Electrochemical polishing device for bracket
By designing the fixed structure of the clamping plate and clamping block and gas pressurization to prevent liquid from immersing, the problems of uneven dimensional accuracy and current density of the shielding area are solved, and the precise control and uniform effect of electrochemical polishing of the tamping bracket is achieved.
Patent Information
- Application Number
- CN202422543754.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-10-21
AI Technical Summary
The prior art is difficult to accurately control the dimensional accuracy of the shielded area during electrochemical polishing of the tamping bracket, and it is easy to swing when the bracket is connected to the anode, resulting in uneven current density distribution, affecting the polishing effect.
A bracket electrochemical polishing device is designed, using a clamping plate and a clamping block to fix the shielding area, and preventing the polishing liquid from contacting the shielding area through the lifting mechanism and airway, and using the clamping plate and the opening side wall shielding and gas pressurization to prevent liquid from immersing, ensuring that the shielding area is not polished.
Accurate fixation and stable clamping of the shielded area are achieved, contact of the polishing liquid is avoided, consistency of polishing effect and uniform distribution of current density are ensured, and polishing quality is improved.
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Figure CN223226221U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of medical stent processing, and particularly relates to a stent electrochemical polishing device. Background Art
[0002] A stent retriever, a medical device used in neurological and cardiovascular surgery, is a metal mesh structure typically made of stainless steel or cobalt-chromium alloy. Its primary function is to support and stabilize blood vessels to prevent stenosis or occlusion. The stent retriever is inserted into the blood vessel via a catheter and then deployed to restore normal vascular patency.
[0003] After preliminary processing, medical metal stents typically have residual slag, burrs, and oxide films on their surfaces. Pretreatment of the metal stents, including grinding or pickling, is essential. Electrochemical polishing can improve the biocompatibility and corrosion resistance of metal stents, thereby enhancing their performance. For example, patent CN105386117A discloses an electrochemical polishing device and method for stents, in which an anode is directly connected to the metal stent for electrochemical polishing.
[0004] However, the proximal end of the thrombectomy stent must be shielded during electrochemical polishing, meaning the shielded area cannot be polished, leaving the remaining area to be polished. The aforementioned prior art makes it difficult to precisely control the dimensions of the shielded area. Furthermore, the connection between the stent and the anode causes a certain degree of oscillation under stirring, resulting in a change in the distance between the cathode and anode. This leads to uneven current density distribution during electrochemical polishing, resulting in localized polishing anomalies. Utility Model Content
[0005] The purpose of the utility model is to provide a stent electrochemical polishing device to solve the technical problem that the fixing method of the stent in the existing polishing method is difficult to control the dimensional accuracy of the shielded area.
[0006] In order to solve the above technical problems, the present invention provides a stent electrochemical polishing device, comprising:
[0007] The box body has an opening on its bottom plate;
[0008] A clamping plate is provided on the bottom plate and is in sliding engagement with the bottom plate; the distance between the bottom surface of the clamping plate and the bottom surface of the bottom plate is equal to the length of the shielding area of the bracket;
[0009] a clamping block, located in the opening and fixed to the bottom surface of the clamping plate;
[0010] a clamping assembly for driving the clamping plate to move the clamping block, thereby clamping the shielding area of the bracket between the clamping block and the side wall of the opening; and
[0011] The lifting mechanism is used to drive the box body to rise and fall.
[0012] In one embodiment of the present application, an air passage is provided inside the box body; the air passage is connected to a pressurized air pipe;
[0013] When the shielding area of the bracket is clamped between the clamping block and the side wall of the opening, the upper end of the shielding area abuts against the bottom surface of the clamping plate, and the clamping plate is provided with through holes connecting the opening and the airway on both sides of the abutting portion.
[0014] In one embodiment of the present application, the clamping assembly includes:
[0015] A fixed frame is installed on the box body;
[0016] A guide post, one end of which is fixedly connected to the clamping plate and the other end of which is inserted into the fixed frame; and
[0017] The spring is sleeved on the outer periphery of the guide column, one end of the spring is against the fixed frame, and the other end is against the clamping plate.
[0018] In one embodiment of the present application, the stent electrochemical polishing device further comprises a polishing liquid pool;
[0019] The lifting mechanism is used to drive the box body to descend so that the bottom surface of the bottom plate of the box body is flush with the liquid level in the polishing liquid pool.
[0020] In one embodiment of the present application, the box body, the clamping plate and the clamping block are made of conductive materials.
[0021] In one embodiment of the present application, a cathode plate is provided in the polishing liquid pool.
[0022] The beneficial effect of the present invention is that the bracket electrochemical polishing device of the present invention can drive the clamping plate through the clamping assembly to drive the clamping block to move, thereby clamping the shielding area of the bracket between the clamping block and the side wall of the opening, and the distance from the bottom surface of the clamping plate to the bottom surface of the bottom plate is equal to the length of the shielding area of the bracket, so that the shielding area of the bracket can be accurately shielded by the clamping block and the side wall of the opening after being clamped, and when the lifting mechanism drives the box body to descend to make the bottom surface of the bottom plate of the box body level with the liquid level in the polishing liquid pool, the shielding area will not be electrochemically polished.
[0023] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.
[0024] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0026] Figure 1 This is a schematic diagram of a thrombus removal bracket in one embodiment of the present invention;
[0027] Figure 2 It is a three-dimensional diagram of the stent electrochemical polishing device of the present invention;
[0028] Figure 3 It is a partial bottom sectional view of the stent electrochemical polishing device of the present invention;
[0029] Figure 4 yes Figure 3 Middle partial enlarged view;
[0030] Figure 5 It is a partial top cross-sectional view of the stent electrochemical polishing device of the present invention;
[0031] Figure 6 It is a top view of the box body of the stent electrochemical polishing device of the present invention;
[0032] Figure 7 yes Figure 6 Partial cross-sectional view along the AA direction.
[0033] In the picture:
[0034] Box body 1, bottom plate 11, opening 111, air duct 12, pressurized air pipe 13, clamping plate 2, abutting part 21, through hole 22, clamping block 3, clamping assembly 4, fixing frame 41, guide column 42, spring 43, lifting mechanism 5, polishing liquid pool 6, bracket 100, shielding area 101, polishing area 102. DETAILED DESCRIPTION
[0035] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.
[0036] See also Figure 1 In one embodiment of the present application, the front end of the bracket 100 is a shielding area 101 that is not polished, and the rest is a polishing area 102 that needs to be polished. The shielding area 101 needs to be shielded during polishing so that the area does not come into contact with the polishing liquid.
[0037] See also Figures 2 to 5 In one embodiment of the present application, the stent electrochemical polishing device includes:
[0038] The box body 1 has an opening 111 on its bottom plate 11;
[0039] The clamping plate 2 is disposed on the bottom plate 11 and is in sliding engagement with the bottom plate 11; the distance between the bottom surface of the clamping plate 2 and the bottom surface of the bottom plate 11 is equal to the length of the shielding area 101 of the bracket;
[0040] The clamping block 3 is located in the opening 111 and is fixed to the bottom surface of the clamping plate 2. In some embodiments, the clamping block 3 and the clamping plate 2 can be integrally formed.
[0041] a clamping assembly 4 for driving the clamping plate 2 to move the clamping block 3 , thereby clamping the shielding area 101 of the bracket between the clamping block 3 and the side wall of the opening 111 ; and
[0042] The lifting mechanism 5 is used to drive the box body 1 to rise and fall.
[0043] Furthermore, the bracket electrochemical polishing device also includes a polishing liquid pool 6; the lifting mechanism 5 is used to drive the box body 1 to descend so that the bottom surface of the bottom plate 11 of the box body 1 is level with the liquid level in the polishing liquid pool 6.
[0044] In one application scenario, the clamping process can be: first, the shielding area 101 is placed between the clamping block 3 and the side wall of the opening 111, with the upper end of the shielding area 101 against the bottom surface of the clamping plate 2, and then clamped by the clamping assembly 4. At this time, the shielding area 101 is fixed; and the boundary line between the shielding area 101 and the polishing area 102 is located in the plane of the bottom surface of the bottom plate 11, that is, the shielding area 101 is shielded by the side surface of the clamping block 3 and the side wall of the opening 111 at the same time. When the lifting mechanism 5 drives the box body 1 to descend so that the bottom surface of the bottom plate 11 of the box body 1 is level with the liquid level in the polishing liquid pool 6, the boundary line between the shielding area 101 and the polishing area 102 is also level with the liquid level, ensuring that the shielding area 101 does not come into contact with the polishing liquid.
[0045] In some application scenarios, the shielding area 101 is a flat structure. Although two surfaces of the shielding area 101 are shielded by the side of the clamping block 3 and the side wall of the opening 111, the remaining two sides of the shielding area 101 are not blocked. The liquid surface and the solid surface have an attraction, causing the polishing liquid to flow upward, which will produce a polishing effect on the two sides of the shielding area 101.
[0046] Based on this, see Figures 3 to 7 In one embodiment, an air duct 12 is provided inside the box body 1; the air duct 12 is connected to a pressurized air pipe 13, and the pressurized air pipe 13 can be connected to an external air source; when the shielding area 101 of the bracket is clamped between the clamping block 3 and the side wall of the opening 111, the upper end of the shielding area 101 is abutted against the bottom surface of the clamping plate 2, and the clamping plate 2 is provided with through holes 22 connecting the opening 111 and the air duct 12 on both sides of the abutting portion 21.
[0047] Specifically, after the shielding area 101 is clamped and fixed, pressure can be applied to the air channel 12 through the pressurized air pipe 13, thereby blowing the polishing liquid through the through hole 22 to prevent the polishing liquid from flowing up along the two side walls of the shielding area 101, thereby ensuring that no electrochemical reaction occurs on the four surfaces of the shielding area 101.
[0048] In some embodiments, the clamping assembly 4 can be driven by a spring to drive the clamping plate 2, or can be driven by a power source such as a motor, an oil cylinder, or an air cylinder.
[0049] Preferably, see Figure 2 、 Figure 3 、 Figure 5 and Figure 6 The clamping assembly 4 includes: a fixed frame 41, mounted on the box body 1; a guide column 42, one end of which is fixedly connected to the clamping plate 2, and the other end is passed through the fixed frame 41; and a spring 43, which is sleeved on the outer periphery of the guide column 42, one end of which is against the fixed frame 41, and the other end is against the clamping plate 2.
[0050] In this embodiment, when the bracket 100 needs to be clamped, the spring 43 can be compressed by moving the clamping block 3, and then the shielding area 101 is inserted between the clamping block 3 and the side wall of the opening 111, and the clamping and fixing can be completed by loosening the clamping block 3.
[0051] In one embodiment, the box body 1 , the clamping plate 2 and the clamping block 3 are made of conductive materials, and one of them can be connected to the positive pole of the power supply.
[0052] In one embodiment, a cathode plate is provided in the polishing liquid pool 6 for connecting to the negative electrode of a power source.
[0053] In some embodiments, the cathode plate may be a side plate of the polishing liquid pool 6 or a conductor placed separately in the polishing liquid pool 6 .
[0054] In some embodiments, a stirring device may be further provided in the polishing liquid pool 6 .
[0055] To sum up, the clamping and fixing structure of the bracket electrochemical polishing device of the utility model limits and fixes the plane shielding area of the bracket, and uses gas pressurization on both sides to prevent liquid immersion, ensuring that the shielding area has no polishing effect at all. The precision size is high, and the bracket is stable and does not swing in the stirred polishing liquid, ensuring the consistency of the polishing effect.
[0056] The various devices selected in this application (components whose specific structures are not described) are all universal standard parts or components known to those skilled in the art, and their structures and principles can be known to those skilled in the art through technical manuals or conventional experimental methods.
[0057] In the description of the embodiments of the present invention, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.
[0058] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0059] Based on the above-mentioned ideal embodiment of the present invention, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the technical scope of the present invention. The technical scope of the present invention is not limited to the content of the specification, but must be determined according to the scope of the claims.
Claims
1. A stent electrochemical polishing device, characterized in that: include: The box body (1) has an opening (111) provided on its bottom plate (11); A clamping plate (2) is disposed on the bottom plate (11) and is slidably engaged with the bottom plate (11); the distance between the bottom surface of the clamping plate (2) and the bottom surface of the bottom plate (11) is equal to the length of the shielding area (101) of the bracket; A clamping block (3) is located in the opening (111) and is fixed to the bottom surface of the clamping plate (2); A clamping assembly (4) for driving the clamping plate (2) to move the clamping block (3) so as to clamp the shielding area (101) of the bracket between the clamping block (3) and the side wall of the opening (111); and The lifting mechanism (5) is used for driving the box body (1) to rise and fall.
2. The stent electrochemical polishing device according to claim 1, characterized in that: An air passage (12) is provided inside the box body (1); the air passage (12) is connected to a pressurized air pipe (13); When the shielding area (101) of the bracket is clamped between the clamping block (3) and the side wall of the opening (111), the upper end of the shielding area (101) abuts against the bottom surface of the clamping plate (2), and the clamping plate (2) is provided with through holes (22) communicating with the opening (111) and the airway (12) on both sides of the abutting portion (21).
3. The stent electrochemical polishing device according to claim 1, characterized in that: The clamping assembly (4) comprises: A fixing frame (41) is mounted on the box body (1); A guide post (42), one end of which is fixedly connected to the clamping plate (2) and the other end of which is inserted into the fixed frame (41); and The spring (43) is sleeved on the outer periphery of the guide post (42), one end of the spring is against the fixed frame (41), and the other end is against the clamping plate (2).
4. The stent electrochemical polishing device according to claim 1, characterized in that: The stent electrochemical polishing device further comprises a polishing liquid pool (6); The lifting mechanism (5) is used to drive the box body (1) to descend so that the bottom surface of the bottom plate (11) of the box body (1) is flush with the liquid level in the polishing liquid pool (6).
5. The stent electrochemical polishing device according to claim 1, characterized in that: The box body (1), the clamping plate (2) and the clamping block (3) are made of conductive materials.
6. The stent electrochemical polishing device according to claim 4, characterized in that: A cathode plate is provided in the polishing liquid pool (6).
Citation Information
Patent Citations
Electrochemical polishing device and method for support
CN105386117A