavity 121. The protrusion 211 includes a third heat dissipation surface 2111 that thermally conducts with the first heat dissipation surface 1211, and a heat dissipation side surface 2112 disposed around the third heat dissipation surface 2111. The third heat dissipation surface 2111 is in contact with the first heat dissipation surface 1211, and the heat dissipation side surface 2112 is in contact with the sidewall of the accommodating cavity 121. In this way, by utilizing the contact between the third heat dissipation surface 2111 and the first heat dissipation surface 1211, and the heat dissipation side surface 2112 and the sidewall of the accommodating cavity 121, the heat conduction area between the plate body 210 and the heat dissipation plate 120 is further increased, thereby improving the heat dissipation efficiency of the temperature vapor chamber 200.

[0068] like Figure 7 As shown, in some embodiments, the middle frame 100 assembly further includes a thermally conductive adhesive layer 300, and the board body 210 and / or skirt 220 are bonded and fixed to the heat sink 120 via the thermally conductive adhesive layer 300. In this way, the thermally conductive adhesive layer 300 can not only secure the heat sink 120 to the board body 210 and / or skirt 220, but also serve as a heat conduction medium to improve the heat conduction efficiency between the board body 210 and / or skirt 220, thereby improving the heat dissipation efficiency of the vapor chamber 200.

[0069] Optionally, in some embodiments, a thermally conductive adhesive layer 300 is interposed between the board body 210 and the first heat dissipation surface 1211. This allows the board body 210 to be securely fixed to the first heat dissipation surface 1211, and heat from the board body 210 is transferred to the first heat dissipation surface 1211 via the thermally conductive adhesive layer 300, thereby improving the heat dissipation efficiency of the board body 210.

[0070] Optionally, the thermally conductive adhesive layer includes a thermally conductive adhesive layer, which is sandwiched between the skirt and the second heat dissipation surface. In this way, the skirt can be securely fixed to the second heat dissipation surface, and heat from the board body can be transferred to the second heat dissipation surface via the thermally conductive adhesive layer, thereby improving the heat dissipation efficiency of the skirt.

[0071] like Figure 8As shown, in some embodiments, the skirt 220 includes a first limiting body 221 adjacent to the plate body 210 and a second limiting body 222 bent and connected to the first limiting body 221. The limiting groove 122 is provided with a first groove 1222 adapted to the first limiting body 221 and a second groove 1223 adapted to the second limiting body 222. In this way, by the first limiting body 221 cooperating with the first groove 1222 and the second limiting body 222 cooperating with the second groove 1223, the contact area between the skirt 220 and the heat sink 120 can be increased, improving the heat conduction efficiency and also facilitating the improvement of the connection strength between the skirt 220 and the heat sink 120.

[0072] It should be noted that the "heat spreader" can be one of the parts of the "middle frame assembly" module, that is, it can be assembled into a module with the "other components of the middle frame assembly" and then modularly assembled; it can also be relatively independent of the "other components of the middle frame assembly" and installed separately during the assembly process of the electronic device, so that it can form a whole with the "other components of the middle frame assembly" in this electronic device.

[0073] Equivalently, the components included in the "assembly" and "device" of this disclosure can also be flexibly combined. They can be modularly produced according to actual conditions and modularly assembled as a separate module; or they can be assembled separately to form a module in this device. The division of the above components in this disclosure is only one embodiment, for the convenience of reading, and not to limit the scope of protection of this disclosure. As long as the above components are included and have the same functions, it should be understood that they are equivalent technical solutions of this disclosure.

[0074] Combine Figure 9 It can be seen that compared with traditional technologies, the electronic device in this application has better heat dissipation performance and a better temperature rise experience.

[0075] Reference Figure 10 As shown, in some embodiments, the electronic device 10 may also include one or more of the following components: a processing component 11, a memory 12, a power component 13, a multimedia component 14, an audio component 15, an input / output interface 16, a sensor component 17, and a communication component 18.

[0076] The processing component generally controls the overall operation of the electronic device, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component may include one or more processors to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component may include one or more modules to facilitate interaction between the processing component and other components. For example, the processing component may include a multimedia module to facilitate interaction between the multimedia component and the processing component.

[0077] The memory is configured to store various types of data to support operations on the electronic device. Examples of such data include instructions for any application or method configured to operate on the electronic device, contact data, phone book data, messages, pictures, videos, etc. The memory can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0078] The control motherboard includes processing components and memory.

[0079] The power supply assembly provides power to various components of an electronic device. The power supply assembly may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to an electronic device.

[0080] The multimedia component includes the display module of the present disclosure to facilitate human-computer interaction. If the display module includes a touch panel, the display module can be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide and gestures on the touch panel. The touch sensor can not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component includes a front camera and / or a rear camera. When the electronic device is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera can receive external multimedia data. Each front camera and rear camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0081] The audio component is configured to output and / or input audio signals. For example, the audio component includes a microphone (MIC), which is configured to receive external audio signals when the electronic device is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in a memory or sent via a communication component. In some embodiments, the audio component also includes a speaker configured to output audio signals.

[0082] The input / output interface provides an interface between the processing component and the peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0083] The sensor assembly includes one or more sensors configured to provide various aspects of status assessment for the electronic device. For example, the sensor assembly can detect the open / closed state of the electronic device, the relative positioning of components, such as the display and keypad of the electronic device. The sensor assembly can also detect changes in the position of the electronic device or a component of the electronic device, the presence or absence of user contact with the electronic device, the orientation or acceleration / deceleration of the electronic device, and temperature changes of the electronic device. The sensor assembly may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly may also include a photosensitive element, such as a CMOS or CCD image sensor, configured to be used in imaging applications. In some embodiments, the sensor assembly may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0084] The communication component is configured to facilitate wired or wireless communication between the electronic device and other devices. The electronic device can access a wireless network based on a communication standard, such as Wi-Fi, 2G, 3G, 4G or 6G, or a combination thereof. In an exemplary embodiment, the communication component receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component further includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0085] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0086] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first," "second," etc., may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0087] In this disclosure, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0088] In the present disclosure, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0089] It should be noted that when an element is referred to as being “fixed to,” “disposed on,” “fixed on,” or “mounted on” another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be “connected to” another element, it may be directly connected to the other element or there may be an intermediate element.

[0090] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0091] The above embodiments merely illustrate several implementations of the present disclosure, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the inventive concept of the present disclosure, and all such variations and improvements fall within the scope of protection of the present disclosure.

Claims

1. A middle frame, applied to an electronic device, wherein the electronic device includes a temperature vapor chamber, characterized in that: include: A frame, surrounded by a protective cavity; as well as a heat dissipation plate, at least a portion of which is disposed in the protective cavity, and the heat dissipation plate is fixedly connected to the frame; In which, the heat dissipation plate is provided with a accommodating cavity for accommodating a temperature equalizing plate and a limiting groove arranged on the side wall of the accommodating cavity, the bottom of the accommodating cavity is provided with a first heat dissipation surface, and the bottom of the limiting groove is provided with a second heat dissipation surface; along the thickness direction of the heat dissipation plate, relative to the opening of the accommodating cavity, the second heat dissipation surface is arranged above the first heat dissipation surface.

2. The middle frame according to claim 1, characterized in that: The limiting groove is at least partially annular and is arranged around the edge of the accommodating cavity.

3. The middle frame according to claim 1, characterized in that: The limiting grooves include a plurality of limiting grooves, which are arranged at intervals along the circumference of the accommodating cavity.

4. The middle frame according to claim 1, characterized in that: The heat dissipation plate and / or the frame are made of metal.

5. The middle frame according to any one of claims 1 to 4, characterized in that: The heat dissipation plate is provided with a battery installation area, and the first heat dissipation surface is provided with a hollow hole. On the orthographic projection surface in the thickness direction of the heat dissipation plate, the hollow hole and the battery installation area at least partially overlap.

6. The middle frame according to claim 5, characterized in that: The second heat dissipation surface is adjacent to at least a portion of an edge of the hollow hole.

7. The middle frame according to claim 5, characterized in that: The heat dissipation plate is provided with a mainboard mounting area. On the orthographic projection surface in the thickness direction of the heat dissipation plate, at least a portion of the first heat dissipation surface overlaps with the mainboard mounting area.

8. A middle frame assembly, characterized in that: It comprises a temperature equalizing plate and a middle frame as described in any one of claims 1 to 7; the temperature equalizing plate comprises a plate body and a skirt adjacent to the edge of the plate body, at least part of the plate body is embedded in the accommodating cavity and cooperates with the first heat dissipation surface for thermal conduction; the thickness of the skirt is less than the thickness of the plate body, the skirt is clamped in the limiting groove, and cooperates with the second heat dissipation surface for thermal conduction.

9. The middle frame assembly according to claim 8, characterized in that: The plate body includes a convex body protruding from the skirt, and the convex body is embedded in the accommodating cavity. The convex body includes a third heat dissipation surface that cooperates with the first heat dissipation surface for thermal conduction, and a heat dissipation side surface arranged around the third heat dissipation surface. The third heat dissipation surface is in contact with the first heat dissipation surface, and the heat dissipation side surface is in thermal conduction with the side wall of the accommodating cavity.

10. The middle frame assembly according to claim 8, characterized in that: The skirt includes a first limiting body adjacent to the plate body and a second limiting body bent and connected to the first limiting body; the limiting groove is provided with a first groove adapted to the first limiting body and a second groove adapted to the second limiting body.

11. The middle frame assembly according to any one of claims 8 to 10, characterized in that: The middle frame assembly further includes a heat-conducting adhesive layer, and the plate body and / or the skirt are bonded and fixed to the heat dissipation plate via the heat-conducting adhesive layer.

12. The middle frame assembly according to claim 11, characterized in that: The thermally conductive adhesive layer is sandwiched between the plate body and the first heat dissipation surface; and / or the thermally conductive adhesive layer is sandwiched between the skirt and the second heat dissipation surface.

13. An electronic device, characterized in that: The device comprises a heat source device and the middle frame assembly according to any one of claims 8 to 12, wherein the heat source device is arranged on the middle frame and cooperates with the plate body for heat conduction.

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