Power module and power conversion device

Abstract

The utility model discloses a power module and a power conversion device. In the power module, a busbar assembly comprises a first busbar, a second busbar and a capacitor, and the first busbar and the second busbar are arranged at an interval; the first busbar comprises a first neutral pole plate and a positive pole plate which are stacked, and the second busbar comprises a second neutral pole plate and a negative pole plate which are stacked; the first busbar is electrically connected with the first end of the first device group, the second busbar is electrically connected with the first end of the second device group, and the second ends of the first device group and the second device group are electrically connected with the third device group respectively. The power module is beneficial to reducing the connection distance between the busbar and the device groups, is also beneficial to ensuring that the connection distances between the busbar and the two device groups are equal, and has a structural basis that the busbar is directly connected with the device groups without passing through the patch cord, so that the stray inductance in the power module is reduced, the line length is shortened, and the imbalance of the line length is improved.

Description

Technical Field

[0001] The present application relates to the field of power conversion technology, and in particular to a power module and a power conversion device including the power module. Background Art

[0002] Power conversion devices can realize the conversion between direct current and alternating current, and are popular in power application scenarios such as power generation, transmission and consumption, playing a role between battery systems and power grids / loads.

[0003] The power module is the core component of a power conversion device, typically consisting of a busbar and electrically connected capacitors and component groups. Busbars and component groups, as well as different component groups, are connected via busbars. Variations in busbar length and dimensions can lead to problems such as long current transmission lines and uneven line lengths, which can negatively impact the performance of the power conversion device. Consequently, there is a need to shorten and improve line length imbalances in the relevant field. Utility Model Content

[0004] In view of this, the embodiments of the present application are committed to providing a power module, which is conducive to reducing the connection distance between the busbar and the device group, and is also conducive to ensuring that the connection distance between the busbar and the two device groups is equal. It also has a structural basis in which the busbar is directly connected to the device group without passing through a transfer bus, so as to reduce the stray inductance in the power module, shorten the line length, and improve the imbalance of the line length.

[0005] The present application provides a power module, comprising at least one power unit; the power unit comprises a first device group, a second device group, a third device group and a busbar assembly, the busbar assembly comprises a first busbar, a second busbar and a capacitor, the first busbar and the second busbar are arranged at intervals, at least one capacitor is provided on the first busbar board, and at least one capacitor is provided on the second busbar; the first busbar comprises a first neutral plate and a positive plate arranged in a stacked manner, and the second busbar comprises a second neutral plate and a negative plate arranged in a stacked manner; the first busbar is electrically connected to a first end of the first device group, the second busbar is electrically connected to a first end of the second device group, and the second ends of the first device group and the second device group are respectively electrically connected to the third device group.

[0006] In a possible implementation manner, the first busbar and the second busbar are parallel to each other.

[0007] In a possible implementation manner, the orthographic projections of the first busbar and the second busbar along the thickness direction completely overlap.

[0008] In a possible implementation manner, an included angle α1 is defined between the first busbar and the second busbar, and the included angle α1 satisfies: α1≤90°.

[0009] In one possible embodiment, a plurality of first lugs are provided at one end of the first busbar close to the first component group. The plurality of first lugs include a positive lug formed at one end of the positive electrode plate and a first neutral lug formed at one end of the first neutral electrode plate. The positive lug and the first neutral lug are respectively connected to the terminal at the first end of the first component group.

[0010] And / or, the second busbar is provided with a plurality of second lug portions at one end close to the second device group, the plurality of second lug portions including a negative lug portion formed at one end of the negative electrode plate and a second neutral lug portion formed at one end of the second neutral electrode plate, the negative lug portion and the second neutral lug portion being respectively connected to the terminal at the first end of the second device group.

[0011] In one possible embodiment, the positive lug portion and the first neutral lug portion are arranged alternately, and any adjacent positive lug portion is spaced apart from the first neutral lug portion; and / or, the negative lug portion and the second neutral lug portion are arranged alternately, and any adjacent negative lug portion is spaced apart from the second neutral lug portion; and / or, the first lug portion and the first busbar are an integral structure, and the second lug portion and the second busbar are an integral structure.

[0012] In one possible embodiment, the first lug portion is flat and parallel to the first busbar; and / or the second lug portion is flat and parallel to the second busbar; and / or the first lug portion includes two bent sections connected in sequence and arranged at an angle, one bent section is parallel to the first busbar, and the other bent section is parallel to the heat sink where the first component group is located; and / or the second lug portion includes two bent sections connected in sequence and arranged at an angle, one bent section is parallel to the second busbar, and the other bent section is parallel to the heat sink where the second component group is located.

[0013] In one possible embodiment, the first lug portion includes a first bent section a, a first bent section b, and a first bent section c that are connected in sequence, the first bent section b being arranged at an angle to the first bent section a and the first bent section c, the first bent section a being connected to and parallel to the first busbar, and the first bent section c being connected to and parallel to the first component group;

[0014] And / or, the second lug portion includes a second a bending section, a second b bending section and a second c bending section connected in sequence, the second b bending section is arranged at an angle to the second a bending section and the second c bending section, the second a bending section is connected to the second busbar and is parallel to the second busbar, and the second c bending section is connected to the second device group and is parallel to the second device group.

[0015] In one possible embodiment, the first bending section a is parallel to the first bending section c; and / or the second bending section a is parallel to the second bending section c; and / or the first bending section b is perpendicular to the first bending section a and / or the first bending section c; and / or the second bending section b is perpendicular to the second bending section a and / or the second bending section c.

[0016] In one possible embodiment, the power unit is provided with at least two heat sinks, each heat sink having two heat sink surfaces disposed opposite to each other in a thickness direction, and the first component group, the second component group, and the third component group are respectively disposed on different heat sink surfaces of the at least two heat sinks.

[0017] The first busbar is parallel to the heat sink where the first component group is located or has an angle α2, and the angle α2 satisfies: 90°≤α2<180°; the second busbar is parallel to the heat sink where the second component group is located or has an angle α3, and the angle α3 satisfies: 90°≤α3<180°.

[0018] In a possible implementation, the first component group and the second component group are distributed on the heat dissipation surfaces on both sides of the same heat dissipation plate, and the first busbar and the second busbar are spaced apart along the thickness direction of the heat dissipation plate and are parallel to the heat dissipation plate.

[0019] In a possible embodiment, each of the power units is provided with a first heat sink, a second heat sink and a third heat sink, the first heat sink and the second heat sink are spaced apart along a first direction and arranged relative to the third heat sink, and is located on the side of the first heat sink and the second heat sink away from the busbar assembly in the second direction; a group of the first device groups is arranged on the first heat sink, a group of the second device groups is arranged on the second heat sink, and a group of the third device groups is arranged on the third heat sink, and the first device group on the first heat sink and the second device group on the second heat sink are electrically connected to the third device group on the third heat sink, respectively.

[0020] In one possible embodiment, the first device group is arranged on the side of the first heat sink facing the second heat sink, the second device group is arranged on the side of the second heat sink facing the first heat sink, and the third device group is arranged on one side of the third heat sink; in the first direction, the distance between the third device group and the first heat sink is equal to the distance between the third device group and the second heat sink.

[0021] In a possible embodiment, two power units are included, and the two power units are provided with a first heat sink, a second heat sink and a third heat sink. The first device group and the second device group in one power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the first heat sink, the first device group and the second device group in the other power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the second heat sink, and the two third device groups in the two power units are arranged on the heat dissipation surfaces on both sides of the thickness direction of the third heat sink; the first heat sink and the second heat sink are spaced and arranged opposite to each other along the first direction, and the third heat sink is located on the side of the first heat sink and the second heat sink in the second direction away from the busbar assembly.

[0022] In one possible embodiment, the first busbar and the second busbar connected to the component group on the first heat sink are both parallel to the first heat sink; and / or the first busbar and the second busbar connected to the component group on the second heat sink are both parallel to the second heat sink.

[0023] In a possible embodiment, the first heat dissipation plate, the second heat dissipation plate, and the third heat dissipation plate are parallel to each other, and the thickness directions are all in the first direction; or, the first heat dissipation plate and the second heat dissipation plate are parallel, and the third heat dissipation plate is perpendicular to the first heat dissipation plate and the second heat dissipation plate.

[0024] In a possible embodiment, the first heat dissipation plate and the third heat dissipation plate have an included angle β1, and the included angle β1 satisfies: 10°≤β1≤170°; and / or the second heat dissipation plate and the third heat dissipation plate have an included angle β2, and the included angle β2 satisfies: 10°≤β2≤170°.

[0025] In one possible implementation, the first device group is connected to the third device group via a first busbar, and the second device group is connected to the third device group via a second busbar, wherein the first busbar satisfies any of the following conditions:

[0026] (a) The first wiring array is in the shape of a flat plate, one end of which is connected to the first device group and the other end of which is connected to the third device group;

[0027] (b) the first wiring array includes two bent sections connected in sequence and arranged at an angle, one bent section being parallel to the heat sink where the first device group is located, and the other bent section being connected to the third device group and being parallel to the heat sink where the third device group is located;

[0028] (c) The first wiring array includes three bent sections that are connected in sequence and arranged at an angle to each other, the three bent sections including a bent section d, a bent section e, and a bent section f, the bent section d being parallel to the heat sink where the first device group is located, and the bent section f being connected to the third device group and parallel to the heat sink where the third device group is located;

[0029] And / or, the second row satisfies any of the following:

[0030] (d) the second wiring array is in the shape of a flat plate, one end of which is connected to the second device group and the other end of which is connected to the third device group;

[0031] (e) the second wiring array includes two bent sections connected in sequence and arranged at an angle, one bent section being parallel to the heat sink where the second device group is located, and the other bent section being connected to the third device group and being parallel to the heat sink where the third device group is located;

[0032] (f) The second line array includes three bending sections that are connected in sequence and arranged at angles to each other, the three bending sections including a bending section h, a bending section g, and a bending section k, the bending section h is parallel to the heat sink where the second device group is located, and the bending section k is connected to the third device group and is parallel to the heat sink where the third device group is located.

[0033] In a possible implementation manner, the first device group, the second device group, and the third device group are all IGBT device groups, and each IGBT device group includes a plurality of IGBT devices connected in parallel.

[0034] The present application also provides a power conversion device, including a cabinet and a DC fuse, a DC isolating switch, a power module, a reactor, an AC filter capacitor and an AC circuit breaker arranged in the cabinet and connected in sequence, wherein the power module is a power module as described in any one of the above items.

[0035] In the power module provided by the present application, according to the connection requirements with different device groups, the busbars that need to be synchronously connected to at least two device groups are divided into a first busbar and a second busbar with different polarities. Both busbars are connected to the corresponding device groups respectively, which can realize a line structure in which one device group and one busbar are connected correspondingly. One busbar does not need to take into account the connection requirements and position arrangement requirements of the two device groups. The first busbar and the second busbar can be set adjacent to their respective corresponding device groups, which can not only shorten the distance to the device group, but also shorten or even eliminate the distance difference with the two device groups. At the same time, since one busbar and one device group are set correspondingly without taking into account the connection requirements of other device groups, it can also be directly connected to the device group without the need for wire bus to transfer. Shortening the connection distance between the busbar and the device group can shorten the current transmission path, eliminating the distance difference between the busbar and the two device groups can eliminate the rate difference between the two current transmission branches at the same DC end, and removing the transfer wire bus to connect the busbar directly to the device group can eliminate the resistance and stray inductance increased by the presence of the wire bus in the line. Therefore, the power module provided by the present application is conducive to reducing the connection distance between the busbar and the device group, ensuring that the connection distance between the busbar and the two device groups is equal, and has a structural basis in which the busbar is directly connected to the device group without passing through a transfer bus, which can reduce the stray inductance of the power module, shorten the current transmission path, and improve the operating efficiency of the power module. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Shown is a first angle schematic diagram of a power module in an embodiment of the present application;

[0037] Figure 2 Shown is a second angle schematic diagram of a power module in an embodiment of the present application;

[0038] Figure 3 Shown is a second angle schematic diagram of a power module in an embodiment of the present application;

[0039] Figure 4 The figure shows a schematic diagram of the composition of the first busbar in the embodiment of the present application;

[0040] Figure 5 The figure shows a schematic diagram of a device group on a heat sink in an embodiment of the present application;

[0041] Figure 6 Shown is a schematic diagram of a power module in the second embodiment of the present application;

[0042] Figure 7 Shown in the figure are schematic diagrams of power modules in three types of embodiments of the present application.

[0043] Figure 1-Figure 7 middle:

[0044] 1. First heat sink; 2. Second heat sink; 3. Third heat sink; 4. First device group; 5. Second device group; 6. Third device group; 7. First busbar; 71. Positive plate; 72. First neutral plate; 711. First lug; 701. Positive lug; 702. First neutral lug; 8. Second busbar; 81. Negative plate; 82. Second neutral plate; 811. Second lug; 801. Negative lug; 802. Second neutral lug; 9. First busbar; 10. Second busbar. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0046] It should be noted that the descriptions of relative position relationships in this application, such as "parallel" and "perpendicular", all cover the error range. For example, "parallel" actually refers to "parallel or basically parallel", "perpendicular" actually refers to "perpendicular or basically vertical", and "consistent in direction" actually refers to "consistent in direction or basically consistent in direction", and so on.

[0047] An embodiment of the present application provides a power module, which includes one or more (referring to two or more) power units.

[0048] First, the basic structure of the power module is introduced. The power unit includes three device groups and busbar components. The three device groups are the first device group, the second device group, and the third device group. Each device group includes at least one device (i.e., the attached Figure 5 Each power unit inverts DC power into AC power. The busbar assembly includes a busbar and capacitors. The capacitors are mounted on the busbar, which connects the device groups to the DC circuit. Therefore, two of the three device groups in each power unit (e.g., the first and second device groups) are connected to the busbar, providing access to the DC circuit. The other device group (e.g., the third device group) has one end connected to these two device groups and the other end connected to the AC circuit.

[0049] Specifically, each component group has two connection ends; the first end of the first component group and the first end of the second component group are both connected to a busbar, and the second end is connected to the first end of the third component group, while the second end of the third component group is used to connect to other electrical components. In the prior art, the same busbar needs to be connected to the ends of both component groups simultaneously, requiring the positional arrangement of all three groups to be considered and interconnected via busbars. All of these issues can result in long circuits, a difference in the circuit lengths of the two component groups, and high module stray inductance due to the large number of components in the circuit, which can affect current transmission.

[0050] Please refer to the attached Figure 1 -Attached Figure 7 In the embodiment provided herein, a busbar assembly includes a first busbar 7, a second busbar 8, and a capacitor. The first busbar 7 and the second busbar 8 are spaced apart and each is equipped with at least one capacitor. The first busbar 7 includes a first neutral plate 72 and a positive plate 71 stacked and insulated, and the second busbar 8 includes a second neutral plate 82 and a negative plate 81 stacked and insulated. The first busbar 7 is electrically connected to the first end of the first component group 4, and the second busbar 8 is electrically connected to the first end of the second component group 5. The second ends of the first component group 4 and the second component group 5 are respectively electrically connected to the third component group 6. The first busbar 7 and the second busbar 8 are spaced apart. For example, if multiple components in the first component group 4 and multiple components in the second component group 5 are arranged in the same direction, and the first component group 4 and the second component group 5 are spaced apart along the X direction, the first busbar 7 and the second busbar 8 are also spaced apart along the X direction to be adjacent to their respective component groups, shortening the distance between them. Furthermore, the first busbar 7 and the second busbar 8 are spaced apart, forming two separate busbars, and the ends connected to the component groups are not physically or electrically connected.

[0051] With such an arrangement, the power module provided by the present application, according to the connection requirements with different device groups, sets the busbar that needs to be synchronously connected to at least two device groups into a split type, divided into a first busbar 7 and a second busbar 8 that are spaced apart and have different polarities. The two busbars are each connected to the corresponding device group, which can realize a line structure in which one device group and one busbar are connected in correspondence. One busbar does not need to take into account the connection requirements and position arrangement requirements of the two device groups. The first busbar 7 and the second busbar 8 can both be set adjacent to their respective corresponding device groups, which can not only shorten the distance to the device group, but also shorten or even eliminate the difference in distance to the two device groups. At the same time, since one busbar is set in correspondence with one device group, there is no need to take into account the connection requirements of other device groups, and thus it can also be directly connected to the device group without the need for line bus switching.

[0052] Shortening the connection distance between the busbar and the device group can shorten the length of the current transmission path; eliminating the distance difference between the busbar and the two device groups to be connected can eliminate the imbalance of the line and the rate difference between the two current transmission branches at the same DC end; removing the adapter busbar so that the busbar is directly connected to the device group can eliminate the resistance and stray inductance increased by the presence of the busbar in the line. Therefore, the power module provided by the present application is conducive to reducing the connection distance between the busbar and the device group, ensuring that the connection distance between the busbar and the two device groups is equal, and has a structural basis in which the busbar is directly connected to the device group without passing through the adapter busbar, which can reduce the stray inductance of the power module, shorten the line length, and improve the imbalance of the line length, thereby helping to shorten the current transmission path, balance the current balance and improve the current transmission rate, thereby improving the operating efficiency of the power module.

[0053] At the same time, since multiple capacitors are usually arranged on one side of the busbar, the busbar is flat and occupies a large space. In this application, the busbar in a single power unit is changed to two split and spaced apart, so that the first busbar 7 and the second busbar 8 can be stacked, such as the positive projection in the thickness direction partially overlaps or completely overlaps, and the capacitors are arranged on the opposite side of the two. In this way, the space occupied by the busbar assembly can be reduced, which is conducive to reducing the volume of the entire module and facilitating the arrangement of the module inside the cabinet of the equipment.

[0054] In the same power unit, the first busbar 7 and the second busbar 8 can be parallel to each other or arranged at an angle. For example, the first busbar 7 and the second busbar 8 are spaced apart and have an angle α1 (α1 refers to the angle between the adjacent surfaces of the two busbars). The angle α1 can be any angle. Preferably, the angle α1 satisfies: α1 ≤ 90°, for example, 85°, 80°, 75°, 70°, 65°, 60°, 55°, 50°, 45°, 40°, 35°, 30°, 25°, 20°, 45°, 10°, etc.

[0055] In a preferred embodiment, the first busbar 7 and the second busbar 8 are parallel to each other, thereby reducing space usage. Furthermore, the orthographic projections of the first busbar 7 and the second busbar 8 along the thickness direction completely overlap. This further reduces the space occupied by the busbar assembly.

[0056] An insulating layer may be provided between the positive plate 71 and the first neutral plate 72 of the first busbar 7 for insulation, and an insulating layer may be provided between the negative plate 81 and the second neutral plate 82 of the second busbar 8 for insulation. The first busbar 7 and the second busbar 8 can be connected to other electrical components by connecting the positive plate 71 to the positive electrode of the electrical component, the negative plate 81 to the negative electrode of the electrical component, and the ends of the first neutral plate 72 and the second neutral plate 82 away from the component group to the neutral electrode, or by physically connecting these ends of the two neutral plates together to a neutral electrode, such as a ground line.

[0057] In this embodiment of the present application, a plurality of first lugs 711 are provided at one end of the first busbar 7 near the first device group 4. The arrangement direction of the lugs 711 is the same as the arrangement direction of the multiple devices in the first device group 4. The plurality of first lugs 711 include a positive lug 701 formed at one end of the positive plate 71 and a first neutral lug 702 formed at one end of the first neutral plate. The positive lug 701 and the first neutral lug 702 are respectively connected to the terminals at the first end of the first device group 4. This achieves a physical and electrical connection between the first busbar 7 and the first device group 4.

[0058] The end of the second busbar 8 near the second component group 5 is provided with multiple second lugs 811. The arrangement of the lugs 811 is the same as the arrangement of the components in the second component group 5. The multiple second lugs 811 include a negative lug 801 formed at one end of the negative plate 81 and a second neutral lug 802 formed at one end of the second neutral plate. The negative lug 801 and the second neutral lug 802 are respectively connected to the terminals at the first end of the second component group 5. This achieves a physical and electrical connection between the first busbar 7 and the first component group 4.

[0059] The first lug portion 711 can be provided by the first busbar 7, i.e., be a part of the first busbar 7. Alternatively, the first lug portion 711 can be connected to the first busbar 7 via fasteners, welding, or a plug-in structure. In a preferred embodiment, the first lug portion 711 is provided by the first busbar 7, is a part of the first busbar 7, and is an integral structure with the first busbar 7. This configuration eliminates the need for a busbar and allows for a direct physical connection to the component assembly. This reduces the current transmission path, lowers resistance and stray inductance in the circuit, and improves the module's operating efficiency and performance.

[0060] Similarly, the second lug portion 811 can be provided by the second busbar 8, that is, it is a part of the second busbar 8, or the second lug portion 811 is connected to the second busbar 8 by fasteners, welding, or plug-in structures. In a preferred embodiment, the second lug portion 811 is provided by the second busbar 8, is a part of the second busbar 8, and is an integrated structure with the second busbar 8. With this arrangement, the second busbar 8 does not need a wire bar, but is directly physically connected to the device group, which can reduce the current transmission path, and also reduce the resistance and stray inductance in the line, thereby improving the operating efficiency and performance of the module.

[0061] The connection between the first lug portion 711 and the terminal of the first component group 4, and the connection between the second lug portion 811 and the terminal of the second component group 5 can be connected together by fasteners for easy disassembly; of course, they can also be connected together by welding or plug-in structure.

[0062] Among the multiple first lugs 711 of the first busbar 7, the positive lugs 701 and the first neutral lugs 702 are arranged alternately, facilitating connection of one positive lug 701 and one first neutral lug 702 to two terminals of the same component in the first component group 4. Any adjacent positive lugs 701 and first neutral lugs 702 are spaced apart, thereby achieving insulation between the positive lugs 701 and first neutral lugs 702. This simplifies the structure and eliminates the need for additional insulating material.

[0063] The alternating arrangement of the negative tabs 801 and the second neutral tabs 802 facilitates connection of one negative tab 801 and one second neutral tab 802 to two terminals of the same device in the second device group 5. Any adjacent negative tabs 801 and second neutral tabs 802 are spaced apart, thereby achieving insulation between the negative tabs 801 and the first neutral tab 702. This simplifies the structure and eliminates the need for additional insulating material.

[0064] During operation, the component assembly generates heat. To prevent overheating, the component assembly is mounted on a heat sink. The heat sink is plate-shaped, with two sides of the plate in the thickness direction forming two heat dissipation surfaces. The component assembly is mounted on the heat sink. As a non-limiting example, the heat sink can be implemented as a liquid cooling plate, which may have flow paths for coolant to flow through, thereby removing heat through the flowing coolant. Of course, other types of heat sinks are also contemplated, such as air-cooled heat sinks with fins or gas-liquid phase change heat sinks.

[0065] Each power unit is provided with at least two heat sinks, and the three device groups are arranged on different heat dissipation surfaces of the at least two heat sinks. The length directions of the three heat sinks can be consistent, and the arrangement direction of the multiple devices in the device group is consistent with the length direction of the heat sink. For example, the first device group 4 and the second device group 5 are arranged on the heat dissipation surfaces on both sides of the thickness direction of the same heat sink, such as Figure 7 As shown, the third device group 6 is located on a heat dissipation surface of another heat dissipation plate; or, the first device group 4, the second device group 5, and the third device group 6 are respectively located on a heat dissipation plate, as shown in FIG. Figure 6 shown.

[0066] Among them, the first busbar 7 is parallel to the heat sink where the first component group 4 is located or has an angle α2. The angle α2 can be any angle. Preferably, the angle α2 satisfies: 90°≤α2<180°. In this way, it is convenient to set multiple capacitors on the side of the first busbar 7 away from the first component group 4.

[0067] Furthermore, 110°≤α2<160°, thus reducing the space occupied by the entire device and facilitating arrangement on the device.

[0068] More preferably, the angle α2 may satisfy α2=135°.

[0069] Of course, the angle α2 can also be any value among 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, and 175°.

[0070] Of course, in order to reduce the overall occupied space, it is optimal that the first busbar 7, the second busbar 8, the heat sink where the first component group 4 is located, and the heat sink where the second component group 5 is located are parallel to each other.

[0071] When the angle α2 is ≤ 90 degrees, the capacitors on the first busbar 7 can be set on the side of the first busbar 7 away from the first component group 4. When the angle α2 is greater than 90 degrees, the capacitors on the first busbar 7 can be set on the side of the first busbar 7 facing the first component group 4.

[0072] Similarly, the second busbar 8 is parallel to or at an angle α3 to the heat sink where the second component group 5 is located. The angle α3 can be any angle, but preferably satisfies the following: 90°≤α3<180°. This facilitates the placement of multiple capacitors on the side of the second busbar 8 facing away from the second component group 5.

[0073] Furthermore, 110°≤α3<160°, thus reducing the space occupied by the entire device and facilitating arrangement on the device.

[0074] More preferably, the angle α3 may satisfy α1 = 135°.

[0075] Of course, the angle α3 can also be any value among 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, and 175°.

[0076] Of course, in order to reduce the overall occupied space, it is optimal that the first busbar 7, the second busbar 8, the heat sink where the first component group 4 is located, and the heat sink where the second component group 5 is located are parallel to each other.

[0077] When the angle α3 is ≤ 90 degrees, the capacitors on the second busbar 8 can be set on the side of the second busbar 8 away from the second component group 5. When the angle α3 is greater than 90 degrees, the capacitors on the second busbar 8 can be set on the side of the second busbar 8 facing the second component group 5.

[0078] In a preferred embodiment, the first busbar 7 is parallel to the heat sink where the first component group 4 is located, and the second busbar 8 is parallel to the heat sink where the second component group 5 is located. This arrangement allows the first busbar 7 and the first component group 4 to be connected at a shorter distance, and the second busbar 8 and the second component group 5 to be connected at an even shorter distance, and the two groups of connections can be arranged in a regular and equidistant manner. This not only shortens the line length and the current transmission path, but also ensures that the connection distance between the busbar and the two component groups is equal, eliminating the distance difference between the busbar and the two component groups, eliminating the current rate difference between the two transmission branches at the same DC end, and improving module performance.

[0079] Furthermore, in some exemplary embodiments, Figure 7 As shown, the same power unit can be provided with two corresponding heat sinks, which can be recorded as the first heat sink 1 and the third heat sink 3. The first device group 4 and the second device group 5 are arranged on the heat dissipation surfaces on both sides of the thickness direction of the first heat sink 1, and the third device group 6 is located on the heat dissipation surface of the third heat sink 3. The first busbar 7 and the second busbar 8 are both parallel to the first heat sink 1 and spaced opposite to each other along the thickness direction of the first heat sink 1. The first busbar 7 and the second busbar 8 are located on the side of the first heat sink 1 away from the third heat sink 3. The third heat sink 3 is parallel to the first heat sink 1 or is arranged at an angle (the angle is preferably greater than or equal to 90° and less than 180°). In this way, the two heat sinks and two busbars in a single power unit can be arranged closely, with a compact structure, which can reduce space occupation and is conducive to arrangement inside the cabinet of the equipment.

[0080] Of course, in some exemplary embodiments, each power unit may also be provided with three heat sinks, for example, a first heat sink 1, a second heat sink 2 and a third heat sink 3. Figure 6As shown, a first device group 4 is disposed on a first heat sink 1, a second device group 5 is disposed on a second heat sink 2, and a third device group 6 is disposed on a third heat sink 3. The first device group 4 on the first heat sink 1 and the second device group 5 on the second heat sink 2 are respectively electrically connected to the third device group 6 on the third heat sink 3. The first heat sink 1 and the second heat sink 2 are spaced apart and arranged opposite each other along a first direction (the X direction shown in the drawings, the same below). The third heat sink 3 is located on the side of the first heat sink 1 and the second heat sink 2 facing away from the busbar assembly in a second direction (the Y direction shown in the drawings, the same below). The three heat sinks can be parallel to each other or arranged at an angle to each other. For example, the first heat sink 1 and the third heat sink 3 have an angle β1, which satisfies the following: 10°≤β1≤170°, preferably 145°. The second heat sink 2 and the third heat sink 3 have an angle β2, which satisfies the following: 10°≤β2≤170°, preferably 145°.

[0081] Preferably, when β1>90° and β2>90°, the first component group 4 is disposed on the side of the first heat sink 1 facing the second heat sink 2, and the second component group 5 is disposed on the side of the second heat sink 2 facing the first heat sink 1. When β1<90° and β2<90°, the first component group 4 is preferably located on the side of the first heat sink 1 facing away from the third heat sink 3, and the second component group 5 is preferably located on the side of the second heat sink 2 facing away from the third heat sink 3. The third component group 6 is disposed on the first heat dissipation surface of the third heat sink 3. The third heat sink 3 is located on the side of the first heat sink 1 and the second heat sink 2 facing away from the busbar assembly in the second direction. The distance between the third component group 6 and the first heat sink 1 in the first direction is less than the distance between the third component group 6 and the second heat sink 2 in the first direction. In the first direction, the spacing between the third component group 6 and the first heat sink 1 is equal to the spacing between the third component group 6 and the second heat sink 2.

[0082] In some other embodiments, Figure 1-3 As shown, the power module includes two power units, each of which is provided with three heat sinks, designated as a first heat sink 1, a second heat sink 2, and a third heat sink 3. The first device group 4 and the second device group 5 in the same power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the first heat sink 1. The first device group 4 and the second device group 5 in the other power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the second heat sink 2. The two third device groups 6 in the two power units are arranged on the heat dissipation surfaces on both sides of the thickness direction of the third heat sink 3. The first heat sink 1 and the second heat sink 2 are spaced and arranged opposite to each other along a first direction, and the third heat sink 3 is located on the side of the first heat sink 1 and the second heat sink 2 in the second direction away from the busbar assembly. This arrangement increases the number of device groups in the module without significantly increasing the number of heat sinks, which can help the power module increase its operating power.

[0083] The first busbar 7 and the second busbar 8 connected to the device group on the first heat sink 1 can be parallel to the first heat sink 1, or they can be arranged at an angle to the first heat sink 1. When the first busbar 7 and the second busbar 8 are arranged at an angle to the first heat sink 1, they can also be arranged symmetrically in the first direction with respect to the first heat sink 1.

[0084] Of course, in order to reduce the overall space occupied, it is optimal that the first busbar 7 and the second busbar 8 connected to the device group on the first heat sink 1 are parallel to the first heat sink 1 .

[0085] Similarly, the first busbar 7 and the second busbar 8 connected to the device group on the second heat sink 2 can be parallel to the second heat sink 2, or they can be arranged at an angle to the second heat sink 2. Of course, in order to reduce the overall occupied space, it is optimal for the first busbar 7 and the second busbar 8 connected to the device group on the second heat sink 2 to be parallel to the second heat sink 2.

[0086] The three heat sinks can be arranged parallel to each other, or two or any two of the three heat sinks can be arranged at an angle. For example, the first heat sink 1, the second heat sink 2, and the third heat sink 3 can be parallel to each other, with their thicknesses all in the first direction; or the first heat sink 1 and the second heat sink 2 can be parallel, with the third heat sink 3 being perpendicular to the first and second heat sinks 1 and 2.

[0087] Alternatively, the first heat sink 1 and the third heat sink 3 have an included angle β1, where β1 satisfies the following: 10°≤β1≤170°; and / or the second heat sink 2 and the third heat sink 3 have an included angle β2, where β2 satisfies the following: 10°≤β2≤170°. When 10°≤β1<90° and 10°≤β2<90°, the entire module assumes a shrunk and gathered shape, resulting in a small overall volume and space occupation, making it easier to arrange on equipment.

[0088] When β1>90° and β2 is greater than 90°, for details, refer to Figure 3 , the first heat sink 1 can be tilted toward the third heat sink 3 in a direction away from the second heat sink 2. Figure 3 From the perspective of the figure, the first heat sink 1 is tilted downward and gradually to the left. If the third heat sink 3 is arranged parallel to the first heat sink 1, the distances between the two component groups on the first heat sink 1 and the corresponding third component group 6 will be different, and the difference between the two distances will be large, which will increase the stray inductance. In contrast, if the first heat sink 1 is arranged to tilt away from the second heat sink 2 and toward the third heat sink 3, the difference in the distances between the two component groups on the first heat sink 1 and the corresponding third component group 6 will be smaller. Accordingly, the length difference between the first and second wiring arrays 9, 10 will be smaller, which helps reduce stray inductance and balance the current transmission rates of the two paths.

[0089] Based on this factor, preferably, the included angle β1 between the first heat dissipation plate 1 and the third heat dissipation plate 3 can satisfy 110°≤β1≤160°.

[0090] If the angle β1 is too large, i.e., close to 180°, the third heat sink 3 will be arranged nearly parallel to the first heat sink 1; as discussed above, this will result in a large difference in length between the corresponding first and second wiring rows 9, 10, increasing stray inductance. If the angle β1 is too small, i.e., close to 90°, the difference in distance from the two device groups on the first heat sink 1 to the third device group 6 will also be large. Setting the angle β1 to meet the above range of the embodiment of the present application helps ensure a small difference in length between the first and second wiring rows 9, 10, thereby helping to reduce stray inductance.

[0091] More preferably, the angle β1 satisfies 120°≤β1≤150°. In this way, the bending angle of the wire array between the third heat sink 3 and the first heat sink 1 can be prevented from being too large, thereby effectively avoiding the risk of wire array breakage.

[0092] More preferably, the angle β1 can satisfy β1 = 135°. In this way, the distance between the third heat sink 3 and the first heat sink 1 can be made closer to each other, thereby further reducing the stray inductance.

[0093] Alternatively, the angle β1 may be any value of 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, or 175°.

[0094] Likewise, reference Figure 3 , the second heat sink 2 can be tilted toward the third heat sink 3 in a direction away from the first heat sink 1. Figure 3 From the perspective of the figure, the second heat sink 2 is tilted downward and gradually to the left. If the third heat sink 3 and the second heat sink 2 are arranged parallel to each other, the distances between the two component groups on the second heat sink 2 and the corresponding third component group 6 will be different, and the difference between the two distances will be large, which will increase the stray inductance. In contrast, if the second heat sink 2 is arranged to tilt toward the third heat sink 3 in a direction away from the first heat sink 1, the difference in the distances between the two component groups on the second heat sink 2 and the corresponding third component group 6 will be smaller. Accordingly, the length difference between the first and second wire arrays 9, 10 will be smaller, which helps to reduce stray inductance and balance the current transmission rates of the two paths.

[0095] Based on this factor, the angle β2 between the second heat sink 2 and the third heat sink 3 can satisfy 110°≤β2≤160°. If the angle β2 is too large, that is, close to 180°, the third heat sink 3 and the second heat sink 2 are arranged almost in parallel; as discussed above, this will result in a large difference in length between the corresponding first line row 9 and the corresponding second line row 10, increasing the stray inductance. If the angle β2 is too small, that is, close to 90°, the difference in distance from the two device groups on the second heat sink 2 to the third device group 6 will also be large. Setting the angle β2 to meet the above range of the embodiment of the present application helps to ensure that the length difference between the first line row 9 and the second line row 10 is small, thereby helping to reduce stray inductance.

[0096] Preferably, the angle β2 can satisfy 120°≤β2≤150°. In this way, the bending angle of the wire array between the third heat dissipation plate 3 and the first heat dissipation plate 1 can be prevented from being too large, thereby effectively avoiding the risk of wire array breakage.

[0097] More preferably, the angle β2 can satisfy β2 = 135°. In this way, the distance between the third heat sink 3 and the first heat sink 1 can be made closer to each other, thereby further reducing the stray inductance.

[0098] Alternatively, the angle β2 may be any value among 115°, 125°, 130°, 140°, 145°, 155°, 160°, 165°, 170°, and 175°.

[0099] Since there are multiple implementation options for the arrangement and angle of the heat sink, the busbar and the heat sink can also be parallel or have an angled relationship, and the shape and structure of the first lug portion 711 can be diverse. For example, in some embodiments, the first lug portion 711 is in the shape of a flat plate and is parallel to the first busbar 7 and parallel to the first device group 4 or the heat sink where the first device group 4 is located. This type of embodiment is applicable to the arrangement in which the first busbar 7 and the first device group 4 or the heat sink where the first device group 4 is located are parallel. In other words, in the embodiment in which the first busbar 7 and the first device group 4 or the heat sink where the first device group 4 is located are parallel, the first lug portion 711 can be in the shape of a flat plate, with one end connected to the first busbar 7 (preferably connected in an integrated manner) and the other end connected to the device in the first device group 4. Such an arrangement can further optimize the line length, optimize the current transmission path, reduce stray inductance, and improve the current transmission efficiency and module operation efficiency.

[0100] In other embodiments, the first lug portion 711 includes two bent sections connected in sequence and arranged at an angle, one bent section is parallel to the first busbar 7, and the other bent section is parallel to the heat sink where the first component group 4 is located. This type of embodiment is applicable to the case where the first busbar 7 and the first component group 4 or the heat sink where the first component group 4 is located are arranged at an angle. It can also be said that in the embodiment where the first busbar 7 and the first component group 4 or the heat sink where the first component group 4 is located are arranged at an angle, the first lug portion 711 can only include two bent sections that are arranged at an angle (the angle is the same as the angle between the first busbar 7 and the first component group 4) and connected. Such an arrangement can further optimize the line length.

[0101] In some other embodiments, the first lug portion 711 includes a first bent section a, a first bent section b, and a first bent section c connected in sequence, the first bent section b being arranged at an angle to the first bent section a and the first bent section c, the first bent section a being connected to and parallel to the first busbar 7, and the first bent section c being connected to and parallel to the first component group 4. Such embodiments are applicable both to situations where the first busbar 7 and the heat sink where the first component group 4 are located are arranged at an angle, and to situations where the first busbar 7 and the heat sink where the first component group 4 are located are parallel. For example, when the first busbar 7 and the heat sink where the first component group 4 are located are parallel, the first bent section a and the first bent section c are parallel; the first bent section b is perpendicular to the first bent section a and the first bent section c, or the first bent section b forms an obtuse angle with the first bent section a and the first bent section c.

[0102] Similarly, the shape and structure of the second lug portion 811 refer to the shape and structure of the first lug portion 711, and there are also many types. For example, the second lug portion 811 is flat and parallel to the second busbar 8, and also parallel to the second component group 5 or the heat sink where the second component group 5 is located. This type of embodiment is applicable to the situation where the second busbar 8 and the second component group 5 or the heat sink where the second component group 5 is located are parallel. Or, the second lug portion 811 includes two bent sections connected in sequence and arranged at an angle, two bent sections are parallel to the second busbar 8, and the other two bent sections are parallel to the heat sink where the second component group 5 is located. This type of embodiment is applicable to the situation where the second busbar 8 and the second component group 5 or the heat sink where the second component group 5 is located are arranged at an angle. Alternatively, the second lug portion 811 includes a second bent section a, a second bent section b, and a second bent section c, which are connected in sequence. The second bent section b is arranged at an angle to the second bent section a and the second bent section c. The second bent section a is connected to the second busbar 8 and is parallel to the second busbar 8. The second bent section c is connected to the second component group 5 and is parallel to the second component group 5. This embodiment is applicable both to the case where the second busbar 8 and the heat sink where the second component group 5 are located are arranged at an angle, and to the case where the second busbar 8 and the heat sink where the second component group 5 are located are parallel to each other.

[0103] The first lug portion 711 and the second lug portion 811 may be symmetrically arranged with respect to a center line of the first busbar 7 and the second busbar 8 in the arrangement direction.

[0104] Regardless of the number of power units, the first device group 4 is connected to the third device group 6 via the first wiring bus 9, and the second device group 5 is connected to the third device group 6 via the second wiring bus 10. The first wiring bus 9 has various structures. For example, in some embodiments, the first wiring bus 9 is flat, with one end connected to the first device group 4 and the other end connected to the third device group 6. This structure of the first wiring bus 9 is suitable for situations where the heat sink where the first device group 4 and the heat sink where the third device group 6 are located are arranged in parallel. In some embodiments, the first wiring bus 9 includes two bent sections connected in sequence and arranged at an angle, one bent section being parallel to the heat sink where the first device group 4 is located, and the other bent section being connected to the third device group 6 and parallel to the heat sink where the third device group 6 is located. This structure of the first wiring bus 9 is suitable for situations where the heat sink where the first device group 4 and the heat sink where the third device group 6 are located are arranged at an angle. In some other embodiments, the first line array 9 includes three bending sections connected in sequence and arranged at angles in sequence, the three bending sections including a d bending section, an e bending section and an f bending section, the d bending section is parallel to the heat sink where the first device group 4 is located, the f bending section is connected to the third device group 6 and is parallel to the heat sink where the third device group 6 is located; this structure of the first line array 9 is applicable to the case where the heat sink where the first heat sink 1 device group is located and the heat sink where the third device group 6 is located are arranged in parallel, and is also applicable to the case where the heat sink where the first device group 4 is located and the heat sink where the third device group 6 is located are arranged at an angle; wherein, when the heat sink where the first device group 4 is located and the heat sink where the third device group 6 is located are parallel, the e bending section can also be perpendicular to the d bending section and the f bending section.

[0105] Similarly, the second bus 10 has various structures. For example, in some embodiments, the second bus 10 is flat, with one end connected to the second device group 5 and the other end connected to the third device group 6. This structure of the second bus 10 is suitable for situations where the heat sinks of the second device group 5 and the third device group 6 are arranged in parallel. In some embodiments, the second bus 10 includes two bent sections connected in sequence and arranged at an angle, one of which is parallel to the heat sink of the second device group 5 and the other is connected to the third device group 6 and parallel to the heat sink of the third device group 6. This structure of the second bus 10 is suitable for situations where the heat sinks of the second device group 5 and the third device group 6 are arranged at an angle. In some other embodiments, the second wiring array 10 includes three bending sections that are connected in sequence and arranged at angles in sequence, and the three bending sections include a bending section h, a bending section g, and a bending section k. The bending section h is parallel to the heat sink where the second device group 5 is located, and the bending section k is connected to the third device group 6 and is parallel to the heat sink where the third device group 6 is located. This structure of the second wiring array 10 is applicable to both the case where the heat sink where the second device group 5 is located and the heat sink where the third device group 6 is located are arranged in parallel, and the case where the heat sink where the second device group 5 is located and the heat sink where the third device group 6 is located are arranged at an angle. When the heat sink where the second device group 5 is located and the heat sink where the third device group 6 is located are parallel, the bending section g can also be perpendicular to the bending section h and the bending section k.

[0106] As an example, the devices in the device groups can be IGBT devices. It is understood that the IGBT devices mentioned herein can be the same as conventional IGBT devices. For the sake of brevity, the structure and operating principles of IGBT devices will not be detailed herein. The first device group 4, the second device group 5, and the third device group 6 are all IGBT device groups, each of which includes multiple IGBT devices connected in parallel.

[0107] The present application also provides an embodiment of a power conversion device, comprising a cabinet and a DC fuse, a DC disconnect switch, a power module, a reactor, an AC filter capacitor, and an AC circuit breaker disposed within the cabinet and connected in sequence. The power module is as described in any of the above embodiments. Therefore, the power conversion device has the beneficial effects of the power modules in the above embodiments, which will not be further elaborated here.

[0108] The DC fuse, DC disconnect switch, power module, reactor, AC filter capacitor and AC circuit breaker are connected in sequence, that is, the first end of the DC fuse is connected to the external DC circuit via the DC input copper busbar, the second end of the DC fuse is connected to the DC disconnect switch, the second end of the DC disconnect switch is connected to the busbar of the power module to achieve connection with the DC capacitor, the DC capacitor is connected to the first and second component groups 5 via the busbar, and the second end of the third component group 6, which is also the second connection end of the power module, is connected to the first end of the reactor, the second end of the reactor is connected to the first end of the AC filter, the second end of the AC filter is connected to the first end of the AC circuit breaker, and the second end of the AC circuit breaker is connected to the AC output copper busbar to output AC power to the outside.

[0109] In particular, the power conversion device provided by the embodiment of the present application may include two reactors, one reactor being connected to a third device group 6 .

[0110] It should be understood that the terms "parallel" and "perpendicular" herein should be understood as "substantially parallel" and "substantially perpendicular," respectively, and a reasonable error range should be included therein. For example, the error range may be ±5°.

[0111] The basic principles of the present application have been described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, and effects mentioned in this application are merely illustrative and not restrictive, and it should not be assumed that these advantages, strengths, and effects are required of each embodiment of this application. In addition, the specific details disclosed above are merely illustrative and facilitating understanding, and are not restrictive. The above details do not limit this application to necessarily being implemented using the above specific details.

[0112] The components and devices involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the drawings. As those skilled in the art will recognize, these components and devices can be connected, arranged, or configured in any manner.

[0113] It should be understood that the term "including" and its variations used in the embodiments of this application are open-ended, i.e., "including but not limited to." The term "according to" means "at least in part according to." The term "one embodiment" means "at least one embodiment," and the term "another embodiment" means "at least another embodiment."

[0114] It should be understood that although the terms "first" or "second" may be used in the embodiments of the present application to describe various elements, such as a first heat sink and a second heat sink, these elements are not defined by these terms, which are only used to distinguish one element from another.

Claims

1. A power module, characterized in that: comprising at least one power unit; the power unit comprising a first device group, a second device group, a third device group and a busbar assembly, The busbar assembly includes a first busbar, a second busbar and a capacitor, the first busbar and the second busbar are spaced apart, at least one capacitor is provided on the first busbar board, and at least one capacitor is provided on the second busbar; The first busbar includes a first neutral electrode plate and a positive electrode plate stacked together, and the second busbar includes a second neutral electrode plate and a negative electrode plate stacked together; The first busbar is electrically connected to a first end of the first component group, the second busbar is electrically connected to a first end of the second component group, and the second ends of the first component group and the second component group are electrically connected to the third component group respectively.

2. The power module according to claim 1, wherein: The first busbar and the second busbar are parallel to each other.

3. The power module according to claim 1, wherein: Orthographic projections of the first busbar and the second busbar along the thickness direction completely overlap.

4. The power module according to claim 1, wherein: An included angle α1 is formed between the first busbar and the second busbar, and the included angle α1 satisfies: α1≤90°.

5. The power module according to claim 1, wherein: The first busbar is provided with a plurality of first lugs at one end close to the first device group. The plurality of first lugs include a positive lug formed at one end of the positive plate and a first neutral lug formed at one end of the first neutral plate. The positive lug and the first neutral lug are respectively connected to the terminal at the first end of the first device group. And / or, the second busbar is provided with a plurality of second lug portions at one end close to the second device group, the plurality of second lug portions including a negative lug portion formed at one end of the negative electrode plate and a second neutral lug portion formed at one end of the second neutral electrode plate, the negative lug portion and the second neutral lug portion being respectively connected to the terminal at the first end of the second device group.

6. The power module according to claim 5, wherein: The positive lug portions and the first neutral lug portions are arranged alternately, and any adjacent positive lug portions are spaced apart from the first neutral lug portions; and / or, the negative lug portions and the second neutral lug portions are arranged alternately, and any adjacent negative lug portions are spaced apart from the second neutral lug portions; and / or, the first lug portions and the first busbar are an integral structure, and the second lug portions and the second busbar are an integral structure.

7. The power module according to claim 5, wherein: The first lug portion is flat and parallel to the first busbar; and / or the second lug portion is flat and parallel to the second busbar; and / or the first lug portion includes two bent sections connected in sequence and arranged at an angle, one bent section is parallel to the first busbar, and the other bent section is parallel to the heat sink where the first component group is located; and / or the second lug portion includes two bent sections connected in sequence and arranged at an angle, one bent section is parallel to the second busbar, and the other bent section is parallel to the heat sink where the second component group is located.

8. The power module according to claim 5, wherein: The first lug portion includes a first bent section a, a first bent section b, and a first bent section c that are connected in sequence, wherein the first bent section b is arranged at an angle to the first bent section a and the first bent section c, the first bent section a is connected to and parallel to the first busbar, and the first bent section c is connected to and parallel to the first component group; And / or, the second lug portion includes a second a bending section, a second b bending section and a second c bending section connected in sequence, the second b bending section is arranged at an angle to the second a bending section and the second c bending section, the second a bending section is connected to the second busbar and parallel to the second busbar, and the second c bending section is connected to the second device group and parallel to the second device group.

9. The power module according to claim 8, wherein: The first a bending section is parallel to the first c bending section; and / or the second a bending section is parallel to the second c bending section; and / or the first b bending section is perpendicular to the first a bending section and / or the first c bending section; and / or the second b bending section is perpendicular to the second a bending section and / or the second c bending section.

10. The power module according to claim 1, wherein: The power unit is provided with at least two heat dissipation plates, each of which has two heat dissipation surfaces arranged opposite to each other along the thickness direction, and the first component group, the second component group and the third component group are respectively arranged on different heat dissipation surfaces of the at least two heat dissipation plates. The first busbar is parallel to the heat sink where the first component group is located or has an angle α2, and the angle α2 satisfies: 90°≤α2<180°; the second busbar is parallel to the heat sink where the second component group is located or has an angle α3, and the angle α3 satisfies: 90°≤α3<180°.

11. The power module according to claim 10, wherein: The first component group and the second component group are distributed on the heat dissipation surfaces on both sides of the same heat dissipation plate, and the first busbar and the second busbar are spaced apart along the thickness direction of the heat dissipation plate and are parallel to the heat dissipation plate.

12. The power module according to claim 10, wherein: Each of the power units is provided with a first heat sink, a second heat sink and a third heat sink, wherein the first heat sink and the second heat sink are spaced apart and arranged opposite to each other along a first direction, and the third heat sink is located on a side of the first heat sink and the second heat sink that is away from the busbar assembly in a second direction; A group of the first device groups is arranged on the first heat sink, a group of the second device groups is arranged on the second heat sink, and a group of the third device groups is arranged on the third heat sink. The first device groups on the first heat sink and the second device groups on the second heat sink are electrically connected to the third device groups on the third heat sink, respectively.

13. The power module according to claim 12, wherein: The first device group is arranged on a side of the first heat sink facing the second heat sink, the second device group is arranged on a side of the second heat sink facing the first heat sink, and the third device group is arranged on a side of the third heat sink; In the first direction, a distance between the third component group and the first heat dissipation plate is equal to a distance between the third component group and the second heat dissipation plate.

14. The power module according to claim 10, wherein: The two power units are provided with a first heat sink, a second heat sink, and a third heat sink. The first component group and the second component group in one power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the first heat sink. The first component group and the second component group in the other power unit are arranged on the heat dissipation surfaces on both sides of the thickness direction of the second heat sink. The two third component groups in the two power units are arranged on the heat dissipation surfaces on both sides of the thickness direction of the third heat sink. The first heat dissipation plate and the second heat dissipation plate are spaced apart and arranged opposite to each other along a first direction, and the third heat dissipation plate is located on a side of the first heat dissipation plate and the second heat dissipation plate that is away from the busbar assembly in a second direction.

15. The power module according to claim 14, wherein: The first busbar and the second busbar connected to the device group on the first heat sink are both parallel to the first heat sink; and / or the first busbar and the second busbar connected to the device group on the second heat sink are both parallel to the second heat sink.

16. The power module according to any one of claims 12 to 15, wherein: The first heat dissipation plate, the second heat dissipation plate, and the third heat dissipation plate are parallel to each other, and their thickness directions are all in the first direction; or, the first heat dissipation plate and the second heat dissipation plate are parallel, and the third heat dissipation plate is perpendicular to the first heat dissipation plate and the second heat dissipation plate.

17. The power module according to any one of claims 12 to 15, wherein: The first heat dissipation plate and the third heat dissipation plate have an included angle β1, and the included angle β1 satisfies: 10°≤β1≤170°; and / or the second heat dissipation plate and the third heat dissipation plate have an included angle β2, and the included angle β2 satisfies: 10°≤β2≤170°.

18. The power module according to claim 1, wherein: The first device group is connected to the third device group via a first busbar, and the second device group is connected to the third device group via a second busbar, wherein the first busbar satisfies any of the following conditions: (a) The first wiring array is in the shape of a flat plate, one end of which is connected to the first device group and the other end of which is connected to the third device group; (b) the first wiring array includes two bent sections connected in sequence and arranged at an angle, one bent section being parallel to the heat sink where the first device group is located, and the other bent section being connected to the third device group and being parallel to the heat sink where the third device group is located; (c) The first wiring array includes three bent sections that are connected in sequence and arranged at an angle to each other, the three bent sections including a bent section d, a bent section e, and a bent section f, the bent section d being parallel to the heat sink where the first device group is located, and the bent section f being connected to the third device group and parallel to the heat sink where the third device group is located; And / or, the second row satisfies any of the following: (d) the second wiring array is in the shape of a flat plate, one end of which is connected to the second device group and the other end of which is connected to the third device group; (e) the second wiring array includes two bent sections connected in sequence and arranged at an angle, one bent section being parallel to the heat sink where the second device group is located, and the other bent section being connected to the third device group and being parallel to the heat sink where the third device group is located; (f) The second line array includes three bending sections that are connected in sequence and arranged at angles to each other, the three bending sections including a bending section h, a bending section g, and a bending section k, the bending section h is parallel to the heat sink where the second device group is located, and the bending section k is connected to the third device group and is parallel to the heat sink where the third device group is located.

19. The power module according to claim 1, wherein: The first device group, the second device group, and the third device group are all IGBT device groups, and each IGBT device group includes a plurality of IGBT devices connected in parallel.

20. A power conversion device, characterized in that: The invention comprises a cabinet body and a DC fuse, a DC isolating switch, a power module, a reactor, an AC filter capacitor and an AC circuit breaker which are arranged in the cabinet body and connected in sequence. The power module is the power module according to any one of claims 1 to 19.

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