Circuit board with air cooling channel

Abstract

The utility model belongs to the technical field of circuit boards, and particularly relates to a circuit board with air cooling channels, which comprises a circuit board, an electronic element, a first air cooling channel and a second air cooling channel. The circuit board comprises a first surface and a second surface, and a plurality of via holes penetrating through the first surface and the second surface are formed in the circuit board; the electronic element is arranged on the first surface or the second surface; the first air cooling channel is arranged on the first face and used for heat dissipation of the first face in the working process. The second air cooling channel is arranged on the second face and used for heat dissipation of the second face in the working process. Through the arrangement of the air cooling channel, the technical scheme can effectively improve the heat dissipation capability of the circuit board, reduce the working temperature, prolong the service life of electronic components, and improve the stability and reliability of the whole electronic system.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a circuit board with an air cooling channel. Background Art

[0002] In modern electronic devices, circuit boards are core components, and their performance and stability are crucial to the entire system. However, as electronic device performance continues to improve, the density of electronic components on circuit boards is increasing, and this in turn generates more heat during operation. If this heat cannot be dissipated effectively and promptly, the circuit board temperature will rise, affecting not only the performance and lifespan of the electronic components but also potentially causing safety issues.

[0003] Traditional circuit board designs often overlook heat dissipation or rely solely on natural convection, which is insufficient for high-power or high-density electronic devices. To address this issue, this technical solution proposes an innovative heat dissipation method: designing air cooling channels on the circuit board. Air cooling channels are an active heat dissipation technology that uses specific channels inside or outside the circuit board to guide air flow and remove heat. Utility Model Content

[0004] The purpose of the present utility model is to provide a circuit board with an air cooling channel, aiming to solve the technical problem that circuit board designs in the prior art often ignore the heat dissipation problem, or only rely on natural convection heat dissipation, which is inadequate in high-power or high-density electronic devices.

[0005] To achieve the above-mentioned objectives, an embodiment of the present invention provides a circuit board with an air-cooling duct, comprising a circuit board, an electronic component, a first air-cooling duct and a second air-cooling duct; the circuit board comprises a first surface and a second surface, and the circuit board is provided with a plurality of vias passing through the first surface and the second surface; the electronic component is arranged on the first surface or the second surface; the first air-cooling duct is arranged on the first surface, and is used for dissipating heat from the first surface during operation; the second air-cooling duct is arranged on the second surface, and is used for dissipating heat from the second surface during operation.

[0006] Optionally, the first air cooling channel is a plurality of strip-shaped grooves with a semicircular cross-section, and each of the strip-shaped grooves avoids the electronic components and the via holes.

[0007] Optionally, the strip-shaped grooves are not interconnected, partially interconnected, or fully interconnected.

[0008] Optionally, the second air cooling channel is an air channel formed by a plurality of heat dissipation fins arranged relative to each other, and each of the heat dissipation fins avoids the electronic components and the vias.

[0009] Optionally, a gap is provided between two adjacent heat dissipation fins.

[0010] Optionally, the intervals between two adjacent heat dissipation fins are the same.

[0011] Optionally, the heat dissipation fins are made of a copper-aluminum composite material.

[0012] Optionally, a mounting hole is further provided on the circuit board, and the mounting hole passes through the first surface and the second surface and is used to fix the circuit board.

[0013] Optionally, the vias include metal vias and non-metal vias.

[0014] One or more of the above-mentioned technical solutions in the circuit board with air cooling ducts provided by the embodiments of the present invention have at least one of the following technical effects: The air cooling duct design of this technical solution takes into account the layout and component distribution of the circuit board. Through precise calculation and simulation, the position, shape, and size of the duct are determined to achieve optimal heat dissipation. The design of the duct must not only consider the dynamic characteristics of air flow, but also the structural strength and electromagnetic compatibility of the circuit board.

[0015] By providing air cooling channels, this technical solution can effectively improve the heat dissipation capacity of the circuit board, reduce operating temperatures, extend the service life of electronic components, and enhance the stability and reliability of the entire electronic system. The application of this active cooling technology has important practical significance for the design of high-power, high-density circuit boards, and is expected to promote the development of heat dissipation technology for electronic devices and meet the growing heat dissipation needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0017] Figure 1 This is a schematic structural diagram of a circuit board with air cooling channels provided in an embodiment of the utility model.

[0018] Figure 2 This is a schematic structural diagram of a circuit board with air cooling channels provided in an embodiment of the present invention from another perspective.

[0019] Among them, the reference numerals in the figures are:

[0020] Circuit board 10 , first surface 11 , second surface 12 , vias 13 , mounting holes 14 , electronic components 20 , first air cooling channels 30 , second air cooling channels 40 , and heat dissipation fins 41 . DETAILED DESCRIPTION

[0021] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0022] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0024] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0025] In one embodiment of the present invention, Figures 1-2As shown, a circuit board with air cooling ducts is provided, comprising a circuit board, electronic components, a first air cooling duct, and a second air cooling duct; the circuit board comprises a first surface and a second surface, and is provided with a plurality of vias penetrating the first surface and the second surface; the electronic components are arranged on the first surface or the second surface; the first air cooling duct is arranged on the first surface and is used to dissipate heat from the first surface during operation; the second air cooling duct is arranged on the second surface and is used to dissipate heat from the second surface during operation. Specifically, both the first surface and the second surface are used to mount electronic components. The first air cooling duct is arranged on the first surface and can cooperate with a fan or other air flow device to remove more heat. The second air cooling duct is arranged on the second surface and can cooperate with a fan or other air flow device to remove more heat.

[0026] The cooling duct design of this technical solution takes into account the circuit board layout and component distribution. Through precise calculation and simulation, the duct's position, shape, and size are determined to achieve optimal heat dissipation. The duct design not only considers the dynamic characteristics of air flow but also the structural strength and electromagnetic compatibility of the circuit board. Furthermore, the cooling duct needs to be coordinated with fans or other air movement devices to form an effective heat dissipation system.

[0027] By providing air cooling channels, this technical solution can effectively improve the heat dissipation capacity of the circuit board, reduce operating temperatures, extend the service life of electronic components, and enhance the stability and reliability of the entire electronic system. The application of this active cooling technology has important practical significance for the design of high-power, high-density circuit boards, and is expected to promote the development of heat dissipation technology for electronic devices and meet the growing heat dissipation needs.

[0028] Furthermore, both the first side and the second side are covered with copper and have wiring, and the lines between the two layers can be connected through vias to form the required network connection.

[0029] Furthermore, the circuit board is equipped with: wires, which are used to connect the electrical copper network of electronic component pins; connectors, which are used to connect components between circuit boards; padding, which is used to cover the copper ground network and effectively reduce impedance; and electrical boundaries, which are used to determine the size of the circuit board. All components on the circuit board cannot exceed this boundary.

[0030] In this embodiment, the first air cooling channel is a plurality of strip grooves with a semicircular cross section, each of which avoids the electronic components and the vias. Specifically, a semicircular cross section can prevent dust or foreign objects from being trapped in the groove compared to a rectangular shape.

[0031] In this example, the strip grooves are not interconnected, partially interconnected, or fully interconnected. Specifically, the structure of the first cold air duct can have three forms: the first is that the strip grooves do not intersect with each other; the second is that some of the strip grooves intersect and some do not intersect; the third is that all the strip grooves intersect. The specific requirements can determine the arrangement structure of the first cold air duct based on the circuit board structure and the arrangement of electronic components.

[0032] In this example, the second cooling duct is formed by a plurality of heat sink fins arranged relative to each other, each of which avoids the electronic components and the vias. Specifically, each heat sink fin forms the second cooling duct, and the arrangement of the heat sink fins facilitates heat absorption and dissipation from the circuit board. The connection between the heat sink fins and the circuit board is made of insulating material to prevent the heat sink fins from interfering with the circuit board's electrical conductivity.

[0033] In this embodiment, a spacing is provided between two adjacent heat dissipating fins. Specifically, compared to two adjacent heat dissipating fins being placed close together, a spacing is provided between two adjacent heat dissipating fins, which allows the heat dissipation to be better. Furthermore, the spacing between two adjacent heat dissipating fins is the same.

[0034] In this embodiment, the heat dissipation fins are made of a copper-aluminum composite material. Specifically, copper products have good thermal conductivity, and aluminum products have good heat dissipation. The copper-aluminum composite material can further improve the heat dissipation effect.

[0035] In this example, the circuit board is further provided with mounting holes that extend through the first and second surfaces and are used to secure the circuit board. In this example, the vias include metal vias and non-metal vias. Furthermore, when the circuit board is multi-layered, the metal vias are used to connect component pins between layers.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A circuit board with an air cooling channel, characterized in that: It includes a circuit board, electronic components, a first air cooling channel and a second air cooling channel; the circuit board includes a first surface and a second surface, and the circuit board is provided with a plurality of vias passing through the first surface and the second surface; the electronic components are arranged on the first surface or the second surface; the first air cooling channel is arranged on the first surface and is used for dissipating heat from the first surface during operation; the second air cooling channel is arranged on the second surface and is used for dissipating heat from the second surface during operation.

2. The circuit board with air cooling channel according to claim 1, characterized in that: The first air cooling channel is a plurality of strip-shaped grooves with a semicircular cross section, and each of the strip-shaped grooves avoids the electronic components and the via holes.

3. The circuit board with air cooling channel according to claim 2, characterized in that: The strip-shaped grooves are not interconnected, partially interconnected, or fully interconnected.

4. The circuit board with air cooling channel according to claim 1, characterized in that: The second air cooling channel is an air channel formed by a plurality of heat dissipation fins arranged relatively to each other, and each of the heat dissipation fins avoids the electronic components and the vias.

5. The circuit board with air cooling channel according to claim 4, characterized in that: A gap is provided between two adjacent heat dissipation fins.

6. The circuit board with air cooling channel according to claim 5, characterized in that: The intervals between two adjacent heat dissipation fins are the same.

7. The circuit board with air cooling channel according to claim 4, characterized in that: The heat dissipation fins are made of copper-aluminum composite material.

8. The circuit board with air cooling channel according to claim 1, characterized in that: The circuit board is further provided with a mounting hole, which passes through the first surface and the second surface and is used to fix the circuit board.

9. The circuit board with air cooling channel according to claim 1, characterized in that: The vias include metal vias and non-metal vias.

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