Multi-channel light emitting diode packaging structure

Abstract

The utility model provides a multi-channel light-emitting diode packaging structure, which comprises a bearing unit, a driving chip, at least one upper light-emitting chip and a lower light-emitting chip. The bearing unit is provided with a bearing top surface and comprises a first accommodating part and a second accommodating part which are recessed from the bearing top surface; the driving chip is arranged in the first accommodating part, and the top surface of the driving chip is lower than the bearing top surface of the bearing unit. The at least one upper light-emitting chip is arranged on the bearing top surface of the bearing unit. The lower light-emitting chip is arranged in the second containing part, the top face of the lower light-emitting chip is lower than the bearing top face of the bearing unit, the second containing part is filled with fluorescent powder, and the fluorescent powder completely covers the lower light-emitting chip.

Description

Technical Field

[0001] The utility model relates to a multi-channel light emitting diode packaging structure, in particular to a light emitting diode packaging structure comprising a plurality of light emitting diode chips and a driver chip. The driver chip can be used to adjust the lighting states of the plurality of light emitting diode chips. Background Art

[0002] Large liquid crystal displays, such as those used in automotive electronic information systems, require dimmable backlighting with light-emitting diode (LED) light sources, also known as multi-channel LED devices. A multi-channel LED device typically includes a carrier substrate, white or amber LEDs, LEDs of other colors, and an LED driver IC.

[0003] Existing multi-channel light-emitting diode devices arrange white or amber LEDs, other color LEDs, and driver ICs in a way that causes light blocking. One arrangement is to arrange the white or amber LEDs, other color LEDs, and driver ICs on the top surface of a carrier substrate. The disadvantage of this arrangement is that the driver IC blocks the side light of the other color LEDs, thereby limiting the intensity and viewing angle of the light. In addition, blue light may irradiate the phosphors around the white or amber LEDs, resulting in unexpected stray light. Another arrangement is to use a retaining wall to separate the white or amber LEDs from the other color LEDs. This method also limits the intensity and viewing angle of the light.

[0004] Therefore, how to improve the lighting effect of the multi-channel LED package by improving the structural design and overcome the above-mentioned defects has become a problem to be solved in this technical field. Utility Model Content

[0005] The technical problem to be solved by the present invention is to provide a multi-channel light emitting diode packaging structure to address the deficiencies of the prior art, so as to increase the light intensity and widen the viewing angle, thereby improving the lighting effect.

[0006] In order to solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a multi-channel light-emitting diode packaging structure, which includes a carrier unit, a driver chip, at least one upper light-emitting chip, and a lower light-emitting chip. The carrier unit is defined to be provided with a carrier top surface, and the carrier unit includes a first accommodating portion recessed by the carrier top surface, and a second accommodating portion. The driver chip is arranged in the first accommodating portion, and the top surface of the driver chip is lower than the carrier top surface of the carrier unit. The at least one upper light-emitting chip is arranged on the carrier top surface of the carrier unit. The lower light-emitting chip is arranged in the second accommodating portion, and the top surface of the lower light-emitting chip is lower than the carrier top surface of the carrier unit. The second accommodating portion is filled with a phosphor body, and the phosphor body completely covers the lower light-emitting chip.

[0007] The beneficial effect of the present invention is at least that the multi-channel LED package structure provided by the present invention can utilize the recessed first and second accommodating portions provided on the carrier unit, wherein the driver chip is disposed in the first accommodating portion, at least one upper light-emitting chip is disposed on the carrier top surface of the carrier unit, and the lower light-emitting chip is disposed in the second accommodating portion. Thus, the light from the at least one upper light-emitting chip and the lower light-emitting chip is not blocked, thereby improving the lighting effect of the multi-channel LED package structure.

[0008] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A schematic cross-sectional view showing a multi-channel light emitting diode package structure according to an embodiment of the present invention;

[0010] Figure 2 express Figure 1 One of the enlarged views of Part II;

[0011] Figure 3 express Figure 1 The second enlarged view of part II;

[0012] Figure 4 express Figure 1 An enlarged view of part IV;

[0013] Figure 5 A schematic top view showing a multi-channel light emitting diode package structure configured with an upper light emitting chip according to an embodiment of the present invention;

[0014] Figure 6A schematic top view showing a multi-channel light emitting diode package structure configured with three upper light emitting chips according to an embodiment of the present invention;

[0015] Figure 7 A side view schematically shows a multi-channel light emitting diode package structure configured with three upper light emitting chips according to an embodiment of the present invention. DETAILED DESCRIPTION

[0016] To make the technical problems, technical solutions, and advantages to be solved by the present invention more apparent, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided solely to facilitate a comprehensive understanding of the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, descriptions of known functions and structures have been omitted for clarity and brevity.

[0017] It should be understood that references throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic associated with the embodiment is included in at least one embodiment of the present invention. Therefore, the appearances of "in one embodiment" or "in an embodiment" throughout this specification do not necessarily refer to the same embodiment. Furthermore, these particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0018] See Figure 1 An embodiment of the present invention provides a multi-channel light-emitting diode package structure 100, hereinafter referred to as the light-emitting diode package structure 100. The light-emitting diode package structure 100 includes a carrier unit 10, a driver chip 20, at least one upper light-emitting chip 31, and a lower light-emitting chip 30. The carrier unit 10 is defined by a carrier top surface 101 and includes a first accommodating portion 11 and a second accommodating portion 12. The first accommodating portion 11 and the second accommodating portion 12 are formed by recesses in the carrier top surface 101.

[0019] The multi-channel light-emitting diode package structure 100 further includes a lens layer 50, which covers at least the upper light-emitting chip 31. However, the coverage of the lens layer 50 is not limited thereto. In this embodiment, the lens layer 50 may be filled with resin, and the lens layer 50 completely covers the top surface 101 of the carrier unit 10. In other words, the coverage of the lens layer 50 may include the first accommodating portion 11, the second accommodating portion 12, the driver chip 20, at least one upper light-emitting chip 31, and a lower light-emitting chip 30, and is higher than all the metal wires ( Figure 1 Omitted, see Figure 7 ).

[0020] The present invention arranges the driver chip 20 in the first accommodating portion 11, and arranges the lower light-emitting chip 30 in the second accommodating portion 12. The first accommodating portion 11 may be, but is not limited to, a square groove, and the second accommodating portion 12 may be, but is not limited to, a bowl-shaped or basin-shaped groove. At least one upper light-emitting chip 31 is located on the supporting top surface 101 between the first accommodating portion 11 and the second accommodating portion 12. In other words, the top surface positions of the driver chip 20 and the lower light-emitting chip 30 are lower than or equal to the bottom surface position of at least one upper light-emitting chip 31. Through the above structural arrangement, its advantages are at least that the driver chip 20 will not block the light of the upper light-emitting chip 31, the light of the lower light-emitting chip 30 will not be mixed with the light of the upper light-emitting chip 31, and the upper light-emitting chip 31 will not accidentally excite the phosphor around the lower light-emitting chip 30 and emit unexpected light. In this way, the lighting angle can be wider and the light color can be simpler.

[0021] In this embodiment, the carrier unit 10 is used to support the driver chip 20 and multiple light-emitting chips. The carrier unit 10 can be a circuit board, and can be a multi-layer printed circuit board. However, the present invention is not limited to this. The first accommodating portion 11 and the second accommodating portion 12 can be drilled or etched into one or more layers of the circuit board.

[0022] The driver chip 20 is disposed in the first accommodation portion 11, and the top surface of the driver chip 20 is lower than the top surface 101 of the carrier unit 10. In this embodiment, the driver chip 20 can be, for example, a four-channel LED driver IC for controlling the brightness and on / off state of the light-emitting chip.

[0023] The light emitting chip is a light emitting diode chip that emits visible light. The number of the upper light emitting chip 31 is at least one, which is arranged on the carrier top surface 101 of the carrier unit 10. The upper light emitting chip 31 is electrically connected to the driver chip 20 through bonding wires. Figure 5 As shown in FIG, the present invention is provided with an upper light emitting chip 31, which can emit light of one color. In addition, another embodiment of the present invention, such as Figure 6 As shown, this is an embodiment of the present invention with three upper light-emitting chips 31, 32, and 33, which can respectively emit light of different colors. Detailed description will be given later.

[0024] like Figure 1As shown, the lower light-emitting chip 30 is disposed within the second accommodating portion 12. The second accommodating portion 12 is filled with a phosphor 30P, which completely covers the lower light-emitting chip 30. The function of the second accommodating portion 12 in this embodiment is to provide white light. For example, the lower light-emitting chip 30 can be a blue LED chip with a wavelength of 445nm to 475nm, and the phosphor 30P can be yellow or green phosphor. The blue light from the LED is partially converted and mixed by the yellow or green phosphor to produce white light.

[0025] In another embodiment, Figure 1 As shown, the lower light-emitting chip 30 is disposed within the second accommodating portion 12. The second accommodating portion 12 is filled with a phosphor 30P, which completely covers the lower light-emitting chip 30. The second accommodating portion 12 in this embodiment functions to provide amber light. The lower light-emitting chip 30 can be a blue LED chip, for example, with a wavelength of 445nm to 525nm. The phosphor 30P can be a red phosphor. The blue light from the LED is partially converted and mixed by the red phosphor to produce amber light.

[0026] like Figure 2 and Figure 3 As shown, Figure 2 for Figure 1 An enlarged view of part II, Figure 3 for Figure 2 An enlarged view of section III of the second accommodating portion 12 is shown. The second accommodating portion 12 is formed by a bottom surface 121 and an inclined wall surface 122, generally forming a bowl or basin shape. The angle θ between the inclined wall surface 122 and the bottom surface 121 is greater than 90 degrees. In this embodiment, the angle θ between the inclined wall surface 122 and the bottom surface 121 is less than or equal to 135 degrees. Furthermore, the inclined wall surface 122 may be provided with a reflective layer to reflect light.

[0027] In this embodiment, the top surface of the lower light-emitting chip 30 is lower than the top surface 101 of the carrier unit 10. Specifically, the top surface of the lower light-emitting chip 30 is at least 0.15 mm lower than the top surface 101 of the carrier unit 10. In other words, the depth D3 of the second accommodating portion 12 is at least 0.15 mm greater than the height H3 of the lower light-emitting chip 30.

[0028] like Figure 4 As shown, Figure 4 for Figure 1An enlarged view of section IV of the first accommodating portion 11 is shown. In this embodiment, the wall surrounding the driver chip 20 may be perpendicular to or slightly inclined relative to the carrier top surface 101, generally forming a shallow cup shape. The top surface of the driver chip 20 is at least 0.1 mm lower than the carrier top surface 101 of the carrier unit 10. In other words, the depth D2 of the first accommodating portion 11 is at least 0.1 mm greater than the height H2 of the driver chip 20.

[0029] like Figure 5 As shown, it is a top view of the multi-channel light emitting diode package structure of the present invention. In this embodiment, the carrier unit 10 is a circuit board. Figure 5 The circuit layout on the top surface of the circuit board is shown. The circuit board has four corners 41a, 41b, 41c, and 41d, each of which is provided with a partial via. Specifically, each partial via can be formed by cutting a large circuit board with multiple carrier units 10 to form a quarter-sized conductive via, which can serve as a conductive terminal.

[0030] The four corners 41a, 41b, 41c, and 41d are respectively provided with a driver chip output portion, a driver chip input portion, an anode connection portion, and a cathode connection portion. The driver chip 20 is adjacent to the driver chip output portion (reference corner 41a) and the driver chip input portion (reference corner 41b), and the second accommodating portion 12 is adjacent to the anode connection portion (reference corner 41c) and the cathode connection portion (reference corner 41d). Furthermore, because the circuit board is a multi-layer printed circuit board, the cathode connection portion (reference corner 41d) can be electrically connected to the driver chip 20 via an internal wiring layer 413, thereby saving the area of the carrier top surface 101. In other words, the carrier unit 10 can be made more compact.

[0031] like Figure 6 As shown, the multi-channel LED package structure 100 a of this embodiment has three upper light-emitting chips 31 , 32 , and 33 , which may be, for example, a blue light-emitting chip, a red light-emitting chip, and a green light-emitting chip, respectively.

[0032] The following example illustrates an embodiment of a circuit design for a multi-channel light-emitting diode package structure of the present invention, but is not limited thereto. For example, the pins of the driver chip 20 may include an input power terminal (Vin), a signal input terminal (Din), a ground terminal (GND), a signal output terminal (Dout), and four terminals (ILED1 to ILED4) connected to the cathode of the LED. A conductive layer 43 is provided on the top surface 101 of the carrier unit 10. The conductive layer 43 includes an anode bus 434. The anode bus 434 electrically connects an electrode of the upper light-emitting chip 31, an electrode of the upper light-emitting chip 32, an electrode of the upper light-emitting chip 33, and an electrode of the lower light-emitting chip 30. The anode bus 434 is also electrically connected to the anode connection portion (41c).

[0033] The conductive layer 43 further includes a first solidification region 431 and a second solidification region 432. The first solidification region 431 is located between the first accommodating portion 11 and the second accommodating portion 12. The second solidification region 432 is located between the first accommodating portion 11 and the anode bus 434. The anode bus 434 is located between the second solidification region 432 and the second accommodating portion 12. The upper light-emitting chip 31 and the upper light-emitting chip 33 are disposed in the second solidification region 432, and the upper light-emitting chip 32 is disposed in the first solidification region 431.

[0034] In one embodiment, the upper light-emitting chip 31 is a blue light-emitting chip, the upper light-emitting chip 32 is a green light-emitting chip, and the upper light-emitting chip 33 is a red light-emitting chip.

[0035] In another embodiment, the upper light-emitting chip 31 is a green light-emitting chip, the upper light-emitting chip 32 is a blue light-emitting chip, and the upper light-emitting chip 33 is a red light-emitting chip.

[0036] [Beneficial Effects of Embodiments]

[0037] The beneficial effect of the present invention is at least that the multi-channel LED package structure provided by the present invention can be achieved by providing a recessed first accommodating portion and a second accommodating portion on a carrier unit, wherein a driver chip is disposed in the first accommodating portion, at least one upper light-emitting chip is disposed on the carrier top surface of the carrier unit, and a lower light-emitting chip is disposed in the second accommodating portion. In this way, the light of the at least one upper light-emitting chip is not blocked, thereby increasing the light intensity and widening the viewing angle, thereby enhancing the lighting effect of the multi-channel LED package structure.

[0038] In this embodiment, the top surfaces of the driver chip and the lower light-emitting chip are both lower than or equal to the bottom surface of the upper light-emitting chip. The top surface of the phosphor is also lower than or equal to the bottom surface of the upper light-emitting chip. This ensures that the blue light from the upper light-emitting chip does not excite the phosphor within the second housing and generate unintended stray light.

[0039] In addition, the multi-channel LED package structure of the present invention also provides an embodiment of circuit planning, which can save the area of the top surface of the carrier. In other words, it can make the carrier unit more compact.

[0040] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A multi-channel light emitting diode packaging structure, characterized in that: include: A carrying unit, wherein the carrying unit defines a carrying top surface, and the carrying unit includes a first accommodating portion recessed from the carrying top surface, and a second accommodating portion; a driver chip disposed in the first accommodating portion, wherein a top surface of the driver chip is lower than the carrying top surface of the carrying unit; At least one upper light-emitting chip is disposed on the carrying top surface of the carrying unit; as well as A lower light-emitting chip is arranged in the second accommodating portion, and the top surface of the lower light-emitting chip is lower than the supporting top surface of the supporting unit, wherein the second accommodating portion is filled with a phosphor body, and the phosphor body completely covers the lower light-emitting chip.

2. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The device further comprises a lens layer, wherein the lens layer at least covers the at least one upper light-emitting chip.

3. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The at least one upper light-emitting chip is located between the first accommodating portion and the second accommodating portion.

4. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The top surface of the driving chip is at least 0.1 mm lower than the carrying top surface of the carrying unit.

5. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The top surface of the lower light-emitting chip is at least 0.15 mm lower than the carrying top surface of the carrying unit.

6. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The second accommodating portion is formed by a bottom surface and an inclined wall surface, and the angle between the inclined wall surface and the bottom surface is greater than 90 degrees.

7. The multi-channel light emitting diode package structure according to claim 6, characterized in that: An included angle between the inclined wall surface and the bottom surface is less than or equal to 135 degrees.

8. The multi-channel light emitting diode package structure according to claim 6, characterized in that: The inclined wall surface is provided with a reflective layer.

9. The multi-channel light emitting diode package structure according to claim 1, characterized in that: The supporting unit is a circuit board having four corners. Each corner is provided with a local through hole. The four corners are respectively provided with an anode connection portion, a cathode connection portion, a driver chip output portion, and a driver chip input portion.

10. The multi-channel light emitting diode package structure according to claim 9, characterized in that: The circuit board is a multi-layer structure, and the cathode connecting portion is electrically connected to the driving chip through an internal circuit layer.

11. The multi-channel light emitting diode package structure according to claim 9, characterized in that: The driving chip is adjacent to the driving chip output portion and the driving chip input portion, and the second accommodating portion is adjacent to the anode connecting portion and the cathode connecting portion.

12. The multi-channel light emitting diode package structure according to claim 11, characterized in that: The at least one upper light emitting chip includes a blue light emitting chip, a red light emitting chip, and a green light emitting chip. The lower light emitting chip emits blue light, and the blue light is converted into white light after passing through the phosphor.

13. The multi-channel light emitting diode package structure according to claim 11, characterized in that: The at least one upper light emitting chip includes a blue light emitting chip, a red light emitting chip, and a green light emitting chip. The lower light emitting chip emits blue light, and the blue light is converted into amber light after passing through the phosphor.

14. The multi-channel light emitting diode package structure according to claim 12 or 13, characterized in that: A conductive layer is provided on the top surface of the carrier unit, and the conductive layer includes an anode bus. The anode bus is electrically connected to an electrode of the blue light-emitting chip, an electrode of the red light-emitting chip, an electrode of the green light-emitting chip, and an electrode of the lower light-emitting chip. The anode bus is also electrically connected to the anode connecting portion.

15. The multi-channel light emitting diode package structure according to claim 14, characterized in that: The conductive layer also includes a first solidification area and a second solidification area. The first solidification area is located between the first accommodating portion and the second accommodating portion. The second solidification area is located between the first accommodating portion and the anode bus. The anode bus is located between the second solidification area and the second accommodating portion.

16. The multi-channel light emitting diode package structure according to claim 15, characterized in that: The blue light emitting chip and the red light emitting chip are arranged in the second crystal-bonding area, and the green light emitting chip is arranged in the first crystal-bonding area.

17. The multi-channel light emitting diode package structure according to claim 15, characterized in that: The green light emitting chip and the red light emitting chip are arranged in the second crystal-bonding area, and the blue light emitting chip is arranged in the first crystal-bonding area.

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