Convection device for promoting TSV / TGV hole filling and copper plating efficiency

Abstract

The utility model discloses a convection device for promoting TSV / TGV hole-filling copper plating efficiency, and relates to the technical field of hole-filling copper plating, the convection device comprises a main limiting frame and a mounting assembly, the front side of the main limiting frame is provided with a supporting plate, the front side of the supporting plate is provided with a fixing plate, the front surface of the fixing plate is provided with an air purification filter element, and the air purification filter element is provided with a water inlet. A circulating air pump is installed on the upper surface of the supporting plate, the rear side of the circulating air pump is connected with a multi-way ventilation pipe, an air spraying head is installed on the rear surface of the lower end of the multi-way ventilation pipe, an air suction pipe is arranged on the front side of the circulating air pump, and the lower side of the front end of the air suction pipe is connected with the upper surface of an air purification filter element. According to the convection device for promoting the TSV / TGV hole filling and copper plating efficiency, the device can be conveniently and stably fixed to the outer side of an electroplating bath through the mounting assembly, the convection device can be suitable for electroplating baths with different widths, the flexibility is enhanced, the device can improve the uniformity and quality of a plating layer by spraying electroplating liquid through the spraying assembly, the adhesive force of the plating layer can be enhanced, and the service life of the plating layer is prolonged. The product quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of via-filling copper plating, in particular to a convection device for promoting TSV / TGV via-filling copper plating efficiency. Background Art

[0002] TSV / TGV copper plating is an advanced packaging technology used to fill copper in through-silicon vias (TSVs) and through-glass vias (TGVs) to achieve vertical electrical interconnection. During the copper plating process, a convection device is required to promote the efficiency of TSV / TGV copper plating. The convection device can effectively promote convection in the electroplating solution, thereby accelerating the speed and uniformity of metal deposition. By enhancing convection, the efficiency of the copper plating process can be significantly improved, ensuring the uniformity and integrity of the filling inside the through-hole, thereby improving the reliability and performance of the entire packaging process. However, the current convection device still has the following shortcomings:

[0003] For example, patent publication number CN219449919U discloses a device for horizontal convection circulation of electroplating solution. This device ensures the fluidity of the electroplating solution by flushing away foam through horizontal convection, ensuring uniform distribution of metal elements within the electroplating tank. Furthermore, the horizontal arrangement of the nozzle shortens the distance between the cathode and anode, further ensuring uniformity of the metal elements within the electroplating tank. However, this device is difficult to install on different electroplating tanks, lacks stability in actual use, and suffers from limited flexibility.

[0004] Therefore, in view of this, research and improvement are conducted to address the shortcomings of the existing structure, and a convection device is proposed to improve the efficiency of TSV / TGV via filling copper plating. Utility Model Content

[0005] The purpose of the present invention is to provide a convection device that improves the efficiency of TSV / TGV via filling copper plating, so as to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a convection device for promoting the efficiency of TSV / TGV hole filling and copper plating, comprising a main limit frame and an installation assembly, a support plate is installed on the front side of the main limit frame, and a fixed plate is provided on the front side of the support plate, and an air purification filter element is provided on the front surface of the fixed plate, a circulating air pump is installed on the upper surface of the support plate, and a multi-way ventilation pipe is connected to the rear side of the circulating air pump, and a nozzle is installed on the rear surface of the lower end of the multi-way ventilation pipe, an exhaust pipe is provided on the front side of the circulating air pump, and the lower side of the front end of the exhaust pipe is connected to the upper surface of the air purification filter element, the installation assembly is arranged on the surface of the main limit frame, and the installation assembly includes a mounting plate, a limiting slide groove, a connecting rod, a secondary limit frame, a connecting hole, a mounting bar, a mounting hole and a mounting bolt.

[0007] Furthermore, the mounting plate is arranged at the lower end of the front side of the main limiting frame, and limiting sliding grooves are provided at both ends of the rear side of the main limiting frame.

[0008] Furthermore, a connecting rod is slidably connected to the inner side of the limiting sliding groove, and a secondary limiting frame is slidably connected to the outer side of the rear end of the connecting rod.

[0009] Furthermore, the connecting rods are symmetrically arranged in two groups, and the upper surfaces of the connecting rods, the upper surface of the rear end of the main limit frame, and the upper surface of the front end of the auxiliary limit frame are all provided with connecting holes.

[0010] Furthermore, mounting bars are installed at both ends of the rear surface of the auxiliary limit frame, and mounting holes are opened on the surface of the mounting bars. Mounting bolts are provided on the mounting holes, the inner sides of the connecting holes and the surface of the mounting plate.

[0011] Furthermore, the auxiliary limiting frame and the main limiting frame are both hard steel structures, and a spray assembly for improving copper plating efficiency is provided on the rear side of the auxiliary limiting frame.

[0012] Furthermore, the injection assembly includes a plating liquid storage box, a fixed horizontal plate and a liquid pump, and the plating liquid storage box is arranged on the rear side of the auxiliary limit frame, a fixed horizontal plate is installed on the upper end of the inner side of the plating liquid storage box, and a liquid pump is arranged on the upper surface of the fixed horizontal plate.

[0013] Furthermore, the injection assembly also includes a liquid extraction tube, a multi-way infusion tube and a high-pressure nozzle, and the rear end of the liquid extraction pump is connected to the liquid extraction tube, the front end of the liquid extraction pump is installed with a multi-way infusion tube, and the front surface of the lower end of the multi-way infusion tube is provided with a high-pressure nozzle.

[0014] The utility model provides a convection device for improving the efficiency of TSV / TGV via filling copper plating, which has the following beneficial effects:

[0015] 1. The utility model provides an installation component, which includes a mounting plate, a limiting slide groove, a connecting rod, a secondary limiting frame, a connecting hole, a mounting bar, a mounting hole and a mounting bolt. When in use, the main limiting frame and the secondary limiting frame are pulled outward, and the connecting rod is slidably connected with the inner side of the limiting slide groove to make the main limiting frame and the secondary limiting frame extend and move outward along the surface of the connecting rod until the inner surface of the mounting plate and the mounting bar can fit the outer wall surface of the electroplating tank through the threaded connection of the mounting bolt and the inner side of the connecting hole. The mounting bar is fixed to the outer wall of the electroplating tank through the threaded connection of the mounting bolt and the inner side of the mounting hole, and the mounting plate is fixed to the outer wall of the electroplating tank through the mounting bolt, so that the device can be conveniently and firmly fixed to the outside of the electroplating tank, and it can be applied to electroplating tanks of different widths, and its flexibility is enhanced.

[0016] 2. The utility model is provided with a spray assembly, which includes a plating liquid storage box, a fixed horizontal plate and a liquid extraction pump. The spray assembly also includes a liquid extraction pipe, a multi-way infusion pipe and a high-pressure nozzle. When in use, the liquid extraction pump is started to extract the plating liquid stored in the plating liquid storage box through the liquid extraction pipe, and transport it to the multi-way infusion pipe, and then the multi-way infusion pipe is sprayed out through the high-pressure nozzle, which can not only drive the continuous flow of the plating liquid, but also replenish the plating liquid, so that the device can improve the uniformity and quality of the plating layer by spraying the plating liquid, and can also enhance the adhesion of the plating layer and improve the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of a convection device for improving the efficiency of TSV / TGV hole filling and copper plating in the present invention;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the installation assembly of a convection device for improving the efficiency of TSV / TGV hole filling and copper plating in the present invention;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of a spray assembly of a convection device for improving the efficiency of TSV / TGV hole filling and copper plating in the present invention;

[0020] Figure 4 This is a schematic diagram of the three-dimensional structure of a support plate of a convection device for promoting TSV / TGV via filling copper plating efficiency according to the present invention.

[0021] In the figure: 1. Main limit frame; 2. Support plate; 3. Fixed plate; 4. Air purification filter element; 5. Circulating air pump; 6. Multi-way ventilation pipe; 7. Nozzle; 8. Exhaust pipe; 9. Mounting assembly; 901. Mounting plate; 902. Limit slide; 903. Connecting rod; 904. Auxiliary limit frame; 905. Connecting hole; 906. Mounting strip; 907. Mounting hole; 908. Mounting bolt; 10. Injection assembly; 1001. Plating liquid storage tank; 1002. Fixed horizontal plate; 1003. Liquid extraction pump; 1004. Liquid extraction pipe; 1005. Multi-way infusion pipe; 1006. High-pressure nozzle. DETAILED DESCRIPTION

[0022] The following embodiments of the present invention are described in further detail with reference to the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0023] like Figures 1 to 4As shown, a convection device for promoting the efficiency of TSV / TGV hole filling copper plating includes a main limit frame 1 and an installation component 9, a support plate 2 is installed on the front side of the main limit frame 1, and a fixed plate 3 is provided on the front side of the support plate 2, and an air purification filter element 4 is provided on the front surface of the fixed plate 3, a circulating air pump 5 is installed on the upper surface of the support plate 2, and a multi-way ventilation pipe 6 is connected to the rear side of the circulating air pump 5, and a nozzle 7 is installed on the rear surface of the lower end of the multi-way ventilation pipe 6, an exhaust pipe 8 is provided on the front side of the circulating air pump 5, and the lower side of the front end of the exhaust pipe 8 is connected to the upper surface of the air purification filter element 4, the installation component 9 is arranged on the surface of the main limit frame 1, and the installation component 9 includes a mounting plate 901, a limiting slide groove 902, a connecting rod 903, an auxiliary limit frame 904, a connecting hole 905, a mounting bar 906, a mounting hole 907 and a mounting bolt 908.

[0024] The specific operation is as follows: when in use, start the circulating air pump 5, so that the circulating air pump 5 pumps air through the exhaust pipe 8, filters the air through the air purification filter element 4, and pumps the filtered air to the multi-way ventilation pipe 6, and then the multi-way ventilation pipe 6 is sprayed out in the electroplating solution through the nozzle 7 to maintain the convection of the electroplating solution and promote the uniform flow of the electroplating solution to ensure the uniform deposition of the coating on the surface of the workpiece. Pull the main limit frame 1 and the auxiliary limit frame 904 outward, and connect the main limit frame 1 with the inner side of the limit slide groove 902 through the sliding connection of the connecting rod 903. The auxiliary limit frame 904 extends and moves outward along the surface of the connecting rod 903 until the inner surface of the mounting plate 901 and the mounting bar 906 can fit with the outer wall surface of the electroplating tank. The connecting rod 903, the main limit frame 1 and the auxiliary limit frame 904 are fixed by the threaded connection between the mounting bolt 908 and the inner side of the connecting hole 905. The mounting bar 906 is fixed to the outer wall of the electroplating tank by the threaded connection between the mounting bolt 908 and the inner side of the mounting hole 907. The mounting plate 901 is fixed to the outer wall of the electroplating tank by the mounting bolt 908.

[0025] Please refer to Figure 3, the mounting plate 901 is arranged at the lower end of the front side of the main limit frame 1, and the two ends of the rear side of the main limit frame 1 are provided with a limit slide groove 902, the inner side of the limit slide groove 902 is slidably connected to the connecting rod 903, and the outer side of the rear end of the connecting rod 903 is slidably connected to the auxiliary limit frame 904, and two groups of connecting rods 903 are symmetrically arranged, and the upper surface of the connecting rod 903 and the upper surface of the rear end of the main limit frame 1 and the upper surface of the front end of the auxiliary limit frame 904 are all provided with connecting holes 905, and mounting strips 906 are installed at both ends of the rear surface of the auxiliary limit frame 904, and the surface of the mounting strip 906 is provided with mounting holes 907, and the mounting holes 907, the inner side of the connecting holes 905 and the surface of the mounting plate 901 are all provided with mounting bolts 908, and the auxiliary limit frame 904 and the main limit frame 1 are both hard steel structures. , and a spray assembly 10 for improving copper plating efficiency is provided on the rear side of the secondary limit frame 904. The spray assembly 10 includes a plating liquid storage tank 1001, a fixed horizontal plate 1002 and a liquid pump 1003. The plating liquid storage tank 1001 is provided on the rear side of the secondary limit frame 904. The fixed horizontal plate 1002 is installed on the upper end of the inner side of the plating liquid storage tank 1001, and the liquid pump 1003 is provided on the upper surface of the fixed horizontal plate 1002. The spray assembly 10 also includes a liquid suction pipe 1004, a multi-channel infusion pipe 1005 and a high-pressure nozzle 1006. The rear end of the liquid suction pump 1003 is connected to the liquid suction pipe 1004, the front end of the liquid suction pump 1003 is installed with a multi-channel infusion pipe 1005, and the front surface of the lower end of the multi-channel infusion pipe 1005 is provided with a high-pressure nozzle 1006.

[0026] The specific operation is as follows. When in use, start the liquid extraction pump 1003, so that the liquid extraction pump 1003 extracts the plating liquid stored in the plating liquid storage tank 1001 through the liquid extraction pipe 1004, and transports it to the multi-channel infusion pipe 1005, and then the multi-channel infusion pipe 1005 sprays it out through the high-pressure nozzle 1006, which can not only drive the continuous flow of the plating liquid, but also replenish the plating liquid.

[0027] In summary, if Figures 1 to 4As shown, the convection device for promoting the efficiency of TSV / TGV hole filling copper plating, when in use, first, pull the main limit frame 1 and the auxiliary limit frame 904 outward, and through the sliding connection between the connecting rod 903 and the inner side of the limit slide 902, the main limit frame 1 and the auxiliary limit frame 904 are stretched and moved outward along the surface of the connecting rod 903 until the inner surface of the mounting plate 901 and the mounting bar 906 can fit with the outer wall surface of the electroplating tank, and the connecting rod 903 and the main limit frame 1 and the auxiliary limit frame 904 are fixed by the threaded connection between the mounting bolt 908 and the inner side of the connecting hole 905, and the mounting bar 906 is fixed to the outer wall of the electroplating tank by the threaded connection between the mounting bolt 908 and the inner side of the mounting hole 907, and the mounting bolt 908 is used to fix the mounting bar 906 to the outer wall of the electroplating tank. Plate 901 is fixed to the outer wall of the electroplating tank. Then, the circulating air pump 5 is started to pump air through the exhaust pipe 8, and the air is filtered through the air purification filter element 4. The filtered air is pumped to the multi-way ventilation pipe 6, and then sprayed out in the electroplating liquid through the nozzle 7 by the multi-way ventilation pipe 6, to maintain the convection of the electroplating liquid and promote the uniform flow of the electroplating liquid to ensure the uniform deposition of the coating on the surface of the workpiece. At the same time, the liquid extraction pump 1003 is started to extract the electroplating liquid stored in the electroplating liquid storage tank 1001 through the liquid extraction pipe 1004, and transport it to the multi-way infusion pipe 1005, and then sprayed out by the multi-way infusion pipe 1005 through the high-pressure nozzle 1006, which can not only drive the continuous flow of the electroplating liquid, but also replenish the electroplating liquid.

[0028] The embodiments of the present invention are provided for purposes of illustration and description and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those skilled in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention and to enable those skilled in the art to understand the present invention and design various embodiments with various modifications suitable for specific applications.

Claims

1. A convection device for improving the efficiency of TSV / TGV via filling copper plating, comprising a main limit frame (1) and a mounting assembly (9), characterized in that: The main limit frame (1) is provided with a support plate (2) on the front side, and a fixed plate (3) is provided on the front side of the support plate (2), and an air purification filter element (4) is provided on the front surface of the fixed plate (3); a circulating air pump (5) is provided on the upper surface of the support plate (2), and a multi-way ventilation pipe (6) is connected to the rear side of the circulating air pump (5), and a nozzle (7) is provided on the rear surface of the lower end of the multi-way ventilation pipe (6); an exhaust pipe (8) is provided on the front side of the circulating air pump (5), and the lower side of the front end of the exhaust pipe (8) is connected to the upper surface of the air purification filter element (4); the mounting assembly (9) is provided on the surface of the main limit frame (1), and the mounting assembly (9) includes a mounting plate (901), a limiting slide groove (902), a connecting rod (903), a secondary limit frame (904), a connecting hole (905), a mounting bar (906), a mounting hole (907) and a mounting bolt (908).

2. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 1, characterized in that: The mounting plate (901) is arranged at the lower end of the front side of the main limiting frame (1), and limiting sliding grooves (902) are provided at both ends of the rear side of the main limiting frame (1).

3. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 2, characterized in that: The inner side of the limiting sliding groove (902) is slidably connected to a connecting rod (903), and the outer side of the rear end of the connecting rod (903) is slidably connected to a secondary limiting frame (904).

4. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 3, characterized in that: The connecting rods (903) are symmetrically arranged in two groups, and the upper surfaces of the connecting rods (903), the upper surface of the rear end of the main limit frame (1), and the upper surface of the front end of the auxiliary limit frame (904) are all provided with connecting holes (905).

5. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 3, characterized in that: Mounting bars (906) are installed at both ends of the rear surface of the auxiliary limit frame (904), and mounting holes (907) are opened on the surface of the mounting bars (906). Mounting bolts (908) are provided on the inner sides of the mounting holes (907), the connecting holes (905) and the surface of the mounting plate (901).

6. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 3, characterized in that: The auxiliary limiting frame (904) and the main limiting frame (1) are both hard steel structures, and a spray assembly (10) for improving copper plating efficiency is provided on the rear side of the auxiliary limiting frame (904).

7. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 6, characterized in that: The injection assembly (10) comprises a plating liquid storage tank (1001), a fixed transverse plate (1002) and a liquid extraction pump (1003), wherein the plating liquid storage tank (1001) is arranged at the rear side of the auxiliary limit frame (904), the fixed transverse plate (1002) is installed at the upper end of the inner side of the plating liquid storage tank (1001), and the liquid extraction pump (1003) is arranged on the upper surface of the fixed transverse plate (1002).

8. The convection device for improving TSV / TGV via filling copper plating efficiency according to claim 7, characterized in that: The spray assembly (10) further comprises a liquid extraction tube (1004), a multi-channel liquid infusion tube (1005) and a high-pressure nozzle (1006), wherein the rear end of the liquid extraction pump (1003) is connected to the liquid extraction tube (1004), the front end of the liquid extraction pump (1003) is equipped with the multi-channel liquid infusion tube (1005), and the front surface of the lower end of the multi-channel liquid infusion tube (1005) is provided with the high-pressure nozzle (1006).

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