Local coating jig in rack plating equipment

By designing local coating fixtures in plating equipment, using the combined structure of cover plate and substrate, the problem of inconvenience in substrate replacement in the prior art is solved, and rapid replacement and multiple fixtures are realized simultaneously, improving coating efficiency and saving electroplating materials.

CN223226200UActive Publication Date: 2025-08-15DONGGUAN HENGJIAN ELECTRONICS CO LTD
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Patent Information

Application Number
CN202422518552.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-18
Publication Date
2025-08-15
Estimated Expiration
2034-10-18

AI Technical Summary

Technical Problem

In the prior art, vertical double-sided coating substrate fixtures need to remove the lower pallet and upper pallet when replacing the substrate, resulting in insufficiency of coating.

Method used

A local coating fixture in a plating device is designed. Through the combination of cover plate and substrate, threaded holes are connected, combined with structures such as shielding plate, support plate and sealing ring, local coating of processing components is realized. The support component can apply pressure to prevent the plating solution from leaking, and multiple fixtures can work at the same time without the need to repeatedly disassemble the positioning component.

Benefits of technology

It realizes rapid replacement of machining parts and the working of multiple fixtures simultaneously, avoids waste of electroplating materials, improves coating efficiency and convenience of use.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a local coating jig in rack plating equipment, which comprises a cover plate and a base plate, and the cover plate is provided with a discharge groove and an open groove which are communicated with each other; a shielding plate is arranged in the discharging groove, and an opening is formed in the shielding plate; a supporting plate is arranged on the base plate, a supporting component is arranged between the supporting plate and the base plate, the supporting component is hinged to the base plate, a through hole channel and a notch are formed in the base plate, the notch is communicated with the through hole channel, a control rod is arranged in the through hole channel, an annular groove is formed in the control rod, and a stretching reset spring is arranged between the supporting plate and the base plate. A sealing ring is arranged between the shielding plate and the cover plate, a silica gel gasket is arranged on the side, close to the machining part, of the shielding plate, a sliding groove is formed in the lower end of the cover plate, and a baffle is arranged in the sliding groove. A pressing plate is arranged in the penetrating groove and can press the machined part to the position behind the shielding plate. Through the combination of the cover plate, the substrate and the shielding plate, a plurality of required processing parts can be locally coated, the structure is simple, the use is convenient, electroplating materials are greatly saved, and resource waste is avoided.
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Description

Technical Field

[0001] The utility model belongs to the technical field of electroplating, and in particular relates to a local coating fixture in rack plating equipment. Background Art

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy on a metal surface using the principle of electrolysis. This prevents oxidation, improves wear resistance, conductivity, reflectivity, corrosion resistance, and enhances aesthetics. Electroplating fixtures typically hold the workpiece with clamps and then place it in the plating solution for electroplating.

[0003] The prior art discloses a substrate fixture for vertical double-sided coating, the authorization announcement number is: CN112458423B, comprising a lower tray, an upper tray, a substrate, a clamping device and a main body bracket, the clamping device is locked on the main body bracket, the main body bracket is used to place the lower tray, the lower tray is provided with an upper tray cooperating therewith, the substrate is clamped between the lower tray and the upper tray through the clamping device, the lower tray and the upper tray are clamped and fit together by the clamping device. The lower tray and the upper tray are provided with hollow sheet positions for convenient coating, the edges of the hollow sheet positions are extended outwardly and edge blocks are provided, and four corner blocks are provided at the four corners of the hollow sheet positions, trapezoidal bosses are provided on the edges of the frame around the upper tray, and trapezoidal grooves cooperating with the trapezoidal bosses are provided on the lower tray. The design of the trapezoidal bosses and the trapezoidal grooves can ensure the accuracy when the upper and lower trays are closed, and can also play the role of protecting the edge blocks and the four corner blocks. The substrate is restricted in the narrow space in the middle by the edge blocks and the four corner blocks, and can remain stable after the tray is erected, which is convenient for vertical coating.

[0004] In the above solution, since the lower tray and the upper tray are provided with hollow positions, they can perform local coating on the substrate. However, replacing the substrate requires disassembling the lower tray and the upper tray, which is troublesome and affects the coating efficiency. Utility Model Content

[0005] The utility model provides a local coating jig in rack plating equipment, aiming to solve the problem of realizing rapid replacement of a coating object during the coating process.

[0006] The utility model solves the above-mentioned technical problems by adopting a technical solution: a local coating fixture in a rack plating device, comprising a cover plate and a base plate, both of which are provided with threaded holes, and the cover plate and the base plate are connected by bolts; a slot is provided on a side of the cover plate away from the base plate, a material discharge groove and a through groove extending from one side of the material discharge groove to the edge of the cover plate are provided on the side of the cover plate close to the base plate, and the material discharge groove is connected to the slot;

[0007] A shielding plate is provided in the discharge trough, and an opening is provided on the shielding plate, and the shielding plate can shield the part that does not need to be electroplated;

[0008] Furthermore, support plates are provided on the substrate, and support components are provided between the support plates. The support plates can apply pressure to the processing components to avoid gaps between the shielding plate and the processing components.

[0009] Furthermore, a through hole and a notch are provided on the base plate, the notch is connected to the through hole, and a control rod is provided in the through hole.

[0010] Furthermore, the supporting component is hinged to the base plate, an annular groove is provided on the control rod, and one end of the supporting component is located in the annular groove.

[0011] Furthermore, a sealing ring is provided between the shielding plate and the cover plate, and a silicone gasket is provided on the side of the shielding plate close to the processing part. The silicone gasket is provided with an opening at the same position as the shielding plate. The sealing ring and the silicone gasket have the same function of preventing leakage of the electroplating solution.

[0012] Furthermore, a slide groove is provided at the lower end of the cover plate, and a baffle is provided in the slide groove, which can prevent the processing parts from falling off.

[0013] Furthermore, a pressing plate is provided in the through-groove, and the pressing plate can press the processed parts into the discharge groove.

[0014] Furthermore, a tension return spring is provided between the support plate and the base plate.

[0015] Compared with the existing technology, the beneficial effects of the present invention are: the present invention can perform local coating on the processing parts through the combination of the cover plate, the substrate and the shielding plate, the support component can apply pressure to the processing parts to prevent the generation of gaps that cause leakage of the electroplating liquid, and there is no need to repeatedly disassemble the positioning component during processing. Multiple jigs can be manufactured to work simultaneously, the structure is simple, and it is easy to use, which greatly saves electroplating materials and avoids waste of resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0017] Figure 2 It is a side sectional schematic diagram of the utility model;

[0018] Figure 3 This is a schematic diagram of the front cover structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the substrate structure of the utility model;

[0020] Figure 5 It is a partial cross-sectional view of the side of the cover plate of the utility model;

[0021] Figure 6 It is a side cross-sectional schematic diagram of another embodiment of the utility model;

[0022] In the figure, 1-front cover, 2-rear cover, 3-base plate, 4-shielding plate, 5-sealing gasket, 6-support plate, 7-tension return spring, 8-extension plate, 9-baffle, 11-discharge chute, 12-groove, 13-chute, 14-box, 15-pressing plate, 16-control lever. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The components of the embodiments of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present invention. In the embodiments, the components of the embodiments of the present application generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application for which protection is claimed, but merely represents selected embodiments of the present application.

[0024] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "front," "back," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections; electrical connections; hydraulic connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0026] refer to Figures 1 to 5As shown, a local coating jig in a rack plating device includes: a cover plate and a substrate. The cover plate and the substrate form a positioning assembly. There are two cover plates, namely a front cover plate 1 and a rear cover plate 2. The front cover plate 1 and the rear cover plate 2 have the same structure. The substrate 3 is located between the front cover plate 1 and the rear cover plate 2. The size of the substrate 3 is the same as that of the cover plate. Several threaded holes are provided on the edges of the substrate 3 and the cover plate. The threaded holes of the substrate 3 and the cover plate are connected to each other, allowing bolts to pass through. A circular groove is provided on the cover plate, and the circular groove corresponds to the threaded hole. The end of the bolt can be located in the circular groove, and the substrate 3 is connected to the cover plate by the bolt.

[0027] A rectangular slot is provided on the center of the side of the cover away from the substrate, and a material discharge groove 11 is provided on the center of the side of the cover close to the substrate. The slot and the material discharge groove 11 are connected to each other, and the depth of the slot is less than the material discharge groove 11. The length and width of the material discharge groove 11 are slightly larger than the slot. A through slot 12 is also provided on the side of the cover where the material discharge groove 11 is provided. The through slot 12 extends from the end of the cover to the material discharge groove 11. There are two through slots 12, which are respectively located at the upper and lower ends of the cover. The width of the through slot 12 is the same as the width of the material discharge groove 11. When the cover is combined with the substrate, the through slot 12 and the material discharge groove 11 will form a longitudinally extending rectangular perforation. The size of the rectangular perforation is slightly larger than the processing component, which can make the processing component It passes through the upper end of the cover plate to the lower end of the cover plate; a shielding plate 4 of matching size is provided in the discharge trough 11, and the shielding plate 4 is the same size as the processing component. After the cover plate is docked with the substrate, the processing component can be inserted into the discharge trough 11 through the through groove 12, and the shielding plate 4 is provided with a coating hole at the corresponding position of the coating part of the processing component. Different coating holes can be designed on the shielding plate 4 according to specific needs. The shielding plate 4 can block the part of the processing component that does not need to be coated, thereby saving electrolytic materials; a sealing gasket 5 is provided between the shielding plate 4 and the cover plate, and a fixedly connected silicone gasket is also provided on the side of the shielding plate 4 close to the processing component. The silicone gasket is provided with the same opening as the shielding plate 4 to prevent the electroplating liquid from leaking to the part that does not need to be coated during the coating process.

[0028] A handle is provided at the upper end of the substrate 3, and a sealing gasket is provided on the side of the cover plate close to the substrate 3. A plate groove is provided on the side where the substrate 3 contacts the cover plate. The size of the plate groove is the same as the discharge groove 11, and a support plate 6 is provided in the plate groove. At this time, the processing part is located between the shielding plate 4 and the support plate 6, and a tension reset spring 7 is connected between the support plate 6 and the substrate 3. When the tension reset spring 7 is in a normal state, the support plate 6 is located in the plate groove, and several support parts are provided in the plate groove. Several support parts are arranged vertically, and the support parts are hinged to the substrate. When the support parts are flipped to a horizontal state, the support parts will apply a thrust to the support plate 6, causing the support plate 5 to move horizontally in the direction away from the substrate to prevent the formation of a gap between the processing part and the shielding plate 4, causing the electroplating liquid to flow into the jig. At the same time, the support parts can make the jig suitable for processing parts of different thicknesses.

[0029] When controlling the support component to flip, a vertically extending through-channel needs to be provided on the base plate, and at the same time, a number of vertically arranged notches are provided on the base plate, each notch is connected to the through-channel, the support component passes through the notch, and the hinge point is located in the notch, a control rod 16 is inserted into the through-channel, and the top of the control rod 16 is screwed to the upper end of the through-channel. When the control rod 16 rotates, the support component can be flipped to a horizontal state. The support component is in the shape of a straight rod, and a number of annular grooves are provided on the control rod 16 at this time. No matter what state the support component is in, the end of the support component located in the through-channel is located in the corresponding annular groove. When the control rod 16 rotates, it will move axially, thereby driving the support component to flip.

[0030] A pressure plate 15 is provided in the through groove 12 at the upper end of the cover plate, and limit plates are provided on both sides of the pressure plate 15. The limit plates can limit the length of the pressure plate 15 in the through groove 12, and the processing part can be pushed downward into the positioning assembly through the pressure plate 15 to align it with the shielding plate 4; a concave area is provided in the through groove 12 at the lower end of the cover plate, and a baffle 9 is installed in the concave area. A short rod with a fixed connection is provided in the middle position below the baffle 9, and the other end of the short rod extends to the outside of the cover plate. A fixed block is provided at one end outside the cover plate. The baffle 9 can slide from the concave space to the through groove 12. At this time, the baffle can block the through hole formed between the cover plate and the substrate to prevent the processing part from slipping.

[0031] Through holes are provided on both sides of the through-channel at the upper end of the substrate 3, and hooks can be connected to the through holes by bolts, or the positioning assembly can be directly fixed to the discharge end of the rack plating equipment by screws. During installation, the sealing gasket 5 is first placed in the discharge trough 11, and the shielding plate 4 is installed in the discharge trough 11, and then the processing component is placed behind the shielding plate 4; a silicone gasket is provided between the processing component and the shielding plate 4, and silicone gaskets are provided between the substrate 3 and the front cover plate 1 and the rear cover plate 2, all of which play a sealing role; the front cover plate 1 and the rear cover plate 2 are placed on the substrate 3, and they are fixed together by bolts. The jig is completely immersed in the plating solution manually or with rack plating equipment, and the power supply is connected for coating. Multiple jigs can be made and used at the same time without repeated disassembly and installation.

[0032] refer to Figure 6As another embodiment of the present invention, a box body 14 can also be assembled on the positioning assembly. Openings are provided on the upper surface of the box body 14 and the center of the lower surface of the box body 14. The upper opening is slightly larger than the lower opening. The opening allows the positioning assembly to pass through. When working, the positioning assembly is located in the box body 14. An extension plate 8 is provided at the upper end of the cover plate. The extension plate 8 can make the jig stuck in the box body 14. A sealing ring is provided at the lower opening of the box body 14. The sealing ring is located between the box body 14 and the positioning assembly to prevent the electroplating liquid from leaking from the box body 14. A water inlet and a drain outlet are provided on the box body 14. A plug is provided in the drain outlet. The box body 14 can be made of transparent material to facilitate observation of the situation during the electroplating process. The style and size of the jig are set according to the specific processing components and can be designed in any style, but the overall structure remains unchanged.

[0033] During work, the worker first places the sealing gasket 5 into the cover plate, places the shielding plate 4 into the discharge trough 11, and then places the processing part on top of the shielding plate 4. A silicone gasket is provided between the shielding plate 4 and the processing part. Finally, the cover plate is placed on both sides of the substrate 3. The cover plate is first fixed with bolts through the threaded holes on the cover plate and the substrate 3. Pressure is applied to the processing part through the support plate 6 to avoid a gap between the shielding plate 4 and the processing part. After the jig is assembled, only the part of the processing part that needs to be plated is exposed; the jig is placed in the box 14, and the extension plate 8 can fix the position of the jig so that the part to be processed is completely in the box 14. The lower end of the jig passes through the sealing ring at the opening of the box 14, and the sealing ring can prevent the electroplating solution from flowing out; water is added to the box 14 through the water inlet on the upper surface of the box 14. 4 is injected with electroplating liquid so that the electroplating liquid completely covers the part to be plated, the power is turned on, and the power is turned off after the electroplating is completed. The baffle 9 at the bottom is opened, and another processing component to be plated is placed in the through groove 12. The pressure plate 15 is used to press downward. At this time, the uncoated processing component pushes the coated processing component out of the fixture, and the pressure plate 15 presses the uncoated processing component into the fixture. The baffle 9 at the bottom is closed to prevent the processing component from slipping and limit the position of the processing component. The power is turned on again and the above operation is repeated. A collection box is provided under the box body 14 to collect the plated processing components in one place for the convenience of the next processing. This embodiment does not need to repeatedly remove the positioning component from the electroplating solution, saving electrolytic materials and improving work efficiency.

[0034] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based primarily on the scope of protection of the claims.

Claims

1. A local coating fixture in a rack plating device, characterized in that: The positioning assembly includes a cover plate and a base plate, both of which are provided with threaded holes, and the cover plate and the base plate are connected by bolts; a slot is provided on a side of the cover plate away from the base plate, and a material discharge groove and a through groove are provided on a side of the cover plate close to the base plate, the material discharge groove is connected to the slot, and the through groove extends from the edge of the cover plate to the material discharge groove, and the through groove is connected to the material discharge groove; A shielding plate is provided in the discharge trough, and an opening is provided on the shielding plate, and the electroplating solution can flow through the opening on the shielding plate; After the base plate and the cover plate are docked, the processing component can be inserted into the discharge trough through the through groove; The base plate is provided with a plate groove, a support plate is provided in the plate groove, the processing component is located between the shielding plate and the support plate, a support component is provided in the plate groove, the support component is hinged to the base plate, and a control rod is connected to the base plate. The control rod can drive the support component to flip to a horizontal state. During this process, the support component applies thrust to the support plate.

2. The local coating fixture in the rack plating equipment according to claim 1, characterized in that: A tension reset spring is connected between the base plate and the support plate, and the tension reset spring is located in the plate groove.

3. The local coating fixture in the rack plating equipment according to claim 2, characterized in that: The base plate is provided with a vertically extending through-hole, a notch is provided in the plate groove of the base plate, the notch is communicated with the through-hole, the support component is hinged in the notch, the control rod is inserted into the through-hole, and the control rod is screwed to the through-hole.

4. The local coating fixture in the rack plating equipment according to claim 3, characterized in that: An annular groove is provided on the control rod, and one end of the supporting component is located in the annular groove. When the control rod moves axially, the supporting component is controlled to flip.

5. The local coating fixture in the rack plating equipment according to claim 1, characterized in that: The positioning component is connected to a box body, an opening is provided at the center of the upper surface of the box body, and the positioning component can be inserted into the box body through the opening, and the electroplating liquid is located in the box body.

6. The local coating fixture in the rack plating equipment according to claim 1, characterized in that: The cover plate is provided with a sliding groove, which is communicated with the through groove. A baffle is provided in the sliding groove, and the baffle can slide to be located in the through groove.

Citation Information

Patent Citations

  • A substrate fixture for vertical double-sided coating

    CN112458423B