Vacuum heating device for drying and dehumidifying wafer box

Abstract

The utility model discloses a vacuum heating device for drying and dehumidifying a wafer box, which comprises a bottom plate, a drying box is arranged on the bottom plate, a plurality of heating rods are arranged on the inner side wall of the drying box, the vacuum heating device further comprises an isolation hood arranged on one side, close to the drying box, of the bottom plate, and the drying box is located in the isolation hood. The bottom plate is provided with a driving assembly used for driving the isolation cover, a small vacuum pump is arranged at the end, away from the bottom plate, of the isolation cover, and the drying box is provided with a containing assembly used for containing the wafer box. According to the utility model, through the arrangement of the isolation cover, the drying and dehumidifying environment of the wafer box is vacuum by utilizing the small vacuum pump, so that the heat loss and the environmental pollution are reduced, the energy consumption expenditure for cleaning the wafer box is reduced, and meanwhile, the moisture is easier to escape from the wafer box by utilizing the reduction of the gas pressure in the drying box.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer boxes, in particular to a vacuum heating device for drying and dehumidifying wafer boxes. Background Art

[0002] In wafer processing and manufacturing equipment, special wafer boxes are required for transfer during intermediate process transfer, so the cleanliness requirements for the transport and transfer carriers are very high and very harsh. In order to meet the cleanliness requirements of the wafer processing carriers, the wafer boxes need to be cleaned regularly. In the existing technology, during the cleaning process of the wafer box, the drying and dehumidification of the wafer box is not airtight, which increases heat conduction and convection heat transfer, resulting in heat waste, thereby increasing the energy consumption of wafer box cleaning.

[0003] Therefore, there is an urgent need for a vacuum heating device for drying and dehumidifying wafer boxes to solve the above problems. Utility Model Content

[0004] The purpose of the present invention is to provide a vacuum heating device for drying and dehumidifying a wafer box, so as to solve the problems of insufficient continuity and heat waste in the cleaning process of the wafer box proposed in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a vacuum heating device for drying and dehumidifying wafer boxes, comprising a base plate, the base plate is provided with a drying box, the inner side wall of the drying box is provided with multiple heating rods, and also includes an isolation cover arranged on the side of the base plate close to the drying box, the drying box is located in the isolation cover, the base plate is provided with a driving component for driving the isolation cover, the isolation cover is provided with a small vacuum pump at the end away from the base plate, the drying box is provided with a placement component for placing the wafer box, and the placement component is provided in multiple groups.

[0006] The driving assembly includes two mounting brackets fixedly connected to the bottom plate on one side close to the drying box, a push rod motor is provided on the side of the two mounting brackets away from the isolation cover, a driving bracket is provided on the side of the two mounting brackets close to each other, one side of the two driving brackets is connected to the isolation cover, and the output ends of the two push rod motors are connected to the driving bracket.

[0007] A plurality of IR lamps are arranged in a circular array in the isolation cover. The connection end of each IR lamp is located on the side of the isolation cover away from the drying box. A temperature detector is provided on the side of the isolation cover close to the connection end of each IR lamp.

[0008] The placement assembly includes a first placement plate and a second placement plate arranged in the drying box, a plurality of placement rods are fixedly connected to the opposite sides of the first placement plate and the second placement plate, a side of the first placement plate away from the small vacuum pump is connected to a fixed plate by a plurality of bolts, and the fixed plate is connected to the inner wall of the drying box, and the drying box is provided with a limiting assembly for limiting the second placement plate.

[0009] The limit assembly includes two connecting plates fixedly connected to the inner wall of the drying box, a rotating rod is rotatably connected between the two connecting plates, one end of the second placement plate is connected to the rotating rod, one of the two connecting plates is fixedly connected to a mounting plate, the side of the mounting plate close to the rotating rod is connected to a limit block through a telescopic assembly, the end of the rotating rod close to the limit block is fixedly connected to a limit ring, a plurality of limit grooves are provided on the side wall of the limit ring, the end of the limit block close to the limit ring has a rounded corner, and an abutment plate is fixedly connected to the inner wall of the drying box away from the connecting plate.

[0010] The telescopic assembly includes two symmetrically arranged T-shaped rods slidably connected to the mounting plate, one end of the two T-shaped rods is connected to the limit block, and the side walls of the two T-shaped rods are sleeved with springs, and the two ends of the two springs are respectively connected to the mounting plate and the limit block.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] The utility model sets an isolation cover, under the action of the driving component, so that the drying box is in a sealed state. At the same time, a small vacuum pump is used to form a vacuum in the drying and dehumidification environment of the wafer box. Therefore, in the vacuum state, due to the extremely small number of gas molecules, the effects of heat conduction and convection heat transfer are significantly reduced, and radiation heat transfer becomes the main heat transfer mode. This environment is conducive to the rapid drying and dehumidification of the wafer box, while reducing heat loss and environmental pollution, thereby reducing the energy consumption expenditure for cleaning the wafer box. At the same time, the reduction of the gas pressure inside the drying box is used to make it easier for moisture to escape from the wafer box, and the vacuum environment reduces the possibility of external pollutants entering, thereby protecting the cleanliness of the wafer box. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the top view of the structure of the utility model;

[0015] Figure 3 This is a schematic diagram of the internal structure of the isolation cover of the utility model;

[0016] Figure 4 This is a schematic diagram of the internal structure of the placement component of the present utility model;

[0017] Figure 5 This is a schematic diagram of the structure of the limit assembly of the utility model;

[0018] Figure 6 for Figure 5 Enlarged view of point A in the middle.

[0019] In the figure: 101, bottom plate; 102, drying box; 2, isolation cover; 3, small vacuum pump; 401, mounting frame; 402, push rod motor; 403, drive frame; 5, IR lamp; 6, temperature detector; 701, first placement plate; 702, second placement plate; 703, placement rod; 704, fixing plate; 705, bolt; 801, connecting plate; 802, rotating rod; 803, mounting plate; 804, limit block; 805, limit ring; 806, limit groove; 807, stop plate; 901, T-bar; 902, spring. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] Example 1

[0022] See also Figures 1-6 The vacuum heating device for drying and dehumidifying a wafer box shown in the figure includes a base plate 101, a drying box 102 is provided on the base plate 101, a plurality of heating rods are provided on the inner wall of the drying box 102, and an isolation cover 2 is provided on the side of the base plate 101 close to the drying box 102, the drying box 102 is located in the isolation cover 2, the base plate 101 is provided with a driving component for driving the isolation cover 2, and a small vacuum pump 3 is provided on the end of the isolation cover 2 away from the base plate 101. The drying box 102 is provided with a placement component for placing the wafer box, and a plurality of placement components are provided.

[0023] It should be noted here that: through the setting of the isolation cover 2, under the action of the driving component, the drying box 102 is in a sealed state. At the same time, the small vacuum pump 3 is used to form a vacuum in the drying and dehumidification environment of the wafer box. Therefore, in the vacuum state, due to the extremely small number of gas molecules, the effects of heat conduction and convection heat transfer are significantly reduced, and radiation heat transfer becomes the main heat transfer method. This environment is conducive to the rapid drying and dehumidification of the wafer box, while reducing heat loss and environmental pollution, thereby reducing the energy consumption expenditure for cleaning the wafer box. At the same time, the reduction of the internal gas pressure of the drying box 102 makes it easier for moisture to escape from the wafer box, and the vacuum environment reduces the possibility of external contaminants entering, thereby protecting the cleanliness of the wafer box.

[0024] See also Figure 1 The driving assembly shown in the figure includes two mounting brackets 401 fixedly connected to the bottom plate 101 on the side close to the drying box 102, a push rod motor 402 is provided on the side of the two mounting brackets 401 away from the isolation cover 2, and a driving bracket 403 is provided on the side of the two mounting brackets 401 close to each other, one side of the two driving brackets 403 is connected to the isolation cover 2, and the output ends of the two push rod motors 402 are connected to the driving bracket 403;

[0025] It should be noted here that the drive assembly is used to drive the isolation cover 2 to move closer to or away from the bottom plate 101, thereby isolating and releasing the isolation of the drying box 102.

[0026] See also Figure 3 In the illustrated isolation cover 2, a plurality of IR lamp tubes 5 are arranged in a circular array. The connection end of each IR lamp tube 5 is located on the side of the isolation cover 2 away from the drying box 102. A temperature detector 6 is provided on the side of the isolation cover 2 close to the connection end of each IR lamp tube 5.

[0027] It should be noted that the IR lamp 5 is provided to assist in heating, and under the detection of the temperature detector 6, it is ensured that the wafer box drying and dehumidification process is carried out within the set temperature range.

[0028] See also Figure 5 The placement assembly shown in the figure includes a first placement plate 701 and a second placement plate 702 arranged in the drying box 102. A plurality of placement rods 703 are fixedly connected to the opposite sides of the first placement plate 701 and the second placement plate 702. The side of the first placement plate 701 away from the small vacuum pump 3 is connected to a fixing plate 704 through a plurality of bolts 705. The fixing plate 704 is connected to the inner wall of the drying box 102. The drying box 102 is provided with a limiting assembly for limiting the second placement plate 702.

[0029] It should be noted here that the placement of the components facilitates the placement of the wafer box in the drying oven 102 .

[0030] Working principle: When processing the wafer box after the initial cleaning and drying, the wafer box is first placed on the placement rod 703 between the first placement plate 701 and the second placement plate 702 in the drying box 102, and then the push rod motor 402 is started to drive the drive frame 403 to move closer to the bottom plate 101, and further drive the isolation cover 2 to move closer to the drying box 102. After the isolation cover 2 is placed on the outer wall of the drying box 102 and one end of it is in contact with the bottom plate 101, the push rod motor 402 is stopped;

[0031] After the isolation cover 2 is driven, the air in the isolation cover 2 and the drying box 102 is extracted by a small vacuum pump 3, so that a vacuum environment is formed in the isolation cover 2 and the drying box 102, and then the heating rod in the drying box 102 is energized to generate heat. In the vacuum state, due to the extremely small number of gas molecules, the effects of heat conduction and convection heat transfer are significantly reduced, and radiation heat transfer becomes the main heat transfer method. This environment is conducive to the rapid drying and dehumidification of the wafer box, while reducing heat loss and environmental pollution, thereby reducing the energy consumption expenditure for cleaning the wafer box. At the same time, the reduction in the internal gas pressure of the drying box 102 makes it easier for moisture to escape from the wafer box, and the vacuum environment reduces the possibility of external pollutants entering, thereby protecting the cleanliness of the wafer box.

[0032] Example 2

[0033] See also Figure 6 , this embodiment further explains Example 1, the limiting assembly in the figure includes two connecting plates 801 fixedly connected to the inner wall of the drying box 102, a rotating rod 802 is rotatably connected between the two connecting plates 801, one end of the second placement plate 702 is connected to the rotating rod 802, one of the two connecting plates 801 is fixedly connected to a mounting plate 803, and the side of the mounting plate 803 close to the rotating rod 802 is connected to the limiting block 804 through a telescopic assembly, and the rotating rod 802 is close to the limiting block 80 4 is fixedly connected to a limit ring 805, and a plurality of limit grooves 806 are provided on the side wall of the limit ring 805. The end of the limit block 804 close to the limit ring 805 has a rounded corner. The inner wall of the drying box 102 away from the connecting plate 801 is fixedly connected to a support plate 807. By using the setting of the support plate 807, after the second placement plate 702 is horizontally rotated, one end side wall of the second placement plate 702 is abutted against the support plate 807, thereby improving the weighing capacity and effect of the second placement plate 702 on the wafer box;

[0034] It should be noted here that: through the setting of the limit assembly, when the wafer box placed near the bottom wall of the drying box 102 is placed or taken out, the second placement plate 702 on the upper layer is rotated so that the second placement plate 702 on the upper layer is away from the second placement plate 702 on the lower layer, thereby avoiding obstruction and interference in the placement and removal of the wafer box on the lower layer, thereby facilitating the multi-layer placement of the wafer box, increasing the number of wafer boxes dried at one time, and further improving the efficiency of the wafer box drying;

[0035] When the second placement plate 702 is rotated, the limiting ring 805 on the side of the rotating rod 802 will be driven to rotate. During the rotation of the limiting ring 805, the side wall of the limiting groove 806 will be against the limiting block 804, so that under the interaction force and the guiding action of the telescopic component, the limiting block 804 will be pushed away from the limiting ring 805. After the second placement plate 702 is rotated to the appropriate position, the limiting block 804 will be pushed into the limiting groove 806 under the elastic action of the telescopic component, and will be against the bottom wall of the limiting groove 806, so that the second placement plate 702 is limited by the pressing effect of the limiting block 804, thereby ensuring the position stability of the second placement plate 702 after rotation.

[0036] See also Figure 6 The telescopic assembly shown in the figure includes two symmetrically arranged T-shaped rods 901 slidably connected to the mounting plate 803. One end of the two T-shaped rods 901 is connected to the limit block 804. The side walls of the two T-shaped rods 901 are provided with springs 902. The two ends of the two springs 902 are respectively connected to the mounting plate 803 and the limit block 804;

[0037] It should be noted here that the arrangement of the telescopic assembly provides guidance and reset functions for the movement of the limit block 804 .

[0038] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A vacuum heating device for drying and dehumidifying a wafer box, comprising: A bottom plate (101), wherein the bottom plate (101) is provided with a drying box (102), and the inner side wall of the drying box (102) is provided with a plurality of heating rods; It is characterized by further comprising: An isolation cover (2) is arranged on a side of a bottom plate (101) close to a drying box (102), the drying box (102) is located inside the isolation cover (2), the bottom plate (101) is provided with a driving component for driving the isolation cover (2), the end of the isolation cover (2) away from the bottom plate (101) is provided with a small vacuum pump (3), the drying box (102) is provided with a placement component for placing a wafer box, and the placement component is provided in multiple groups.

2. The vacuum heating device for drying and dehumidifying a wafer box according to claim 1, characterized in that: The driving assembly comprises two mounting frames (401) fixedly connected to a side of the bottom plate (101) close to the drying box (102); a push rod motor (402) is provided on a side of the two mounting frames (401) away from the isolation cover (2); a driving frame (403) is provided on a side of the two mounting frames (401) close to each other; one side of the two driving frames (403) is connected to the isolation cover (2); and the output ends of the two push rod motors (402) are connected to the driving frame (403).

3. The vacuum heating device for drying and dehumidifying a wafer box according to claim 1, characterized in that: A plurality of IR lamp tubes (5) are arranged in a circular array within the isolation cover (2), the connection end of each IR lamp tube (5) being located on a side of the isolation cover (2) away from the drying box (102), and a temperature detector (6) is provided on a side of the isolation cover (2) close to the connection end of each IR lamp tube (5).

4. The vacuum heating device for drying and dehumidifying a wafer box according to claim 1, characterized in that: The placement assembly comprises a first placement plate (701) and a second placement plate (702) arranged in a drying box (102); a plurality of placement rods (703) are fixedly connected to opposite sides of the first placement plate (701) and the second placement plate (702); a side of the first placement plate (701) away from the small vacuum pump (3) is connected to a fixing plate (704) via a plurality of bolts (705); the fixing plate (704) is connected to the inner wall of the drying box (102); and the drying box (102) is provided with a limiting assembly for limiting the second placement plate (702).

5. The vacuum heating device for drying and dehumidifying a wafer box according to claim 4, characterized in that: The limiting assembly comprises two connecting plates (801) fixedly connected to the inner wall of the drying box (102); a rotating rod (802) is rotatably connected between the two connecting plates (801); one end of the second placement plate (702) is connected to the rotating rod (802); one of the two connecting plates (801) is fixedly connected to a mounting plate (803); a side of the mounting plate (803) close to the rotating rod (802) is connected to a limiting block (804) through a telescopic assembly; an end of the rotating rod (802) close to the limiting block (804) is fixedly connected to a limiting ring (805); a plurality of limiting grooves (806) are provided on the side wall of the limiting ring (805); an end of the limiting block (804) close to the limiting ring (805) has a rounded corner; and an abutment plate (807) is fixedly connected to the inner wall of the drying box (102) away from the connecting plate (801).

6. The vacuum heating device for drying and dehumidifying a wafer box according to claim 5, characterized in that: The telescopic assembly comprises two symmetrically arranged T-shaped rods (901) slidably connected to a mounting plate (803), one end of the two T-shaped rods (901) being connected to a limit block (804), and a spring (902) being sleeved on the side walls of the two T-shaped rods (901), and the two ends of the two springs (902) being respectively connected to the mounting plate (803) and the limit block (804).

Images