Product structure with heat conduction and insulation functions and packaging product structure

Abstract

The utility model discloses a product structure with heat conduction and insulation functions. The product structure comprises a heat dissipation main body and a thermosetting heat conduction and insulation base material layer, the heat dissipation body has a surface. The thermosetting heat-conducting insulating base material layer is arranged on the heat dissipation main body. And the thermosetting heat-conducting insulating base material layer is attached to the surface of the heat dissipation main body through a hot-pressing reaction. A high-heat-conduction medium layer is not arranged between the surface of the heat dissipation body and the thermosetting heat-conduction insulating base material layer, so that one part, making contact with the thermosetting heat-conduction insulating base material layer, of the heat dissipation body directly receives heat energy released by the heat dissipation body.

Description

Technical Field

[0001] The content of the utility model relates to a product structure with thermal insulation functions and a packaging product structure, and in particular to a thermal insulation and high-pressure resistant product structure without a high thermal conductivity medium layer between the heat dissipation body and the thermosetting thermal insulation substrate layer, and a packaging product structure with a thermosetting thermal insulation substrate layer attached to a cover. Background Art

[0002] Generally speaking, current products with thermal insulation functions typically use a heat sink made of a highly thermally conductive material and a layer of adhesive attached to the heat dissipation body to be dissipated. This allows the heat energy within the heat dissipation body to be transferred to the heat sink and adhesive backing for heat dissipation. However, if the adhesive backing of traditional product structures is not sticky enough, the heat dissipation body will fall off the heat sink, and if the adhesive backing is damaged, there is a risk of insulation failure. Furthermore, the adhesive backing of traditional product structures has a high thermal resistance coefficient, causing the heat energy emitted by the heat dissipation body to be transferred through two mediums, thereby reducing the efficiency of heat conduction. Utility Model Content

[0003] The technical problem solved by the present invention is that one technical embodiment of the present invention is a product structure with thermal insulation function, wherein the heat dissipation body is in direct contact with the thermosetting thermal insulation substrate layer and there is no high thermal conductivity medium layer between the heat dissipation body and the thermosetting thermal insulation substrate layer, thereby improving the thermal conduction efficiency of the product structure with thermal insulation function.

[0004] The technical means adopted in this utility model are as follows.

[0005] According to the above technical embodiments, embodiments of the present invention provide a product structure with thermal insulation functions. This product structure with thermal insulation functions includes a heat sink body and a thermosetting thermally conductive insulating substrate layer. The heat sink body has a surface. The thermosetting thermally conductive insulating substrate layer is disposed on the heat sink body. The thermosetting thermally conductive insulating substrate layer is bonded to the surface of the heat sink body by a hot pressing reaction. There is no high thermal conductivity dielectric layer between the surface of the heat sink body and the thermosetting thermally conductive insulating substrate layer, so that the portion of the heat sink body that contacts the thermosetting thermally conductive insulating substrate layer directly receives the heat energy released by the heat sink body.

[0006] According to one embodiment of the present invention, there is no gap between the surface of the heat dissipation body and the thermosetting heat-conductive insulating substrate layer.

[0007] According to one embodiment of the present invention, before the thermosetting thermally conductive insulating substrate layer is adhered to the surface, the thermosetting thermally conductive insulating substrate layer is heated and pressurized to be in a molten state, and the molten thermosetting thermally conductive insulating substrate layer is used to be adhered to the surface of the heat dissipation body.

[0008] According to one embodiment of the present invention, there is no heat dissipation paste layer or adhesive layer between the surface of the heat dissipation body and the thermosetting heat-conductive insulating substrate layer.

[0009] According to one embodiment of the present invention, the surface of the heat dissipation body is flush, and the lower surface of the thermosetting heat-conductive insulating substrate layer contacting the heat dissipation body is coplanar with the surface of the heat dissipation body.

[0010] According to one embodiment of the present invention, the surface of the heat dissipation body has a convex portion, a portion of the thermosetting thermally conductive insulating base layer covers the convex portion, and another portion of the thermosetting thermally conductive insulating base layer adheres to the surface of the heat dissipation body.

[0011] According to one embodiment of the present invention, the surface of the heat dissipation body has a recessed portion, the thermosetting thermally conductive insulating substrate layer covers the recessed portion, and a portion of the thermosetting thermally conductive insulating substrate layer extends into the heat dissipation body through the recessed portion.

[0012] According to one embodiment of the present invention, a portion of the surface of the heat dissipation body is curved, and the thermosetting heat-conductive insulating substrate layer is aligned with the curved surface of the heat dissipation body.

[0013] An embodiment of the present invention provides a packaging product structure. This packaging product structure includes a cover, a thermosetting thermally conductive insulating substrate layer, and a heat dissipation body. The cover has an inner surface. The thermosetting thermally conductive insulating substrate layer is disposed on the inner surface of the cover. The thermosetting thermally conductive insulating substrate layer is formed on the inner surface of the cover by a hot pressing reaction. The heat dissipation body is located on the side of the thermosetting thermally conductive insulating substrate layer facing away from the cover. The thermosetting thermally conductive insulating substrate layer is used to receive heat energy released by the heat dissipation body.

[0014] According to one embodiment of the present invention, an intermediary layer is provided between the thermosetting heat-conductive insulating substrate layer and the heat dissipation body, and the intermediary layer is a heat dissipation paste layer or an adhesive layer.

[0015] The technical effects of the present invention are as follows: In the present invention, the thermosetting thermally conductive insulating substrate layer of the product structure with thermal insulation function is bonded to the surface of the heat dissipation body by hot pressing reaction. Therefore, there is no high thermal conductivity medium layer between the surface of the heat dissipation body and the thermosetting thermally conductive insulating substrate layer. Therefore, the portion of the thermosetting thermally conductive insulating substrate layer that contacts the heat dissipation body can directly receive the heat energy released by the heat dissipation body, improving the defects of the traditional heat energy transfer path such as the presence of air gaps or thermal paste, thereby improving the overall heat dissipation performance of the heat sink product. The thermosetting thermally conductive insulating substrate layer itself has an insulating effect. Therefore, when the thermosetting thermally conductive insulating substrate layer is attached to the outside, it can provide insulation to the heat dissipation body to protect the circuit structure of the heat dissipation body, thereby improving the overall insulation performance of the heat sink product. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of a product structure with thermal insulation functions according to one embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of a product structure with thermal insulation functions according to another embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of a product structure with thermal insulation functions according to another embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of a product structure with thermal insulation functions according to another embodiment of the present invention.

[0020] Figure 5 Schematic diagram of a packaging product structure according to one embodiment of the present invention.

[0021] Explanation of symbols:

[0022] 100, 100a, 100b, 100c: Product structures with thermal insulation functions

[0023] 100d: Package product structure

[0024] 110, 110a, 110b, 110c, 110d: heat dissipation body

[0025] 112, 112a, 112b, 112c: Surface

[0026] 114a: convex part

[0027] 114b: concave part

[0028] 120, 120a, 120b, 120c, 120d: Thermosetting thermally conductive insulating substrate layer

[0029] 122: Lower surface

[0030] 130d: Intermediary layer

[0031] 210: Covering piece

[0032] 212: Inner surface. DETAILED DESCRIPTION

[0033] Please refer to Figure 1 , Figure 1FIG1 is a schematic diagram of a product structure 100 having thermal insulation functions according to one embodiment of the present invention. The product structure 100 having thermal insulation functions includes a heat dissipation body 110 and a thermosetting thermally conductive insulating substrate layer 120. The heat dissipation body 110 has a surface 112. For example, the heat dissipation body 110 can be a chip, a mold, a cooling component, or any other component or device that generates heat. The thermosetting thermally conductive insulating substrate layer 120 is disposed on the heat dissipation body 110. It is noteworthy that the thermosetting thermally conductive insulating substrate layer 120 is bonded to the surface 112 of the heat dissipation body 110 by a hot pressing reaction, and there is no high thermal conductivity dielectric layer (for example, an adhesive layer or thermal paste layer made of a high thermal conductivity dielectric material) between the surface 112 of the heat dissipation body 110 and the thermosetting thermally conductive insulating substrate layer 120. This allows the portion of the heat dissipation body 110 contacted by the thermosetting thermally conductive insulating substrate layer 120 to directly receive the heat energy released by the heat dissipation body 110. In addition, the thermosetting thermally conductive insulating substrate layer 120 itself also has an insulating effect. Therefore, when the thermosetting thermally conductive insulating substrate layer 120 is attached to the outside, it can provide an insulating effect to the heat dissipation body 110 to protect the circuit structure of the heat dissipation body 110, thereby improving the overall insulation performance of the radiator product.

[0034] Furthermore, before the thermosetting thermally conductive insulating substrate layer 120 is bonded to the surface 112 of the heat dissipation body 110 via a thermocompression reaction, the thermosetting thermally conductive insulating substrate layer 120 is heated and pressurized to transform from a solidified state to a molten state. The molten thermosetting thermally conductive insulating substrate layer 120 is then bonded to the surface 112 of the heat dissipation body 110. Bonding the thermosetting thermally conductive insulating substrate layer 120 to the surface 112 of the heat dissipation body 110 in a molten state can improve the gap between the thermosetting thermally conductive insulating substrate layer 120 and the surface 112 of the heat dissipation body 110. In some embodiments, the surface 112 of the heat dissipation body 110 may have slots to facilitate the formation of the thermosetting thermally conductive insulating substrate layer 120 on the surface 112 of the heat dissipation body 110. In other words, the surface 112 of the heat dissipation body 110 may be subjected to a hairline treatment, facilitating the formation of the thermosetting thermally conductive insulating substrate layer 120 on the surface 112 of the heat dissipation body 110.

[0035] In some embodiments, there is no gap between the surface 112 of the heat sink 110 and the thermosetting thermally conductive insulating substrate layer 120. That is, the molten thermosetting thermally conductive insulating substrate layer 120 is completely adhered to the surface 112 of the heat sink 110, so that the thermosetting thermally conductive insulating substrate layer 120 and the heat sink 110 are in full contact with each other, with no gap between them. In some embodiments, the molten thermosetting thermally conductive insulating substrate layer 120 is completely adhered to the surface 112 of the heat sink 110, so there is no thermal paste or adhesive layer between the surface 112 of the heat sink 110 and the thermosetting thermally conductive insulating substrate layer 120. In addition, the surface 112 of the heat sink 110 is flush, and the lower surface 122 of the thermosetting thermally conductive insulating substrate layer 120 that contacts the heat sink 110 is coplanar with the surface 112 of the heat sink 110. That is, the flush surface 112 of the heat dissipation body 110 allows the lower surface 122 of the thermosetting thermally conductive insulating substrate layer 120 to contact the heat dissipation body 110 to be flush as well, so the lower surface 122 of the thermosetting thermally conductive insulating substrate layer 120 is coplanar with the surface 112 of the heat dissipation body 110 .

[0036] Specifically, the thermosetting thermally conductive insulating substrate layer 120 of the product structure 100 with thermally conductive insulating functions is bonded to the surface 112 of the heat dissipation body 110 by a hot pressing reaction. Therefore, there is no high thermal conductivity medium layer between the surface 112 of the heat dissipation body 110 and the thermosetting thermally conductive insulating substrate layer 120. Therefore, the portion of the thermosetting thermally conductive insulating substrate layer 120 that contacts the heat dissipation body 110 can directly receive the heat energy released by the heat dissipation body 110, thereby improving the defects of the traditional heat energy transfer path such as the presence of air gaps or thermal paste, thereby improving the overall heat dissipation efficiency of the product structure 100 with thermally conductive insulating functions.

[0037] Please refer to Figure 2 , Figure 2 Schematic diagram of a product structure 100a with thermal insulation functions according to another embodiment of the present invention. Figure 2 The embodiment shown is similar to Figure 1 The embodiment shown differs in that Figure 2 The surface 112a of the heat dissipation body 110a of the product structure 100a with heat conduction and insulation function has a convex portion 114a. In the actual manufacturing process, even if it is desired as Figure 1 The surface 112 of the heat dissipation body 110 is flush, but in practical applications it is still inevitable that Figure 2The heat dissipation body 110a of the product structure 100a with thermal insulation functions has a protrusion 114a on its surface 112a. Despite the protrusion 114a, the molten thermosetting thermally conductive insulating substrate layer 120a can still be bonded to the surface 112a of the heat dissipation body 110a through thermocompression reaction, ensuring a complete separation between the two. Furthermore, since the molten thermosetting thermally conductive insulating substrate layer 120a is bonded to the surface 112a of the heat dissipation body 110a, there is no thermal paste or adhesive layer between the heat dissipation body 110a and the thermosetting thermally conductive insulating substrate layer 120a.

[0038] In some embodiments, a portion of the thermosetting thermally conductive insulating substrate layer 120a covers the protrusion 114a of the heat dissipation body 110a, while the remaining portion of the thermosetting thermally conductive insulating substrate layer 120a adheres to the surface 112a of the heat dissipation body 110a. Even if the surface 112a of the heat dissipation body 110a has the protrusion 114a, the thermosetting thermally conductive insulating substrate layer 120a of the product structure 100a with thermal conductivity and insulation functions can still be adhered to the surface 112a of the heat dissipation body 110a via hot pressing. Therefore, the portion of the thermosetting thermally conductive insulating substrate layer 120a contacting the heat dissipation body 110a can still directly receive the heat energy released by the heat dissipation body 110a, thereby improving the defects of traditional heat transfer paths such as air gaps or the presence of thermal paste, thereby improving the overall heat dissipation efficiency of the product structure 100a with thermal conductivity and insulation functions.

[0039] Please refer to Figure 3 , Figure 3 FIG. 1 is a schematic diagram of a product structure 100b having thermal insulation functions according to another embodiment of the present invention. Figure 3 The embodiment shown is similar to Figure 1 The embodiment shown differs in that Figure 3 The surface 112b of the heat dissipation body 110b of the product structure 100b with heat conduction and insulation function has a concave portion 114b. In the actual manufacturing process, even if it is desired as Figure 1 The surface 112 of the heat dissipation body 110 is flush, but in practical applications it is still inevitable that Figure 3The surface 112b of the heat sink body 110b of the product structure 100b with thermal insulation functions has a recess 114b. Despite the recess 114b, the molten thermosetting thermally conductive insulating substrate layer 120b can still be bonded to the surface 112b of the heat sink body 110b by thermocompression reaction, ensuring a complete separation between the two. Furthermore, since the molten thermosetting thermally conductive insulating substrate layer 120b is bonded to the surface 112b of the heat sink body 110b, there is no thermal paste or adhesive layer between the heat sink body 110b and the thermosetting thermally conductive insulating substrate layer 120b.

[0040] In some embodiments, the thermosetting thermally conductive insulating substrate layer 120b covers the recessed portion 114b of the heat sink body 110b, and a portion of the thermosetting thermally conductive insulating substrate layer 120b extends into the heat sink body 110b through the recessed portion 114b of the heat sink body 110b. The portion of the thermosetting thermally conductive insulating substrate layer 120b that contacts the heat sink body 110b can still directly receive heat energy released by the heat sink body 110b, thereby improving the defects of traditional heat transfer paths that often involve air gaps or thermal paste, thereby enhancing the overall heat dissipation efficiency of the product structure 100b with thermal conductivity and insulation functions.

[0041] Please refer to Figure 4 , Figure 4 Schematic diagram of a product structure 100c with thermal insulation functions according to another embodiment of the present invention. Figure 4 The embodiment shown is similar to Figure 1 The embodiment shown differs in that Figure 4 In the heat dissipation body 110c of the product structure 100c with thermal insulation functions, a portion of the surface 112c is curved. Despite this curved portion, the molten thermosetting thermally conductive insulating substrate layer 120c can still be completely bonded to the surface 112c of the heat dissipation body 110c by hot pressing, leaving no gap between the thermosetting thermally conductive insulating substrate layer 120c and the curved portion of the heat dissipation body 110c. In other words, the thermosetting thermally conductive insulating substrate layer 120c is flush with the curved surface 112c of the heat dissipation body 110c. Furthermore, because the molten thermosetting thermally conductive insulating substrate layer 120c is bonded to the surface 112c of the heat dissipation body 110c, no thermal paste or adhesive layer is required between the heat dissipation body 110c and the thermosetting thermally conductive insulating substrate layer 120c.

[0042] Please refer to Figure 5 , Figure 5It is a schematic diagram of a packaging product structure 100d according to an embodiment of the present invention. The packaging product structure 100d includes a cover member 210, a thermosetting thermally conductive insulating substrate layer 120d and a heat dissipation body 110d. The cover member 210 has an inner surface 212. The thermosetting thermally conductive insulating substrate layer 120d is arranged on the inner surface 212 of the cover member 210. The thermosetting thermally conductive insulating substrate layer 120 is formed on the inner surface 212 of the cover member 210 by hot pressing reaction. The heat dissipation body 110d is located on the side of the thermosetting thermally conductive insulating substrate layer 120d facing away from the cover member 210. The thermosetting thermally conductive insulating substrate layer 120d is used to receive the heat energy released by the heat dissipation body 110d. In addition, there is an intermediate layer 130d between the thermosetting thermally conductive insulating substrate layer 120d and the heat dissipation body 110d, and the intermediate layer 130d is a heat dissipation paste layer or an adhesive layer.

[0043] Specifically, the thermosetting thermally conductive insulating substrate layer 120d is attached to the inner side of the cover 210, and the exposed chipset on the heat sink body 110d is covered by the interposer 130d. This allows heat energy emitted by the exposed chipset to be transferred to the cover 210 through the interposer 130d and the thermosetting thermally conductive insulating substrate layer 120d for heat dissipation. Furthermore, the thermosetting thermally conductive insulating substrate layer 120d provides insulation, so voltages outside the cover 210 do not affect the exposed chipset inside the cover 210, thus preventing the exposed chipset on the heat sink body 110d from being broken down or short-circuited by the external voltage.

Claims

1. A product structure with thermal insulation function, characterized in that: Include: a heat dissipation body having a surface; and A thermosetting thermally conductive insulating substrate layer is disposed on the heat dissipation body, wherein the thermosetting thermally conductive insulating substrate layer is formed on the surface of the heat dissipation body by a hot pressing reaction, and there is no high thermal conductivity medium layer between the surface of the heat dissipation body and the thermosetting thermally conductive insulating substrate layer, so that the portion of the heat dissipation body contacted by the thermosetting thermally conductive insulating substrate layer directly receives the heat energy released by the heat dissipation body.

2. The product structure with thermal insulation function according to claim 1, characterized in that: There is no gap between the surface of the heat dissipation body and the thermosetting heat-conductive insulating substrate layer.

3. The product structure with thermal insulation function according to claim 1, characterized in that: Before the thermosetting thermally conductive insulating substrate layer is attached to the surface, the thermosetting thermally conductive insulating substrate layer is heated and pressurized to be in a molten state, and the molten thermosetting thermally conductive insulating substrate layer is used to be attached to the surface of the heat dissipation body.

4. The product structure with thermal insulation function according to claim 1, characterized in that: There is no heat dissipation paste layer or adhesive layer between the surface of the heat dissipation body and the thermosetting heat-conductive insulating substrate layer.

5. The product structure with thermal insulation function according to claim 1, characterized in that: The surface of the heat dissipation body is flush, and the thermosetting heat-conductive insulating substrate layer contacts a lower surface of the heat dissipation body and is coplanar with the surface of the heat dissipation body.

6. The product structure with thermal insulation function according to claim 1, characterized in that: The surface of the heat dissipation body has a convex portion, a portion of the thermosetting heat-conductive insulating base material layer covers the convex portion, and another portion of the thermosetting heat-conductive insulating base material layer adheres to the surface of the heat dissipation body.

7. The product structure with thermal insulation function according to claim 1, characterized in that: The surface of the heat dissipation body has a concave portion, the thermosetting heat-conductive insulating substrate layer covers the concave portion, and a portion of the thermosetting heat-conductive insulating substrate layer extends into the heat dissipation body through the concave portion.

8. The product structure with thermal insulation function according to claim 1, characterized in that: A portion of the surface of the heat dissipation body is curved, and the thermosetting heat-conductive insulating substrate layer is aligned with the curved surface of the heat dissipation body.

9. A packaging product structure, characterized in that: Include: a cover member having an inner surface; a thermosetting heat-conductive insulating substrate layer disposed on the inner surface of the cover, wherein the thermosetting heat-conductive insulating substrate layer is formed on the inner surface of the cover by a hot pressing reaction; as well as A heat dissipation body is located on the side of the thermosetting heat-conducting insulating substrate layer facing away from the cover component, wherein the thermosetting heat-conducting insulating substrate layer is used for receiving heat energy released by the heat dissipation body.

10. The packaged product structure according to claim 9, wherein: An intermediate layer is provided between the thermosetting heat-conducting insulating substrate layer and the heat-dissipating body, and the intermediate layer is a heat-dissipating paste layer or an adhesive layer.

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