Heating chip for ceramic and heating ceramic tile

Abstract

The utility model relates to the technical field of building decoration materials, in particular to a heating chip and a heating ceramic tile. The utility model provides a heating chip for ceramics. The heating chip comprises a foaming heat preservation layer, a first cement layer, a second cement layer and a heating wire. The heating wire is in close contact with the first cement layer and the foaming heat preservation layer, the heat preservation layer reduces heat transfer to the second cement layer during power-on heating, heat energy is rapidly transferred to the first cement layer, and heat is evenly dissipated through the first cement layer. The utility model further provides a heating ceramic tile. The decorative layer is located above the first water layer.

Description

Technical Field

[0001] The utility model relates to the technical field of building decoration materials, in particular to a heating chip and a heating tile. Background Art

[0002] In recent years, heating tiles have gained popularity in architectural decoration. These tiles achieve their heating function by coiling heating wires through grooves in insulation panels, coiling heating wires through foamed polyurethane insulation panels with cable ducts, or attaching electric heating film to extruded panels. However, these heating tile products are simply assembled and processed, leading to problems such as loose adhesion to the tiles, hollowing, loose adhesion to cement mortar, and poor insulation of the heating material, which can lead to leakage and tripping. Utility Model Content

[0003] In order to solve the problems and shortcomings in the prior art, the present invention provides a heating chip and a heating tile. Specifically, the heating chip provided by the present invention includes:

[0004] Foam insulation layer;

[0005] a first cement layer, the first cement layer being disposed on a first side of the foam insulation layer;

[0006] a second cement layer, the second cement layer being arranged on a second side surface of the foamed thermal insulation layer;

[0007] A heating wire is tightly attached to the back surface of the first cement layer, where the back surface is in contact with the first side surface.

[0008] Optionally, the heating chip further includes a thermally conductive tape, and the thermally conductive tape is used to fix the heating wire on the back side of the first cement layer and isolate the heating wire from the foam insulation layer.

[0009] Optionally, the heating chip further includes a terminal, and the terminal connects the heating wire to a cable, so that an external power source supplies power to the heating wire through the cable.

[0010] Optionally, the heating chip further includes an aviation plug, which is arranged at an end of the cable away from the heating wire and is sleeved on the outer circumference of the cable.

[0011] Optionally, the terminal is made of copper.

[0012] Optionally, the thickness of the foam insulation layer is 12-20 mm.

[0013] Optionally, the aviation plug is a self-locking aviation plug with a waterproof grade of IP68.

[0014] Optionally, the terminals are insulated by silicone encapsulation.

[0015] The utility model also provides a heating tile, which comprises the heating chip described in any one of the above items, and the decorative layer is connected to the front side of the first cement layer, and the front side is opposite to the back side.

[0016] Optionally, the decorative layer of the heating ceramic tile is a ceramic tile layer.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] (1) The heating chip is integrally formed, and each structural layer is tightly combined to reduce the occurrence of cracking and delamination;

[0019] (2) Using a foam insulation layer for heat insulation reduces the heat transfer from the heating wire to the second cement layer, thereby improving the thermal energy utilization rate and heat transfer speed;

[0020] (3) Using copper-nickel-chromium alloy wire as the heating wire increases the service life of the heating chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0022] Figure 1 is an exploded view according to an embodiment of the present utility model;

[0023] Figure 2 It is an exploded diagram of another heating chip according to the utility model.

[0024] In the figure: 10-foam insulation layer, 20-first cement layer, 30-second cement layer, 40-heating wire, 50-terminal, 60-aviation plug, 70-thermal conductive tape. DETAILED DESCRIPTION

[0025] Refer to the following Figures 1 to 2To describe a heating chip and heating tile of an embodiment of the present utility model. In the description of this embodiment, it should be understood that the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0026] In the description of the present embodiment, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any appropriate manner in any one or more embodiments or examples.

[0027] Figure 1 This is a schematic diagram of the internal structure of a ceramic heating chip according to an embodiment of the present invention. Figure 1 As shown in the figure, and in conjunction with the figures, the present invention provides a heating chip and heating ceramic tile. The heating chip includes a foam insulation layer 10, a first cement layer 20, a second cement layer 30, and a heating wire 40. The first cement layer 20 and the second cement layer 30 are symmetrically arranged on either side of the foam insulation layer 10 and are both tightly connected to the foam insulation layer 10. The side of the first cement layer 20 connected to the foam insulation layer 10 is called the back side of the first cement layer 20, and the heating wire 40 is tightly attached to the back side of the first cement layer 20.

[0028] Specifically, first, a heating wire 40 is laid on the back of the first cement layer 20 so that the heating wire 40 is in close contact with the first cement layer 20. Secondly, the second cement layer 30 is placed on the back of the first cement layer 20, with a certain gap reserved between the second cement layer 30 and the first cement layer 20. Thereafter, a foaming material is placed in the gap formed by the first cement layer 20 and the second cement layer 30, and is fully foamed to form a foamed insulation layer 10, thereby obtaining a heating chip having a foamed insulation layer 10, a first cement layer 20, a second cement layer 30, and a heating wire 40. The thermal insulation layer in the heating chip isolates the heating wire 40 from the second cement layer 30, so that the heat generated by the heating wire 40 is dissipated in one direction to the first cement layer 20, and the heat energy is quickly transferred to the first cement layer 20 for uniform dissipation.

[0029] In this embodiment, the heating chip is integrally formed rather than simply processed and assembled, so that the various structural layers of the heating chip fit tightly together to avoid separation due to loose bonding. At the same time, the presence of the foam insulation layer 10 makes the effective utilization of heat high and the heating speed fast.

[0030] In some embodiments of the present invention, the heating wire 40 is a copper-nickel-chromium alloy heating wire 40. The copper-nickel-chromium alloy heating wire 40 has little attenuation in a temperature environment of 40-60°C and generally has a lifespan of more than 50 years.

[0031] In this embodiment, the copper-nickel-chromium alloy heating wire 40 is selected to extend the service life of the heating chip and reduce the maintenance frequency and maintenance costs.

[0032] In some embodiments of the present invention, the heating wires 40 are evenly distributed on the back of the first cement board. The specific winding pattern can be U-shaped, spiral, or other shapes. In this embodiment, the heating wires 40 are evenly wound so that the first cement board is heated evenly.

[0033] In some embodiments of the present invention, the thickness of the foam insulation layer 10 is 12-20 mm. That is, the thickness of the foam insulation layer 10 can be 12 mm, 13.5 mm, 14 mm, 16 mm, etc. Preferably, the thickness of the foam insulation layer 10 is 16 mm.

[0034] In this embodiment, the thickness of the foam insulation layer 10 is set between 12 and 20 mm. This ensures that the insulation effect is not poor due to being too thin, thereby reducing the heat generated by the heating wires 40 from dissipating to the second cement layer 30; nor does it become excessively bulky due to being too thick. Furthermore, this appropriate thickness also minimizes the space required for the heating tile.

[0035] In some embodiments of the present invention, the foamed insulation layer 10 is a polyurethane insulation layer. Specifically, B2-grade flame-retardant, environmentally friendly polyurethane foam is formed to form an integral structure with the first cement layer 20 and the second cement layer 30. When the first cement layer 20 of the heating chip is placed horizontally on top, the polyurethane foam insulation layer 10 serves as both a load-bearing support for the heating chip and a thermal insulation board for downward insulation.

[0036] Polyurethane material is a B2 grade flame retardant thermal insulation material, resistant to high temperatures above 100°C, and has the advantages of being healthy and formaldehyde-free.

[0037] In this embodiment, polyurethane material is selected as the foam insulation layer 10, which has both flame retardant and heat-insulating effects, and can also avoid the release of formaldehyde and pollution during use, further improving the safety of the heating chip.

[0038] In some embodiments of the present invention, the heating chip further includes a thermally conductive tape 70 , which is used to fix the heating wire 40 on the back of the first cement layer 20 and isolate the heating wire 40 from the foam insulation layer 10 .

[0039] Specifically, before injecting the foaming material, the thermal conductive tape 70 is attached to the back of the first cement layer 20 so that the heating wire 40 is covered, thereby protecting the heating wire 40 from being wrapped by the foaming material during the foaming process.

[0040] In this embodiment, a thermally conductive tape 70 is used to cover the heating wire 40 to prevent the heating wire 40 from being wrapped by the foam material, thereby ensuring the heating efficiency of the heating wire 40 .

[0041] In a further embodiment of the present invention, the thermally conductive tape 70 is an aluminum foil tape. Aluminum foil tape has excellent thermal conductivity and heat dissipation properties. In this embodiment, the use of the aluminum foil tape can disperse the heat generated by the heating wire 40 more evenly within the first cement layer 20.

[0042] In some embodiments of the present invention, the heating chip further includes a terminal 50 , and the terminal 50 connects the heating wire 40 to the cable so that an external power source supplies power to the heating wire 40 through the cable.

[0043] In this embodiment, the terminal 50 is used to connect the heating wire 40 and the cable to achieve electrical conduction between the two, while also protecting the circuit and increasing the stability and safety of the connection.

[0044] In some embodiments of the present invention, the terminal 50 is made of copper. In this embodiment, copper is selected as the material for the terminal 50 because it has stable electrical properties, mechanical strength, and corrosion resistance. This makes the connection between the heating wire 40 and the cable more reliable and secure.

[0045] In some embodiments of the present invention, the terminal 50 is insulated by silicone potting. In this embodiment, the use of silicone potting insulation further increases the safety of the circuit.

[0046] In some embodiments of the present invention, the heating chip further includes an aviation plug 60, which is disposed at an end of the cable away from the heating wire 40 and is sleeved around the outer circumference of the cable. In this embodiment, the aviation plug 60 is disposed at the end of the cable to improve circuit reliability.

[0047] In some embodiments of the present invention, the aviation plug 60 is a self-locking aviation plug 60 with a waterproof rating of IP68. In this embodiment, the aviation plug 60 has a high waterproof rating and is self-locking, waterproof and leak-proof, further improving the safety performance of the heating chip.

[0048] The present invention also provides a heating tile, which includes the heating chip in any of the above embodiments, and the decorative layer is connected to the front side of the first cement layer 20, and the front side of the first cement board is the side opposite to the back side of the first cement board.

[0049] Specifically, the decorative layer is connected to the front surface of the first cement layer 20, and the decorative layer and the front surface of the first cement layer 20 are connected by an adhesive, thereby obtaining a heating tile.

[0050] In this embodiment, the heating tiles can not only realize the heating function, but also have a decorative effect.

[0051] In some embodiments of the present invention, the decorative layer of the ceramic tile is a ceramic tile layer. Specifically, the ceramic tile layer is selected as the decorative layer material, and the ceramic tile layer is bonded to the first cement layer 20 by an adhesive such as cement mortar to obtain a heating ceramic tile.

[0052] In this embodiment, ceramic tiles, as a commonly used building decoration material, are integrated with the heating plate to reduce subsequent decoration processes and improve paving quality.

[0053] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention can be directly determined or deduced from the contents disclosed herein without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A heating chip for ceramics, characterized in that: include: Foam insulation layer; a first cement layer, the first cement layer being disposed on a first side of the foam insulation layer; a second cement layer, the second cement layer being arranged on a second side surface of the foamed thermal insulation layer; A heating wire is tightly attached to the back surface of the first cement layer, where the back surface is in contact with the first side surface.

2. The heating chip for ceramics according to claim 1, characterized in that: Also includes: A heat-conducting tape is used to fix the heating wire on the back of the first cement layer and to isolate the heating wire from the foam insulation layer.

3. The heating chip for ceramics according to claim 1, characterized in that: Also includes: The terminal connects the heating wire to the cable so that an external power source supplies power to the heating wire through the cable.

4. The heating chip for ceramics according to claim 3, characterized in that: It also includes an aviation plug, which is arranged at one end of the cable away from the heating wire and is sleeved on the outer circumference of the cable.

5. The heating chip for ceramics according to claim 3, characterized in that: The material of the terminal is copper.

6. The heating chip for ceramics according to claim 1, characterized in that: The thickness of the foam insulation layer is 12-20 mm.

7. The heating chip for ceramics according to claim 4, characterized in that: The aviation plug is a self-locking aviation plug and has a waterproof grade of IP68.

8. The heating chip for ceramics according to claim 3, characterized in that: The terminals are insulated by silicone potting.

9. A heating tile, characterized in that The heat generating chip comprises the heat generating chip according to any one of claims 1 to 8, wherein the decorative layer is connected to the front side of the first cement layer, and the front side is opposite to the back side.

10. The heating tile according to claim 9, characterized in that The decorative layer is a tile layer.

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