Crystal optical axis surface processing equipment and system

Abstract

The utility model discloses crystal optical axis surface machining equipment and system, and belongs to the technical field of crystal machining equipment. The crystal optical axis surface machining equipment comprises a single-wire cutting mechanism, an angle adjusting mechanism, a crystal clamping mechanism and a stress detector. The crystal clamping mechanism, the angle adjusting mechanism and the stress detector are all integrated in the single-wire cutting mechanism platform, and the crystal clamping mechanism is adopted for one-time clamping to be matched with the angle adjusting mechanism, so that rough machining and finish machining can be carried out on a crystal bar through a cutting wire in the single-wire cutting mechanism platform. In other words, the crystal bar does not need to be clamped in multiple machining and detecting devices in a circulating and reciprocating mode, the crystal bar can be detected and machined through the crystal optical axis surface machining device, the directional machining process of the crystal bar optical axis surface is effectively simplified, and the directional machining efficiency of the crystal bar optical axis surface is improved.

Description

Technical Field

[0001] The present application relates to the technical field of crystal processing equipment, and in particular to a crystal optical axis surface processing equipment and system. Background Art

[0002] Crystals (e.g., fluoride crystals) are widely used in laser, infrared, ultraviolet optics, high-energy detection and other fields. They are excellent materials for making infrared optical system components such as optical prisms, lenses and windows. They can also be used to make large-size lenses for laser lithography, as well as used as fluorescent and upconversion luminescent materials.

[0003] Currently, crystal orientation processing typically involves grinding the crystal on a single-axis machine to correct the deflection angle. Once the polished plane (i.e., the crystal plane) is within ±10° of the ideal optical axis, the crystal is placed in an X-ray orientation instrument to measure the deflection between the actual and ideal optical axes. The crystal is then re-ground on the single-axis machine for further refinement. This process is repeated until the deflection between the actual and ideal optical axes is within 12°.

[0004] However, the above steps require continuous disassembly and assembly of the crystal, resulting in low efficiency in the crystal optical axis plane orientation processing. Utility Model Content

[0005] The present invention provides a crystal optical axis surface processing device and system. This device and system can solve the problem of low efficiency in crystal optical axis surface orientation processing in the prior art. The technical solution is as follows:

[0006] In one aspect, a crystal optical axis surface processing device is provided, the crystal optical axis surface processing device comprising:

[0007] Single-wire cutting mechanism, angle adjustment mechanism, crystal clamping mechanism and stress detector;

[0008] The single-wire cutting mechanism extends along a first direction, has a first installation position and a second installation position distributed along the first direction, and has a cutting line moving along the first direction;

[0009] The angle adjustment mechanism is installed at the first installation position, and the single-wire cutting mechanism can drive the angle adjustment mechanism to rotate around a first axis, and the extension direction of the first axis is parallel to the first direction;

[0010] The crystal clamping mechanism is installed on a side of the angle adjustment mechanism away from the first installation position, and the crystal clamping mechanism is used to clamp the crystal rod;

[0011] The stress detector is installed at the second installation position and is movably connected to the single-wire cutting mechanism. The stress detector is arranged adjacent to the crystal clamping mechanism, and the crystal rod is distributed between the polarizer and the analyzer of the stress detector;

[0012] In which, when the stress detector moves so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod, the angle adjustment mechanism is used to drive the crystal to move through the crystal clamping mechanism to present a target image in the analyzer of the stress detector, and can drive the crystal rod to rotate around a second axis through the crystal clamping mechanism, and the extension direction of the second axis is perpendicular to the first direction and is not parallel to the central axis of the crystal rod.

[0013] Optionally, the angle adjustment mechanism includes: a universal shaft adjustment assembly and a tilt angle adjustment assembly, wherein the bottom of the tilt angle adjustment assembly is mounted at the first mounting position, the bottom of the universal shaft adjustment assembly is fixed to the top of the tilt angle adjustment assembly, and the end of the universal shaft adjustment assembly facing away from the tilt angle adjustment assembly is fastened to the crystal clamping mechanism;

[0014] In which, the universal joint adjustment component is configured to: drive the crystal to move through the crystal clamping mechanism to present the target image in the analyzer of the stress detector; the tilt angle adjustment component is configured to: drive the crystal rod to rotate around the second axis through the crystal clamping mechanism.

[0015] Optionally, the universal shaft adjustment assembly includes: a ball joint base fixedly mounted on the tilt angle adjustment assembly, and a universal shaft ball joint rotatably mounted in the ball joint base, the universal shaft ball joint having a connecting piece, and the universal shaft ball joint is connected to the crystal clamping mechanism through the connecting piece.

[0016] Optionally, the tilt angle adjustment assembly includes: a first sliding platform, a second sliding platform, a transmission member, and a driving member, wherein the first sliding platform has a first curved surface, the second sliding platform has a second curved surface that slides in cooperation with the first curved surface, the first sliding platform is installed at the first installation position on a side facing away from the second sliding platform, and the second sliding platform is fastened to the universal shaft adjustment assembly on a side facing away from the first sliding platform; the transmission member is located between the first sliding platform and the second sliding platform and is respectively in transmission connection with the first sliding platform and the second sliding platform; and the driving member is in transmission connection with the transmission member;

[0017] Wherein, the first arc surface and the second arc surface are both distributed around the second axis.

[0018] Optionally, the crystal clamping mechanism includes: at least one set of locking assemblies, each set of the locking assemblies including two oppositely disposed V-shaped clamps and two locking members, each of the locking members being respectively fastened to one set of ends of the two V-shaped clamps;

[0019] Wherein, the crystal rod is installed between two V-shaped clamps in each set of locking components.

[0020] Optionally, the crystal clamping mechanism further includes: a rubber pad located between the V-shaped clamp and the crystal rod, with two sides of the rubber pad respectively in contact with the crystal rod and the V-shaped clamp.

[0021] Optionally, the single-wire cutting mechanism has a rotary drive platform provided at the first installation position, and the angle adjustment mechanism is installed on the rotary drive platform;

[0022] Wherein, the rotation driving platform can drive the angle adjustment mechanism to rotate around the first axis.

[0023] Optionally, the crystal optical axis surface processing equipment further comprises: a driving mechanism installed at the second installation position, the stress detector being in transmission connection with the driving mechanism;

[0024] The driving mechanism is configured to drive the stress detector to move so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod.

[0025] Optionally, the driving mechanism includes: a driving screw, an adapter, and a lifting bracket, the driving screw is installed at the second installation position and is threadedly connected to the adapter, the lifting bracket is slidably connected to the adapter along the first direction, the stress detector is connected to the lifting bracket, and the extension direction of the driving screw is parallel to the extension direction of the second axis;

[0026] Wherein, the driving screw is configured to: when it rotates under the action of an external force, drive the stress detector to move through the adapter and the lifting bracket.

[0027] On the other hand, a crystal optical axis surface processing system is provided, which includes: an X-ray orienter and the crystal optical axis surface processing equipment, and the crystal optical axis surface processing equipment is the crystal optical axis surface processing equipment given above.

[0028] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0029] A crystal optical axis surface processing device may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism, and a stress detector. By integrating the crystal clamping mechanism, angle adjustment mechanism, and stress detector into a single-wire cutting platform, the crystal clamping mechanism, combined with the angle adjustment mechanism, can be used to perform rough and fine processing of a crystal rod using a cutting wire within the single-wire cutting platform. This eliminates the need to repeatedly clamp the crystal rod between multiple processing and testing devices. This device can be used to inspect and process the crystal rod, effectively simplifying the orientation processing of the crystal rod's optical axis surface and improving its efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 This is a schematic structural diagram of a crystal optical axis surface processing device provided in an embodiment of the present application;

[0032] Figure 2 yes Figure 1 A front view of a crystal optical axis surface processing device is shown;

[0033] Figure 3 This is a schematic structural diagram of another crystal optical axis surface processing device provided in an embodiment of the present application;

[0034] Figure 4 This is a schematic structural diagram of a universal joint adjustment assembly provided in an embodiment of the present application;

[0035] Figure 5 This is a structural diagram of a tilt angle adjustment assembly provided in an embodiment of the present application;

[0036] Figure 6 This is a schematic structural diagram of a crystal optical axis surface processing device provided in an embodiment of the present application;

[0037] Figure 7 This is a partial structural diagram of a driving mechanism provided in an embodiment of the present application.

[0038] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0040] Please refer to Figure 1 and Figure 2 , Figure 1 This is a schematic structural diagram of a crystal optical axis surface processing device provided in an embodiment of the present application. Figure 2 yes Figure 1 The crystal optical axis surface processing device 000 may include: a single wire cutting mechanism 100 , an angle adjustment mechanism 200 , a crystal clamping mechanism 300 and a stress detector 400 .

[0041] The single-wire cutting mechanism 100 in the crystal optical axis surface processing apparatus 000 can extend along a first direction f1. The single-wire cutting mechanism 100 can have a first mounting position w1 and a second mounting position w2 distributed along the first direction f1. The single-wire cutting mechanism 100 can also have a cutting wire 101 that moves along the first direction f1. Here, the cutting wire 101 in the single-wire cutting mechanism 100 can be driven by the single-wire cutting mechanism to move along the first direction f1 to cut wafers from the crystal rod A.

[0042] The angle adjustment mechanism 200 in the crystal optical axis surface processing equipment 000 can be installed at the first installation position w1 of the single-wire cutting mechanism 100, and the single-wire cutting mechanism 100 can drive the angle adjustment mechanism 200 to rotate around the first axis L1, and the extension direction of the first axis L1 can be parallel to the first direction f1.

[0043] The crystal clamping mechanism 300 in the crystal optical axis surface processing apparatus 000 is installed on the side of the angle adjustment mechanism 200 away from the first mounting position w1 of the single wire cutting mechanism 100. The crystal clamping mechanism 300 can be used to clamp the crystal rod A. For example, the crystal rod A can be cylindrical and can be a magnesium fluoride crystal.

[0044] The stress detector 400 in the crystal optical axis surface processing apparatus 000 can be installed at the second installation position w2 of the single-wire cutting mechanism 100 and can be movably connected to the single-wire cutting mechanism 100. The stress detector 400 can be arranged adjacent to the crystal clamping mechanism 300, and the crystal rod A can be distributed between the polarizer 401 and the analyzer 402 in the stress detector 400. For example, the stress detector 400 can also have a light source (not shown in the figure) located on the side of the polarizer 401 away from the analyzer 402, and the light source can emit light toward the polarizer 401.

[0045] In particular, when the stress detector 400 moves on the single-wire cutting mechanism 100 so that the optical axis of the polarizer 401 of the stress detector 400 is coaxial with the crystal axis of the crystal rod A, the angle adjustment mechanism 200 can be used to drive the crystal rod A to move through the crystal clamping mechanism 300 to present a target image in the analyzer 402 of the stress detector 400. The crystal clamping mechanism 300 can also drive the crystal rod A to rotate about a second axis L2. The extension direction of the second axis L2 can be perpendicular to the first direction f1 and non-parallel to the central axis of the crystal rod A (which extends along the axial direction of the crystal rod). The relative position between the second axis L2 and the angle adjustment mechanism 200 remains constant, but the second axis moves with the corresponding angle adjustment mechanism. Here, the target image presented in the analyzer 402 of the stress detector 400 can be a crystal conoscopic diagram.

[0046] For example, in the process of orienting the optical axis surface of the crystal rod, the crystal clamping mechanism 300 can be used to clamp the crystal rod A first; then the position of the stress detector 400 on the platform of the single-wire cutting mechanism 100 is adjusted so that the crystal axis of the crystal rod A is coaxial with the optical axis of the polarizer 401 in the stress detector 400; then, the angle adjustment mechanism 200 is used to adjust the placement angle of the crystal rod A until the crystal conoscopic diagram is seen at the center of the analyzer 402 in the stress detector 400; then, the cutting line 101 of the single-wire cutting mechanism 100 is manipulated to move in the crystal rod. A wafer is cut from the solid ingot A to complete rough machining of the ingot A. An external X-ray orienter is used to determine the first deviation angle between the actual crystal plane (i.e., the optical axis plane) cut from the wafer and the ideal crystal plane. Finally, using the first deviation angle as a reference, the single-wire cutting mechanism 100 and the angle adjustment mechanism 200 coordinate to correct the deviation angle between the actual crystal plane and the ideal crystal plane of the ingot A. Cutting line 101 is then used to cut another crystal plane from the ingot A, completing the finish machining of the ingot A. The second deviation angle between this crystal plane and the ideal crystal plane is now the desired deviation angle. For example, the deviation angle range for the first deviation angle can be ±10°, and the deviation angle range for the second deviation angle can be ±12′.

[0047] In the embodiment of the present application, by integrating the crystal clamping mechanism 300, the angle adjustment mechanism 200, and the stress detector 400 into the single-wire cutting mechanism 100 platform, the crystal clamping mechanism 300 can be used in conjunction with the angle adjustment mechanism 200 to perform both rough and fine machining of the crystal rod A using the cutting wire 101 within the single-wire cutting mechanism 100 platform. This eliminates the need to repeatedly clamp the crystal rod A between multiple processing and inspection devices. Instead, the crystal optical axis surface processing device 000 can be used to complete the inspection and processing of the crystal rod A, effectively simplifying the crystal rod optical axis surface orientation processing process and improving the efficiency of the crystal rod optical axis surface orientation processing.

[0048] In summary, the embodiments of the present application provide a crystal optical axis surface processing device, which may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism, and a stress detector. By integrating the crystal clamping mechanism, the angle adjustment mechanism, and the stress detector into a single-wire cutting platform, the crystal rod can be rough- and fine-machined using a cutting wire in the single-wire cutting mechanism platform by using the crystal clamping mechanism and the angle adjustment mechanism for one-time clamping. In other words, there is no need to cyclically move and clamp the crystal rod in multiple processing and inspection equipment. Instead, the crystal optical axis surface processing device can be used to complete the inspection and processing of the crystal rod, effectively simplifying the directional processing process of the crystal rod optical axis surface and improving the efficiency of the directional processing of the crystal rod optical axis surface.

[0049] Optional, please refer to 1 and Figure 3 , Figure 3 : is a structural schematic diagram of another crystal optical axis surface processing device provided in an embodiment of the present application. The angle adjustment mechanism 200 in the crystal optical axis surface processing device 000 may include: a universal shaft adjustment component 201 and a tilt angle adjustment component 202. The bottom of the tilt angle adjustment component 202 can be installed at the first installation position w1 of the single-wire cutting mechanism 100. The bottom of the universal shaft adjustment component 201 can be fixed to the top of the tilt angle adjustment component 202, and the end of the universal shaft adjustment component 201 facing away from the tilt angle adjustment component 202 can be fastened to the crystal clamping mechanism 300. Among them, the universal shaft adjustment component 201 can be configured to: drive the crystal rod A to move through the crystal clamping mechanism 300, so as to present the target image in the analyzer 402 of the stress detector 400. The tilt angle adjustment component 202 can be configured to: drive the crystal rod A to rotate around the second axis L2 through the crystal clamping mechanism 300. In this case, the provision of a universal shaft adjustment assembly 201 facilitates manual adjustment of the angle of crystal ingot A during the rough machining of crystal ingot A, allowing the cutting line 101 in the single-wire cutting mechanism 100 to perform a primary cut on crystal ingot A to correct the deflection angle between the actual crystal plane and the ideal crystal plane. Furthermore, the provision of a tilt angle adjustment assembly 202 enables precise adjustment of the angle of crystal ingot A during the fine machining of crystal ingot A, allowing the cutting line 101 in the single-wire cutting mechanism 100 to perform a secondary cut on crystal ingot A to further correct the deflection angle between the actual crystal plane and the ideal crystal plane.

[0050] It should be noted that the deflection angle between the actual crystal plane measured by the X-ray orienter and the ideal crystal plane typically includes two angles. Of the six degrees of freedom, one angle is the deflection angle around the first axis L1, and the other is the deflection angle around the second axis L2. Therefore, the combination of the single-wire cutting mechanism 100 and the tilt angle adjustment assembly 202 can respectively correct the deflection angle around the first axis L1 and the second axis L2.

[0051] In the examples of this application, please refer to Figure 3 and Figure 4 , Figure 4 : is a structural schematic diagram of a universal shaft adjustment assembly provided in an embodiment of the present application. The universal shaft adjustment assembly 201 may include: a ball hinge base 201a fixedly mounted on the tilt angle adjustment assembly 202, and a universal shaft ball hinge 201b rotatably mounted in the ball hinge base 201a, the universal shaft ball hinge 201b may have a connector 201c, and the universal shaft ball hinge 201b may be connected to the crystal clamping mechanism 300 through the connector 201c. In this case, the torque and stop generated by the cooperation of the ball hinge base 201a and the universal shaft ball hinge 201b can realize the rotation and stop of the crystal rod A at various angles, thereby improving the convenience of operation. For example, the connector 201c can be tightly connected to the crystal clamping mechanism 300.

[0052] Optional, please refer to Figure 3 、 Figure 5 and Figure 6 , Figure 5 is a structural diagram of a tilt angle adjustment assembly provided in an embodiment of the present application, Figure 6 Schematic diagram of the structure of a crystal optical axis surface processing device provided by an embodiment of the present application. The tilt angle adjustment assembly 202 may include: a first sliding table 202a, a second sliding table 202b, a transmission member (not shown in the figure), and a driving member 202c. The first sliding table 202a may have a first curved surface m1, and the second sliding table 202b may have a second curved surface m2 that slides in cooperation with the first curved surface m1 of the first sliding table 202a. The side of the first sliding table 202a facing away from the second sliding table 202b may be mounted at the first mounting position w1 of the single-wire cutting mechanism 100, and the side of the second sliding table 202b facing away from the first sliding table 202a may be fastened to the universal shaft adjustment assembly 201. The transmission member may be located between the first sliding table 202a and the second sliding table 202b and may be respectively connected to the first sliding table 202a and the second sliding table 202b. One end of the driving member 202c may be connected to the transmission member. The first arc surface m1 of the first sliding platform 202a and the second arc surface m2 of the second sliding platform 202b may both be distributed around the second axis L2.

[0053] In this case, by providing a first sliding platform 202a, a second sliding platform 202b, a transmission member, and a driver 202c within the tilt angle adjustment assembly 202, turning the driver 202c can drive the second sliding platform 202b to slide about the second axis L2 on the first curved surface m1 of the first sliding platform 202a via the transmission member, thereby causing the crystal clamping mechanism 300 and the crystal rod A to synchronously deflect by a corresponding angle. For example, the sides of the first and second sliding platforms 202a, 202b, may have angle reference scale lines (not shown) to facilitate the operator's identification of the deflection angle of the second sliding platform 202b. Alternatively, by presetting the rotation angle of the second sliding platform 202b relative to the first sliding platform 202a based on one rotation of the driver 202c, the rotation angle of the second sliding platform 202b relative to the first sliding platform 202a can be determined based on the number of rotations of the driver 202c.

[0054] It should be noted that the tilt angle adjustment assembly 202 can be a manual goniometer slide. For example, the side of the second slide 202b facing away from the first slide 202a can be fastened to the ball joint base 201a in the universal shaft adjustment assembly 201.

[0055] In the embodiments of this application, Figure 6 As shown, the crystal clamping mechanism 300 may include at least one set of locking assemblies 301. Each set of locking assemblies may include two opposing V-shaped clamps 301a and two locking members 301b. Each locking member 301b may be securely connected to one end of each of the two V-shaped clamps 301a. A crystal rod A may be mounted between the two V-shaped clamps 301a in each set of locking assemblies 301. In this case, by providing at least one set of locking assemblies in the crystal clamping mechanism, the two opposing V-shaped clamps 301a and two locking members 301b in each set of locking assemblies may facilitate the installation and removal of the crystal rod A. For example, the crystal clamping mechanism 300 may include two sets of locking assemblies 301.

[0056] It should be noted that a V-shaped clamp 301a can be connected to the universal shaft ball joint 201b in the universal shaft adjustment assembly 201. Each locking member 301b can be detachably connected to a set of ends of two V-shaped clamps 301a, and the locking members 301b can be used to adjust the tightness of the two V-shaped clamps 301a. For example, the locking members 301b can be locking screws, and the ends of the V-shaped clamps 301a can have screw holes corresponding to the locking screws.

[0057] Optional, such as Figure 6As shown, the crystal clamping mechanism 300 may further include a rubber pad 301c positioned between the V-shaped clamp 301a and the crystal rod A. Two sides of the rubber pad 301c may contact the outer side of the crystal rod A and the V-shaped clamp 301a, respectively. The rubber pad 301c may be fixed to the V-shaped clamp 301a. In this case, by providing the rubber pad 301c between the V-shaped clamp 301a and the crystal rod A in the crystal clamping mechanism 300, the rubber pad 301c can effectively protect the crystal rod A and prevent damage to the crystal rod A within the crystal clamping mechanism 300.

[0058] In the embodiments of this application, Figure 6 As shown, the single-wire cutting mechanism 100 can include a rotary drive platform 102 disposed at a first mounting position w1, and the angle adjustment mechanism 200 can be mounted on the rotary drive platform 102. The rotary drive platform 102 can drive the angle adjustment mechanism 200 to rotate about a first axis L1. It should be noted that the rotary drive platform 102 can drive the angle adjustment mechanism 200 to rotate one full revolution about the first axis L1. Thus, by directly mounting the angle adjustment mechanism 200 on the rotary drive platform 102 in the single-wire cutting mechanism 100, there is no need to install an additional rotary drive mechanism in the crystal optical axis surface processing equipment, thereby improving the integration of the crystal optical axis surface processing equipment and saving manufacturing costs.

[0059] It should be noted that the tilt angle adjustment component 202 in the angle adjustment mechanism 200 can be connected to the rotation driving platform 102 .

[0060] Optional, please refer to Figure 6 and Figure 7 , Figure 7 This is a partial structural diagram of a drive mechanism provided in an embodiment of the present application. The crystal optical axis surface processing apparatus 000 may further include a drive mechanism 500 mounted at the second mounting position w2 of the single-wire cutting mechanism 100, with the stress detector 400 being in transmission connection with the drive mechanism 500. The drive mechanism 500 may be configured to drive the stress detector so that the optical axis of the polarizer 401 of the stress detector is coaxial with the crystal axis of the crystal rod A.

[0061] In the present application, the drive mechanism 500 in the crystal optical axis surface processing apparatus 000 may include: a drive screw 501, an adapter 502, and a lifting bracket 503. The drive screw 501 may be mounted at the second mounting position w2 of the single-wire cutting mechanism and threadedly connected to the adapter 502. The lifting bracket 503 may be slidably connected to the adapter 502 along a first direction f1. The stress detector 400 may be connected to the lifting bracket 503. The drive screw 501 may extend parallel to the direction of the second axis L2. The drive screw 501 may be configured such that, when rotated by an external force, it drives the stress detector 400 via the adapter 502 and the lifting bracket 503. For example, the drive mechanism 500 may include: a base 504 fixed at the second mounting position w2 of the single-wire cutting mechanism 100. The drive screw 501 may be rotatably connected to the base 504. The adapter 502 may be threadedly connected to the drive screw 501 and capable of sliding on the base 504.

[0062] In this embodiment of the present application, the single-wire cutting mechanism includes a lifting drive mechanism and a cutting wire mounting mechanism (not shown). The cutting wire mounting mechanism comprises two disks positioned opposite each other along the length of the cutting wire, and two connecting plates corresponding to the two disks. The disks are mounted on the corresponding connecting plates, and the cutting wire is wound around the two disks and driven to rotate by the disks. The lifting drive mechanism is configured to drive the connecting plates to move the disks and the cutting wire back and forth along a first direction f1 to cut the crystal ingot A.

[0063] In summary, the embodiments of the present application provide a crystal optical axis surface processing device, which may include: a single-wire cutting mechanism, an angle adjustment mechanism, a crystal clamping mechanism, and a stress detector. By integrating the crystal clamping mechanism, the angle adjustment mechanism, and the stress detector into a single-wire cutting platform, the crystal rod can be rough- and fine-machined using a cutting wire in the single-wire cutting mechanism platform by using the crystal clamping mechanism and the angle adjustment mechanism for one-time clamping. In other words, there is no need to cyclically move and clamp the crystal rod in multiple processing and inspection equipment. Instead, the crystal optical axis surface processing device can be used to complete the inspection and processing of the crystal rod, effectively simplifying the directional processing process of the crystal rod optical axis surface and improving the efficiency of the directional processing of the crystal rod optical axis surface.

[0064] The embodiment of the present application also provides a crystal optical axis surface processing system, and the crystal optical axis surface processing system may include: an X-ray orienter (not shown in the figure) and a crystal optical axis surface processing device 000. For example, the crystal optical axis surface processing device may be any of the crystal optical axis surface processing devices given above. In this way, in the process of orienting the optical axis surface of the crystal rod, the crystal clamping mechanism 300 may be used to clamp the crystal rod A first; then the position of the stress detector 400 on the platform of the single-wire cutting mechanism 100 is adjusted so that the crystal axis of the crystal rod A is coaxial with the optical axis of the polarizer 401 in the stress detector 400; then the angle adjustment mechanism 200 is used to adjust the placement angle of the crystal rod A until the crystal cone diagram is seen at the center of the analyzer 402 in the stress detector 400; then the cutting line 101 of the single-wire cutting mechanism 100 is manipulated to be positioned at the crystal rod. A wafer is cut from the body rod A, and an X-ray orienter is used to obtain a first deviation angle between the actual crystal plane (i.e., the optical axis plane) cut from the wafer and the ideal crystal plane, i.e., rough processing of the crystal rod is performed. Finally, the deviation angle between the actual crystal plane and the ideal crystal plane of the crystal rod A is corrected using the first deviation angle as a reference through the single-wire cutting mechanism 100 and the angle adjustment mechanism 200, and a crystal plane is cut from the crystal rod A again using the cutting line 101, i.e., fine processing of the crystal rod A is performed. At this time, the second deviation angle between the crystal plane and the ideal crystal plane is the required deviation angle.

[0065] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0066] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0067] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A crystal optical axis surface processing device, characterized in that: include: Single-wire cutting mechanism, angle adjustment mechanism, crystal clamping mechanism and stress detector; The single-wire cutting mechanism extends along a first direction, has a first installation position and a second installation position distributed along the first direction, and has a cutting line moving along the first direction; The angle adjustment mechanism is installed at the first installation position, and the single-wire cutting mechanism can drive the angle adjustment mechanism to rotate around a first axis, and the extension direction of the first axis is parallel to the first direction; The crystal clamping mechanism is installed on a side of the angle adjustment mechanism away from the first installation position, and the crystal clamping mechanism is used to clamp the crystal rod; The stress detector is installed at the second installation position and is movably connected to the single-wire cutting mechanism. The stress detector is arranged adjacent to the crystal clamping mechanism, and the crystal rod is distributed between the polarizer and the analyzer in the stress detector. In which, when the stress detector moves so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod, the angle adjustment mechanism is used to drive the crystal rod to move through the crystal clamping mechanism to present the target image in the analyzer of the stress detector, and can drive the crystal rod to rotate around a second axis through the crystal clamping mechanism, and the extension direction of the second axis is perpendicular to the first direction and is not parallel to the central axis of the crystal rod.

2. The crystal optical axis surface processing equipment according to claim 1, characterized in that: The angle adjustment mechanism includes: a universal shaft adjustment assembly and a tilt angle adjustment assembly, wherein the bottom of the tilt angle adjustment assembly is installed at the first installation position, the bottom of the universal shaft adjustment assembly is fixed to the top of the tilt angle adjustment assembly, and the end of the universal shaft adjustment assembly facing away from the tilt angle adjustment assembly is fastened to the crystal clamping mechanism; In which, the universal joint adjustment component is configured to: drive the crystal rod to move through the crystal clamping mechanism to present the target image in the analyzer of the stress detector; the tilt angle adjustment component is configured to: drive the crystal rod to rotate around the second axis through the crystal clamping mechanism.

3. The crystal optical axis surface processing equipment according to claim 2, characterized in that: The universal shaft adjustment assembly includes: a ball joint base fixedly mounted on the tilt angle adjustment assembly, and a universal shaft ball joint rotatably mounted in the ball joint base, the universal shaft ball joint having a connecting piece, and the universal shaft ball joint is connected to the crystal clamping mechanism through the connecting piece.

4. The crystal optical axis surface processing equipment according to claim 2, characterized in that: The tilt angle adjustment assembly includes: a first sliding platform, a second sliding platform, a transmission member, and a driving member. The first sliding platform has a first curved surface, the second sliding platform has a second curved surface that slides in cooperation with the first curved surface, the first sliding platform is installed at the first mounting position on a side facing away from the second sliding platform, and the second sliding platform is fastened to the universal shaft adjustment assembly on a side facing away from the first sliding platform. The transmission member is located between the first sliding platform and the second sliding platform and is respectively in transmission connection with the first sliding platform and the second sliding platform. The driving member is in transmission connection with the transmission member. Wherein, the first arc surface and the second arc surface are both distributed around the second axis.

5. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The crystal clamping mechanism includes: at least one set of locking assemblies, each set of the locking assemblies including two oppositely disposed V-shaped clamps and two locking members, each of the locking members being respectively fastened to one set of ends of the two V-shaped clamps; Wherein, the crystal rod is installed between two V-shaped clamps in each set of locking components.

6. The crystal optical axis surface processing equipment according to claim 5, characterized in that: The crystal clamping mechanism further includes a rubber pad located between the V-shaped clamp and the crystal rod, with two sides of the rubber pad contacting the crystal rod and the V-shaped clamp respectively.

7. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The single-wire cutting mechanism has a rotary drive platform provided at the first installation position, and the angle adjustment mechanism is installed on the rotary drive platform; Wherein, the rotation driving platform can drive the angle adjustment mechanism to rotate around the first axis.

8. The crystal optical axis surface processing equipment according to any one of claims 1 to 4, characterized in that: The crystal optical axis surface processing equipment further includes: a driving mechanism installed at the second installation position, and the stress detector is in transmission connection with the driving mechanism; The driving mechanism is configured to drive the stress detector to move so that the optical axis of the polarizer of the stress detector is coaxial with the crystal axis of the crystal rod.

9. The crystal optical axis surface processing equipment according to claim 8, characterized in that: The driving mechanism includes: a driving screw, an adapter, and a lifting bracket, wherein the driving screw is installed at the second installation position and is threadedly connected to the adapter, the lifting bracket is slidably connected to the adapter along the first direction, the stress detector is connected to the lifting bracket, and the extension direction of the driving screw is parallel to the extension direction of the second axis; Wherein, the driving screw is configured to: when it rotates under the action of an external force, drive the stress detector to move through the adapter and the lifting bracket.

10. A crystal optical axis surface processing system, characterized in that: include: An X-ray orienter and a crystal optical axis surface processing device as described in any one of claims 1 to 9.

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