Computer host heat dissipation auxiliary device
By introducing an efficient heat dissipation mechanism composed of studs, lift seats, heat dissipation fans and temperature sensors into the computer host, the heat dissipation air flow coverage area is dynamically adjusted according to the heat distribution, solving the problems of uneven heat dissipation and inconvenient parts replacement, and improving the heat dissipation efficiency and convenience.
Patent Information
- Application Number
- CN202422547744.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2034-10-22
AI Technical Summary
The existing computer host heat dissipation device has an uneven heat distribution due to the fixed position of the heat dissipation fan, which affects the heat dissipation efficiency, and is inconvenient to disassemble and replace the heat dissipation components.
It adopts an efficient heat dissipation mechanism composed of studs, lift seats, heat dissipation fans, temperature sensors and drive motors. The heat dissipation air flow coverage area is adjusted through transmission elements and detection elements, and combined with elastic plugging and fixing the heat dissipation components, so as to achieve flexible disassembly and replacement.
It improves the auxiliary heat dissipation efficiency of the computer host and simplifies the replacement process of the heat dissipation components to ensure that the device adapts to the heat dissipation needs of different heat distribution areas.
Smart Images

Figure CN223229947U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of computer heat dissipation, in particular to a computer host heat dissipation auxiliary device. Background Art
[0002] A computer mainframe refers to the main body of a computer, excluding its input and output devices. It also serves as the control box housing the motherboard and other major components. It typically includes the CPU, memory, motherboard, hard drive, optical drive, power supply, chassis, cooling system, and other input and output controllers and interfaces. During use, the computer mainframe utilizes auxiliary cooling devices to dissipate heat generated by the operation of its internal electronic components. Some auxiliary cooling devices include a cooling bracket, which is secured to a designated location within the computer mainframe casing with screws. A cooling fan is installed within the bracket. To assist in cooling the computer mainframe, the cooling fan is activated by a control element, accelerating the flow of cooling air within the device, thereby achieving rapid heat dissipation. However, the electronic components within the computer mainframe require varying power and release varying amounts of heat under different operating conditions, resulting in irregular heat distribution within the device. Because the cooling fan is fixed in position, the area covered by the cooling airflow within the computer mainframe remains constant. If areas of high heat distribution within the device are not within the coverage area, the heat stored in these high-heat areas must be gradually dissipated through heat transfer, impacting the device's auxiliary cooling efficiency for the computer mainframe and requiring improvement. Utility Model Content
[0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide a computer host heat dissipation auxiliary device. The device can move and adjust the heat dissipation airflow coverage area accordingly according to the changes in the heat distribution area in the computer host through transmission elements and detection elements, thereby improving the auxiliary heat dissipation efficiency of the device for the computer host. At the same time, the heat dissipation components in the device are fixed by elastic plug-in, and the subsequent disassembly and replacement operations are convenient, which can effectively solve the problems in the background technology.
[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a computer host heat dissipation auxiliary device, comprising a host housing and a high-efficiency heat dissipation mechanism;
[0005] Main casing: Both the front and rear walls are equipped with heat dissipation nets;
[0006] High-efficiency heat dissipation mechanism: It includes a stud, a lifting seat, a heat dissipation fan and a temperature sensor. The stud is rotatably connected to the rear end of the bottom wall of the main casing through a bearing. The outer side of the stud is threadedly connected to the lifting seat. The left and right ends of the lifting seat are provided with installation slots. The inside of the installation slots are clamped with heat dissipation fans. The right wall of the main casing is provided with multiple vertically evenly distributed temperature sensors. Through transmission elements and detection elements, the device can move and adjust the heat dissipation airflow coverage area accordingly according to changes in the heat distribution area in the computer host, thereby improving the device's auxiliary heat dissipation efficiency for the computer host. At the same time, the heat dissipation components in the device are fixed by elastic plug-in, which is convenient for later disassembly and replacement.
[0007] Furthermore, a single-chip microcomputer is provided on the right side of the main housing, the input end of the single-chip microcomputer is electrically connected to the external power supply, the single-chip microcomputer is bidirectionally electrically connected to the temperature sensor, and the input end of the cooling fan is electrically connected to the output end of the single-chip microcomputer, which makes it convenient to control electrical components.
[0008] Furthermore, the efficient heat dissipation mechanism also includes a fixing seat and a drive motor. The fixing seat is arranged on the top wall of the main housing. The drive motor is provided inside the fixing seat. The input end of the drive motor is electrically connected to the output end of the single-chip microcomputer. The output shaft of the drive motor is fixedly connected to the upper end of the stud, providing power for the device to adjust the heat dissipation airflow coverage area in the computer host heat dissipation auxiliary device.
[0009] Furthermore, the efficient heat dissipation mechanism also includes guide rods, which are respectively arranged at the left and right ends of the bottom wall of the main casing. The upper ends of the guide rods are slidably connected to the circular holes opened on the lifting seat to avoid rotation during the vertical movement of the lifting seat in the computer host heat dissipation auxiliary device.
[0010] Furthermore, two symmetrically distributed locking columns are slidably connected to the upper and lower sides of the lifting seat, and locking holes are provided on the upper and lower sides of the heat dissipation fan. The locking columns are plugged into adjacent locking holes, and a dial button is provided on the end of the locking column away from the center of the lifting seat to limit the insertion and installation of the heat dissipation elements in the computer host heat dissipation auxiliary device, which is convenient for disassembly, assembly and replacement of the heat dissipation components.
[0011] Furthermore, springs are provided between the dial button and the lifting seat, and the springs are movably connected to the outer sides of the adjacent locking columns. Through the tensile elastic force of the springs, relative sliding can be avoided when the locking columns and locking holes in the computer host heat dissipation auxiliary device are plugged in.
[0012] Furthermore, two symmetrically distributed guide grooves are provided on the front and rear sides of the main housing, and a brush scraper is slidably connected between the two horizontally adjacent guide grooves to clean dust and impurities adhering to the surface of the heat dissipation net, thereby avoiding the heat dissipation efficiency of the computer host being reduced due to dust clogging the heat dissipation holes of the heat dissipation net.
[0013] Compared with the prior art, the beneficial effects of the present invention are: the computer host heat dissipation auxiliary device has the following advantages:
[0014] 1. When assisting in cooling the computer host, the studs, lifting seat, cooling fan, guide rod, temperature sensor and drive motor can be used to move and adjust the cooling airflow coverage area accordingly according to the changes in the heat distribution area in the computer host, thereby improving the auxiliary cooling efficiency of the device for the computer host.
[0015] 2. In the computer host cooling auxiliary device, the cooling components are elastically plugged and fixed through locking columns, dial buttons and springs, making it easy to disassemble and replace the cooling components later. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 This is a schematic diagram of the structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the rear structure of the utility model;
[0018] Figure 3 This is a schematic diagram of the internal structure of the rear side of the utility model;
[0019] Figure 4 This is an enlarged structural diagram of point A of the present utility model.
[0020] In the figure: 1 main casing, 2 single-chip microcomputer, 3 heat dissipation net, 4 guide slide, 5 brush scraper, 6 high-efficiency heat dissipation mechanism, 61 stud, 62 lifting seat, 63 heat dissipation fan, 64 guide rod, 65 temperature sensor, 66 fixing seat, 67 drive motor, 7 locking column, 8 dial button, 9 spring. DETAILED DESCRIPTION
[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0022] See also Figure 1-4 , this embodiment provides a technical solution: a computer host heat dissipation auxiliary device, including a host case 1 and a high-efficiency heat dissipation mechanism 6;
[0023] Mainframe 1: Both its front and rear walls are equipped with heat dissipation nets 3. Two symmetrically distributed guide slots 4 are provided on both the front and rear sides of the mainframe 1. A brush scraper 5 is slidably connected between two horizontally adjacent guide slots 4. After long-term use of the computer mainframe, the brush scraper 5 is moved vertically up and down, so that the brush scraper 5 moves vertically along the guide slots 4, thereby cleaning dust and impurities adhering to the surface of the heat dissipation net 3, thereby preventing the heat dissipation holes of the heat dissipation net 3 from being blocked by dust, thereby reducing the heat dissipation efficiency of the device itself;
[0024] Efficient heat dissipation mechanism 6: It includes a stud 61, a lifting seat 62, a heat dissipation fan 63 and a temperature sensor 65. The stud 61 is rotatably connected to the rear end of the bottom wall of the main casing 1 through a bearing. The outer side of the stud 61 is threadedly connected to the lifting seat 62. The left and right ends of the lifting seat 62 are provided with mounting grooves. The inside of the mounting grooves are all clamped with heat dissipation fans 63. The right wall of the main casing 1 is provided with multiple vertically evenly distributed temperature sensors 65. The right side of the main casing 1 is provided with a single-chip microcomputer 2. The input end of the single-chip microcomputer 2 is electrically connected to the external power supply. The single-chip microcomputer 2 is bidirectionally electrically connected to the temperature sensor 65. The input end of the heat dissipation fan 63 is electrically connected to the output end of the single-chip microcomputer 2. The efficient heat dissipation mechanism 6 also includes a fixed seat 66 and a drive motor 67. The fixed seat 66 is arranged on the On the top wall, a driving motor 67 is provided inside the fixing seat 66. The input end of the driving motor 67 is electrically connected to the output end of the single-chip computer 2. The output shaft of the driving motor 67 is fixedly connected to the upper end of the stud 61. The efficient heat dissipation mechanism 6 also includes a guide rod 64. The guide rod 64 is respectively arranged at the left and right ends of the bottom wall of the main housing 1. The upper ends of the guide rods 64 are slidably connected to the circular holes opened on the lifting seat 62. The upper and lower sides of the lifting seat 62 are slidably connected with two symmetrically distributed locking columns 7. Locking holes are provided on the upper and lower sides of the heat dissipation fan 63. The locking columns 7 are plugged into adjacent locking holes. A dial button 8 is provided on the end of the locking column 7 away from the center of the lifting seat 62. A spring 9 is provided between the dial button 8 and the lifting seat 62. The spring 9 is movable with the outer side of the adjacent locking column 7. When assisting the heat dissipation of the computer host, the single-chip computer 2 starts the heat dissipation fan 63, and the heat dissipation fan 63 is used to speed up the speed of the heat dissipation airflow passing through the inside of the device. The heat dissipation airflow transfers the heat in the device to the outside through heat transfer, thereby speeding up the heat dissipation speed in the computer host. Then the single-chip computer 2 starts the temperature sensor 65, and the temperature sensor 65 detects the ambient temperature of the part in the computer host through the internal thermistor, and transmits the detection result to the single-chip computer 2 in the form of an electrical signal. There are more than four temperature sensors 65 arranged vertically inside the device. The single-chip computer 2 obtains the heat distribution inside the computer host through the temperature data values uploaded by the temperature sensors 65 at various positions inside the device. Then the single-chip computer 2 calculates the heat distribution inside the computer host according to the heat distribution. The driving motor 67 is controlled by the condition to make its output shaft drive the stud 61 to rotate. The stud 61 is connected by a thread so that the lifting seat 62 drives the cooling fan 63 to move vertically to the area with the most heat distribution inside the device. By directly blowing air to the area with the most heat distribution in the computer host, the auxiliary heat dissipation efficiency of the device for the computer host is improved. During this process, the round hole on the lifting seat 62 and the guide rod 64 slide adaptively, thereby preventing the lifting seat 62 from rotating during the vertical movement. When disassembling and replacing the cooling fan 63 in the computer host heat dissipation auxiliary device, it is only necessary to toggle the dial button 8 toward the end away from the center of the lifting seat 62. The dial button 8 drives the locking column 7 away from the locking hole on the cooling fan 63, thereby releasing the installation limit of the cooling fan 63.The spring 9 is elastically stretched, and then the heat dissipation fan 63 is replaced and installed using the same principle. The stretching force of the spring 9 prevents relative sliding when the locking column 7 and the locking hole are plugged in later. The heat dissipation fan 63 inside the device is easy to replace. The device can adjust the heat dissipation airflow coverage area according to the changes in the heat distribution area in the computer host through transmission elements and detection elements, thereby improving the device's auxiliary heat dissipation efficiency for the computer host. At the same time, the heat dissipation components in the device are fixed by elastic plug-in, making it easy to disassemble and replace them later.
[0025] The working principle of a computer host heat dissipation auxiliary device provided by the present invention is as follows: when assisting the heat dissipation of the computer host, the single-chip microcomputer 2 starts the heat dissipation fan 63, and the heat dissipation fan 63 is used to accelerate the speed of the heat dissipation airflow passing through the inside of the device. The heat dissipation airflow transfers the heat in the device to the outside through heat transfer, thereby accelerating the heat dissipation speed in the computer host. Then the single-chip microcomputer 2 starts the temperature sensor 65, and the temperature sensor 65 detects the ambient temperature of the part in the computer host through the internal thermistor, and transmits the detection result to the single-chip microcomputer 2 in the form of an electrical signal. There are more than four temperature sensors 65 arranged vertically inside the device. The single-chip microcomputer 2 obtains the heat distribution inside the computer host through the temperature data values uploaded by the temperature sensors 65 at various positions inside the device. Then the single-chip microcomputer 2 controls the drive motor 67 according to the heat distribution so that its output shaft drives the stud 61 to rotate. The stud 61 is connected by a thread so that the lifting seat 62 drives the heat dissipation fan 63 to move vertically to the area with the most heat distribution inside the device. By Direct air cooling is carried out in the area with the highest heat distribution, thereby improving the auxiliary heat dissipation efficiency of the device for the computer host. During this process, the round hole on the lifting seat 62 and the guide rod 64 slide adaptively, thereby preventing the lifting seat 62 from rotating during the vertical movement. When disassembling and replacing the heat dissipation fan 63 in the computer host heat dissipation auxiliary device, it is only necessary to toggle the dial button 8 toward the end away from the center of the lifting seat 62. The dial button 8 drives the locking column 7 away from the locking hole on the heat dissipation fan 63, thereby releasing the installation limit of the heat dissipation fan 63, and the spring 9 elastically stretches. Then, the heat dissipation fan 63 is replaced and installed according to the same principle. The stretching elastic force of the spring 9 prevents relative sliding when the locking column 7 and the locking hole are plugged in later. The heat dissipation fan 63 inside the device is easy to replace. After the computer host is used for a long time, the brush scraper 5 is vertically moved up and down, so that the brush scraper 5 moves vertically along the guide slide 4, thereby cleaning the dust and impurities adhering to the surface of the heat dissipation net 3, thereby preventing the heat dissipation holes of the heat dissipation net 3 from being blocked by dust, thereby reducing the heat dissipation efficiency of the device itself.
[0026] It is worth noting that the single chip microcomputer 2 disclosed in the above embodiment can adopt STM32, the heat dissipation fan 63 can adopt DC5V DC heat dissipation fan, the temperature sensor 65 can adopt AM2303, and the drive motor 67 can adopt WS-50ZYT78-R. The single chip microcomputer 2 controls the operation of the heat dissipation fan 63, the temperature sensor 65 and the drive motor 67 using methods commonly used in the prior art.
[0027] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.
Claims
1. A computer host heat dissipation auxiliary device, characterized in that: It comprises a main housing (1) and a high-efficiency heat dissipation mechanism (6); Main housing (1): heat dissipation nets (3) are installed on both the front and rear walls; The high-efficiency heat dissipation mechanism (6) comprises a stud (61), a lifting seat (62), a heat dissipation fan (63) and a temperature sensor (65). The stud (61) is rotatably connected to the rear end of the bottom wall of the main housing (1) through a bearing. The outer side of the stud (61) is threadedly connected to the lifting seat (62). The lifting seat (62) is provided with mounting grooves at both left and right ends. The heat dissipation fan (63) is clamped in the mounting grooves. The right wall of the main housing (1) is provided with a plurality of vertically evenly distributed temperature sensors (65).
2. The computer host heat dissipation auxiliary device according to claim 1, characterized in that: A single-chip microcomputer (2) is provided on the right side of the main housing (1); an input end of the single-chip microcomputer (2) is electrically connected to an external power supply; the single-chip microcomputer (2) is bidirectionally electrically connected to a temperature sensor (65); and an input end of a heat dissipation fan (63) is electrically connected to an output end of the single-chip microcomputer (2).
3. The computer host heat dissipation auxiliary device according to claim 2, characterized in that: The high-efficiency heat dissipation mechanism (6) further comprises a fixing seat (66) and a driving motor (67), wherein the fixing seat (66) is arranged on the top wall of the main housing (1), and the driving motor (67) is arranged inside the fixing seat (66), wherein the input end of the driving motor (67) is electrically connected to the output end of the single-chip computer (2), and the output shaft of the driving motor (67) is fixedly connected to the upper end of the stud (61).
4. The computer host heat dissipation auxiliary device according to claim 1, characterized in that: The high-efficiency heat dissipation mechanism (6) further comprises guide rods (64), which are respectively arranged at the left and right ends of the bottom wall of the main housing (1), and the upper ends of the guide rods (64) are slidably connected to the circular holes provided on the lifting seat (62).
5. The computer host heat dissipation auxiliary device according to claim 1, characterized in that: The upper and lower sides of the lifting seat (62) are slidably connected to two symmetrically distributed locking columns (7), the upper and lower sides of the heat dissipation fan (63) are provided with locking holes, the locking columns (7) are plugged into adjacent locking holes, and the end of the locking column (7) away from the center of the lifting seat (62) is provided with a dial button (8).
6. The computer host heat dissipation auxiliary device according to claim 5, characterized in that: A spring (9) is provided between the dial button (8) and the lifting seat (62), and the spring (9) is movably sleeved with the outer side of the adjacent locking column (7).
7. The computer host heat dissipation auxiliary device according to claim 1, characterized in that: Two symmetrically distributed guide slots (4) are provided on both the front and rear sides of the main housing (1), and a brush scraper (5) is slidably connected between two horizontally adjacent guide slots (4).