Copper-plated circuit board and copper plating process thereof

By using high-energy ion beam implantation of metal particles and magnetically filtered arc deposition technology, combined with pulsed magnetron sputtering to form a copper foil layer with low surface roughness, the problem of insufficient bonding strength between copper foil and substrate material is solved, resulting in a circuit board with low loss and high reliability.

CN121781083APending Publication Date: 2026-04-03GUANGDONG GUANGXIN ION BEAM TECH CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202511988965.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-26
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve a high-strength bond between copper foil and substrate materials in low-loss printed circuit boards, leading to decreased reliability and difficulty in simultaneously meeting the requirements of reliability and low loss.

Method used

A metal seed layer is formed by injecting metal particles with a high-energy ion beam. Combined with magnetically filtered arc deposition and pulsed magnetron sputtering technology, a copper foil layer with low surface roughness is formed, achieving a high-strength bond between the copper foil and the substrate material.

Benefits of technology

This achieves a high-strength bond between the copper foil and the substrate material, reduces the surface roughness of the copper foil, and meets the reliability and low-loss requirements of the circuit board.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a copper-plated circuit board and a copper plating process thereof, and relates to the technical field of circuit board manufacturing. The copper plating process of the circuit board comprises the following steps: after carrying out surface cleaning pretreatment on a dielectric substrate, injecting metal particles by adopting a high-energy ion beam to form a metal seed layer; performing magnetic filtering arc deposition treatment on the surface of the metal seed layer to form a metal bottom layer; and performing copper plating on the surface of the metal bottom layer through pulse magnetron sputtering treatment to form a copper foil layer combined with the dielectric substrate. According to the method, the metal particles are injected through the high-energy ion beam, then the metal layer is deposited on the surface in an electric arc mode, then copper plating is conducted through pulse magnetron sputtering, high-strength combination of the metal copper foil and the base material is achieved by combining physical vapor deposition and the ion injection technology, meanwhile, the surface roughness of the copper foil is low, and the requirements for reliability and low loss of the circuit board are met.
Need to check novelty before this filing date? Find Prior Art