Novel vein-imitating vapor chamber radiator

Abstract

The utility model discloses a novel vein-imitating vapor chamber radiator which comprises a vapor chamber, the vapor chamber comprises an evaporation end shell plate and a condensation end shell plate, a sealed heat exchange bin is formed between the evaporation end shell plate and the condensation end shell plate, and a condensation end liquid absorption core and an evaporation end liquid absorption core are arranged in the heat exchange bin. And at least one of the condensation end wick and the evaporation end wick is of a vein-imitating structure. The condensation end liquid absorption core or the evaporation end liquid absorption core is designed to be of a vein-imitating structure, the vein-imitating structure is used for simulating veins of plant leaves, a more complex and efficient heat conduction path can be provided, cooling liquid can take away heat more quickly, and the heat conduction efficiency is improved. And the vein structure design can ensure that the cooling liquid is more uniformly distributed in the whole vapor chamber, the problem of local heat accumulation possibly existing in a porous structure is avoided, meanwhile, the vein-imitated structure can provide excellent heat conduction performance, the overall mechanical strength of the vapor chamber can be enhanced, and deformation caused by thermal expansion is prevented.

Description

Technical field:

[0001] The utility model relates to the technical field of heat conduction, in particular to a novel leaf vein-imitation vapor chamber radiator. Background technology:

[0002] A vapor chamber is a device used for efficient heat conduction and dissipation, widely used in various electronic devices and thermal management systems. Its core structure is a microstructured heat exchange chamber, typically filled with coolant. When heat is transferred from the heat source to the evaporation zone of the cavity, the coolant vaporizes in the low vacuum environment, absorbing thermal energy and rapidly expanding, filling the entire cavity with the vapor-phase cooling medium. When the vapor-phase working medium comes into contact with the cooler area, it condenses, releasing heat. This process creates an efficient heat convection system within the cavity, quickly and evenly dissipating heat, thereby achieving efficient heat dissipation.

[0003] The shells of the heat spreaders currently on the market are usually made of metal materials, and the internal structure of the shells usually includes a capillary structure and a support structure. The capillary structure can enhance the flow of the coolant and the heat exchange efficiency, while the support structure ensures the stability of the shell in high temperature and high pressure environments. For example, the heat spreader with Chinese patent authorization announcement number CN 216205564U, in the technical solution disclosed in the patent, the capillary structure 5 adopts a sheet-like porous structure made of copper material, but because the porous structure mainly relies on the coolant in the pores for heat conduction, the distribution and connectivity of these pores are too uniform and uniform, resulting in poor heat conductivity and inability to achieve efficient heat conduction. Moreover, since the size and distribution of the pores are relatively uniform, the flow path of the coolant in the porous structure is relatively fixed, which will cause the coolant to fail to fully cover all areas that need heat dissipation, thereby reducing the heat dissipation efficiency.

[0004] In view of this, the inventors propose the following technical solutions. Utility model content:

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a novel leaf vein-imitation vapor chamber radiator.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions: the new leaf vein imitation heat spreader radiator includes: a heat spreader, the heat spreader includes an evaporation end shell plate and a condensation end shell plate, a sealed heat exchange chamber is formed between the evaporation end shell plate and the condensation end shell plate, a condensation end liquid absorption core and an evaporation end liquid absorption core are arranged in the heat exchange chamber, wherein at least one of the condensation end liquid absorption core and the evaporation end liquid absorption core is an imitation leaf vein structure.

[0007] Furthermore, in the above technical solution, the evaporation end shell plate is provided with a receiving tank for accommodating the condensation end liquid absorption core and the evaporation end liquid absorption core and filled with coolant, and the condensation end shell plate is covered on the receiving tank to seal and form a heat exchange chamber.

[0008] Furthermore, in the above technical solution, the evaporation end liquid absorption core includes a plate body and heat-conducting keels distributed on the plate body in the shape of leaf veins.

[0009] Furthermore, in the above technical solution, the heat spreader is arranged on the first heat dissipation fin group, the second heat dissipation fin group is arranged beside the first heat dissipation fin group, and a heat pipe is provided between the first heat dissipation fin group and the second heat dissipation fin group.

[0010] Furthermore, in the above technical solution, at least two reinforcement brackets are provided on the bottom surfaces of the first heat dissipation fin group and the second heat dissipation fin group, and the reinforcement brackets connect the first heat dissipation fin group and the second heat dissipation fin group in series by welding.

[0011] Furthermore, in the above technical solution, the top surfaces of the first heat dissipation fin group and the second heat dissipation fin group are further provided with first heat dissipation fins and second heat dissipation fins, and the first heat dissipation fins and the second heat dissipation fins are respectively located on both sides of the heat spreader.

[0012] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: in the present invention, by adopting the imitation leaf vein structure design for the condensation end liquid absorption core 13 or the evaporation end liquid absorption core 14, the imitation leaf vein structure is used to simulate the veins of plant leaves, which can provide a more complex and efficient heat conduction path, so that the coolant can take away heat more quickly, and the leaf vein structure design can ensure that the coolant is more evenly distributed in the entire heat spreader, avoiding the local heat accumulation problem that may exist in the porous structure. At the same time, the imitation leaf vein structure can not only provide excellent thermal conductivity performance, but also enhance the overall mechanical strength of the heat spreader and prevent deformation caused by thermal expansion. Description of the drawings:

[0013] Figure 1 This is a three-dimensional Figure 1 ;

[0014] Figure 2 This is a three-dimensional Figure 2 ;

[0015] Figure 3 This is an exploded view of the heat sink in the present invention;

[0016] Figure 4 It is a schematic diagram of the internal leaf vein direction of the heat spreader in the present invention. Specific implementation method:

[0017] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0018] See Figures 1 to 4 The figure shows a novel leaf-vein-like vapor chamber heat sink, comprising a vapor chamber 1. The vapor chamber 1 includes an evaporator shell plate 11 and a condenser shell plate 12. A sealed heat exchange chamber 10 is formed between the evaporator shell plate 11 and the condenser shell plate 12. Within the heat exchange chamber 10 are disposed a condenser wick 13 and an evaporator wick 14. At least one of the condenser wick 13 and the evaporator wick 14 has a leaf-vein-like structure. By designing the condenser wick 13 or the evaporator wick 14 with a leaf-vein-like structure, which mimics the veins of plant leaves, a more complex and efficient heat conduction path is provided, allowing the coolant to more quickly remove heat. Furthermore, the leaf-vein structure ensures a more even distribution of the coolant throughout the vapor chamber, avoiding the localized heat accumulation that can occur with porous structures. Furthermore, the leaf-vein-like structure not only provides excellent thermal conductivity but also enhances the overall mechanical strength of the vapor chamber, preventing deformation caused by thermal expansion.

[0019] The evaporation end shell plate 11 is provided with a receiving groove filled with coolant for accommodating the condensation end liquid wick 13 and the evaporation end liquid wick 14. The condensation end shell plate 12 covers the receiving groove to seal and form a heat exchange chamber 10. The evaporation end liquid wick 14 includes a plate body 141 and heat-conducting keels 142 distributed on the plate body 141 in the shape of leaf veins. The new leaf vein-like heat spreader 1 adopts an imitation leaf vein structure design, which improves the heat transfer performance of the heat spreader by optimizing the capillary flow mechanism in the working fluid and the liquid wick structure. The radiator quickly transfers heat to the entire surface of the heat spreader through the internal keel heat conduction effect, achieving rapid heating. At the same time, its surface is smooth, the water flow is smooth, and it is not easy to form scaling and other problems, making the heat dissipation capacity about 15% higher than that of traditional radiators.

[0020] The vapor chamber 1 is mounted on a first heat sink fin group 2. A second heat sink fin group 3 is mounted next to the first heat sink fin group 2. A heat pipe 4 is provided between the first and second heat sink fin groups 2 and 3. Both the first and second heat sink fin groups 2 and 3 include a plurality of fins fixedly connected to each other. The fins have holes for the heat pipes 4 and are assembled together with the heat pipes.

[0021] At least two reinforcement brackets 5 are provided on the bottom surfaces of the first and second heat fin groups 2, 3. These reinforcement brackets 5 connect the first and second heat fin groups 2, 3 in series by welding. First and second mounting holes 51, 52 are provided at each end of the reinforcement brackets 5 for mounting and fixing. First and second heat sinks 6, 7 are also provided on the top surfaces of the first and second heat sink groups 2, 3, respectively, located on either side of the vapor chamber 1.

[0022] The first heat sink fin group 2 includes a plurality of spaced first fins 21 and first positioning bars 22 disposed on both sides of the first fins 21 for welding and securing. In this embodiment, three first positioning bars 22 are provided, one on each side and one in the middle. The ends of the first fins 21 at the bottom of the first heat sink fin group 2 are flush, and grooves are formed on both sides for positioning and welding with the reinforcement bracket 5. The ends of the first fins 21 at the top of the first heat sink fin group 2 are not flush, and grooves are formed for positioning the vapor chamber 1 and the first heat sink 6. These grooves can accommodate the vapor chamber 1 and the first heat sink 6 for positioning.

[0023] The second heat sink fin set 3 includes a plurality of spaced-apart second fins 31 and second positioning bars 32 disposed on either side of the second fins 31 for welding and securing. In this embodiment, three second positioning bars 32 are disposed at the bottom of the second heat sink fin set 3, one on each side and one in the middle. The second fins 31 at the bottom of the second heat sink fin set 3 have flush ends and grooves formed on both sides for positioning and welding with the reinforcement bracket 5. The second fins 31 at the top of the second heat sink fin set 3 have uneven ends, forming multiple concave and convex positioning areas of varying depths. Different areas are divided into second positioning bars 32 of varying lengths and staggered locations.

[0024] In summary, in the present invention, the condensation end wick 13 or the evaporation end wick 14 having a leaf vein structure is used inside the vapor chamber 1. The capillary structure of the leaf vein structure enables the present invention to achieve the following technical effects:

[0025] 1. Significantly improve heat dissipation efficiency: The leaf vein-like structure design can significantly improve the heat dissipation efficiency of the heat sink, making it perform better in high-power applications.

[0026] 2. Reduce volume and weight: Due to the efficient heat dissipation capability of the leaf vein-like structure, a smaller and lighter heat spreader can be designed with the same heat dissipation effect, which is suitable for application scenarios with strict requirements on weight and volume.

[0027] 3. Extend equipment life: Through more uniform and efficient heat dissipation, the leaf vein-like structure can reduce the impact of thermal stress on the equipment, thereby extending the service life of the equipment.

[0028] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made based on the structure, features and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

Claims

1. A novel leaf vein-like vapor chamber heat sink, comprising a vapor chamber (1), characterized in that: The heat exchange plate (1) comprises an evaporation end shell plate (11) and a condensation end shell plate (12), a sealed heat exchange chamber (10) is formed between the evaporation end shell plate (11) and the condensation end shell plate (12), and a condensation end liquid absorption core (13) and an evaporation end liquid absorption core (14) are arranged in the heat exchange chamber (10), wherein at least one of the condensation end liquid absorption core (13) and the evaporation end liquid absorption core (14) is a leaf vein imitation structure.

2. The novel leaf vein-like vapor chamber heat sink according to claim 1 is characterized in that: The evaporation end shell plate (11) is provided with a receiving tank for accommodating the condensation end liquid absorption core (13) and the evaporation end liquid absorption core (14) and filled with cooling liquid, and the condensation end shell plate (12) covers the receiving tank to seal and form a heat exchange chamber (10).

3. The novel leaf vein-like vapor chamber heat sink according to claim 1 is characterized in that: The evaporation end liquid absorption core (14) comprises a plate body (141) and a heat-conducting keel (142) distributed on the plate body (141) in the shape of leaf veins.

4. The novel leaf vein-like vapor chamber heat sink according to any one of claims 1 to 3, characterized in that: The heat spreader (1) is arranged on a first heat dissipation fin group (2), a second heat dissipation fin group (3) is arranged beside the first heat dissipation fin group (2), and a heat pipe (4) is provided between the first heat dissipation fin group (2) and the second heat dissipation fin group (3).

5. The novel leaf vein-like vapor chamber heat sink according to claim 4 is characterized in that: At least two reinforcement brackets (5) are provided on the bottom surfaces of the first heat dissipation fin group (2) and the second heat dissipation fin group (3), and the reinforcement brackets (5) connect the first heat dissipation fin group (2) and the second heat dissipation fin group (3) in series by welding.

6. The novel leaf vein-like vapor chamber heat sink according to claim 4 is characterized in that: The top surfaces of the first heat dissipation fin group (2) and the second heat dissipation fin group (3) are further provided with a first heat dissipation fin (6) and a second heat dissipation fin (7), and the first heat dissipation fin (6) and the second heat dissipation fin (7) are respectively located on both sides of the heat spreader (1).

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