Substrate processing equipment and substrate processing system

Abstract

The utility model discloses substrate processing equipment and a substrate processing system, and relates to the field of substrate processing equipment.The substrate processing equipment comprises a vibration workbench; a substrate to be machined is fixed to the vibration workbench, and the vibration workbench is used for driving the substrate on the vibration workbench to vibrate in the first direction at the set amplitude and frequency in the machining process, so that periodic contact and separation are formed between the machining tool rotating at the high speed and the substrate, and the substrate is machined. In the embodiment, the vibration workbench is arranged on the substrate processing equipment, and the vibration workbench drives the substrate on the vibration workbench to perform high-frequency vibration in the first direction through the amplitude and frequency set in the processing process, so that the complex structure of a traditional main shaft vibration mode is simplified, and the cost is reduced; the problems that an existing substrate machining device adopting a main shaft vibration mode is complex in structure and high in cost are solved.

Description

Technical Field

[0001] The utility model relates to the field of substrate processing equipment, in particular to substrate processing equipment and a substrate processing system. Background Art

[0002] With the rapid development of the aerospace, medical, automotive, and electronics industries, substrates (such as printed circuit boards) are becoming increasingly multi-layered, micropore diameters are shrinking, and micropore quality requirements are becoming increasingly stringent. However, in substrate processing, micropore machining often involves difficult-to-machine materials such as carbon fiber composites. These materials have poor machinability, and the micropores generally have large aspect ratios. This results in high drilling forces and temperatures, shortening drill bit life, and ultimately reducing substrate machining accuracy.

[0003] In the prior art, in order to improve the processing accuracy of the substrate, vibration is usually applied to the main shaft. However, this method requires adding a vibration device to the main shaft, which increases the complexity of the main shaft structure and is costly. Summary of the Invention

[0004] Based on this, the embodiments of the present invention provide a substrate processing device and a substrate processing system to solve the technical problems of the existing substrate processing equipment using a spindle vibration method having a complex structure and high cost.

[0005] In order to solve the above problems, the technical solutions adopted by the present invention are as follows:

[0006] In a first aspect, an embodiment of the present utility model provides a substrate processing device, comprising a vibrating worktable;

[0007] The vibrating worktable is fixed with a substrate to be processed, and is used to drive the substrate on the vibrating worktable to vibrate in a first direction at a set amplitude and frequency during the processing process, so that a high-speed rotating processing tool and the substrate form periodic contact and separation to achieve processing of the substrate.

[0008] Optionally, the vibration workbench includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a processing workbench and an ultrasonic vibration device;

[0009] The ultrasonic vibration device is used to drive the substrate on the processing workbench to vibrate in the first direction at a set amplitude and frequency during the processing process, so that the high-speed rotating processing tool and the substrate form periodic contact and separation to achieve processing of the substrate.

[0010] Optionally, the frequency range of the ultrasonic vibration device is 20kHz~60kHz; the ultrasonic vibration device includes an ultrasonic transducer, a horn and a resonator;

[0011] One end of the ultrasonic transducer is connected to one end of the horn;

[0012] The other end of the horn is connected to one end of the resonator;

[0013] The other end of the resonator is connected to the processing workbench.

[0014] Optionally, at least one ultrasonic vibration device is included, and the ultrasonic vibration device is arranged on the processing workbench in a uniform arrangement.

[0015] Optionally, the substrate processing equipment further comprises an ultrasonic generator for converting electrical energy into a high-frequency electrical signal matching the ultrasonic transducer;

[0016] The ultrasonic generator is connected to the ultrasonic transducer.

[0017] Optionally, the ultrasonic vibration device includes an air static pressure ultrasonic vibration device.

[0018] Optionally, the aerostatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, a first aerostatic bearing, a second aerostatic bearing, a third aerostatic bearing, a vibration rod, and an air-floating vibration plate provided on the vibration rod;

[0019] The bearing mounting cover is detachably connected to the bearing mounting base;

[0020] The first aerostatic bearing is mounted in the bearing mounting cover;

[0021] The second aerostatic bearing and the third aerostatic bearing are mounted in the bearing mounting base;

[0022] The vibration rod is arranged in a receiving chamber formed by the bearing mounting cover and the bearing mounting base, and is located at the axial center of the first, second and third aerostatic bearings;

[0023] The air-floating vibration plate is located between the first air static pressure bearing and the second air static pressure bearing, and is used to drive the vibration rod to vibrate in the first direction, so that the vibration rod drives the substrate on the processing workbench to vibrate in the first direction.

[0024] Optionally, the air static pressure ultrasonic vibration device further includes a muffler;

[0025] The bearing mounting base is provided with an outlet communicated with the accommodating chamber, and the muffler is arranged at the outlet.

[0026] Optionally, the substrate processing equipment further comprises a spindle, a bed, a gantry system and a mobile platform;

[0027] A passage is formed between the gantry system and the bed;

[0028] The gantry system and / or the movable platform are movably arranged on the bed along the third direction, and the movable platform can drive the vibration worktable to move into or out of the channel;

[0029] The main shaft is movably arranged on the gantry system along the second direction, and the main shaft can move along the first direction;

[0030] The first direction, the second direction and the third direction are perpendicular to each other.

[0031] Optionally, the substrate processing equipment further comprises a laser displacement sensor for detecting the actual amplitude and actual frequency of the processing workbench;

[0032] The laser displacement sensor is arranged below the processing workbench.

[0033] Optionally, the processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect substrate.

[0034] In a second aspect, an embodiment of the present invention provides a substrate processing system, wherein the substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device described in the first aspect above.

[0035] In one embodiment of the present invention, substrate processing equipment includes a vibrating worktable to which a substrate to be processed is fixed, and is used to drive the substrate on the vibrating worktable to vibrate in a first direction at a set amplitude and frequency during the processing process, so that a high-speed rotating processing tool and the substrate are periodically contacted and separated to achieve processing of the substrate. In this embodiment, by providing a vibrating worktable on the substrate processing equipment and driving the substrate thereon to vibrate in the first direction at a high frequency using the amplitude and frequency set by the vibrating worktable during the processing process, the complex structure of the traditional spindle vibration method is simplified, the cost is reduced, and the problem of the complex structure and high cost of the spindle vibration method used in existing substrate processing equipment is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0037] Figure 1 It is a schematic diagram of a substrate processing device in one embodiment of the present utility model;

[0038] Figure 2 This is a partial schematic diagram of a substrate processing device in one embodiment of the present invention;

[0039] Figure 3 is a schematic diagram of an ultrasonic vibration device in one embodiment of the present utility model;

[0040] Figure 4 1 is a schematic diagram of an air static pressure ultrasonic vibration device in one embodiment of the present utility model;

[0041] Figure 5 This is a schematic diagram of a partial installation of an ultrasonic vibration device in one embodiment of the present utility model;

[0042] Figure 6 This is another schematic diagram of the partial installation of the ultrasonic vibration device in one embodiment of the present invention.

[0043] The accompanying drawings are numerals as follows:

[0044] 1. Spindle;

[0045] 2. Vibration workbench; 21. Processing workbench;

[0046] 22. Ultrasonic vibration device; 221. Ultrasonic transducer; 222. Horn; 223. Resonator; 2211. Stud; 2212. Front cover; 2213. Insulating sleeve; 2214. Electrode; 2215. Ceramic sheet; 2216. Rear cover; 2217. First screw; 224. Second screw.

[0047] 23. Aerostatic ultrasonic vibration device; 231. Bearing mounting cover; 232. Bearing mounting base; 233. First aerostatic bearing; 234. Second aerostatic bearing; 235. Third aerostatic bearing; 236. Vibrating rod; 237. Air-floating vibration plate; 238. Muffler; 239. Air path structure; 240. Third screw;

[0048] 3. Mobile platform;

[0049] 4. Beam base; 41. First base; 42. Second base;

[0050] 5. Crossbeam; 6. Bed; 7. First motion component; 8. Second motion component; 9. Third motion component; 10. Ultrasonic generator; 11. Laser displacement sensor; 12. Control system; 13. Base plate; 14. Processing tool. DETAILED DESCRIPTION

[0051] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0052] In the description of the present invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0053] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0054] To facilitate understanding of the embodiments of the present invention, the substrate 13 involved in the present invention is explained as follows: The substrate 13 involved in the present invention can include a PCB board, a packaging substrate (IC carrier board), and a glass substrate, which are not limited here. The embodiments provided by the present invention are explained as follows:

[0055] The first aspect provides a substrate processing device, see Figure 1 and Figure 2 The substrate processing equipment includes a vibrating worktable 2; the vibrating worktable 2 is fixed with a substrate 13 to be processed, and is used to drive the substrate 13 on the vibrating worktable 2 to vibrate in a first direction at a set amplitude and frequency during the processing process, so that a high-speed rotating processing tool 14 and the substrate 13 form periodic contact and separation to realize processing of the substrate 13.

[0056] In some embodiments, the processing tool 14 can be connected to the output end of the main shaft 1, and the vibration worktable 2 can be set below the main shaft 1, wherein the rotation speed of the main shaft 1 can be between 50,000 rpm and 300,000 rpm. Preferably, the rotation speed of the main shaft 1 can be 100,000 rpm, 150,000 rpm, 200,000 rpm or 250,000 rpm, which is not limited here. Therefore, when the main shaft 1 rotates at high speed, the processing tool 14 is driven to rotate at high speed. Specifically, when the substrate 13 is processed by the substrate processing equipment, based on the provision of the vibration worktable 2 on the substrate processing equipment, the vibration worktable 2 drives the substrate 13 thereon to vibrate at high frequency in the first direction at a set amplitude and frequency during the processing, thereby simplifying the complex structure of the traditional main shaft 1 vibration mode, reducing costs, and solving the problem that the existing substrate processing equipment adopts the spindle vibration mode with a complex structure and high cost.

[0057] In actual application scenarios, the preset amplitude range of the vibration worktable 2 can be 1µm~20µm, and the preset frequency range can be 100Hz~80kHz. As an example, in the process of controlling the spindle 1 to drive the processing tool 14 to process the substrate 13, the vibration worktable 2 can be simultaneously controlled to vibrate in the first direction with the set amplitude and frequency, so that while the processing tool 14 rotates and feeds, due to the vibration of the vibration worktable 2, a periodic contact and separation is formed between the substrate 13 on the vibration worktable 2 and the high-speed rotating processing tool 14. Compared with the continuous contact between the traditional processing tool 14 and the substrate 13, the processing accuracy and efficiency are greatly improved.

[0058] For example, during vibration drilling, when the drill bit encounters an offset during the drilling process, the vibration will cause the drill bit to temporarily exit and reposition, thereby automatically eliminating the offset and ensuring that the drill bit can accurately re-drill into the target position, thereby improving the positioning accuracy of the drill hole, making vibration drilling show higher precision and efficiency in substrate processing compared to ordinary drilling. In particular, it shows great advantages when processing difficult-to-process materials such as high aspect ratio substrates, multi-layer stacked substrates, and high-density interconnected substrates. Therefore, by using a vibration workbench 2 to drive the substrate 13 thereon to vibrate at high frequency in the first direction during the processing, the effect of improving the processing accuracy can also be achieved, simplifying the complex structure of the traditional spindle 1 vibration method and reducing costs.

[0059] Furthermore, the excellent chip-breaking properties generated by vibration facilitate smoother chip removal during machining, reducing scraping of the hole surface by the chips. Furthermore, the reciprocating ironing action of the machining tool 14 on the inner hole surface during vibration machining further reduces the surface roughness of the substrate 13 and the surface quality of the hole wall, thereby improving the machining quality of the substrate 13. Furthermore, the intermittent action between the machining tool 14 and the substrate 13 significantly reduces friction, thus maintaining a stable and normal wear state for the machining tool 14. This results in low cutting temperatures, stable drill performance, and slow wear, thus extending the life of the machining tool 14.

[0060] It should be understood that the periodic contact and separation described above, manifested as the number of times the tool 14 and substrate 13 come into contact and separate during machining, is determined by the vibration frequency of the vibrating table 2. For example, one contact and separation cycle is completed every 50µs (1s / 20,000 times). The amplitude determines the amount of pressure applied by the tool 14 to the substrate 13 during each contact; the greater the amplitude, the greater the contact force.

[0061] Further, if Figure 2 As shown, the vibration workbench 2 includes an ultrasonic vibration workbench, which includes a processing workbench 21 and an ultrasonic vibration device 22; the ultrasonic vibration device 22 is used to drive the substrate 13 on the processing workbench 21 to vibrate in a first direction at a set amplitude and frequency during the processing process, so that periodic contact and separation are formed between the high-speed rotating processing tool 14 and the substrate 13, so as to realize processing of the substrate 13.

[0062] As an example, the ultrasonic vibration device 22 applies vibration to the processing table 21 at a set amplitude and frequency during the processing, thereby driving the substrate 13 to perform a small periodic displacement in the first direction. The amplitude and frequency can be adjusted according to the specific requirements of the processing to adapt to different types of processing tasks. For example, during drilling or milling, the amplitude range can be set between 1µm and 20µm, and the frequency range can be set between 20kHz and 60kHz, and the specific range does not constitute a limitation. By vibrating at a specific amplitude and frequency, the cutting ability of the processing tool 14 can be effectively improved, and the processing accuracy of the substrate 13 can be optimized.

[0063] In one embodiment, if Figure 3As shown, the frequency range of the ultrasonic vibration device 22 can be above 20kHz. Further, the frequency range of the ultrasonic vibration device 22 can be configured within the range of 20kHz to 60kHz. Preferably, it can be configured to 20kHz, 30kHz or 40kHz, etc. The ultrasonic vibration device 22 includes an ultrasonic transducer 221, a horn 222 and a resonator 223; one end of the ultrasonic transducer 221 is connected to one end of the horn 222; the other end of the horn 222 is connected to one end of the resonator 223; and the other end of the resonator 223 is connected to the processing workbench 21.

[0064] As an example, one end of the ultrasonic transducer 221 can be connected to one end of the horn 222 via threads or other means. The other end of the horn 222 can also be connected to one end of the resonator 223 via a similar connection method. The other end of the resonator 223 can be connected to the processing table 21 via threads or welding to ensure that it does not move during the processing. During operation, the ultrasonic transducer 221 is used to convert the high-frequency electrical signal sent by the ultrasonic generator 10 into ultrasonic vibrations. These vibrations are amplified by the horn 222 and transmitted to the resonator 223, so that the resonator 223 drives the processing table 21 to vibrate, further acting on the substrate 13, thereby improving processing efficiency, reducing drilling force, and improving the roughness of the processed surface.

[0065] It should be noted that the amplitude transformer 222 in this embodiment can be a single-stage amplitude transformer or a multi-stage amplitude transformer, for example, an amplitude transformer composed of a first-stage amplitude transformer and a second-stage amplitude transformer connected in series. The specific selection can be based on processing requirements and is not limited here.

[0066] Further, if Figure 3As shown, the ultrasonic transducer 221 includes a stud 2211, a front cover 2212, an insulating sleeve 2213, an electrode sheet 2214, a ceramic sheet 2215, a rear cover 2216, and a first screw 2217. As an example, the front cover 2212 and the rear cover 2216 can be detachably connected together via threads or a snap-fit device to form a receiving chamber. The first screw 2217 is disposed in the receiving chamber. One end of the stud 2211 is fixed to the front cover 2212, and the other end of the stud 2211 passes through the front cover 2212 and is connected to one end of the horn 222 via threads or a plug-in device. The ceramic sheet 2215 and the electrode sheet 2214 are sequentially sleeved on the first screw 2217 and positioned within the receiving chamber. To prevent direct contact between the first screw 2217 and the ceramic plate 2215 and electrode plate 2214, an insulating sleeve 2213 is positioned between the first screw 2217, the ceramic plate 2215, and the electrode plate 2214. This reduces electrical interference and short circuits between the first screw 2217 and these components, thereby maintaining the stability and efficiency of the ultrasonic transducer 221. During operation, the high-frequency electrical signal transmitted by the ultrasonic generator 10 applies an AC voltage to the ceramic plate 2215 via the electrode plate 2214. The electric field causes the ceramic plate 2215 to experience a piezoelectric effect, mechanically deforming its internal crystal structure and generating high-frequency mechanical vibrations. These vibrations are transmitted to the horn 222 via the other end of the stud 2211. The amplitude transformer 222 further amplifies these high-frequency vibrations and transmits them to the resonator 223, thereby driving the processing table 21 and the substrate 13 fixed thereon to vibrate at the micron level, so that the processing tool 14 forms periodic contact and separation with the substrate 13 during the rotation and feeding process, thereby optimizing the cutting effect and improving the processing accuracy and efficiency.

[0067] As an example, the ultrasonic vibration device 22 is evenly arranged above and / or below the processing workbench 21, or the processing workbench 21 can be implemented with a honeycomb aluminum structure, and the ultrasonic vibration device 22 can be evenly arranged inside the processing workbench 21, etc., which is not specifically limited here. The purpose is to enable the substrate 13 on the processing workbench 21 to vibrate in the first direction, so that the processing tool 14 and the substrate 13 form periodic contact and separation. The technical solution, or the corresponding vibration fixture can enable the substrate 13 to vibrate in the first direction, so that the processing tool 14 and the substrate 13 form periodic contact and separation. Both are within the scope of protection requested by this application.

[0068] Preferably, taking the ultrasonic vibration device 22 evenly arranged under the processing workbench 21 as an example, four identical ultrasonic vibration devices 22 can be used and symmetrically arranged under the processing workbench 21, for example, at the four corners of the processing workbench 21, so as to achieve uniform vibration distribution of the processing workbench 21 and ensure that the substrate 13 can obtain uniform ultrasonic vibration during the processing process.

[0069] It should be noted that the above is merely an example and does not constitute a limitation of the present application. If the power of a single ultrasonic vibration device 22 is sufficient, only one ultrasonic vibration device 22 can be arranged directly below the processing table 21. It should be understood that in this case, a guide column structure is required to enhance stability and prevent displacement or uneven vibration of the processing table 21 caused by vibration.

[0070] Furthermore, the substrate processing equipment also includes an ultrasonic generator 10 for converting electrical energy into a high-frequency electrical signal matching the ultrasonic transducer 221 ; one end of the ultrasonic generator 10 is connected to the ultrasonic transducer 221 , and the other end is connected to the control system 12 .

[0071] In some embodiments, the ultrasonic generator 10 is responsible for converting input electrical energy into high-frequency electrical signals, which are then transmitted to the ultrasonic transducer 221 via a cable or other conductor. The ultrasonic generator 10 includes a signal generating module and a power amplifying module. The signal generating module is used to generate electrical signals having a desired frequency, while the power amplifying module is used to amplify these electrical signals to drive the ultrasonic transducer 221. The ultrasonic transducer 221 converts the high-frequency electrical signals into mechanical vibrations, which further drive the processing table 21 to vibrate.

[0072] In one embodiment, the ultrasonic vibration device 22 includes an air-static pressure ultrasonic vibration device 23. As an example, one end of the air-static pressure ultrasonic vibration device 23 can be connected to the processing table 21 via a third screw 240, and the other end can be connected to the movable platform 3 via a flange. During operation, the air-static pressure ultrasonic vibration device 23 drives the processing table 21 to perform micron-level ultrasonic vibration along the first direction, so that the processing tool 14 and the substrate 13 are periodically in contact and separation, effectively reducing the drilling force and temperature, and improving the processing accuracy and processing quality. Among them, the input air pressure range of the air-static pressure ultrasonic vibration device 23 can be configured to be 0.2MPa~0.8MPa. Preferably, the input air pressure range can be configured to be 0.4MPa~0.6MPa, and the specific range is not limited.

[0073] Further, if Figure 4As shown, the air static pressure ultrasonic vibration device 23 includes a bearing mounting cover 231, a bearing mounting base 232, a first air static pressure bearing 233, a second air static pressure bearing 234, a third air static pressure bearing 235, a vibration rod 236 and an air floating vibration plate 237 arranged on the vibration rod 236; the bearing mounting cover 231 and the bearing mounting base 232 are detachably connected, the first air static pressure bearing 233 is installed in the bearing mounting cover 231, and the second air static pressure bearing 234 and the third air static pressure bearing 235 are installed in the bearing mounting cover. In the mounting base 232, the vibration rod 236 is arranged in the accommodating chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, and is located at the axial center position of the first air static pressure bearing 233, the second air static pressure bearing 234 and the third air static pressure bearing 235. The air-floating vibration plate 237 is located between the first air static pressure bearing 233 and the second air static pressure bearing 234, and is used to drive the vibration rod 236 to vibrate in the first direction, so that the vibration rod 236 drives the substrate 13 on the processing workbench 21 to vibrate in the first direction.

[0074] In some embodiments, the bearing mounting cover 231 can be secured to the bearing mounting base 232 via a removable connection, for example, using bolts, snaps, or other suitable mechanical connection methods. A first aerostatic bearing 233 is secured within the bearing mounting cover 231, ensuring stable axial support for the vibration rod 236. A second aerostatic bearing 234 and a third aerostatic bearing 235 are mounted on the bearing mounting base 232, further enhancing the vertical positioning accuracy and smooth movement of the vibration rod 236. The vibration rod 236 is disposed within the housing chamber formed by the bearing mounting cover 231 and the bearing mounting base 232, positioned at the axis of the three aerostatic bearings and capable of free movement along a first direction. The air-floating vibration plate 237 is located between the first air static pressure bearing 233 and the second air static pressure bearing 234. When high-pressure air enters the air static pressure ultrasonic vibration device 23 through the air path structure 239, an extremely thin air film is formed between the vibration rod 236 and the three air static pressure bearings. This air film has sufficient rigidity and bearing capacity to keep the vibration rod 236 in a suspended state.

[0075] During operation, the difference in the number of pores between the first and second hydrostatic air bearings 233, 234 creates a differential pressure on either side of the air-floating vibration plate 237, driving the air-floating vibration plate 237 axially toward the lower pressure area. As the sliding distance increases, the change in air film thickness causes the high and low pressure areas to swap, causing the air-floating vibration plate 237 to slide in opposite directions, creating a reciprocating axial motion that drives the vibration rod 236 to achieve high-frequency micro-vibration in the first direction. This vibration is transmitted to the substrate 13 on the machining table 21 via the vibration rod 236, causing the substrate 13 to periodically contact and separate with the machining tool 14 during machining, effectively reducing drilling forces and cutting temperatures and improving machining accuracy.

[0076] Furthermore, the air static pressure ultrasonic vibration device 23 also includes a muffler 238; the bearing mounting base 232 is provided with an outlet communicating with the accommodating chamber, and the muffler 238 is arranged at the outlet.

[0077] In some embodiments, a muffler 238 can be secured to the bearing mounting base 232 at the outlet communicating with the accommodating chamber via bolts, clamps, or flanges. This muffler is used to reduce noise generated by the aerostatic pressure ultrasonic vibration device 23 during operation, thereby improving the comfort of the working environment and the quiet operation of the substrate processing equipment. The muffler 238 can be of various types, including but not limited to porous mufflers, diffuser mufflers, and reflective mufflers.

[0078] In one embodiment, the substrate processing equipment further includes a spindle 1 , a bed 6 , a gantry system and a moving platform 3 .

[0079] In some embodiments, the spindle 1 includes a mechanical spindle or an electric spindle. As an example, the mechanical spindle may include a spindle body and a drive gear, one end of the drive gear being connected to one end of the spindle body, and the other end being connected to an external motor or transmission device to drive the rotation of the spindle body. The electric spindle may include an electric motor and a spindle body, one end of the electric motor being connected to one end of the spindle body so that the electric motor directly drives the rotation of the spindle body. It should be noted that the spindle 1 may also be an air static pressure ultrasonic electric spindle or a liquid static pressure ultrasonic electric spindle, which is not limited in the specific embodiment of the present invention.

[0080] Furthermore, a machining tool 14 is provided at the output end of the spindle 1. As an example, the spindle 1 can be connected to the machining tool 14 via a dedicated connector, such as a tool holder, chuck, or flange. This connector drives the machining tool 14 to rotate at high speed when the spindle 1 rotates, performing drilling or other machining tasks. This ensures that the high-speed rotation of the spindle 1 is accurately and error-freely transmitted to the machining tool 14, allowing it to process the substrate 13 at a stable rotation speed and cutting force. The machining tool 14 can be replaced with different tools, such as tools for drilling, boring, milling, or cutting, according to different substrate processing requirements.

[0081] Furthermore, the gantry system includes a beam base 4 and a beam 5 arranged on the beam base 4. Specifically, the beam base 4 includes a first base 41 and a second base 42 arranged at intervals. Among them, one end of the first base 41 and the second base 42 are respectively connected to the beam 5 by fasteners or other means, thereby forming a gantry system. Through this connection method, the gantry system can be quickly disassembled and reassembled when it needs to be moved or adjusted, thereby improving the operating efficiency and flexibility of the substrate processing equipment. Among them, the beam 5 can also be made of a material with strong rigidity, such as marble, steel or aluminum alloy, to ensure that it can withstand the weight of the spindle 1 and the load caused by the movement during the processing to avoid deformation.

[0082] Furthermore, a passage is formed between the gantry system and the bed 6. As an example, one end of the first base 41 and the second base 42 can be connected to the crossbeam 5 respectively, and the other end can be connected to the bed 6 respectively, thereby forming a movement passage for the vibrating worktable 2 between the first base 41 and the second base 42.

[0083] Furthermore, the gantry system and / or the mobile platform 3 are movably disposed on the bed 6 along the third direction. That is, the gantry system is movably disposed on the bed 6 along the third direction, or the mobile platform 3 is movably disposed on the bed 6 along the third direction, or the gantry system and the mobile platform 3 are movably disposed on the bed 6 along the third direction. Then, when the gantry system and / or the mobile platform 3 move, the mobile platform 3 can drive the vibrating worktable 2 to move in or out of the passage. If the gantry system moves, the mobile platform 3 can drive the vibrating worktable 2 to pass through or through the passage to achieve movement in or out of the passage.

[0084] In some embodiments, the bed 6 serves as a supporting base, on which a gantry system and / or a mobile platform 3 are movably provided along a third direction. As an example, a third motion component 9 for moving along the third direction can be provided between the bed 6 and the mobile platform 3, and one end of the third motion component 9 is connected to the bed 6 by a threaded connection, a pin connection, a key connection or a quick locking device, and the other end is also connected to the mobile platform 3 by a threaded connection, a pin connection, a key connection or a quick locking device, so as to drive the mobile platform 3 to move along the third direction through the third motion component 9, so that the mobile platform 3 drives the vibration worktable 2 to move in or out along the channel, thereby driving the substrate 13 to move in or out of the channel, thereby improving the degree of automation and efficiency of the substrate processing equipment. The gantry system can also be fixed to the bed 6 in the above manner to form a channel for driving the vibration worktable 2 to move relative to each other. Specifically, the present invention does not limit this.

[0085] In some embodiments, the third motion assembly 9 may include a third linear motor, a third rolling guide, and a third slider. The third linear motor and the third rolling guide are mounted on the bed 6, and the third slider is disposed on the third rolling guide and is connected to the mobile platform 3 and the third linear motor. During operation, the third linear motor is controlled to drive the third slider to move along the third rolling guide in the third direction, thereby driving the mobile platform 3 to move in the third direction, thereby driving the vibration table 2 to move in or out of the channel formed between the gantry system and the bed 6.

[0086] Further, if Figure 5 and Figure 6 As shown, the ultrasonic vibration device 22 is installed between the processing workbench 21 and the mobile platform 3. As an example, one end of the ultrasonic vibration device 22 can be tightly connected to the processing workbench 21 by means of a thread or a slot, etc., to ensure that the vibration energy is effectively transmitted to the substrate 13. The other end of the ultrasonic vibration device 22 is installed inside the mobile platform 3 by a second screw 224 to facilitate adjusting the distance between the processing workbench 21 and the mobile platform 3. For example, the flange mounting hole on the mobile platform 3 can be designed as a countersunk hole so that the flange of the ultrasonic transducer 221 can be installed inside the mobile platform 3 by the second screw 224. This design not only helps to ensure the stable installation of the ultrasonic vibration device 22, but also can flexibly adjust the position of the processing workbench 21 according to different processing requirements and workpiece sizes, thereby optimizing the effect of ultrasonic vibration transmission and ensuring processing accuracy and efficiency. At the same time, the design of the countersunk hole also makes the routing of the ultrasonic vibration device 22 more convenient, which is conducive to heat dissipation and subsequent maintenance work.

[0087] Furthermore, the main spindle 1 is movably provided on the gantry system along the second direction, and the main spindle 1 can move along the first direction.

[0088] As an example, a first motion component 7 for moving in a first direction and a second motion component 8 for moving in a second direction can be set between the main shaft 1 and the beam 5, so that the main shaft 1 is driven to move in the first direction by the first motion component 7; the first motion component 7 is driven to move in the second direction by the second motion component 8, so that the first motion component 7 drives the main shaft 1 to move in the second direction, thereby realizing movement in the second direction on the beam 5.

[0089] Specifically, one end of the spindle 1 can be detachably connected to one end of the first motion assembly 7; the other end of the first motion assembly 7 can be detachably connected to one end of the second motion assembly 8; and the other end of the second motion assembly 8 can be detachably connected to the crossbeam 5. The first motion assembly 7 and the second motion assembly 8 can employ high-precision ball screws or linear guides to ensure smooth and precise movement when the spindle 1 is driven in the first direction, without limitation.

[0090] In some embodiments, the first motion component 7 may include a first linear motor, a first rolling guide, a first slider and a base plate. The first linear motor and the first rolling guide are fixed to the front of the base plate, the first slider is arranged on the first rolling guide and is connected to the first linear motor, and the spindle 1 can be fixed on the first slider, or connected to the first slider through a spindle fixing assembly. During operation, by controlling the first linear motor, the first linear motor drives the first slider to move in the first direction along the first rolling guide, thereby driving the spindle 1 to move in the first direction. Preferably, the first rolling guide is made of high-precision and low-friction materials, such as marble, steel or aluminum alloy, to ensure the stability and accuracy of the first slider when moving on the first rolling guide, and effectively reduce vibration or friction that affects processing accuracy.

[0091] The second motion component 8 may include a second linear motor, a second rolling guide, and a second slider. As an example, the second linear motor and the second rolling guide may be arranged on the crossbeam 5, and the second slider may be arranged on the second rolling guide, and respectively connected to the back of the base plate and the second linear motor. During operation, by controlling the second linear motor, the second linear motor drives the second slider to move along the second rolling guide in the second direction, thereby realizing the second motion component 8 driving the first motion component 7, and then driving the spindle 1 to move in the second direction. Through the above arrangement, the spindle 1 can move not only in the first direction, but also in the second direction, thereby realizing all-round, high-precision processing of the substrate 13.

[0092] In summary, the first motion assembly 7 and the second motion assembly 8 respectively drive the spindle 1 to perform precision machining in the first and second directions. After machining is completed, the third motion assembly 9 drives the mobile platform 3 to move out in the third direction, so that the mobile platform 3 drives the machining worktable 21 out of the machining area, thereby driving the substrate 13 out of the machining area, allowing the operator to conveniently unload and reload the substrate 13. This entire process improves the working efficiency and operational convenience of the substrate machining equipment.

[0093] Among them, the first direction, the second direction and the third direction are perpendicular to each other. Specifically, this perpendicular relationship ensures that the first motion component 7, the second motion component 8 and the third motion component 9 do not interfere with each other when working independently in their respective directions, thereby achieving precise and stable motion control. For example, when the first motion component 7 drives the spindle 1 to move in the first direction, the second motion component 8 can simultaneously adjust the processing position in the second direction, while the third motion component 9 can flexibly adjust the movement of the workbench in the third direction. Through this design, the substrate processing equipment can be accurately positioned and operated in three-dimensional space, thereby achieving complex processing tasks.

[0094] In one embodiment, if Figure 1 As shown, the substrate processing equipment also includes a laser displacement sensor 11 for detecting the actual amplitude and actual frequency of the processing worktable 21; the laser displacement sensor 11 is disposed below the processing worktable 21 and is connected to the control system 12. As an example, the laser displacement sensor 11 can be mounted on the movable platform 3 below the processing worktable 21 by screws or other means. The laser displacement sensor 11 further measures the actual displacement of the surface of the processing worktable 21 by emitting a laser beam and receiving the reflected light signal, thereby determining the actual amplitude and actual frequency of the processing worktable 21, realizing real-time detection of the vibration state of the processing worktable 21 during the processing process, ensuring optimal coordination between the spindle 1 and the vibration worktable 2, and thus achieving high-precision, low-wear processing.

[0095] Furthermore, the laser displacement sensor 11 comprises a laser transmitter and a laser receiver. Specifically, the laser transmitter emits a laser beam onto the surface of the machining table 21, where it reflects upon contact. The laser receiver receives this reflected light signal and, based on the intensity and frequency of the reflected light, calculates the vibration of the machining table 21, ensuring that the amplitude and frequency during machining meet preset machining requirements.

[0096] In one embodiment, the processing types of the substrate 13 include drilling, riveting, milling or cutting.

[0097] As an example, drilling is a processing method for forming holes on the substrate 13 .

[0098] In some embodiments, when the spindle 1 is used to drill a hole in the substrate 13, the vibrating table 2 causes the substrate 13 to vibrate at a high frequency in a first direction (e.g., perpendicular to the surface of the substrate 13) at a set amplitude and frequency. This vibration creates a periodic contact and separation between the drill bit connected to the spindle 1 and the substrate 13, effectively reducing cutting forces and heat, and facilitating the timely removal of chips.

[0099] During the drilling process, the vibrating table 2 drives the substrate 13 to vibrate at high frequencies. This not only ensures the accuracy of the drilling—namely, the position, diameter, and depth of the hole—but also reduces cutting stress and thermal effects, protecting the integrity of the substrate 13 and surrounding circuit structures. Furthermore, it helps remove burrs and residues generated during the drilling process, improving the quality of the drilled hole.

[0100] Gong is a processing method for removing excess material from the substrate 13 to form a specific shape or structure.

[0101] In some embodiments, when the substrate 13 is vibrated by the spindle 1, the vibrating worktable 2 drives the substrate 13 to vibrate at high frequency in the first direction at a set amplitude and frequency. This vibration enables the special tool connected to the spindle 1 to cut off excess material on the substrate 13, which not only greatly reduces the cutting resistance and thermal impact, ensures the accuracy and integrity of the processing area, but also promotes the smooth discharge of chips, effectively preventing tool blockage and wear.

[0102] Milling is a processing method for surface treatment and fine processing of the substrate 13.

[0103] In some embodiments, when the substrate 13 is milled by the spindle 1, the vibrating worktable 2 drives the substrate 13 to vibrate at high frequency in the first direction at a set amplitude and frequency. This vibration makes the milling cutter connected to the spindle 1 more precise and delicate during the cutting process, which not only reduces the damage to the substrate 13 caused by cutting heat and mechanical stress, but also ensures the smoothness and accuracy of the processed edge.

[0104] Cutting is a processing method for forming the substrate 13 into a desired shape and structure.

[0105] In some embodiments, when the substrate 13 is cut by the spindle 1, the vibrating worktable 2 drives the substrate 13 to vibrate at high frequency in the first direction at a set amplitude and frequency. This vibration causes the cutting tool connected to the spindle 1 to have a high-frequency impact with the substrate 13, thereby achieving precise and efficient cutting, which not only reduces damage to the base material of the substrate 13, ensures the smoothness and flatness of the processed edge, but also greatly improves the processing accuracy and production efficiency.

[0106] Furthermore, substrate 13 includes a high aspect ratio substrate, a multi-layer laminated substrate, or a high-density interconnect substrate. Specifically, a high aspect ratio substrate refers to a relatively thick substrate, for example, a substrate with a thickness of 1.0 mm to 10.0 mm. A multi-layer laminated substrate refers to a circuit board composed of multiple laminated substrate layers, each layer having independent circuit patterns and connection structures. For example, a substrate with 4 to 20 layers and a thickness of 1.5 mm to 10.0 mm. A high-density interconnect (HDI) substrate refers to a printed circuit board with a high wiring density.

[0107] On the other hand, a substrate processing method is provided, which is applicable to the substrate processing device of the first embodiment. The substrate processing device includes a vibration worktable 2 and a control system 12. The substrate processing method includes:

[0108] S10, obtaining processing parameters of the substrate 13;

[0109] In this embodiment, the processing parameters of the substrate 13 include substrate parameters and processing type parameters. Specifically, the substrate parameters include substrate type and substrate inherent parameters; wherein the substrate type includes a high aspect ratio substrate, a multi-layer stacked substrate or a high density interconnect (HDI) substrate, and the substrate inherent parameters include high aspect ratio substrate parameters, multi-layer stacked substrate parameters or high density interconnect substrate parameters.

[0110] As an example, high aspect ratio substrate parameters include:

[0111] Thickness: for example, 1.0mm to 10.0mm;

[0112] Aperture: for example, 0.2mm to 1.0mm;

[0113] Aspect ratio: for example, 5:1 to 10:1 or higher;

[0114] Material type: For example, FR-4 material.

[0115] Multi-layer substrate parameters include:

[0116] Number of layers: for example, 4 to 20 layers or more;

[0117] Total thickness: for example, 1.5mm to 10.0mm;

[0118] Material type: For example, FR-4 material.

[0119] High-density interconnect substrate parameters include:

[0120] Thickness: for example, 0.5mm to 3.0mm;

[0121] Aperture: for example, 0.1mm to 0.3mm;

[0122] Line width and spacing: for example, 50µm to 150µm.

[0123] Material type: For example, low dielectric constant material.

[0124] The processing type parameters include drilling parameters, drilling parameters, milling parameters or cutting parameters.

[0125] Specifically, drilling parameters include: drilling depth, spindle speed and feed speed.

[0126] The gong parameters include: cutting width, gong knife diameter, cutting speed, gong knife speed and feed speed.

[0127] Milling parameters include: milling depth, milling cutter diameter, spindle speed and feed speed.

[0128] Cutting parameters include: cutting depth, cutting speed and cutting accuracy.

[0129] S20, determining target vibration parameters corresponding to the processed substrate 13 according to the processing parameters;

[0130] In this embodiment, the target vibration parameters may include amplitude and frequency, wherein the amplitude range may be 1µm to 20µm, and the frequency range may be 2kHz to 40kHz. Preferably, the amplitude may be configured to be 5µm, 10µm, 15µm or 18µm, and the frequency may be configured to be 5kHz, 10kHz, 20kHz, 30kHz or 35kHz, and the specific details are not limited. The amplitude and frequency applicable to the substrate 13 are determined according to the processing parameters of the substrate 13 in order to optimize the processing effect and ensure the processing quality. Specifically, the corresponding amplitude and frequency can be pre-set according to the processing parameters of the substrate 13, and the corresponding amplitude and frequency can be automatically queried by inputting the processing parameters of the substrate 13. It can also be determined in other ways, which are not limited here.

[0131] As an example, a database of processing parameters for substrate 13 can be pre-established. This database includes the aforementioned processing parameters for substrate 13, the corresponding amplitudes and frequencies, and the processing results. Subsequently, a parameter prediction model is pre-trained based on a large amount of experimental data and theoretical analysis. This parameter prediction model is used to predict the amplitudes and frequencies corresponding to the processing parameters for substrate 13.

[0132] Specifically, once the user enters the processing parameters for substrate 13, control system 12 immediately initiates an automatic query and matching mechanism to quickly filter out similar or similar cases from the historical database based on the input processing parameters for substrate 13. Next, a parameter prediction model intelligently analyzes the amplitude and frequency settings in these cases, taking into account multiple factors such as processing accuracy, processing quality, and tool wear, ultimately recommending the optimal amplitude and frequency.

[0133] For example, a user needs to process a batch of FR-4 substrates 13 with a thickness of 1.6 mm, a pore diameter of 0.3 mm, and a material type of FR-4. After entering these parameters, the control system 12 uses a pre-trained parameter prediction model to determine the corresponding amplitude and frequency. For example, the amplitude is set to 2.5 µm and the frequency is set to 30 kHz. It should be noted that the above is only an example, and the specific determination process is not limited here.

[0134] As another example, a relationship table between the processing parameters of the substrate 13, the amplitude, and the frequency can be pre-established. After the user inputs the processing parameters of the substrate 13, the control system 12 determines the amplitude and frequency corresponding to the substrate 13 by querying the pre-established relationship table. For example, a 1.0 mm thick high aspect ratio substrate corresponds to a frequency of 30 kHz and an amplitude of 1.5 µm. A 2.0 mm thick high aspect ratio substrate corresponds to a frequency of 28 kHz and an amplitude of 2 µm. It should be noted that the above is only an example. Specifically, the processing parameters of the substrate 13, the corresponding amplitude and frequency, can be pre-set according to actual conditions and are not limited here.

[0135] S30 , according to the target vibration parameters, controlling the vibration table 2 to vibrate along the first direction, so as to drive the substrate 13 on the vibration table 2 to vibrate in the first direction, so that the machining tool 14 and the substrate 13 form periodic contact and separation, so as to realize machining of the substrate 13 .

[0136] In this embodiment, based on the target vibration parameters determined in step S20, the vibrating table 2 is controlled to vibrate stably along the first direction at the micrometer level. As the vibrating table 2 vibrates, the substrate 13 affixed thereto also vibrates, causing the machining tool 14 to periodically contact and separate from the substrate 13 during machining. This effectively reduces the continuous friction between the machining tool 14 and the substrate 13, thereby reducing cutting forces and temperatures, and achieving efficient and precise machining of the substrate 13.

[0137] For example, take a 5.4mm high aspect ratio substrate and drilling a 0.2mm through hole as an example:

[0138] Assume that spindle 1 is set at 100,000 rpm, the drill speed is 20µm / rev, the amplitude is 10µm, and the frequency is 20kHz. Under these settings, the drill feed rate is 33.33mm / s. This can be calculated as follows: multiply the drill speed (20µm / rev) by the spindle 1 revolutions per second (1666.67 rpm), and convert the units. Spindle 1 speed is 100,000 rpm, or 100,000 revolutions per minute. Converting to revolutions per second, 100,000 ÷ 60 = 1666.67 rpm.

[0139] During operation, the amplitude is 10µm and the frequency is 20kHz, meaning that the vibrating table 2 vibrates 20,000 times per second. Under these settings, each vibration of the drill bit occurs with an amplitude of 10µm, resulting in an actual drilling feed displacement of 1.67µm (calculated as 33.33mm / 20,000 times). Thus, during the drilling process, the vibrating table 2 undergoes 20,000 ultrasonic vibrations. The displacement generated on the substrate 13 by each vibration is far greater than the actual drilling displacement, enabling the drill bit to effectively cut the substrate 13 at the micron level. Under ultrasonic vibration conditions, the drill bit does not continuously and uninterruptedly drill 33.33mm. Instead, while drilling, the vibrating table 2 undergoes high-frequency, minute (1.67µm) vibrations. This micron-level cutting significantly improves cutting efficiency and quality, effectively reducing cutting forces and temperatures, minimizing drill wear, and improving machining accuracy and surface quality. It should be noted that the above is only an example and does not constitute a limitation of the present invention.

[0140] In one embodiment, after step S10, that is, after obtaining the processing parameters of the substrate 13, the following steps are included:

[0141] S40 , controlling the spindle 1 to move to a preset position above the vibration worktable 2 , and controlling the spindle 1 to rotate at a high speed according to a preset speed, so as to drive the machining tool 14 provided on the spindle 1 to rotate at a high speed.

[0142] In this embodiment, after obtaining the processing parameters of the substrate 13, the spindle 1 is further controlled to move to a preset position above the vibrating workbench 2. The purpose of this process is to ensure the accurate positioning of the spindle so that the processing tool 14 can be aligned with the substrate 13 at an appropriate distance and angle, thereby performing effective processing. Next, the spindle 1 is controlled to rotate at a high speed according to a preset speed to ensure that the processing tool 14 can effectively cut or drill. The setting of its speed depends on the obtained processing parameters. For example, different types of substrates 13 require different speeds. The drive system of the spindle 1 is adjusted according to the set speed to achieve a stable rotation speed. For example, when processing a substrate 13 with a high aspect ratio, the speed of the spindle 1 can be set to 50,000 revolutions per minute to reduce the wear of the processing tool 14 and ensure the stability of the processing.

[0143] In one embodiment, after step S40, that is, after controlling the vibration table 2 to vibrate according to the target vibration parameters, the following steps are included:

[0144] S50, obtaining actual vibration parameters of the vibration workbench 2;

[0145] S60, comparing the actual vibration parameter with the target vibration parameter to obtain a comparison result;

[0146] S70, if the comparison result is a match, then start processing the substrate 13;

[0147] S80 , if the comparison result is mismatch, adjust the control parameters until the actual vibration parameters of the vibration workbench 2 match the target vibration parameters.

[0148] In this embodiment, after controlling the vibration table 2 to vibrate, the control system 12 receives the actual vibration parameters of the vibration table 2, namely, the actual amplitude and frequency, as monitored in real time by the laser displacement sensor 11 or other vibration detection device. This provides basic data for subsequent comparison and adjustment. The laser displacement sensor 11 can be positioned below the machining table 21 to obtain the actual vibration parameters by measuring the actual displacement of the machining table 21.

[0149] Next, the actual vibration parameters are compared with the target vibration parameters to generate a comparison result. If the actual vibration parameters match the target vibration parameters, it means that the vibration table 2 is vibrating under the expected conditions. If they do not match, further adjustment of the control parameters is required to meet the expected processing conditions and achieve high-quality processing results.

[0150] For example, assuming that the target vibration parameter frequency is 30kHz and the amplitude is 10µm, while the actual measured frequency is 29.8kHz and the amplitude is 9.8µm, the control system 12 will automatically adjust the control parameters of the vibration worktable 2 based on this comparison result, for example, increasing the input power of the ultrasonic transducer 221 by 5 watts and increasing the output frequency by 0.2kHz. After each adjustment, the laser displacement sensor 11 will remeasure the actual vibration parameters and feed them back to the control system 12, and compare the remeasured actual vibration parameters with the target vibration parameters. If there is still a difference, the control system 12 will continue to adjust until the actual vibration parameters match the target vibration parameters, thereby ensuring the best processing effect. It should be understood that the above is only an example and does not constitute a limitation of the present invention.

[0151] In one embodiment, the vibration worktable 2 includes an ultrasonic vibration worktable, which includes a processing worktable 21 and an ultrasonic vibration device 22. The ultrasonic vibration device 22 includes an air static pressure ultrasonic vibration device 23. That is, in step S30, that is, according to the target vibration parameter, controlling the vibration worktable 2 to vibrate in the first direction to drive the substrate 13 on the vibration worktable 2 to vibrate in the first direction includes the following steps:

[0152] S31. Outputting a corresponding current signal according to the target vibration parameter;

[0153] S32 , converting the current signal into an air signal, and controlling the input air pressure of the air static pressure ultrasonic vibration device 23 according to the air signal, so that the air static pressure ultrasonic vibration device 23 drives the substrate 13 on the processing workbench 21 to vibrate in the first direction.

[0154] In this embodiment, after determining the amplitude and frequency, the control system 12 further generates corresponding current signals. These current signals directly correspond to the desired amplitude and frequency. For example, these signals can be implemented using an advanced digital signal processor (DSP) or microcontroller, which can accurately calculate the input amplitude and frequency values and output a matching current signal. The current signal is then converted into a gas signal using a dedicated signal conversion device, such as an electric-to-pneumatic converter (E / P converter) or a proportional solenoid valve, which are not limited here. The converted gas signal is used to control the input air pressure of the air static pressure ultrasonic vibration device 23, thereby achieving precise control of the amplitude and frequency of the air static pressure ultrasonic vibration device 23, so that the air static pressure ultrasonic vibration device 23 drives the machining tool 14 to vibrate in the first direction based on the input air pressure. The input air pressure range of the air static pressure ultrasonic vibration device 23 can be set to 0.2 MPa to 0.8 MPa, and preferably, the input air pressure range can be configured to be 0.4 MPa to 0.6 MPa, which is not limited here.

[0155] The second aspect provides a substrate processing system, which includes at least one substrate processing device according to the embodiment of the first aspect.

[0156] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A substrate processing device, characterized in that: It includes a vibration workbench, wherein the vibration workbench includes an ultrasonic vibration workbench, and the ultrasonic vibration workbench includes a processing workbench and an ultrasonic vibration device; The processing workbench is fixed with a substrate to be processed; The ultrasonic vibration device is used to drive the substrate on the processing workbench to vibrate in the first direction at a set amplitude and frequency during the processing process, so that the high-speed rotating processing tool and the substrate form periodic contact and separation to achieve processing of the substrate.

2. The substrate processing equipment according to claim 1, wherein The frequency range of the ultrasonic vibration device is 20kHz~60kHz; the ultrasonic vibration device includes an ultrasonic transducer, a horn and a resonator; One end of the ultrasonic transducer is connected to one end of the horn; The other end of the horn is connected to one end of the resonator; The other end of the resonator is connected to the processing workbench.

3. The substrate processing equipment according to claim 1, wherein It comprises at least one ultrasonic vibration device, and the ultrasonic vibration device is arranged on the processing workbench in a uniform arrangement.

4. The substrate processing equipment according to claim 2, wherein: The substrate processing equipment further includes an ultrasonic generator for converting electrical energy into a high-frequency electrical signal matching the ultrasonic transducer; The ultrasonic generator is connected to the ultrasonic transducer.

5. The substrate processing equipment according to claim 1, wherein The ultrasonic vibration device includes an air static pressure ultrasonic vibration device.

6. The substrate processing equipment according to claim 5, wherein: The aerostatic ultrasonic vibration device includes a bearing mounting cover, a bearing mounting base, a first aerostatic bearing, a second aerostatic bearing, a third aerostatic bearing, a vibration rod, and an air-floating vibration plate arranged on the vibration rod; The bearing mounting cover is detachably connected to the bearing mounting base; The first aerostatic bearing is mounted in the bearing mounting cover; The second aerostatic bearing and the third aerostatic bearing are mounted in the bearing mounting base; The vibration rod is arranged in a receiving chamber formed by the bearing mounting cover and the bearing mounting base, and is located at the axial center of the first, second and third aerostatic bearings; The air-floating vibration plate is located between the first air static pressure bearing and the second air static pressure bearing, and is used to drive the vibration rod to vibrate in the first direction, so that the vibration rod drives the substrate on the processing workbench to vibrate in the first direction.

7. The substrate processing equipment according to claim 6, wherein: The air static pressure ultrasonic vibration device also includes a muffler; The bearing mounting base is provided with an outlet communicated with the accommodating chamber, and the muffler is arranged at the outlet.

8. The substrate processing equipment according to any one of claims 1 to 7, characterized in that: The substrate processing equipment also includes a spindle, a bed, a gantry system and a mobile platform; A passage is formed between the gantry system and the bed; The gantry system and / or the movable platform are movably arranged on the bed along the third direction, and the movable platform can drive the vibration worktable to move into or out of the channel; The main shaft is movably arranged on the gantry system along the second direction, and the main shaft can move along the first direction; The first direction, the second direction and the third direction are perpendicular to each other.

9. The substrate processing equipment according to claim 8, wherein: The substrate processing equipment further includes a laser displacement sensor for detecting the actual amplitude and actual frequency of the processing workbench; The laser displacement sensor is arranged below the processing workbench.

10. The substrate processing equipment according to any one of claims 1 to 7, characterized in that: The processing type of the substrate includes drilling, grooving, milling or cutting, and / or the substrate includes a high aspect ratio substrate, a multi-layered substrate or a high density interconnect substrate.

11. A substrate processing system, characterized in that: The substrate includes a PCB board, a packaging substrate and a glass substrate; the substrate processing system includes at least one substrate processing device according to any one of claims 1 to 10.

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